Patent application number | Description | Published |
20120038703 | INKJET PRINTING APPARATUS AND INKJET PRINTING METHOD - A clear ink layer is formed by a first application of the clear ink. After a film of the clear ink is formed, a second application of the clear ink is performed onto the layer thereof. Thereby, a permeation speed of the clear ink which is applied at the second time after the clear ink is applied once becomes low, and becomes a substantially uniform one in the printed matter. That is, when the clear ink is applied at the second time onto the surface of the clear ink which is once formed into the film, the clear ink permeates therein at a substantially uniform permeation speed and is fixed thereto. As a result, the clear ink which is applied at the second time does not generate unevenness since the permeation speed thereof has no difference thereon, and can form a smooth printed matter surface. | 02-16-2012 |
20120313998 | IMAGE RECORDING METHOD - An image recording method has a feature such that a first ink, a second ink, and a third ink satisfy both the following relationships (1) and (2): (1) the film thickness of dots of the inks formed when one drop of each ink is applied to the recording medium is as follows: First ink>Second ink>Third ink; and (2) the penetration time of the clear ink when applying the inks to the recording medium, and then further applying one drop of the clear ink to the region to which each ink is applied is as follows: First ink≧Second ink≧Third ink. | 12-13-2012 |
20140002559 | INK JET PRINTING APPARATUS | 01-02-2014 |
20150109365 | INK, INK CARTRIDGE, AND IMAGE-RECORDING METHOD - Provided is an ink containing a self-dispersible pigment, an acrylic resin particle, a surfactant, a water-soluble organic solvent, and water. The surfactant includes a fluorinated surfactant represented by Formula (1) and having an HLB value determined by a Griffin method of 11 or less. The water-soluble organic solvent includes at least one water-soluble organic solvent selected from a specific group, and the total content of the water-soluble organic solvents of the specific group is 4 times or more the total content of the water-soluble organic solvents other than the solvents of the specific group. The total content of the self-dispersible pigment and the acrylic resin particle is 10% by mass or less based on the total mass of the ink. | 04-23-2015 |
20150109384 | INK, INK CARTRIDGE, AND IMAGE-RECORDING METHOD - Provided is an ink containing a self-dispersible pigment, a polyurethane polymer particle, a surfactant, a water-soluble organic solvent, and water. The surfactant includes a fluorinated surfactant represented by Formula (1) and having an HLB value determined by a Griffin method of 11 or less. The water-soluble organic solvent includes at least one water-soluble organic solvent selected from a specific group, and the total content of the water-soluble organic solvents of the specific group is higher than the total content of the water-soluble organic solvents other than the solvents of the specific group. | 04-23-2015 |
20150184007 | INK, INK CARTRIDGE, AND IMAGE-RECORDING METHOD - An ink contains a pigment dispersed with polymer, a surfactant, a water-soluble organic solvent, and water. The mass ratio of a content of the pigment to a content of the polymer in the ink is more than 3. The surfactant includes a fluorinated surfactant which is represented by Formula (1) and which has an HLB of 11 or less as determined by a Griffin method. The water-soluble organic solvent includes at least one selected from specific Group A. The total content of the water-soluble organic solvents of the Group-A in the ink is larger than the total content of water-soluble organic solvents other than the water-soluble organic solvents of Group A in the ink. | 07-02-2015 |
20150299486 | INK, INK CARTRIDGE, AND IMAGE-RECORDING METHOD - An ink including: a pigment dispersed with a polymer dispersant; polymer particles; a surfactant; a water-soluble organic solvent; and water, wherein the amount of anionic functional group on the surface of the polymer particles is 0.2 mmol/g or less, the surfactant is represented by the general formula (1) and contains a fluorinated surfactant having a hydrophile-lipophile balance (HLB) of 11 or less as determined by a Griffin method, and the water-soluble organic solvent contains at least one water-soluble organic solvent selected from glycerin, ethylene glycol, diethylene glycol, poly(ethylene glycol) having a weight-average molecular weight of 10,000 or less, 1,3-propanediol, 1,4-butanediol, and diglycerol. | 10-22-2015 |
