Patent application number | Description | Published |
20110064541 | Spine formation device, post-processing apparatus, and bookbinding system - An spine formation device includes a sheet conveyer, a contact member including a first row of grooves provided in a contact surface thereof to house a projection projecting from a folded portion of a bundle of folded sheets, a driving unit to move the contact member, first and second sandwiching units to squeeze the bundle, a discharge unit, and a controller. The first row of grooves extends in parallel to the folded portion of the bundle and includes at least a first pair of grooves inclined in different directions with an interval therebetween varying in size with location of the grooves in a first direction perpendicular to a sheet conveyance direction. The contact member is moved to change the size of interval between the first pair of grooves at a position aligned with the projection projecting from the folded portion of the bundle of folded sheets. | 03-17-2011 |
20110103919 | Spine formation device, bookbinding system, and spine formation method - A spine formation device includes a sheet conveyer, a clamping unit disposed downstream from the sheet conveyer in a sheet conveyance direction, for squeezing a folded portion of a bundle of folded sheets, a contact member against which the folded portion of the bundle is pressed, disposed downstream from the clamping unit, and a controller to cause the bundle of folded sheets to bulge by stopping the sheet conveyer after the bundle of folded sheets is transported a predetermined conveyance distance from a contact position between the contact member and the folded portion of the bundle and to cause the clamping unit to squeeze a bulging portion of the bundle created between the sheet conveyer and the contact member with the folded portion pressed against the contact member. The predetermined distance is set in accordance with a predetermined sheet-related variable. | 05-05-2011 |
20110103921 | Spine formation device, bookbinding system, and control method therefor - An spine formation device includes a sheet conveyer that conveys the bundle of folded sheets with a folded portion of the bundle of folded sheets forming a front end portion of the bundle of folded sheets, a spine formation unit disposed downstream from the sheet conveyer in a sheet conveyance direction for forming the spine of the bundle of folded sheets by squeezing the folded portion of the bundle from a folded leading side, a front side, and a back side of the bundle, a discharge unit to discharge the bundle of folded sheets outside the spine formation device, disposed downstream form the spine formation unit in the sheet conveyance direction, and a controller to cause the spine formation unit to operate in one of multiple selectable control modes for controlling the spine formation unit in accordance with at least one of multiple predetermined sheet-related variables. | 05-05-2011 |
Patent application number | Description | Published |
20080246146 | WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD - A method of manufacturing a wiring substrate comprises: a first step of forming, on a support plate, an electrode pad made of metal; a second step of etching the support plate in such a manner that the support plate has a shape which includes a projection portion to be contacted with the electrode pad; a third step of forming, on the surface of the support plate, an insulating layer for covering the electrode pad; a fourth step of forming, on the surface of the insulating layer, a conductive pattern to be connected to the electrode pad; and, a fifth step of removing the support plate. | 10-09-2008 |
20080258300 | WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD - A semiconductor device | 10-23-2008 |
20080297221 | DELAY CIRCUIT AND DELAY TIME ADJUSTMENT METHOD - A delay circuit includes an interface for giving a command of setting a delay time and a delay device that can be set to any desired delay time, and the delay time of the delay device is set according to a command from the interface. | 12-04-2008 |
20080308308 | METHOD OF MANUFACTURING WIRING BOARD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRING BOARD - A semiconductor device | 12-18-2008 |
20090101401 | WIRING BOARD - A thickness of the portion, which is placed between an electronic component mounting pad and a first wiring, of a first insulating layer (insulating layer in which electronic component mounting pads are placed) is set to be smaller than a thickness of the portion, which is placed between the first wiring and a second wiring, of a second insulating layer. | 04-23-2009 |
20100032196 | MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a multilayer wiring board having a wiring layer, a pad, an insulating layer provided between the wiring layer and the pad, and a plurality of connecting vias provided on the insulating layer and connecting the wiring layer to the pad, the connecting vias are provided on a peripheral edge of the pad. | 02-11-2010 |
20100084163 | WIRING BOARD AND METHOD OF FABRICATING THE SAME - A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad. | 04-08-2010 |
20110139502 | WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD - A semiconductor device | 06-16-2011 |
