Yoshimizu, JP
Chikai Yoshimizu, Ibaraki JP
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20090014194 | Electric power tool - A cover which covers outer peripheries of fastening screws are disposed on an outer periphery of a hammer case. A stopper which detachably positions and fixes the cover to the outer periphery of the hammer case is disposed. | 01-15-2009 |
20090108806 | ADAPTOR, ASSEMBLY OF BATTERY PACK AND ADAPTOR, AND ELECTRIC TOOL WITH THE SAME - When a battery pack having an output voltage of 14.4 V that is connectable to an electric tool in a sliding manner is used as a power supply source for the electric tool that is connectable to a battery pack in an insertion manner and has a rated voltage of 12 V, the electric tool and the battery pack are connected to each other with an adaptor interposed therebetween. The adaptor has an FET that is switched at a predetermined duty of a predetermined frequency. The battery pack and the electric tool are connected or disconnected to or from each other by the switching operation, thereby dropping the output voltage of the battery pack. The voltage from the battery pack is detected. When the detected voltage is out of a predetermined value range, it is judged that the overcurrent or overdischarge has occurred. Then, the FET is turned off to stop the electric tool. | 04-30-2009 |
20120104881 | ELECTRIC MOTOR AND WORKING MACHINE COMPRISING THE SAME - A motor has an output shaft which is rotatably supported by a housing, a rotor which is fixed to the output shaft and which comprises a printed-wiring board, and a stator which is fixed to the housing and which comprises a magnet facing the rotor. The printed-wiring board comprises a coil/commutator disk and a coil disk. A commutator conductor pattern is formed in a commutator region of the coil/commutator disk. Likewise, coil conductor patterns are formed in respective coil regions of the coil/commutator disk and of the coil disk. | 05-03-2012 |
20120104983 | WORK MACHINE AND BRUSHLESS MOTOR - An electric grasscutter includes a motor ( | 05-03-2012 |
20120199372 | IMPACT TOOL - According to an aspect of the present invention, there is provided an impact tool including: a motor; a hammer connected to an output portion of the motor; and an anvil to be struck by the hammer in a rotation direction and having a rotary shaft, the hammer striking the anvil in the rotation direction by driving the motor in pulses, wherein the anvil is provided in front of the hammer, wherein the hammer is driven in pulses by the motor, and wherein a rotation angle of the hammer is substantially proportional to a rotation angle of the motor. | 08-09-2012 |
20120262035 | ADAPTOR, ASSEMBLY OF BATTERY PACK AND ADAPTOR, AND ELECTRIC TOOL WITH THE SAME - When a battery pack having an output voltage of 14.4 V that is connectable to an electric tool in a sliding manner is used as a power supply source for the electric tool that is connectable to a battery pack in an insertion manner and has a rated voltage of 12 V, the electric tool and the battery pack are connected to each other with an adaptor interposed therebetween. The adaptor has an FET that is switched at a predetermined duty of a predetermined frequency. The battery pack and the electric tool are connected or disconnected to or from each other by the switching operation, thereby dropping the output voltage of the battery pack. When the detected voltage is out of a predetermined value range, it is judged that the overcurrent or overdischarge has occurred. Then, the FET is turned off to stop the electric tool. | 10-18-2012 |
Chikai Yoshimizu, Hitachinaka JP
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20150214520 | ELECTRIC DEVICE, BATTERY PACK, AND ELECTRIC APPARATUS - The sealing property obtained when a battery pack is attached to an electric power tool is improved. An electric power tool to/from which a battery pack retaining a battery cell is attachable/detachable has: a tool main body being provided with an attachment part to/from which the battery pack is attached/detached; a guide groove which is provided in the attachment part and which determines a direction of the attachment/detachment of the battery pack; a device-side terminal which is provided in the attachment part and which is connected to a battery-side terminal provided in the battery pack; and a seal member which is provided in the attachment part and which seals a connecting part between the battery-side terminal and the device-side terminal. | 07-30-2015 |
Chikai Yoshimizu, Hitachinaka-Shi JP
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20110025255 | Solar Power System For Charging Battery Pack - A solar power system has a charging device. The charging device is powered by a solar cell to charge a battery pack having a secondary cell. The charging device has input voltage detection circuit that detects an input voltage from the solar cell; switching circuit that converts the input voltage to supply a charging current to the battery pack; charging current detection circuit that detects the charging current; and control circuit that controls the switching circuit to change the input voltage in order that a resultant charging current becomes suitable for charging the battery pack. | 02-03-2011 |
