Patent application number | Description | Published |
20080223514 | SYSTEMS AND METHODS FOR ELECTRICAL CONTACTS TO ARRAYS OF VERTICALLY ALIGNED NANORODS - Systems and methods may provide electrical contacts to an array of substantially vertically aligned nanorods. The nanorod array may be fabricated on top of a conducting layer that serves as a bottom contact to the nanorods. A top metal contact may be applied to a plurality of nanorods of the nanorod array. The contacts may allow I/V (current/voltage) characteristics of the nanorods to be measured. | 09-18-2008 |
20080268669 | Transferable Micro Spring Structure - A method for mounting the micro spring structures onto cables or contact structures includes forming a spring island having an “upside-down” stress bias on a first release material layer or directly on a substrate, forming a second release material over at least a portion of the spring island, and then forming a base structure over the second release material layer. The micro spring structure is then transferred in an unreleased state, inverted such that the base structure contacts a surface of a selected apparatus, and then secured (e.g., using solder reflow techniques) such that the micro spring structure becomes attached to the apparatus. The spring structure is then released by etching or otherwise removing the release material layer(s). | 10-30-2008 |
20090077807 | Self-Releasing Spring Structures And Methods - According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention. | 03-26-2009 |
20100140858 | 'All In One' Spring Process For Cost-Effective Spring Manufacturing And Spring Self-Alignment - A method of forming spring structures using a single lithographic operation is described. In particular, a single lithographic operation both defines the spring area and also defines what areas of the spring will be uplifted. By eliminating a second lithographic operation to define a spring release area, processing costs for spring fabrication can be reduced. | 06-10-2010 |
20100184311 | Micro-Machined Structure Production Using Encapsulation - Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure. | 07-22-2010 |
20100213161 | Capillary-Channel Probes For Liquid Pickup, Transportation And Dispense Using Stressy Metal - Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved. | 08-26-2010 |
20100216669 | Capillary-Channel Probes For Liquid Pickup, Transportation And Dispense Using Stressy Metal - Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved. | 08-26-2010 |
20100221375 | Extrusion/Dispensing Systems And Methods - A device for extruding/dispensing materials on a substrate includes a housing with at least two channels formed to facilitate flow. The housing includes entrance ports for each of the channels for receiving different materials. The housing further includes an exit port for co-extruding the materials on the substrate to generate a relatively fine feature with a relatively high aspect ratio. | 09-02-2010 |
20100252104 | Solar Cell With High Aspect Ratio Gridlines Supported Between Co-Extruded Support Structures - A solar cell structure formed by extruding/dispensing materials on a substrate such that centrally disposed conductive high aspect ratio line structures (gridlines) are formed on the substrate surface with localized support structures coincidentally disposed on opposing side surfaces of the gridlines such that the gridlines are surrounded or otherwise supported by the localized support structures. In one embodiment the localized support structures are transparent, remain on the substrate after the co-extrusion process, and are covered by a layer of material. In another embodiment, the localized support structures are sacrificial support structures that are removed as part of the solar cell structure manufacturing process. In both cases the co-extrusion process is performed such that both the central gridline and the localized support structures are in direct contact with the surface of the substrate. | 10-07-2010 |
20100252105 | Cell Structure With High Aspect Ratio Gridlines - A cell structure (e.g., a battery or solar cell) is formed by extruding/dispensing materials on a substrate such that centrally disposed conductive high aspect ratio line structures (gridlines) are formed on the substrate surface such that each gridline has an aspect ratio greater than 2:1. Each gridline is formed with localized support structures coincidentally disposed on opposing side surfaces of the gridlines such that the gridlines are surrounded or otherwise supported by the localized support structures. The localized support structures are sacrificial in the sense that they are removed as part of the solar cell structure manufacturing process (e.g., after subsequent processing hardens the gridline material). In one embodiment each gridline has a width in the range of 100 nanometers to 100 microns. The co-extrusion process is performed such that both the central gridline and the localized support structures are in direct contact with the surface of the substrate. | 10-07-2010 |
20120021170 | Micro-Machined Structure Production Using Encapsulation - Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure. | 01-26-2012 |