20120006591 | Wiring Substrate and Method for Manufacturing Wiring Substrate - A wiring substrate that prevents the occurrence of delamination near an interface between an insulation layer and an electrode pad, which is formed in a recess of the insulation layer. An adjustment layer is formed in an opening in a resist, which is applied to a support body, to adjust the shape of the electrode pad. The adjustment layer includes a flat surface, which is substantially parallel to the support body, and an inclined surface, which extends from a rim of the flat surface toward the support body and to the side wall of the opening. A pad body of the electrode pad and an insulation layer including a wire is formed on the adjustment layer. The support body and adjustment layer are etched to expose the pad body. | 01-12-2012 |
20130153271 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 06-20-2013 |
20130185936 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 07-25-2013 |
20140020931 | SUPPORT BODY, METHOD OF MANUFACTURING SUPPORT BODY, METHOD OF MANUFACTURING WIRING BOARD, METHOD OF MANUFACTURING ELECTRONIC COMPONENT, AND WIRING STRUCTURE - A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer. | 01-23-2014 |
20140076614 | WIRING SUBSTRATE - A wiring substrate includes a first insulating layer, an adhesion insulating layer formed under the first insulating layer and an outer face of the adhesion insulating layer is made to a roughened face, a first wiring layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer, and in which a first via hole reaching the first wiring layer is provided, a second wiring layer formed on the second insulating layer, and connected to the first wiring layer through the first via hole, a second via hole formed in the adhesion insulating layer and the first insulating layer, and reaching the first wiring layer, and a third wiring layer formed on the outer face of the adhesion insulating layer, and connected to the first wiring layer through the second via hole. | 03-20-2014 |
20140087556 | METHOD OF MANUFACTURING WIRING SUBSTRATE - A method of manufacturing a wiring substrate, includes, forming an etching stop layer and a first wiring layer on a supporting member, forming a first insulating layer on the first wiring layer, forming a via hole reaching the first wiring layer, and forming the wiring layers of an n-layer and the insulating layers of an n-layer, removing the supporting member and the etching stop layer, thereby forming a build-up intermediate body, forming a second insulating layer on the wiring layer of an n-th layer, and forming a third insulating layer on first wiring layer, forming a via hole reaching the wiring layer of the n-th layer, and forming a via hole reaching the first wiring layer, forming a roughened face to the third insulating layer, and forming a second wiring layer connected to the wiring layer, and forming a third wiring layer connected to the first wiring layer. | 03-27-2014 |
20140097009 | WIRING SUBSTRATE - A wiring substrate includes a first wiring layer, a first insulating layer, a second wiring layer, and a first wiring pattern. The second wiring layer includes a first metal foil that is thinner than the first wiring layer. A first via in the first insulating layer connects the first and second wiring layers. The first via is arranged to fill a first through hole and a first recess. The first through hole extends through the first insulating layer and has a first open end with a first opening diameter and a second open end with a smaller second opening diameter. The first recess is in communication with the first through hole. The first recess has a larger diameter than the second opening diameter. The first metal foil includes a first opening communicating with the first through hole and having a larger opening diameter larger than the first opening diameter. | 04-10-2014 |
20150014020 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A wiring substrate includes an insulating layer, a first pad, and a solder resist layer. The first pad is embedded in the insulating layer. The solder resist layer is provided on an upper surface of the insulating layer. The solder resist layer is formed with an opening portion through which the recess portion is exposed. An adjacent portion of the solder resist layer adjacent to a peripheral portion of the opening portion covers a peripheral portion of the upper surface of the first pad and protrudes from the peripheral portion of the upper surface of the first pad toward the center portion of the first pad so as to cover above the recess portion. Surfaces of the first pad being in contact with the insulating layer are smaller in roughness than the upper surface of the insulating layer and the peripheral portion of the upper surface of the first pad. | 01-15-2015 |
20150014027 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring substrate includes an insulating layer, a pad, and a solder resist layer. The insulating layer has a first surface formed with a first recess portion. The pad is embedded in the first recess portion. The pad includes a second surface and a third surface. The third surface that is located at a lower position than the first surface so as to expose an inner wall surface of the first recess portion. The pad is formed with a second recess portion in a center portion of the third surface. The solder resist layer is provided on the first surface. An adjacent portion of the first surface to a peripheral portion of the first recess portion is smaller in roughness than a region of the first surface peripheral to the adjacent portion of the first surface. | 01-15-2015 |