20110199756 | Power Tool - A power tool includes a motor as a drive power source, a body housing the motor and having an end output unit for chucking an end tool, a handle grip connected to the body; and a light unit disposed to one of the handle grip and the body, and having a light-emitting element for providing illumination near the end tool. The light unit includes an angle adjuster and holder which adjusts and holds a lighting angle of the light-emitting element at least in accordance with a length of the end tool. | 08-18-2011 |
20120033405 | Power Tool - A power tool includes a body housing a motor and a power transmission mechanism positioned ahead of the motor for transmitting a power of the motor, a handle grip having an upper end portion connected to an approximately intermediate portion of the body and a lower end portion to which a battery is connected, a light emitting element positioned below the power transmission mechanism and receiving electrical power from the battery for illuminating a portion ahead of the body, and a trigger positioned below the power transmission mechanism for controlling a supply of the electrical power from the battery to the motor and to the light emitting element. | 02-09-2012 |
20120139456 | ELECTRIC OPERATING MACHINE - When a main switch ( | 06-07-2012 |
Chikai Yoshimizu, Ibaraki-Ken JP
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20090039136 | ELECTRIC FASTENER DRIVER - An electric fastener driver having a compact size and simple construction. A driver segment provided with a rack is movably disposed in a housing. A flywheel is driven by a motor. A drive shaft is concentric with and integral with the flywheel. A coil spring is fixed to the drive shaft. A driven rotor is coaxial with the drive shaft and has one end portion serving as a spring seat portion positioned within the coil spring. A pinion is disposed at the driven rotor and is meshedly engaged with the rack. An urging section is disposed within the driven rotor. A ball is movably disposed in a through-hole formed in the driven rotor for urging an end portion of the coil spring by the urging section. A solenoid controls a protruding amount of the ball from the surface of the driven rotor. | 02-12-2009 |
Eiki Yoshimizu, Kanagawa JP
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20100149299 | IMAGE FORMING APPARATUS - An inkjet recording apparatus provides an improved printing speed and improved convenience of use. A recording head discharges droplets of a recording liquid onto a paper so as to form an image on the paper. A belt conveyance mechanism has a belt onto which the paper is electrostatically attached. The paper attached onto the belt is conveyed in a direction perpendicular to a carding direction of the paper. | 06-17-2010 |
20150360892 | SEPARATION CONVEYANCE DEVICE, IMAGE FORMING APPARATUS, METHOD FOR CONTROLLING SEPARATION CONVEYANCE DEVICE, AND COMPUTER-READABLE RECORDING MEDIUM - A separation conveyance device comprises: a separation unit that includes a first roller feeding a conveyance object, and a load unit applying a load to the fed conveyance object, and separates one conveyance object from conveyance objects; a second roller that conveys the fed conveyance object; a driving unit that causes a motor to rotate the first roller at a first linear speed and the second roller at a second linear speed higher than the first linear speed; a connection unit that cuts off the motor's power from the first roller when first load torque toward a rotation direction of the first roller is equal to or larger than a certain value; a detection unit that detects second load torque in the direction opposite to a rotation direction of the motor; and a determination unit that determines a separation state of the conveyance object based on the second load torque. | 12-17-2015 |
Hisanori Yoshimizu, Ayase-Shi JP
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20150257284 | METHOD OF BENDING BACK RIGID PRINTED WIRING BOARD WITH FLEXIBLE PORTION - A method for bending back a rigid printed wiring board with a flexible portion includes: forming a preparation substrate on a surface of a prepreg made of thermosetting resin, the preparation substrate including a conducting layer made of a conductive material; laminating the plurality of preparation substrates; thermally hardening the thermosetting resin so as to integrate the plurality of laminated preparation substrates as an intermediate substrate while heating and pressing together the plurality of preparation substrates; cutting an insulating layer formed by thermally hardening the thermosetting resin in a lamination direction of the preparation substrate so as to form a flexible portion, the flexible portion being thinly formed across opposed both edges of the intermediate substrate to form a complete substrate; bending the flexible portion; bending-back the flexible portion; and dehydrating by raising a temperature of the bent flexible portion before bending-back the flexible portion. | 09-10-2015 |
Hisato Yoshimizu, Ibaraki JP
