Gonska
Brent Ryan Gonska, Wilmington, DE US
Patent application number | Description | Published |
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20090143608 | SULFUR CONTAINING FLUOROALKYL AMINES AND ISOCYANATES - The present invention provides a method of making sulfur containing fluoroalkyl amines which overcomes the problems previously known methods. Unlike previously known methods, the method of the present invention can achieve higher yields of sulfur containing fluoroalkyl amines without resorting to costly solvents. Furthermore, unlike previously known methods, the method of the present invention can produce oxidized forms of sulfur containing fluoroalkyl amines wherein the sulfur atom thereof is oxidized. | 06-04-2009 |
20110009668 | POLYFLUOROSULFONAMIDO AMINE AND INTERMEDIATE - Current methods for making polyfluorosulfonamido amines, which involve the use of a diamine reactant, provide low yields and produce an undesirable fluorine containing bis-sulfonamide by-product representing an economic loss. The bis-sulfonamide by-product is particularly undesirable because it shares very similar physical properties with the desired monoamine product thus making isolation of the desired polyfluorosulfonamido amine product difficult and costly. Furthermore, instead of the efficient incorporation of fluorine to make the desired polyfluorosulfonamido amine product, the bis-sulfonamide by-product constitutes a substantial loss of costly fluorinated starting material. The bis-sulfonamide by-product also constitutes an undesirable impurity that can worsen surfactancy, repellency, or other performance characteristics of the desired polyfluorosulfonamido amine product. The present invention provides a method of making a polyfluorosulfonamido amine without the production of a bis-sulfonamide by-product by reacting a polyfluoroalkylsulfonic compound with a monoamino amide rather than with a diamine reactant as in previously known methods. | 01-13-2011 |
David Gonska, Beverly Hills, MI US
Patent application number | Description | Published |
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20100154955 | DRIVE AXLE WITH AIR PASSAGE FOR TIRE INFLATION SYSTEM - A drive axle assembly includes a non-rotating spindle having a cylindrical body defining an internal cavity and an axle shaft assembly mounted within the internal cavity for rotation about an axis. A seal assembly is positioned within the internal cavity to provide a sealed chamber between the axle shaft assembly and the non-rotating spindle. A first air passage is formed within the cylindrical body and includes an air inlet to be in fluid communication with an air supply and an air outlet in fluid communication with the sealed chamber. A second air passage is formed within the axle shaft assembly and receives air input from the sealed chamber and includes an air output to be associated with at least one tire. | 06-24-2010 |
20100181739 | SPINDLE FOR CONTROLLING WHEEL END ENDPLAY AND PRELOAD - A spindle includes an inner bearing shoulder to seat an inner bearing and an outer bearing shoulder to seat an outer bearing. The inner and outer bearing shoulders are spaced apart by a controlled distance such that the outboard bearing is accurately positioned relative to the inboard bearing to control endplay and preload without requiring bearing adjustment. | 07-22-2010 |
20100244546 | AXLE SHAFT ASSEMBLY - An axle shaft is fabricated from two separate pieces. The axle shaft is comprised of an axle shaft body having a forged initial flange portion formed at one end. An axle shaft flange, fabricated by stamping or casting for example, is secured to the forged initial flange portion at a weld interface to form a finished axle shaft. | 09-30-2010 |
David G. Gonska, Beverly Hills, MI US
Patent application number | Description | Published |
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20090101457 | WHEEL HUB FOR CAMSHAFT SERVICEABILITY - A wheel hub includes a hub flange that extends about the wheel hub. The hub flange includes a removed section that is aligned with a camshaft assembly. An insert is used to fill the removed section. The insert is selectively removable from the hub flange to provide access to the removed section such that the camshaft assembly can be removed from a brake assembly via the removed section without having to remove the wheel hub from an axle assembly. | 04-23-2009 |
20120223498 | ADJUSTMENT ASSEMBLY - An adjustment assembly includes first and second connection points associated with a component. The second connection point is selectively adjustable to adjust a position of the component. A shield has one end coupled to the first connection point and an opposite end proximate to the second connection point to selectively prevent access to the second connection point. The shield is selectively movable when the first connection point is loosened to allow access to the second connection point. To achieve proper adjustment of the component, the first connection point must be loosened prior to adjusting a position of the second connection point. | 09-06-2012 |
David Gregory Gonska, Beverly Hills, MI US
Patent application number | Description | Published |
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20100147429 | TIRE INFLATION SYSTEM WITH INTEGRATED WHEEL SEAL - An axle assembly includes a non-rotating component and a wheel hub supported for rotation relative to the non-rotating component about an axis. The wheel hub includes a hub air passage that has a hub inlet and a hub outlet to be fluidly connected to at least one tire. An air chamber is formed at least in part between the non-rotating component and the wheel hub. The air chamber receives air flow from an air source and directs air flow into the hub inlet. A seal assembly engages the wheel hub to seal the air chamber. | 06-17-2010 |
20110162773 | TIRE INFLATION SYSTEM WITH INTEGRATED WHEEL SEAL - An axle assembly includes a non-rotating component and a wheel hub supported for rotation relative to the non-rotating component about an axis. The wheel hub includes a hub air passage that has a hub inlet and a hub outlet to be fluidly connected to at least one tire. An air chamber is formed at least in part between the non-rotating component and the wheel hub. The air chamber receives air flow from an air source and directs air flow into the hub inlet. A seal assembly engages the wheel hub to seal the air chamber. | 07-07-2011 |
