Patent application number | Description | Published |
20080274654 | ELECTRICAL INTERCONNECTION DEVICES INCORPORATING REDUNDANT CONTACT POINTS FOR REDUCING CAPACITIVE STUBS AND IMPROVED SIGNAL INTEGRITY - An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs. | 11-06-2008 |
20090027137 | TAPERED DIELECTRIC AND CONDUCTOR STRUCTURES AND APPLICATIONS THEREOF - Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore. | 01-29-2009 |
20090091017 | Partitioned Integrated Circuit Package with Central Clock Driver - Disclosed are IC partitioned packaging and interconnection constructions that provide for improved distribution of power, ground, cross chip interconnections and clocks. | 04-09-2009 |
20090093173 | High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for their Manufacture - An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof. | 04-09-2009 |
20090119464 | MEMORY CHAIN - A memory system having a plurality of memory devices and a memory controller. The memory devices are coupled to one another in a chain. The memory controller is coupled to the chain and configured to output a memory access command that is received by each of the memory devices in the chain and that selects a set of two or more of the memory devices to be accessed. | 05-07-2009 |
20090167334 | Controlled Impedance Structures for High Density Interconnections - An interconnection structure suitable for use as an IC package, probe head or other electrical termination of high density where uninterrupted controlled impedance is desired is described. | 07-02-2009 |
20100112829 | Electrical Interconnection Devices Incorporating Redundant Contact Points for Reducing Capacitive Stubs and Improved Signal Integrity - An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs. | 05-06-2010 |
20100127402 | Interconnect System without Through-Holes - Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations. | 05-27-2010 |
20100151704 | High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for their Manufacture - An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof. | 06-17-2010 |
20100165525 | Low Profile Discrete Electronic Components and Applications of Same - Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package. | 07-01-2010 |
20100221871 | Multi-Surface IC Packaging Structures and Methods for their Manufacture - An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated. | 09-02-2010 |
20100284115 | ESD Protection Utilizing Radiated Thermal Relief - An ESD device with a protection structure utilizing radiated heat dissipation to prevent or reduce thermal failures. The device includes a voltage switchable polymer | 11-11-2010 |
20110065332 | Torsionally-Induced Contact-Force Conductors for Electrical Connector Systems - An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface. | 03-17-2011 |
20110171857 | Torsionally-Induced Contact-Force Conductors for Electrical Connector Systems - An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface. | 07-14-2011 |
20110215475 | MULTI-SURFACE IC PACKAGING STRUCTURES - An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated. | 09-08-2011 |
20110252164 | MEMORY CHAIN - A memory system having a plurality of memory devices and a memory controller. The memory devices are coupled to one another in a chain. The memory controller is coupled to the chain and configured to output a memory access command that is received by each of the memory devices in the chain and that selects a set of two or more of the memory devices to be accessed. | 10-13-2011 |
20120149250 | Torsionally-Induced Contact-Force Conductors for Electrical Connector Systems - An electrical connector. An electrical connector a pair of cylindrical housings, one having a plurality of torsion bar conductors and a second having a plurality of ramps. Rotating the pair of housings relative to one another causes an angled tip on the torsion bar to rotate as it moves up the ramp. A land is provided to discontinue further rotation of the torsion bar tip as the housings continue to rotate. | 06-14-2012 |
20130078826 | TORSIONALLY-INDUCED CONTACT-FORCE CONDUCTORS FOR ELECTRICAL CONNECTOR SYSTEMS - An electrical connector comprising a pair of elongated bodies, each having a facing ramp, the ramp having an notch, each having a rotatable torsion bar conductor with a tip located in the notch, the end of a tip spaced above the ramp such that when the two bodies are mated, the tips engage the ramp of the other connector and rotate against a torsional restoring force, and when fully mated, the two ramps abut each other, notches aligned, with the respective tips of the torsion bars engaging the torsion bar of the other body in the aligned notches. | 03-28-2013 |
20130321232 | MODULAR ANTENNA SYSTEM - A modular reconfigurable indoor antenna is disclosed. The antenna may include a bottom piece, a top piece, and a plurality of vertical members. The top piece may include an Ultra High Frequency (UHF) reception element. The plurality of vertical members may be disposed between the bottom piece and the top piece and coupled therewith. At least one of the plurality of vertical members may include a Very High Frequency (VHF) reception element. | 12-05-2013 |