Felk
Guenter Felk, Ulm DE
Patent application number | Description | Published |
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20110078981 | PACKAGING FOR PHARMACEUTICAL PRODUCTS AND METHOD AND DEVICE FOR ITS PRODUCTION - The device for the production of a packaging for pharmaceutical products includes a forming station for forming troughs in a nonstretchable cover sheet in a stepwise, individual, successive manner, and further includes a transport device for laying the formed cover sheet onto a bottom sheet. This bottom sheet has pockets, which serve to hold the pharmaceutical products, and webs arranged between the pockets, and at least portions of some of the webs have ridges corresponding to the shape of the troughs in the cover sheet. The device further includes a sealing station for sealing the cover sheet to the bottom sheet. This sealing station has two sealing plates shaped in correspondence with the troughs in the cover sheet, thus resulting in the sealing of the cover sheet to the bottom sheet also in the area of the ridges of the bottom sheet. | 04-07-2011 |
20120031737 | DEVICE FOR CONVEYING OBJECTS IN PACKAGING MACHINES - The device for conveying objects in packaging machines has a first endless transport unit, which moves first driver elements; a second endless transport unit, which moves second driver elements; a motor-driven drive shaft, which drives the first endless transport unit; an auxiliary shaft, which drives the second endless transport unit; and a belt-type or chain-type connecting element for transmitting drive power from the drive shaft to the auxiliary shaft. The connecting element is guided between the drive shaft and the auxiliary shaft over a plurality of stationary auxiliary rollers and over at least two adjusting rollers, which can be shifted simultaneously in a direction perpendicular to their axes of rotation. The connecting element is guided in such a way that a shift of the adjusting rollers brings about a movement of the connecting element on the auxiliary shaft and thus a change in the angular position of the auxiliary shaft. | 02-09-2012 |
Gunter Felk, Ulm DE
Patent application number | Description | Published |
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20080271417 | Method of Manufacturing Packaging Comprising Pharmaceutical Products - The method for producing a multi-day package containing various drugs has the following steps: a bottom layer is formed with a plurality of wells arranged in a pattern; a predetermined number of different drugs is arranged in predetermined positions at various dispensing stations of a filling device; the desired number of drugs are picked in a controlled manner from their predetermined positions at each dispensing station by at least one movable suction or gripper device, and the drugs are deposited in the predetermined wells; and a sealing film is applied to the bottom layer to seal off the wells. In the course of this method, in at least one dispensing station several suction or gripper devices, which are arranged in correspondence with the pattern of the wells in the multi-day package and which travel parallel to each other, are actuated individually. | 11-06-2008 |
20080295460 | Method of Manufacturing Packaging Comprising Pharmaceutical Products - The method for producing a multi-day package containing various drugs has the following steps. A bottom layer is formed with a plurality of wells arranged in a pattern. A predetermined number of different drugs are arranged in predetermined positions at various dispensing stations of a filling device. The desired drugs are picked in a controlled manner from their predetermined positions at each dispensing station by at least one movable suction or gripper device, and the drugs are placed in predetermined wells. Finally, a sealing film is applied to the bottom layer to seal off the wells. | 12-04-2008 |
Yacine Felk, Grenoble FR
Patent application number | Description | Published |
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20110086468 | ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS - A method for assembling a first semiconductor chip provided with pads on a second semiconductor chip or wafer provided with pads, comprising covering the chip(s) with a dielectric, superposing the two chips, the pads being arranged substantially opposite to each other, and applying a voltage difference between the pads of the first and second chips to cause a breakdown of the dielectric and a diffusion of the conductor forming the pads into the broken down areas, whereby a conductive path forms between the opposite pads. | 04-14-2011 |
20110095437 | INTERFACE PLATE BETWEEN INTEGRATED CIRCUITS - An interface plate capable of being mounted between first and second surface-mounted electronic chips. The plate includes a plurality of first, second, and third through openings, the first openings being filled with a conductive material and being arranged to be in front of pads of the first and second chips during the assembly, the second openings being filled with a second material, the third openings being filled with a third material, the second and third materials forming two complementary components of a thermoelectric couple. | 04-28-2011 |
Yacine Felk, Avully CH
Patent application number | Description | Published |
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20120074527 | INTEGRATED CIRCUIT COMPRISING A DEVICE WITH A VERTICAL MOBILE ELEMENT INTEGRATED IN A SUPPORT SUBSTRATE AND METHOD FOR PRODUCING THE DEVICE WITH A MOBILE ELEMENT - The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element. | 03-29-2012 |