Spielberger
Lee Spielberger, Warwick, RI US
Patent application number | Description | Published |
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20140087621 | Modular Track for Model Vehicles - Modular tracks for model vehicles are disclosed. In some embodiments, a track of the present disclosure includes a plurality of track sections, each track section including at least one upper and lower surface and at least one end. In some embodiments, a first track section of the plurality of track sections includes a female connector and a male connector located in a first track section end region and a second track section of the plurality of track sections includes a male connector and a female connector located in a second track end region. In some embodiments, the female connector of the first track section correspondingly interconnects with the male connector of the second track section and the female connector of the second track section correspondingly interconnects with the male connector of the first track section to interconnect the first track section and the second track section. | 03-27-2014 |
Peter Spielberger, Wien AT
Patent application number | Description | Published |
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20090014484 | Holster for Small Arms - A holster for retaining a pistol has a frame configured to receive a pistol, with a first pistol retention facility on the frame. The first pistol retention facility has a secure condition and a release condition, and operates operable to prevent extraction of a pistol from the holster when in the secure condition, and to enable extraction of the pistol when in the release condition. The first pistol retention facility includes a first actuator operable in response to deliberate user force to set the first pistol retention facility in the release condition. The holster has a second pistol retention facility on the frame, and having a secure condition and a release condition, and operable to prevent extraction of a pistol from the holster when in the secure condition, and to enable extraction of the pistol when in the release condition. The second pistol retention facility includes a second actuator operable in response to deliberate user force to set the second pistol retention facility in the release condition. The actuators may be adjacent to each other to enable simultaneous actuation, and operation of one actuator may operate the other. | 01-15-2009 |
20090033101 | Method for the Generation of Electrical Energy, Method for Operation of an Electrically-Driven Motor Vehicle and Device for Generation of Electrical Energy and Electric Vehicle - A process for generation of electrical power comprises the exothermic, possibly catalytic, decomposition of a medium, preferably hydrogen peroxide, with the addition of water and the use of the steam to drive a steam machine, which is connected to an electricity generator. | 02-05-2009 |
20110107562 | Belt buckle - A belt buckle is provided with a waist belt outlet slot ( | 05-12-2011 |
Richard Spielberger, Maple Grove, MN US
Patent application number | Description | Published |
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20100007367 | Packaged Die Heater - A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature. | 01-14-2010 |
Richard K. Spielberger, Hannover, MN US
Patent application number | Description | Published |
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20080272482 | Integrated Circuit Package With Top-Side Conduction Cooling - An IC package that employs top-side conduction cooling. The IC package has a low thermal resistance between a substrate housed within the package and the lid of the package. Thermal resistance is decreased by increasing the conduction cross-sections laterally through the package and lid and vertically from the package into the lid. The lid may also be modified with an extended mesa portion that reduces the gap between the lid and the IC. A thermally conductive spacer may also be interposed between the IC and the lid. Also, the package housing body and lid may be made from high thermal conductivity materials having thermal conductivities of 50 W/mK or greater with matching CTE between the lid and the package. | 11-06-2008 |