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20130306911 | Method of Producing Fluorescent Material Dispersed Glass and Fluorescent Material Dispersed Glass - A method of manufacturing fluorescent material-dispersed glass, comprising: performing production of a fluorescent material-dispersed gel utilizing sol-gel reaction and acid-base reaction by preparing a fluorescent material-dispersed sol containing silicon alkoxide, metal chloride and/or metal aklkoxide, and fluorescent material, and subsequently gelling the fluorescent material-dispersed sol; and performing production of a fluorescent material-dispersed glass by heating the fluorescent material-dispersed gel. | 11-21-2013 |
Kazutaka Yoshimizu, Toyota-Shi JP
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20110313632 | VEHICLE POWER TRANSMISSION APPARATUS - A control unit ( | 12-22-2011 |
Kazuyuki Yoshimizu, Tokyo JP
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20080268616 | SEMICONDUCTOR DEVICE, ITS MANUFACTURE METHOD AND ELECTRONIC COMPONENT UNIT - A LED chip having first and second electrodes on opposite principal surfaces, is bonded to a substrate through a composite bonding layer. The composite bonding layer is formed when a support substrate including the substrate and a first bonding layer is bonded to a lamination structure including the LED, the first electrode and a second bonding layer. The first or second bonding layer contains at least part of eutectic composition. At least one of the support substrate and the lamination structure includes a diffusion material layer. The composite bonding layer is formed in such a manner that eutectic material contents are mixed with the other to form a first mixture, and that the first mixture is mixed with diffusion material to form a second mixture having a melting point higher than a melting point of the first mixture. | 10-30-2008 |
20100044734 | MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT-EMITTING APPARATUS AND SEMICONDUCTOR LIGHT-EMITTING APPARATUS - A method includes forming a light-emission operating layer on a growth substrate; forming a reflection insulating layer on the light-emission operating layer; forming opening portions in the insulating layer; forming a contact portion which has a thickness adapted to flatten the opening portions and has been embedded into the opening portions; forming an electrode layer on the insulating layer and the contact portions; forming a first bonding metal layer on the electrode layer; preparing a supporting substrate in which a second bonding metal layer has been formed; and making the first and second bonding metal layers molten and joined. | 02-25-2010 |
Keiko Yoshimizu, Yokohama JP
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20120281207 | DEFECT INSPECTION DEVICE USING CATADIOPTRIC OBJECTIVE LENS - A defect inspection device comprises an inspection optical system including a light source, a half mirror for reflecting illumination light emitted from the light source, a catadioptric objective lens for collecting reflected light from the sample by illumination light reflected by the half mirror, an imaging lens for focusing the reflected light transmitted through the catadioptric objective lens, a relay lens having a blocking member provided at a position at which specularly reflected light from the sample is focused by the imaging lens, and a detector for defecting the reflected light of the specularly deflected light blocked by the blocking member; and a computation processing unit for detecting defects of the sample on the basis of the signals detected by the detector. | 11-08-2012 |
Keiko Yoshimizu, Yokohama-Shi JP
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20110228537 | Adjustable Beam Size Illumination Optical Apparatus and Beam Size Adjusting Method - An adjustable beam size illumination optical apparatus includes a beam size adjusting optical system which includes groups of cylindrical array lenses disposed correspondingly to the long and short axis directions respectively and having variable intervals among the lenses, and a group of cylindrical telescope lenses disposed correspondingly to one of the long and short axis directions and having variable intervals among the lenses, and adjusts parallel light from a light source in size in accordance with the two axis directions orthogonal to each other. The lens interval of one of the cylindrical array lens groups and the cylindrical telescope lens group is changed to adjust a beam size on a projection surface in accordance with the long axis direction or the short axis direction. Thus, it is possible to adjust the beam size in accordance with the long axis direction and the short axis direction individually, and it is possible to make irradiation with the beam with uniform intensity. | 09-22-2011 |
Miwako Yoshimizu, Ryugasaki-Shi JP
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20110104709 | POROUS SOLID PHASE FOR BINDING ASSAY, AND BINDING ASSAY METHOD USING THE SAME - A porous solid phase for binding assay that enables a test sample such as whole blood to be analyzed promptly, conveniently, accurately, and inexpensively without requiring a pretreatment, and a binding assay method using said porous solid phase are disclosed. At least one surfactant is incorporated into the porous solid phase for binding assay prior to addition of a test sample, the at least one surfactant being selected from the group consisting of (A) a sugar-containing surfactant that comprises a compound shown by a general formula (I), (B) a sugar-containing surfactant that comprises a sucrose fatty acid ester wherein the constituent fatty acid has 5 to 14 carbon atoms, and (C) a steroid surfactant. | 05-05-2011 |