Gernot Gonska, Bad Vibel DE
Patent application number | Description | Published |
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20100302728 | CHASSIS FOR INVERTER - The present invention provides an inverter or other electronically controlled power source for transforming electrical energy into electrical energy of predetermined voltage and/or current comprising: an inner housing for housing the main circuitry of the inverter, a cover connected to the inner housing, covering at least part of the inner housing, defining at least one cover channel between the inner housing and the cover for air to flow through that channel for cooling of the inverter, whereby the cover channel is adapted to facilitate natural convection of the air. The present invention further proposes an inverter according to any of the preceding claims, additionally comprising at least one ventilator to enhance an air flow through the channel. According to the invention the cooling properties of an inverter are to be improved. | 12-02-2010 |
Heinrich Gonska, Offenburg DE
Patent application number | Description | Published |
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20080202557 | Industrial Dishwasher and Method of Operating the Same - Industrial dishwasher and method of operating the same, wherein, during at least one operating state other than the drying phase, program control automatically provides for second ambient air to be blown by means of the additional blower directly into the drying channel and through the latter and out through the blowing-out opening, the dishwasher being switched on but the main blower being switched off. | 08-28-2008 |
20080202566 | INDUSTRIAL DISHWASHER - Industrial dishwasher with a main blower and an additional blower and a drying channel, wherein, in the base, the drying channel has a drainage means which runs transversely to the channel base and has a drainage opening, the channel base sloping up in the direction of the drainage means. | 08-28-2008 |
20080264458 | Commercial Dishwasher - A commercial dishwasher ( | 10-30-2008 |
Julian Gonska, Reutlingen DE
Patent application number | Description | Published |
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20080254635 | Method for Accelerated Etching of Silicon - A method for the plasma-free etching of silicon using the etching gas ClF | 10-16-2008 |
20100028618 | MICROMECHANICAL DEVICE WHICH HAS CAVITIES HAVING DIFFERENT INTERNAL ATMOSPHERIC PRESSURES - A micromechanical device having a substrate wafer has at least one first cavity and one second cavity, the cavities being hermetically separated from each other, the first cavity having a different internal atmospheric pressure than the second cavity. The cavities are capped by a thin film cap. A method is for manufacturing a micromechanical device which has a thin film cap having cavities of different internal atmospheric pressures. | 02-04-2010 |
20100258884 | Method for attaching a first carrier device to a second carrier device and micromechanical components - A method for attaching a first carrier device to a second carrier device includes forming at least one first bond layer and/or solder layer on a first exterior of the first carrier device, a partial surface being framed by the at least one first bond layer and/or solder layer, and placing the first carrier device on the second carrier device and fixedly bonding or soldering the first carrier device to the second carrier device. The at least one first bond layer and/or solder layer includes a first cover area which is larger than a first contact area. | 10-14-2010 |
20120045628 | MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT - A method is described for producing a micromechanical component. The method includes providing a first substrate, providing a second substrate, developing a projecting patterned element on the second substrate, and connecting the first and the second substrate via the projecting patterned element. The method provides that the connecting of the first and the second substrate includes eutectic bonding. Also described is a micromechanical component, in which a first and a second substrate are connected to each other. | 02-23-2012 |
20130147020 | Component Having a Via and Method for Manufacturing It - An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer. | 06-13-2013 |
20130161820 | METHOD FOR BONDING TWO SILICON SUBSTRATES, AND A CORRESPONDEING SYSTEM OF TWO SILICON SUBSTRATES - A method for bonding two silicon substrates and a corresponding system of two silicon substrates. The method includes: providing first and second silicon substrates; depositing a first bonding layer of pure aluminum or of aluminum-copper having a copper component between 0.1 and 5% on a first bonding surface of the first silicon substrate; depositing a second bonding layer of germanium above the first bonding surface or above a second bonding surface of the second silicon substrate; subsequently joining the first and second silicon substrates, so that the first and the second bonding surfaces lie opposite each other; and implementing a thermal treatment step to form an eutectic bonding layer of aluminum-germanium or containing aluminum-germanium as the main component, between the first silicon substrate and the second silicon substrate, spikes which contain aluminum as a minimum and extend into the first silicon substrate, forming at least on the first bonding surface. | 06-27-2013 |
20130285175 | MICROMECHANICAL COMPONENT AND METHOD FOR MANUFACTURING A MICROMECHANICAL COMPONENT - A micromechanical component, in particular a micromechanical sensor having a carrier substrate and having a cap substrate, and a manufacturing method are provided. The carrier substrate and the cap substrate are joined together with the aid of a eutectic bond connection or by a metallic solder connection or a glass solder connection (e.g., glass frit), in an edge area of the carrier substrate and the cap substrate. The connection of the carrier substrate and the cap substrate is established with the aid of connecting areas, and a stop trench or a stop protrusion or both a stop trench and a stop protrusion are situated within the edge areas in the bordering areas. | 10-31-2013 |