20150299487 | INK, INK CARTRIDGE, AND IMAGE-RECORDING METHOD - An ink including: a self-dispersing pigment; polymer particles; a surfactant; a water-soluble organic solvent; and water, wherein the amount of anionic functional group on the surface of the polymer particles is 0.2 mmol/g or less, the surfactant is represented by the general formula (1) and contains a fluorinated surfactant having a hydrophile-lipophile balance (HLB) of 11 or less as determined by a Griffin method, and the water-soluble organic solvent contains at least one water-soluble organic solvent selected from glycerin, ethylene glycol, diethylene glycol, poly(ethylene glycol) having a weight-average molecular weight of 10,000 or less, 1,3-propanediol, 1,4-butanediol, and diglycerol. | 10-22-2015 |
Patent application number | Description | Published |
20090075427 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN). | 03-19-2009 |
20100065951 | Method of Manufacturing A Semiconductor Device - The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN). | 03-18-2010 |
20100068852 | Method of Manufacturing A Semiconductor Device - The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN). | 03-18-2010 |
20110204502 | Method of Manufacturing A Semiconductor Device - The quality of a non-leaded semiconductor device is to be improved. The semiconductor device comprises a sealing body for sealing a semiconductor chip with resin, a tab disposed in the interior of the sealing body, suspension leads for supporting the tab, plural leads having respective to-be-connected surfaces exposed to outer edge portions of a back surface of the sealing body, and plural wires for connecting pads formed on the semiconductor chip and the leads with each other. End portions of the suspending leads positioned in an outer periphery portion of the sealing body are not exposed to the back surface of the sealing body, but are covered with the sealing body. Therefore, stand-off portions of the suspending leads are not formed in resin molding. Accordingly, when cutting the suspending leads, corner portions of the back surface of the sealing body can be supported by a flat portion of a holder portion in a cutting die which flat portion has an area sufficiently wider than a cutting allowance of the suspending leads, whereby it is possible to prevent chipping of the resin and improve the quality of the semiconductor device (QFN). | 08-25-2011 |
20130020691 | Method of Manufacturing a Semiconductor Device - A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented. | 01-24-2013 |
20140054759 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented. | 02-27-2014 |
20150235987 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A non-leaded semiconductor device comprises a sealing body for sealing a semiconductor chip, a tab in the interior of the sealing body, suspension leads for supporting the tab, leads having respective surfaces exposed to outer edge portions of a back surface of the sealing body, and wires connecting pads formed on the semiconductor chip and the leads. End portions of the suspension leads positioned in an outer periphery portion of the sealing body are unexposed to the back surface of the sealing body, but are covered with the sealing body. Stand-off portions of the suspending leads are not formed in resin molding. When cutting the suspending leads, corner portions of the back surface of the sealing body are supported by a flat portion of a holder portion in a cutting die having an area wider than a cutting allowance of the suspending leads, whereby chipping of the resin is prevented. | 08-20-2015 |
Patent application number | Description | Published |
20090136186 | OPTICAL FIBER FUSION SPLICER AND METHOD FOR ESTIMATING A SHAPE OF BEAM DISCHARGED BY THE OPTICAL FIBER FUSION SPLICER - The present invention is provided for fusion splicing optical fibers with low splice loss even when a shape of a discharge beam for the splicing is distorted. In the present invention, a preliminary discharge is performed with the optical fibers outside a discharge area and an image of the discharge beam thereof is picked up. Based on this image, brightness distributions of the discharge beam are estimated on a plurality of lines in a Z direction that are set in different positions in an X direction, and a discharge center of the beam is found from the plurality of brightness distributions. Then, the abutment portion of the optical fibers is positioned at the discharge center, and a main discharge is performed so as to fusion splice the distal ends of the optical fibers. | 05-28-2009 |