Naofumi Yoshimizu, Saitama JP
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20130162688 | IMAGE PROJECTING APPARATUS, IMAGE PROCESSING METHOD, AND COMPUTER-READABLE STORAGE MEDIUM - An image projecting apparatus includes an image projecting unit configured to project received original image data on an image projection surface; an area identifying unit configured to identify an obstruction area in which different content is displayed as compared to a normal projection surface to be projected based on the original image data; and a layout modifying unit configured to modify a layout of an object included in the original image data that is projected, on the basis of the object and the obstruction area on the image projection surface. | 06-27-2013 |
20130169607 | PROJECTION DISPLAY DEVICE, PROJECTION DISPLAY METHOD, AND COMPUTER PROGRAM - A projection display device according to the invention includes a separating unit that assigns X separation information for identifying a type of an image to each pixel by using a characteristic amount of the input image, a luminance detecting unit that detects a luminance of a screen, a first determining unit that determines a first target region indicating a region on which halftone processing of converting the number of gradations is performed on the input image by using the X separation information, and a halftone processing unit that executes the halftone processing that varies depending on the luminance on the first target region. | 07-04-2013 |
Takao Yoshimizu, Tokyo JP
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20080312435 | Imine Compound - An imine compound represented by the formula: | 12-18-2008 |
Takashi Yoshimizu, Kariya-City JP
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20110180915 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic device includes a heat sink, a substrate mounted on the heat sink, a coating layer formed on the substrate, a lead frame fixed to the heat sink, and a mold resin sealing the substrate and the lead frame. The coating layer is made of one of a polyimide-based resin and a polyamideimide-based resin. The lead frame has a fixing terminal fixed to the heat sink through an adhesive layer. The adhesive layer is made of the same material as the coating layer. | 07-28-2011 |
Toshiyuki Yoshimizu, Osaka-Shi JP
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20120154825 | LOCATION IDENTIFICATION SENSOR, ELECTRONIC DEVICE, AND DISPLAY DEVICE - The present invention provides a location identification sensor ( | 06-21-2012 |
20120249484 | COORDINATE SENSOR AND DISPLAY DEVICE - A coordinate sensor of the present invention includes light emitting diodes ( | 10-04-2012 |
20130027355 | INPUT DISPLAY DEVICE, INPUT DEVICE, AND CONTROL METHOD OF INPUT DEVICE - The present invention provides an input display device including: a display device which recognizes an input position with a light sensor by blinking a backlight; and an input device of a light-emitting type (light pen), wherein a light emitting diode (LED) of the input device is adapted so that (i) its non-light-emitting period overlaps at least a part of a period (X) during which the backlight is OFF and (ii) its light-emitting period overlaps at least a part of a period (Y) during which the backlight is ON. According to this arrangement, it is possible to realize an input display device which can reduce the effect of ambient light and in which a light pen can be used (in addition to a finger and a reflective pen etc.) as inputting means. | 01-31-2013 |
Toshiyuki Yoshimizu, Osaka JP
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20100118227 | LIQUID CYSTAL DISPLAY PANEL WITH MICROLENS ARRAY AND METHOD FOR MANUFACTURING THE SAME - A highly reliable liquid crystal display panel is provided in which problems such as mixing of foreign matter are prevented. | 05-13-2010 |
20110025956 | LIQUID CRYSTAL DISPLAY DEVICE - A liquid crystal display device of high image quality is provided at a low cost, in which the viewing angle is restricted only in a specific direction. | 02-03-2011 |
20110069253 | LIQUID CRYSTAL DISPLAY DEVICE - One of the objects is to improve the light utilization efficiency of a liquid crystal display panel with microlenses. | 03-24-2011 |
20110298757 | TOUCH PANEL INPUT SYSTEM AND INPUT PEN - A touch panel input system of the present invention includes a touch panel integrated liquid crystal display device ( | 12-08-2011 |
20110316005 | DISPLAY APPARATUS - In a liquid crystal display apparatus ( | 12-29-2011 |