Patent application number | Description | Published |
20080202661 | Method of manufacturing wiring substrate and method of manufacturing electronic component device - In a method of manufacturing a wiring substrate of the present invention, first, a structure in which an underlying layer is arranged in a wiring forming area of a temporary substrate and a peelable multi-layer metal foil that is larger in size than the underlying layer is arranged on the underlying layer and is adhered partially to an outer peripheral portion of the wiring forming area of the temporary substrate, and the peelable multi-layer metal foil is constructed by temporary adhering a first metal foil and a second metal foil with peelable. Then, a built-up wiring layer is formed on the peelable multi-layer metal foil, and the peelable multi-layer metal foil is separated from the temporary substrate by cutting a portion of such a structure that the underlying layer, the peelable multi-layer metal foil, and the built-up wiring layer are formed on the temporary substrate, the portion corresponding to a peripheral portion the underlying layer, whereby a wiring member in which the built-up wiring layer is formed on the peelable multi-layer metal foil is obtained. | 08-28-2008 |
20100065322 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 03-18-2010 |
20110169164 | WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE - A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess. | 07-14-2011 |
20110289770 | APPARATUS FOR AND METHOD OF MANUFACTURING TEMPORARY SUBSTRATE - An apparatus for manufacturing a temporary substrate includes a jig having a table, a holding guide for positioning constituent members of the temporary substrate, a holding unit for holding the laminated constituent members, and a heater unit for performing a temporary bonding on the laminated constituent members, and further includes a drive mechanism for moving each member constituting the jig between a standby position and an in-use position. The holding guide has a plurality of step portions formed in such a manner that peripheries of the step portions define areas corresponding to outer sizes of the respective constituent members when the holding guide is moved to the in-use position. The temporary substrate has as the constituent members, a prepreg, inner metal foils respectively stacked on both surfaces of the prepreg and each having a smaller outer size than the prepreg, and outer metal foils respectively stacked on the inner metal foils and each having a larger outer size than the prepreg. | 12-01-2011 |
20120175153 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings. | 07-12-2012 |
20130075145 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height. | 03-28-2013 |
20130134127 | WIRING BOARD AND METHOD OF FABRICATING THE SAME - A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad. | 05-30-2013 |
20130140692 | WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE INCLUDING WIRING SUBSTRATE - A wiring substrate includes an insulating layer having a first surface on which a projecting part is formed, and an electrode pad being formed on the projecting part and including a first electrode pad surface and a second electrode pad surface on a side opposite to the first electrode pad surface. The first electrode pad surface is exposed from the projecting part of the insulating layer. The second electrode pad surface is covered by the insulating layer. A cross-section of the projecting part is a tapered shape. One side of the cross-section toward the first electrode pad surface is narrower than another side of the cross-section toward the first surface of the insulating layer. | 06-06-2013 |
20130143062 | METHOD AND SUPPORT MEMBER FOR MANUFACTURING WIRING SUBSTRATE, AND STRUCTURE MEMBER FOR WIRING SUBSTRATE - A wiring substrate manufacturing method includes forming a layered configuration including a first metal layer, a peeling layer, and a second metal layer, removing an edge part of the layered configuration, so that the first metal layer is smaller than the second metal layer from a plan view, forming a support body by adhering the first metal layer to a base member and adhering the base member to a process part, the process part being formed by the removing of the edge part, forming a wiring substrate on the second metal layer, removing a part of the support body and a part of the wiring substrate that are superposed with respect to the process part from a plan view, and separating the second metal layer and the wiring substrate from the support body after the removing of the parts of the support body and the wiring substrate. | 06-06-2013 |
20130269185 | WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE - A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess. | 10-17-2013 |