20110235982 | METHOD FOR CONNECTING OPTICAL FIBERS AND CONNECTION STRUCTURE OF OPTICAL FIBERS - A method for connecting optical fibers and a connection structure of optical fibers capable of suppressing axial misalignment between cores in end-to-end connection of optical fibers at least one of which has a clad for a non-circular shape. | 09-29-2011 |
20130251318 | METHOD FOR CONNECTING OPTICAL FIBERS AND CONNECTION STRUCTURE OF OPTICAL FIBERS - A method for connecting optical fibers and a connection structure of optical fibers capable of suppressing axial misalignment between cores in end-to-end connection of optical fibers at least one of which has a clad for a non-circular shape. A core of at least one optical fiber has a circular shape and a clad thereof has a non-circular shape, and in the optical fiber having the clad of the non-circular shape, the clad is formed to have a more circular shape at and near a splice than at another portion thereof. | 09-26-2013 |
20140016656 | LIGHT DELIVERY COMPONENT AND LASER SYSTEM EMPLOYING SAME - A light delivery component includes a delivery fiber configured to include a core and a clad; and a heat radiating member, wherein the delivery fiber is configured to include a first light emitting unit connected to a first heat radiating member which is a portion of the heat radiating member and a second light emitting unit connected to a second heat radiating member which is another portion of the heat radiating member, and at least the second light emitting unit is bent, and wherein the first light emitting unit is installed closer to a light incidence end of the delivery fiber than the second light emitting unit, and a bending radius of the first light emitting unit is set to be larger than that of the second light emitting unit. | 01-16-2014 |
20140211300 | OPTICAL AMPLIFICATION COMPONENT AND FIBER LASER DEVICE - An optical amplification component | 07-31-2014 |
20140240818 | OPTICAL AMPLIFICATION COMPONENT AND FIBER LASER DEVICE - An optical amplification component | 08-28-2014 |
20150029580 | FIBER-OPTIC SYSTEM AND METHOD FOR MANUFACTURING SAME - In a fiber amplifier including a third optical fiber made of a double clad fiber for amplifying light and a fifth optical fiber made of a single clad fiber for transmitting the light amplified by the double clad fiber, a fourth optical fiber made of a triple clad fiber is inserted between the third optical fiber and the fifth optical fiber. | 01-29-2015 |
Patent application number | Description | Published |
20130250362 | IMAGE PROCESSING APPARATUS AND QUANTIZATION METHOD - When quantizing the color material amount data of a black color and that of a chromatic color, the color material amount data of a first chromatic color is quantized so that the phase of a low spatial frequency component of black color quantization data obtained by quantizing the color amount data of the black color is opposite to that of the low spatial frequency component of first quantization data obtained by quantizing the color material amount data of the first chromatic color, and the high spatial frequency component of the black color quantization data has no correlation with that of the first quantization data. | 09-26-2013 |
20130342536 | IMAGE PROCESSING APPARATUS, METHOD OF CONTROLLING THE SAME AND COMPUTER-READABLE MEDIUM - Object information concerning an object image is input. Line-of-sight information of a viewer is input. Conversion parameters for converting for values on a coordinate system on an object image in the virtual space defined with respect to a display device into values on the coordinate system of the display device. A rendering image is created by rendering an object image based on the conversion parameters. A deformed filter is created by deforming a reference filter to be applied to the object image set at reference coordinates in a virtual space, based on the line-of-sight information and conversion parameters. The image data obtained by performing filter processing for the rendering image by using the deformed filter is output. | 12-26-2013 |
20140063235 | DISTANCE INFORMATION ESTIMATING APPARATUS - To provide a method which can estimate a distance of a flat part while keeping a precision for estimating a distance in detail. Distance information is estimated by estimating each piece of distance information of an image represented by image data, and distance information represented by resolution-converted image data, and combining the distance information of the image and the distance information of the resolution-converted image. | 03-06-2014 |