20120162064 | COORDINATE SENSOR AND DISPLAY DEVICE - The amount of the light emitted from a light-emitting diode is changed from that of the initial condition to increase, among the light sensors that are not shielded from the light emitted from the light-emitting diode, the number of the light sensors at which the difference (C−D) between the light detection amount at the light sensor when the light-emitting diode is ON and the light detection amount at the light sensor when the light-emitting diode is OFF is equal to the difference (A−B) between the light detection amount at the light sensor in the initial condition when the light-emitting diode was ON and the light detection amount at the light sensors in the initial condition when the light-emitting diode was OFF with no detection object present. As a result, regardless of the presence or absence of the detection object, the coordinate sensor and the display device disclosed can establish a threshold for determining the presence or absence of the detection object, and can also determine the coordinates of the detection object in a stable manner regardless of changes in the ambient environmental light or in the ambient environmental temperature, or fluctuations in the amount of light emitted from the light-emitting element disposed in the coordinate sensor or the change in the sensitivity of the light-receiving elements. | 06-28-2012 |
20120176342 | POSITION DETECTION SYSTEM, DISPLAY PANEL, AND DISPLAY DEVICE - In an LED unit ( | 07-12-2012 |
20130082982 | OPTICAL RECEIVING DEVICE AND OPTICAL TOUCH PANEL DEVICE PROVIDED WITH SAME - A light-receiving device | 04-04-2013 |
Toshiyuki Yoshimizu, Kyoto JP
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20090284683 | LIQUID CRYSTAL DISPLAY PANEL PROVIDED WITH MICROLENS ARRAY, METHOD FOR MANUFACTURING THE LIQUID CRYSTAL DISPLAY PANEL, AND LIQUID CRYSTAL DISPLAY DEVICE - There is provided a liquid crystal display panel with microlenses in which deformation, peeling, and the like of an optical film are not likely to occur and which has a good displaying quality. | 11-19-2009 |
Yasuhito Yoshimizu, Mie JP
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20130249062 | FILM EMBEDDING METHOD AND SEMICONDUCTOR DEVICE - A method of forming an embedded film comprises depositing a first layer on a second layer that is disposed on a substrate and includes a material different from materials included in the first layer, forming an aperture through the first layer and into the second layer, the aperture having a side surface that includes an exposed portion of the first layer and an exposed portion of the second layer, bringing a material that includes organic molecules into contact with the exposed portion of the first layer and the exposed portion of the second layer to form a monomolecular film that covers the side surface, and forming the embedded film in the aperture with a material having a high enough affinity to the monomolecular film to substantially fill the aperture. | 09-26-2013 |
20140065555 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - According to one embodiment, a manufacturing method includes forming a desired pattern containing an uneven pattern on a substrate, subjecting the surface of the desired pattern to a water repellent treatment, forming a resist film on the desired pattern, performing an exposure treatment to expose the uneven pattern, rinsing the substrate with water, and drying the substrate. | 03-06-2014 |
20140065765 | MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF FUNCTIONAL ELEMENT - According to one embodiment, the manufacturing method of a functional element includes filling a solvent comprising hydrogen gas and having organic molecules dispersed therein into a gap between the first electrode and the second electrode formed facing the first electrode, and forming an organic layer containing the organic molecules mentioned above between the first electrode and the second electrode. | 03-06-2014 |
Yasuhito Yoshimizu, Yokkaichi-Shi JP
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20130307047 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a device includes a first fin structure having first to n-th semiconductor layers (n is a natural number equal to or more than 2) stacked in a first direction perpendicular to a surface of a semiconductor substrate, and extending in a second direction parallel to the surface of the semiconductor substrate, first to n-th memory cells provided on surfaces of the first to n-th semiconductor layers in a third direction perpendicular to the first and second directions respectively, and first to n-th select transistors connected in series to the first to n-th memory cells respectively. | 11-21-2013 |
Yasuhito Yoshimizu, Kanagawa-Ken JP
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20100078622 | NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME - A nonvolatile memory device includes: a substrate; a stacked structure member including a plurality of dielectric films and a plurality of electrode films alternately stacked on the substrate and including a through-hole penetrating through the plurality of the dielectric films and the plurality of the electrode films in a stacking direction of the plurality of the dielectric films and the plurality of the electrode films; a semiconductor pillar provided in the through-hole; and a charge storage layer provided between the semiconductor pillar and each of the plurality of the electrode films. At least one of the dielectric films includes a film generating one of a compressive stress and a tensile stress, and at least one of the electrode films includes a film generating the other of the compressive stress and the tensile stress. | 04-01-2010 |
20110061684 | CLEANING METHOD FOR SEMICONDUCTOR WAFER - A cleaning method for a semiconductor wafer with cleaning liquid comprising: | 03-17-2011 |
