Patent application number | Description | Published |
20080268373 | Imide-Urethane Resin, Photosensitive Resin Composition Including the Same and Cured Product - [PROBLEMS] To provide a photosensitive resin composition which has excellent photosensitivity and gives a cured product reduced in warpage and excellent in flexing properties, adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, resistance to gold plating, etc. | 10-30-2008 |
20090042126 | Photosensitive resin composition and cured article thereof - A photosensitive resin composition which is excellent in photosensitivity and excellent in flame resistance, flexibility, adhesiveness, pencil hardness, resistance to solvent, acid resistance, heat resistance, resistance to gold plating and the like and a cured article thereof are provided. | 02-12-2009 |
20090117388 | Epoxy Resin, Curable Resin Composition and Cured Product Thereof - Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (α) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50≦1000×(A−B)/B≦250 (α) | 05-07-2009 |
20090131607 | Epoxy Resin, Epoxy Resin Composition, Photosensitive Resin Composition and Cured Object Obtained Therefrom - [Problems] To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. | 05-21-2009 |