20140064633 | IMAGE PROCESSING APPARATUS AND IMAGE PROCESSING METHOD - The present invention controls blur and sharpness according to a depth without performing processes repeatedly for each object determination or for each distance. A filter for a target pixel is determined by comparing multiple thresholds representing an optical characteristic of an image capturing unit and multiple values representing distance to a subject in the target pixel and pixels around the target pixel. Then, the filter is applied to the target pixel. | 03-06-2014 |
Patent application number | Description | Published |
20090129056 | Light guide plate and backlight unit - A light guide plate includes: a plate surrounded by two main surfaces and a plurality of end surfaces connecting the main surfaces, one of the end surfaces designated as an entrance surface, one of the main surfaces designated as a reflection surface; a first reflection element provided in a first region of the reflection surface separated from the entrance surface, and configured to reflect a light incident from the entrance surface in a first angle with respect to the reflection surface; and a second reflection element provided in a second region of the reflection surface between the entrance surface and the first region, and configured to reflect the light in a second angle different from the first angle with respect to the reflection surface. | 05-21-2009 |
20090147532 | Backlight unit - A backlight unit includes: light guide plate surrounded by main surfaces and end surfaces, one end surface facing a light source designated as entrance surface, one main surface designated as emitting surface; first prism sheet provided above the light guide plate, having first prism columns on a top surface and second prism columns on a bottom surface, each first prism column has first ridge line parallel or perpendicular to the entrance surface, each second prism column has second ridge line extending in a different direction from the first ridge line; second prism sheet provided above the first prism sheet, having third prism columns abutting each other on a top surface, each third prism column has third ridge line extending in a direction different from the first and second ridge lines; and reflection sheet facing the light guide plate below the light guide plate. | 06-11-2009 |
Patent application number | Description | Published |
20120246666 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR OPTICAL DATA RECORDING MEDIUM, OPTICAL DATA RECORDING MEDIUM, AND METHOD AND DEVICE FOR REPRODUCING DATA FROM OPTICAL DATA RECORDING MEDIUM - A pressure-sensitive adhesive sheet | 09-27-2012 |
20130017363 | PRESSURE-SENSITIVE ADHESIVE SHEETAANM Morioka; TakashiAACI Itabashi-kuAACO JPAAGP Morioka; Takashi Itabashi-ku JPAANM Taya; NaokiAACI Itabashi-kuAACO JPAAGP Taya; Naoki Itabashi-ku JP - A pressure-sensitive adhesive sheet includes a base material and a pressure-sensitive adhesive layer and is formed therein with a plurality of through-holes passing through from one surface to the other surface, wherein the base material comprises a resin composition, and the resin composition contains: 50 to 88 wt % of a polyolefin-based resin (A); 10 to 48 wt % of a styrene-based resin and/or an acrylic-based resin (B) excluding the polyolefin-based resin (A); and 2.0 to 30 wt % of a pigment (C). According to such pressure-sensitive adhesive sheet, air entrapments and blisters can be prevented or removed via the through-holes and the inner diameter of the through-holes is suppressed from expanding, and thereby the pressure-sensitive adhesive sheet has a good appearance. | 01-17-2013 |
20130040100 | PRESSURE-SENSITIVE ADHESIVE SHEET - A pressure-sensitive adhesive sheet includes a base material and a pressure-sensitive adhesive layer and is formed therein with a plurality of through-holes passing through from one surface to the other surface. The base material includes a first layer positioned on a side of the pressure-sensitive adhesive layer and a second layer positioned on an opposite side of the pressure-sensitive adhesive layer. The first layer includes a resin composition containing: 50 to 88 wt % of a polyolefin-based resin (A); 10 to 48 wt % of a styrene-based resin and/or an acrylic-based resin (B) excluding the polyolefin-based resin (A); and 2.0 to 30 wt % of a pigment (C), and the second layer contains a polyolefin-based ionomer resin (D) as a main constituent, and the ratio of thickness between the first layer and the second layer is 80:20 to 97:3.0. | 02-14-2013 |
20140205835 | BASE FILM FOR DICING SHEET AND DICING SHEET - A base film for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object without imparting physical energy, such as electron beam or γ ray. The base film for a dicing sheet comprises a resin layer. The resin layer comprises: a norbornene-based resin that is a thermoplastic resin having a norbornene-based compound as at least one type of monomer; and an olefin-based thermoplastic resin other than the norbornene-based resin. The norbornene-based resin in the resin layer has a content of more than 3.0 mass %. A dicing sheet is also provided which comprises: the base film for a dicing sheet; and a pressure-sensitive adhesive layer placed on a surface of the film at the resin layer side. | 07-24-2014 |
