Patent application number | Description | Published |
20090095891 | Image Sensor and Manufacturing Method Thereof - Disclosed is an image sensor. The image sensor includes a semiconductor substrate, a photodiode in the semiconductor substrate in each unit pixel, a lower color filter on each photodiode, a metal interconnection layer on or over the semiconductor substrate and the lower color filter, and a microlens on or over the metal interconnection layer corresponding to a particular lower color filter. | 04-16-2009 |
20090096050 | Image Sensor and Method for Manufacturing the Same - Disclosed are an image sensor and a method for manufacturing the same. The image sensor includes a semiconductor substrate including a unit pixel, first to third color filters provided on the semiconductor substrate, a first micro-lens provided on each of the first and third color filters, and a second micro-lens provided on the second color filter, in which an outer periphery of the first micro-lens has a square shape, and an upper portion of the first micro-lens has a semi-spherical or convex shape. | 04-16-2009 |
20100072568 | Image Sensor and Method of Manufacturing the Same - An image sensor and a method of manufacturing the same are disclosed. The image sensor includes a plurality of photodiodes on a substrate, an dielectric layer on the plurality of the photodiodes, a metal line layer in the dielectric layer corresponding to a border region between neighboring photodiodes, the metal line layer having a curved backside, a color filter layer on the dielectric layer, and a microlens on the color filter layer. | 03-25-2010 |
20100109112 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - An image sensor and a method for manufacturing the same are disclosed. The image sensor can include a semiconductor substrate that includes photodiodes arranged for each unit pixel; an interlayer dielectric layer and metal wirings disposed on the semiconductor substrate; and a photorefractive unit that is formed on the periphery of an optical path incident on the photodiodes. The photorefractive unit has a lower refractive index than the interlayer dielectric layer. The slantly incident light can be incident on the photodiodes, while maintaining the slanted optical path as it is. The light sensitivity of the photodiodes can be improved, thereby improving image quality. | 05-06-2010 |
20120113354 | Display Device and Method for Manufacturing Optical Member - Disclosed are a display device and a method for manufacturing an optical member. The display device includes a light source; a plurality of wavelength conversion particles to convert a wavelength of a light generated from the light source; and a tube to receive the wavelength conversion particles, wherein a scattering pattern is formed on at least one surface of the tube. | 05-10-2012 |
20120257414 | Display Device - Disclosed is a display device. The display device includes a light source, a light guide part to receive a light emitted from the light source, a light conversion member between the light source and the light guide part, and a spacer between the light source and the light conversion member. | 10-11-2012 |
20140009959 | DISPLAY DEVICE AND LIGHT CONVERSION MEMBER - Disclosed are a display device and a light conversion member. The display device includes a light source; and a light conversion member to convert a wavelength of light generated from the light source. The light conversion member includes a first region to convert light generated from the light source into light having a first color; and a second region to convert the light generated from the light source into light having a second color. | 01-09-2014 |
20140160789 | OPTICAL MEMBER AND DISPLAY DEVICE HAVING THE SAME - Disclosed are an optical member and a display device. The display device includes a light guide plate; a light source on a lateral side of the light guide plate; and a wavelength conversion member between the light source and the light guide plate. The wavelength conversion member includes a receiving part between the light source and the light guide plate; a host in the receiving part; and a plurality of wavelength conversion particles in the host. The receiving part includes a convex part between the light source and the host; and a concave part between the light guide plate and the host. | 06-12-2014 |
20140160790 | OPTICAL MEMBER AND DISPLAY DEVICE HAVING THE SAME - Disclosed are an optical member, a display device having the same, and a method of fabricating the same. The optical member includes a receiving part having an empty space therein, a host in the receiving part, a plurality of wavelength conversion particles in the host, a sealing part in the receiving part, and a pre-treatment layer between the sealing part and an inner surface of the receiving part. | 06-12-2014 |
20140313770 | DISPLAY DEVICE - Disclosed is a display device. The display device includes a light source, a light guide part to receive a light emitted from the light source, a light conversion member between the light source and the light guide part, and a spacer between the light source and the light conversion member. | 10-23-2014 |
20140319995 | DISPLAY DEVICE - Disclosed is a display device. The display device includes: a light source; an optical sheet into which light is incident from the light source; a display panel disposed on the optical sheet and including an effective display region and a non-effective display region around the effective display region; and a light conversion/light-blocking sheet corresponding to the non-effective display region. | 10-30-2014 |
20140346547 | Light Emitting Device Package - Disclosed is a light emitting device package. The light emitting device package includes a body part provided therein with a cavity, a light emitting chip in the cavity, a cover part to cover the cavity, and a light conversion part provided on a bottom surface of the cover part while being separated from the light emitting chip. | 11-27-2014 |
Patent application number | Description | Published |
20100193901 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a substrate including a trench, a buried gate filling a part of the trench, an inter-layer dielectric layer formed on the buried gate to gap-fill the rest of the trench, and a protection layer covering substantially an entire surface of the substrate including the inter-layer dielectric layer. | 08-05-2010 |
20110241106 | SEMICONDUCTOR DEVICE WITH BURIED GATES AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a supplementary layer and a silicon layer stacked over a substrate, a trench penetrating the supplementary layer and the silicon layer and formed over the substrate, a gate insulation layer formed along a surface of the trench, and a buried gate formed over the gate insulation layer and filling a portion of the trench. | 10-06-2011 |
20140256125 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a substrate including a trench, a buried gate filling a part of the trench, an inter-layer dielectric layer formed on the buried gate to gap-fill the rest of the trench, and a protection layer covering substantially an entire surface of the substrate including the inter-layer dielectric layer. | 09-11-2014 |