Rhine
Cindy Rhine, Alna, ME US
Patent application number | Description | Published |
---|---|---|
20110233958 | See thru sun visor - The present invention provides a See Thru Sun Visor, designed to replace any existing sun visor in order to provide sun blocking protection without obstructing the driver's view of the road comprising primarily heavy duty plastic, the See Thru Sun Visor is a see-through unit which features a smoky tinted plexiglass or shatterproof optical glass material, which filters the sun's harmful ultraviolet rays. Rectangular in shape, the See Thru Sun Visor measures the approximate length of standard visors and several inches in width. The device can be packaged in a kit and comes pre-assembled with the See Thru Sun Visor attached to the arm for easy installation. Simply remove the existing sun visor arm and install the See Thru Sun Visor. Both the driver and passenger side See Thru Sun Visor can be packaged and sold as a set, to be installed by the vehicle owner. | 09-29-2011 |
Danielle Rhine, Roanoke, VA US
Patent application number | Description | Published |
---|---|---|
20120100589 | METHOD FOR METHANE GENERATION - A method for treatment of a material comprising lignocellulosic fibres is disclosed. More particularly, the treatment increases the accessibility of the lignocellulosic fibres for following microbial or biological processes. | 04-26-2012 |
David Rhine, Georgetown, KY US
Patent application number | Description | Published |
---|---|---|
20110318882 | METHOD OF RESTRICTING CHIP MOVEMENT UPON BONDING TO RIGID SUBSTRATE USING SPRAY COATABLE ADHESIVE - A method of bonding a chip to a wafer at precise alignment suitable for fabricating a heater chip in an ink jet printhead is provided. The method includes spray coating an adhesive composition on a surface of a substrate, aligning and tacking at least one chip to the substrate coated with the adhesive composition, exposing the substrate tacked with at least one chip coated with the adhesive composition to radiation and heat, and performing thermal compression bonding. The method uses a spray coatable adhesive composition comprising a thermally activated adhesive and a photoacid generator. | 12-29-2011 |
20110319513 | SPRAY COATABLE ADHESIVE FOR BONDING SILICON DIES TO RIGID SUBSTRATES - A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate. | 12-29-2011 |
20130048601 | Use of Hydrogen-Oxygen Plasma for Forming Hydroxyl Functional Groups on a Polymer Surface - A method for improving adhesion between polymeric materials is provided. The method includes treating a surface of a first polymeric material with plasma of oxygen gas and hydrogen-containing gas. The first polymeric material may be a fully cured polymeric material. A second polymeric material may then be deposited on the plasma treated surface of the first polymeric material. The second polymeric material may be an uncured polymeric material. This plasma treatment may be used in improving the adhesion between polymeric components of an inkjet printer. It provides good adhesion between the polymeric components of the inkjet printer even after long exposure to ink. | 02-28-2013 |
David B. Rhine, Georgetown, KY US
Patent application number | Description | Published |
---|---|---|
20150360466 | FLUID EJECTION CHIP INCLUDING HYDROPHILIC AND HYDROPHOPIC SURFACES AND METHODS OF FORMING THE SAME - A fluid ejection chip and associated methods of forming are disclosed. According to an exemplary embodiment, the fluid ejection chip comprises a substrate, a flow feature layer, and a nozzle layer. The flow feature layer is disposed over the substrate and has an exposed hydrophilic surface layer with an ink contact angle of about 80 degrees. The nozzle layer is disposed over the flow feature layer and has a thickness of about 4 microns to about 8 microns and an exposed hydrophobic surface layer having an ink contact angle of about 115 degrees. | 12-17-2015 |
Holly Carol Rhine, Poway, CA US
Patent application number | Description | Published |
---|---|---|
20100079355 | MULTI-PANEL DEVICE WITH CONFIGURABLE INTERFACE - A multi-panel device is disclosed. In a particular embodiment, the device includes a first hinge coupled to a first panel and coupled to a second panel. The first panel includes a first display surface and the second panel includes a second display surface. The second hinge is coupled to the second panel and coupled to a third panel that includes a third display surface. The device also includes a sensor coupled to the first hinge to detect a relative orientation of the first panel to the second panel. The device includes a processor responsive to the sensor to detect a device configuration. The processor is configured to adjust a user interface displayed at the first display surface, the second display surface, and the third display surface based on the detected device configuration. | 04-01-2010 |
20100085274 | MULTI-PANEL DEVICE WITH CONFIGURABLE INTERFACE - A multi-panel device with a configurable interface is disclosed. In a particular embodiment, the device includes a hinge rotatably coupled to a first panel of the device via a first pin and rotatably coupled to a second panel of the device via a second pin. The first pin is engaged within a slot of the first panel to enable a lateral movement of the first panel relative to the second panel such that the first panel has a first range of motion relative to the second panel when the hinge is in an extended configuration and a second range of motion when the hinge is in a retracted configuration. The first range of motion is larger than the second range of motion. | 04-08-2010 |
Jeffrey Jay Rhine, Poway, CA US
Patent application number | Description | Published |
---|---|---|