20140322528 | BASE FILM FOR DICING SHEET AND DICING SHEET - A base film for a dicing sheet is provided which can suppress dicing debris from generating during the dicing of a cut object without imparting physical energy, such as electron beam or γ ray. The base film for a dicing sheet comprises a resin layer. The resin layer comprises: a ring-containing resin that is a thermoplastic resin having a monomer, as a constitutional unit, having at least one type of an aromatic ring and an aliphatic ring; and an acyclic olefin-based resin that is an olefin-based thermoplastic resin other than the ring-containing resin. The ring-containing resin in the resin layer has a content of more than 3.0 mass %. A dicing sheet is also provided which comprises: the base film for a dicing sheet; and a pressure-sensitive adhesive layer placed on the base film. | 10-30-2014 |
Patent application number | Description | Published |
20130119649 | AIRBAG APPARATUS - An airbag apparatus having an airbag, which is formed into a bag shape by sewing a base fabric, is disclosed. The airbag includes a seam having a first seam section and a second seam section, which is formed after the first seam section is formed. The second seam section has an extremity and an overlapped portion, which is a section between the extremity and an intersected portion. The first seam section has an end part, which includes an overlapping portion. The overlapping portion is located at a position inside of the overlapped portion of the second seam section and extends along the overlapped portion. The overlapping portion includes an intersecting portion, which intersects the intersected portion of the second seam section. The end part of the first seam section further includes an extension, which extends from the intersecting portion to a position that is outside of the second seam section. | 05-16-2013 |
20140265277 | AIRBAG APPARATUS - An airbag apparatus has an airbag formed by sewing fabric portions together at peripheries thereof. A periphery sewn portion of the airbag has two terminals separated from each other. The terminals are formed by leaving sections of the peripheries of the fabric portions unsewn. A surrounding sewn portion is formed about each terminal of the periphery sewn portion. The airbag has a vent hole between the terminals. The opening of the vent hole is defined by vent hole defining sections, each of which is in one of the surrounding sewn portions. Position determining portions are provided in the margin of the airbag. Each surrounding sewn portion is formed in place with reference to the corresponding position determining portion. Each position determining portion is located father from the vent hole in the circumferential direction of the margin than the vent hole defining section of the corresponding surrounding sewn portion. | 09-18-2014 |
20160075303 | SIDE AIRBAG APPARATUS - A lateral partition divides the interior of an airbag main body into an upper inflation chamber including a first section and a lower inflation chamber including a second section. The upper inflation chamber is located above the second section of the lower inflation chamber. An upper restricting portion is provided in a bridging manner in the first section. The upper restricting portion has a front-rear length that is shorter than a circumferential length in a front-rear direction of the first section. The upper restricting portion is tensioned in the front-rear direction when the upper inflation chamber is inflated. The upper restricting portion restricts an inflated dimension in the front-rear direction of the upper inflation chamber such that an inflated dimension of the first section in a lateral direction of the automobile is greater than an inflated dimension of the lower inflation chamber in the lateral direction. | 03-17-2016 |
Patent application number | Description | Published |
20090013751 | Method of drawn and ironed processing of resin coated metal sheet and resin coated drawn and ironed can produced thereby - A method of drawn and ironed processing of a resin coated metal sheet, in which in the drawn and ironed processing of resin coated metal sheet, there can be obtained a can body of satisfactorily small wall thickness and at an opening edge part of the can body, the coating resin is free from any defect; and a resin coating drawn and ironed processed can produced thereby. | 01-15-2009 |
