Achari
Basudeb Achari, Jadavpur IN
Patent application number | Description | Published |
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20080274985 | Pharmaceutical composition useful for the treatment of peptic ulcer diseases - The present invention deals with the pharmaceutical composition comprising the therapeutically effective amount of a compound oenothein C obtained from the bioactive fraction of plant | 11-06-2008 |
20110207682 | PHARMACEUTICAL COMPOSITION USEFUL FOR THE TREATMENT OF PEPTIC ULCER DISEASES - The present invention deals with the pharmaceutical composition comprising the therapeutically effective amount of a compound oenothein C obtained from the bioactive fraction of plant | 08-25-2011 |
Karim Achari, Montgeron FR
Patent application number | Description | Published |
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20080316357 | SECURE DISPLAY METHOD AND DEVICE - A secure display device is designed to display on a screen a first set of information edited by an open operating system. A secure operating system resident in a dedicated circuit edits a second set of information. A filter allocates, independently of the open operating system, a first zone of the screen to the first set of information and a second zone of the screen to the second set of information. The zones and can have a non-zero intersection and any value. A real video memory is used for transferring the two sets of information to the screen under the sole control of the secure operating system so as to produce a secure display of the second set of information. | 12-25-2008 |
Murugasan Manikam Achari, Penang MY
Patent application number | Description | Published |
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20100258705 | METHOD AND STRUCTURE OF MINIMIZING MOLD BLEEDING ON A SUBSTRATE SURFACE OF A SEMICONDUCTOR PACKAGE - A substrate surface of a semiconductor package, comprising: a plurality of product forming areas to provide mounting spaces of semiconductor chips. The substrate surface also comprises a plurality of staggered offset mesh block areas surrounding the plurality of product forming areas. The plurality of staggered offset mesh block areas minimize mold bleeding from a mold cavity of the semiconductor package to outer areas of the substrate surface. | 10-14-2010 |
Murugasan Manikam Achari, Georgtown MY
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20080274591 | CARRIER FOR STACKED TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING STACKED TYPE SEMICONDUCTOR DEVICES - A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other. | 11-06-2008 |
Murugasan Manikam Achari US
Patent application number | Description | Published |
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20090057883 | Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package - A method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package is disclosed. In one embodiment, a method includes forming a dam structure on an outer area of a substrate surface of a semiconductor package and blocking a flow of a mold material from a mold cavity of the semiconductor package to the outer area of the substrate surface using the dam structure. In another embodiment, a substrate surface of a semiconductor package includes product forming areas to provide mounting spaces of semiconductor chips and staggered offset mesh block areas surrounding the product forming areas to act as dam structures to minimize mold bleeding from a mold cavity of the semiconductor package to outer areas of the substrate surface. | 03-05-2009 |
Rajesh Kumar Ganapathy Achari, Ernakulam IN
Patent application number | Description | Published |
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20150121481 | APPLICATION AUTHENTICATION USING NETWORK AUTHENTICATION INFORMATION - In general, in one aspect, embodiments relate to receiving, by a system of one or more network devices from a client device, a request to access one or more applications, determining, by the system, that the client device has already been authenticated to access a network, and based on determining that the client device has already been authenticated to access the network, causing authenticating of the client device for accessing the one or more applications. | 04-30-2015 |
Rajesh Kumar Ganapathy Achari, Bangalore IN
Patent application number | Description | Published |
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20150121500 | USING APPLICATION LEVEL AUTHENTICATION FOR NETWORK LOGIN - In general, in one aspect, embodiments relate to receiving, by a system comprising one or more network devices, a first client authentication information comprising a first indication that a first client device was successfully authenticated by a first authentication server based on credentials provided by the first client device, and forwarding, by the system, the first client authentication information to a second authentication server without determining that the client device was already successfully authenticated by the first authentication server based on the credentials provided by the first client device. The operations further include receiving, by the system from the second authentication server, a second indication that the first client device was successfully authenticated, and based on the second indication received by the system from the second authentication server, granting, by the system, network access to the first client device. | 04-30-2015 |