20100079355 | MULTI-PANEL DEVICE WITH CONFIGURABLE INTERFACE - A multi-panel device is disclosed. In a particular embodiment, the device includes a first hinge coupled to a first panel and coupled to a second panel. The first panel includes a first display surface and the second panel includes a second display surface. The second hinge is coupled to the second panel and coupled to a third panel that includes a third display surface. The device also includes a sensor coupled to the first hinge to detect a relative orientation of the first panel to the second panel. The device includes a processor responsive to the sensor to detect a device configuration. The processor is configured to adjust a user interface displayed at the first display surface, the second display surface, and the third display surface based on the detected device configuration. | 04-01-2010 |
20100085274 | MULTI-PANEL DEVICE WITH CONFIGURABLE INTERFACE - A multi-panel device with a configurable interface is disclosed. In a particular embodiment, the device includes a hinge rotatably coupled to a first panel of the device via a first pin and rotatably coupled to a second panel of the device via a second pin. The first pin is engaged within a slot of the first panel to enable a lateral movement of the first panel relative to the second panel such that the first panel has a first range of motion relative to the second panel when the hinge is in an extended configuration and a second range of motion when the hinge is in a retracted configuration. The first range of motion is larger than the second range of motion. | 04-08-2010 |
Scott Rhine, Frisco, TX US
Patent application number | Description | Published |
---|---|---|
20080270752 | PROCESS ASSIGNMENT TO PHYSICAL PROCESSORS USING MINIMUM AND MAXIMUM PROCESSOR SHARES - A system and method is provided for assigning a plurality of executable processes to a plurality of physical processors in a multi-processor computer system using a minimum processor share and a maximum processor share defined for each executable process. In an embodiment, the method can include allocating shares of total processor time to each executable process in proportion to the minimum processor shares up to the maximum processor shares to form target share allocations. The target share allocations can be used to map processes to the physical processors. | 10-30-2008 |
Scott Rhine, Isanti, MN US
Patent application number | Description | Published |
---|---|---|
20090077550 | VIRTUAL MACHINE SCHEDULAR WITH MEMORY ACCESS CONTROL - A computer system comprises a virtual machine scheduler that dynamically and with computed automation controls non-uniform memory access of a plurality of cells in interleaved and cell local configurations. The virtual machine scheduler maps logical central processing units (CPUs) to physical CPUs according to preference and solves conflicts in preference based on a predetermined entitlement weight and iterative switching of individual threads. | 03-19-2009 |
Wendell E. Rhine, Belmont, MA US
Patent application number | Description | Published |
---|---|---|
20090029147 | AEROGEL-FOAM COMPOSITES - The invention provides reinforced aerogel monoliths as well as reinforced composites thereof for a variety of uses. Compositions and methods of preparing the monoliths and composites are also provided. Application of these materials in transparent assemblies is also discuss. | 01-29-2009 |
20120136079 | MODIFIED HYBRID SILICA AEROGELS - Disclosed and claimed herein are hybrid silica aerogels containing non-polymeric, functional organic materials covalently bonded at one or both ends to the silica network of the aerogels through a C—Si bond between a carbon atom of the organic material and a silicon atom of the aerogel network. Methods of their preparation are also disclosed. | 05-31-2012 |
20120175546 | ORGANICALLY MODIFIED HYBRID AEROGELS - Disclosed and claimed herein are hybrid aerogels which are compositions of tetraalkoxysilanes and bis-(trialkoxysilyl)imides that exhibit low thermal conductivities and high compressive strengths. Methods for their preparation are also provided. | 07-12-2012 |
20120189782 | ELECTRONIC DEVICE MANUFACTURE USING LOW-k DIELECTRIC MATERIALS - Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided. | 07-26-2012 |
20130287661 | AEROGEL SORBENTS - The current invention describes methods and compositions of various sorbents based on aerogels of various silanes and their use as sorbent for carbon dioxide. Methods further provide for optimizing the compositions to increase the stability of the sorbents for prolonged use as carbon dioxide capture matrices. | 10-31-2013 |
20150021509 | ORGANICALLY MODIFIED HYBRID AEROGELS - Disclosed and claimed herein are hybrid aerogels which are compositions of tetraalkoxysilanes and bis-(trialkoxysilyl) imides that exhibit low thermal conductivities and high compressive strengths. Methods for their preparation are also provided. | 01-22-2015 |
20150065590 | MODIFIED HYBRID SILICA AEROGELS - Disclosed and claimed herein are hybrid silica aerogels containing non-polymeric, functional organic materials covalently bonded at one or both ends to the silica network of the aerogels through a C—Si bond between a carbon atom of the organic material and a silicon atom of the aerogel network. Methods of their preparation are also disclosed. | 03-05-2015 |
20150145106 | ELECTRONIC DEVICE MANUFACTURE USING LOW-k DIELECTRIC MATERIALS - Materials and methods for manufacturing electronic devices and semiconductor components using low dielectric materials comprising polyimide based aerogels are described. Additional methods for manipulating the properties of the dielectric materials and affecting the overall dielectric property of the system are also provided. | 05-28-2015 |
20150259476 | ORGANICALLY MODIFIED HYBRID AEROGELS - Disclosed and claimed herein are hybrid aerogels which are compositions of tetraalkoxysilanes and bis-(trialkoxysilyl) imides that exhibit low thermal conductivities and high compressive strengths. Methods for their preparation are also provided. | 09-17-2015 |