20090113976 | METHOD OF DRAWING AND IRONING A RESIN FILM LAMINATED METAL SHEET AND RESIN FILM LAMINATED DRAWN AND IRONED CAN USING THE SAME METHOD - A method of drawing and ironing a resin film laminated metal sheet for forming a can body having a bottom portion, a can wall portion and a flange-forming portion by drawing the resin film laminated metal sheet obtained by laminating at least one surface of a metal sheet with an organic resin film, followed by ironing by using a punch and a plurality of dies neighboring each other. The can wall is effectively prevented from being broken by a decrease in the thickness of the can wall, and drawn and ironed cans are efficiently formed having a thickness which is decreased as designed. | 05-07-2009 |
20150111057 | Surface-Treated Steel Sheet for Container Having Excellent Processing Adhesion to Resin, Method For Manufacturing Same, and Can - Provided is a container-use surface treated steel sheet which is manufactured without using chromium and exhibits excellent working adhesion with a coated organic resin, a method of manufacturing the container-use surface treated steel sheet, an organic resin coated surface treated steel sheet. The container-use surface treated steel sheet is a surface treated steel sheet where nickel plating is applied to at least one-side surface of surfaces of a steel sheet by coating, wherein nickel plating has a fine particle shape formed by fine particles which has particle density of 2 to 500 pieces/μm | 04-23-2015 |
Patent application number | Description | Published |
20140332397 | BATH FOR SURFACE TREATMENT, METHOD OF PRODUCING SURFACE-TREATED STEEL PLATE BY USING THE BATH FOR SURFACE TREATMENT, AND SURFACE-TREATED STEEL PLATE PRODUCED BY THE SAME METHOD - To provide a bath for surface treatment capable of forming a surface-treating film having excellent corrosion resistance by a high-speed electrolytic treatment, and a method of producing a surface-treated steel plate having excellent corrosion resistance and closely adhering property to the coating maintaining good productivity. A bath for surface treatment used for forming a surface-treating film on the surface of a steel plate by cathodic electrolysis, the bath for surface treatment containing Zr and/or Ti, and a polycarboxylic acid. | 11-13-2014 |
20150129453 | SURFACE TREATMENT AGENT COMPOSITION, METHOD FOR PRODUCING SURFACE-TREATED STEEL SHEET, SURFACE-TREATED STEEL-SHEET, SURFACE-TREATED STEEL SHEET WITH ORGANIC COATING, CAN LID, CAN BODY, AND SEAMLESS CAN - A surface treatment agent composition for non-chromium steel sheets for removing iron ions without reducing the amount of aluminum ions when subjecting the steel sheet to surface treatment by means of cathodic electrolysis using a surface treatment agent containing aluminum ions as the main component; and a method for producing a surface-treated steel sheet using the composition. A surface-treated steel sheet exhibiting high corrosion resistance, a surface-treated steel sheet with an organic coating, and a can lid, can body and seamless can produced using the surface-treated steel sheets. A surface treatment agent composition for steel sheets contains aluminum ions, fluorine ions and polycarboxylic acid and is used as the surface treatment bath used for forming a surface treatment coating film on the surface of the steel sheet by cathodic electrolysis. | 05-14-2015 |
20150246384 | METHOD OF MANUFACTURING CYLINDRICAL CONTAINER - There is provided a method of manufacturing a cylindrical container using a metal sheet on at least one surface of which the metal is exposed. The method includes: obtaining a blank having a hexagonal shape from the metal sheet; and processing the blank into a cylindrical shape by pressing a central part of the blank with a punch in a state in which a peripheral part of the blank is clamped between a die for drawing process and a blank holder. The method is characterized by the following features. At least one of the die for drawing process and the blank holder has a groove-formed area at a portion of a surface thereof. The portion corresponds to a side of the blank. The groove-formed area is formed with a plurality of grooves along the circumferential direction. The blank is processed into the cylindrical shape by clamping the peripheral part of the blank between the die for drawing process and the blank holder so that the surface of the blank on which the metal is exposed is in a state of facing the groove-formed area and the side of the blank is in a position that corresponds to the groove-formed area. | 09-03-2015 |