20130314886 | WIRING BOARD AND MOUNTING STRUCTURE - A wiring board includes an insulating layer; a connection part provided on a surface of the insulating layer, the connection part including a first plating layer including a flat surface and a curved surface continuous with the flat surface, wherein the flat surface and the curved surface are exposed on the insulating layer, and an end portion of the curved surface is in contact with the surface of the insulating layer; and a second plating layer formed on an interior surface of the first plating layer so as to be coated with the first plating layer; and a via formed in the insulating layer so as to be connected to the second plating layer. | 11-28-2013 |
20140021625 | WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE - A wiring substrate includes an insulating layer including a reinforcement member and having a first surface and a second surface positioned on an opposite side of the first surface, an electrode pad exposed from the first surface, a layered body including first insulating layers and being formed on the second surface, the first insulating layers having a first insulating material as a main component, another layered body including second insulating layers and being formed on the layered body, the second insulating layers having a second insulating material as a main component, and another electrode pad exposed from a surface of the another layered body that is opposite to the layered body. The number of the first insulating layers is equal to that of the second insulating layers. The first insulating layers have a thermal expansion coefficient that is greater than that of the second insulating layers. | 01-23-2014 |
20150289380 | WIRING BOARD AND METHOD OF FABRICATING THE SAME - A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad. | 10-08-2015 |
Patent application number | Description | Published |
20150083720 | FUEL FILLER SYSTEMS AND METHODS OF ASSEMBLING SAME - Systems and methods for assembling a fuel filler system for use in a vehicle are provided. The fuel filler system includes a closure device assembly and a fuel filler tube. A circumferential rim extends radially outwardly from a first end of the fuel filler tube. The rim has a non-planar cross-sectional shape. The fuel filler system also includes at least one catch member that extends from an inner surface of the closure device assembly. A seal member encircles a portion of the closure device assembly, and is axially spaced apart from the at least one catch member. After the closure device assembly is coupled to the fuel filler tube, the circumferential rim is axially captured between the at least one catch member and the seal member. | 03-26-2015 |
20150083721 | FUEL FILLER SYSTEMS AND METHODS OF ASSEMBLING SAME - Systems and methods for assembling a fuel filler system for use in a vehicle are provided. A locking bracket is coupled within an end of a fuel filler tube. At least one passage is defined in the locking bracket for facilitating insertion of a closure device into the fuel filler tube end. At least one anti-removal structure on the closure device passes through the at least one passage during insertion of the closure device. The at least one anti-removal structure precludes removal of the closure device after insertion of the closure device, and rotation of the closure device from a first rotational position relative to the locking bracket to a second rotational position. First and second anti-rotation structures extending from the closure device engage first and second ends of the locking bracket to prevent further rotation of the closure device. | 03-26-2015 |
20150136768 | FUEL FILLER SYSTEMS AND METHODS OF ASSEMBLING SAME - A fuel filler system for use in a vehicle is provided. The system includes a fuel filler tube, a locking bracket coupled to an inner surface of the fuel filler tube, and a closure device coupleable within the tube end and including an outer wall and a radially movable tab extending from the outer wall. The tab engages the locking bracket after rotation of the closure device from a first rotational position to a second rotational position to prevent rotation of the closure device relative to the locking bracket. The closure device further includes a web flexibly connecting the tab to the outer wall and a region of weakness defined in the web, such that upon forcible rotation of the closure device from the second rotational position to the first rotational position, the region of weakness facilitates separation of the web from the outer wall. | 05-21-2015 |
20150291022 | CAPLESS FUEL FILLER ASSEMBLY FOR VEHICLE - A fuel filler assembly for a vehicle includes a main flap unit connected to a fuel filler pipe adjacent a filling end thereof and a main flap pivotally disposed on the main flap unit for selectively closing access to the filling end of the fuel filler pipe. The fuel filler assembly further includes a shutter unit connected to the fuel filler pipe adjacent the filling end thereof and engaging the main flap unit, and a shutter pivotally disposed on the shutter unit for selectively closing access to the filling end of the fuel filler pipe. Cooperative engagement (e.g., an interference fit) between the main flap unit and the shutter unit seals the main flap unit and the shutter unit together and prevents fuel from leaking therebetween. | 10-15-2015 |