20120104340 | NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME - A nonvolatile memory device includes: a substrate; a stacked structure member including a plurality of dielectric films and a plurality of electrode films alternately stacked on the substrate and including a through-hole penetrating through the plurality of the dielectric films and the plurality of the electrode films in a stacking direction of the plurality of the dielectric films and the plurality of the electrode films; a semiconductor pillar provided in the through-hole; and a charge storage layer provided between the semiconductor pillar and each of the plurality of the electrode films. At least one of the dielectric films includes a film generating one of a compressive stress and a tensile stress, and at least one of the electrode films includes a film generating the other of the compressive stress and the tensile stress. | 05-03-2012 |
20130065400 | ETCHING METHOD - According to one embodiment, an etching method includes: supplying an etching-resistant material; and etching the silicon nitride film. The supplying includes supplying the etching-resistant material to a processing surface including a surface of a silicon nitride film and a surface of a non-etching film, the non-etching film including a material different from the silicon nitride film. The etching includes etching the silicon nitride film using an etchant in a state of the etching-resistant material being formed relatively more densely on the surface of the non-etching film than on the surface of the silicon nitride film. | 03-14-2013 |
20130154087 | METHOD FOR FORMING INTERCONNECTION PATTERN AND SEMICONDUCTOR DEVICE - According to one embodiment, a method for forming an interconnection pattern includes forming an insulating pattern, forming a self-assembled film, and forming a conductive layer. The insulating pattern has a side surface on a major surface of a matrix. The self-assembled film has an affinity with a material of the insulating pattern on the side surface of the insulating pattern. The forming the conductive layer includes depositing a conductive material on a side surface of the self-assembled film. | 06-20-2013 |
Yasuhito Yoshimizu, Kanagawa JP
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20120024317 | CLEANING APPARATUS AND CLEANING METHOD - According to one embodiment, a cleaning apparatus includes a removing unit whose tip portion is harder than a constituent material of a surface layer on a back surface side of a semiconductor wafer (wafer) and which is configured to clean a back surface of the wafer held by a holding unit and a moving mechanism that relatively moves the removing unit and the wafer in a direction parallel to the wafer back surface. The removing unit grinds and removes a protrusion that is formed of a material same as the surface layer of the wafer back surface, by the moving mechanism relatively moving the removing unit and the wafer and causing the tip portion of the removing unit to come into contact with the protrusion. | 02-02-2012 |
Yasuhito Yoshimizu, Yokkaichi Mie JP
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20160005604 | Manufacturing Method of Semiconductor Device - According to an embodiment, a manufacturing method of a semiconductor device includes: forming a first film on a processing target by using a first material; forming a second film on the first film by using a second material; selectively removing the second and first films to provide an opening pierced in the second and first films; selectively forming a metal film on an inner surface of the opening in the first film; and processing the processing target by using the metal film as a mask. | 01-07-2016 |
Yasuhito Yoshimizu, Yokohama-Shi JP
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20090255558 | CLEANING APPARATUS FOR SEMICONDUCTOR WAFER AND CLEANING METHOD FOR SEMICONDUCTOR WAFER - A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas. | 10-15-2009 |
20090286391 | SEMICONDUCTOR DEVICE FABRICATION METHOD - According to one aspect of the invention, there is provided a qsemiconductor device fabrication method having: | 11-19-2009 |
20130037055 | CLEANING METHOD, CLEANING APPARATUS - Transferring plural semiconductor substrates under a state being held with predetermined intervals; holding the plural semiconductor substrates with roll brushes provided in plural pieces by each front side and back side of the plural semiconductor substrates, longitudinal directions of the roll brushes being oriented in parallel relative to the front side and the back side; and cleaning the plural semiconductor substrates by rotating the plural roll brushes. | 02-14-2013 |
Yasuhito Yoshimizu, Kawasaki-Shi JP
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20110230054 | SEMICONDUCTOR SUBSTRATE CLEANING METHOD - In one embodiment, a semiconductor substrate cleaning method is disclosed. The method can clean a semiconductor substrate by using a chemical of 80° C. or above. The method can rinse the semiconductor substrate by using pure water of 40° C. or above after the cleaning of the semiconductor substrate. The method can then rinse the semiconductor substrate by using pure water of 30° C. or below. In addition, the method can dry the semiconductor substrate. | 09-22-2011 |