20130334622 | MICROMECHANICAL DEVICE AND METHOD FOR MANUFACTURING A MICROMECHANICAL DEVICE - A micromechanical device, in particular a sensor device, and a method for manufacturing a micromechanical device are provided. The micromechanical device has a housing, the housing including a first cavity, and the housing including a second cavity that is separate from the first cavity. The micromechanical device is configured in such a way that a predetermined first gas pressure prevails in the first cavity, and a predetermined second gas pressure which is reduced compared to the first gas pressure prevails in the second cavity. A heating element is situated in the area of the second cavity. The micromechanical device has a printed conductor, the heating element being heatable with the aid of the printed conductor. | 12-19-2013 |
20140117472 | MICROMECHANICAL COMPONENT - A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed. | 05-01-2014 |
20150123221 | MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD - A micromechanical sensor device and a corresponding manufacturing method are described. The micromechanical sensor device includes a CMOS wafer having a front side and a rear side, a rewiring device formed on the front side of the CMOS wafer including a plurality of stacked printed conductor levels and insulation layers, an MEMS wafer having a front side and a rear side, a micromechanical sensor device formed across the front side of the MEMS wafer, a bond connection between the MEMS wafer and the CMOS wafer, a cavern between the MEMS wafer and the CMOS wafer, in which the sensor device is hermetically enclosed, and an exposed getter layer area applied to at least one of the plurality of stacked printed conductor levels and insulation layers. | 05-07-2015 |
20150137329 | COMPONENT HAVING A VIA AND METHOD FOR MANUFACTURING IT - An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a conductive substrate. The via (Vertical Interconnect Access), which is led to the back side of the component and which is used for the electrical contacting of functional elements realized in the layer construction, includes a connection area in the substrate that extends over the entire thickness of the substrate and is electrically insulated from the adjoining substrate by a trench-like insulating frame likewise extending over the entire substrate thickness. According to the present system, the trench-like insulating frame is filled up with an electrically insulating polymer. | 05-21-2015 |
20150353349 | COMPONENT INCLUDING TWO SEMICONDUCTOR ELEMENTS, WHICHARE BONDED TO ONE ANOTHER VIA A STRUCTURED BONDING LAYER, ANDMETHOD FOR MANUFACTURING A COMPONENT OF THIS TYPE - Measures are provided for improving and simplifying metallic bonding processes which enable a reliable initiation of the bonding process and thus contribute to a uniform bonding. The present method provides a further option for using bonding layers. The method in the case of which the two semiconductor elements are bonded to one another via a bond of at least one metallic starting layer and at least one further starting layer provides that the two starting layers are structured in such a way that the layer areas which are assigned to one another have differently sized areal extents. Moreover, the layer thicknesses of the two starting layers should be selected in such a way that the layer areas which are assigned to one another meet the material ratio necessary for the bonding process. | 12-10-2015 |
Julian Gonska, Reutingen DE
Patent application number | Description | Published |
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20150123217 | Micromechanical sensor unit and method for manufacturing micromechanical sensor units - A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, in the first method step the substrate and the sealing cap being configured and joined in such a way that, as a result of bonding the sealing cap and the substrate, a first cavity, which has a first pressure and in which a first sensor element is situated, and a second cavity, which has a second pressure and in which a second sensor element is situated, are manufactured, in a second method step a sealable channel leading into the first cavity being created, in a third method step the first pressure in the first cavity being established via the sealable channel. | 05-07-2015 |
Jullian Gonska, Reutlingen DE
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20150353346 | Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component - For the targeted influencing of the internal pressure within a cavity between two elements of a component, a getter material or an outgassing material is situated in an additional cavity between the two elements. After the two elements are bonded to one another, the additional cavity is still to be joined via a connecting opening to the cavity. The getter material or the outgassing material is then activated so that gasses are bound in the additional cavity and in the connected cavity, or an outgassing takes place. Only when the sought internal pressure has established itself in the connected cavity is the connecting opening to the additional cavity closed. In this way, the getter material or the outgassing material is only used for establishing a defined internal pressure, but no longer has any influence on the internal pressure within the cavity during ongoing operation of the component. | 12-10-2015 |
Maurice Gonska, Kassel DE
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20110231159 | FORWARDING OPERATION DATA RELATED TO THE PRESENT OPERATION OF A PLURALITY OF INVERTER UNITS TO A MONITORING UNIT - For forwarding operation data related to the present operation of a plurality of inverter units which feed electric power from power generators into a power grid to a monitoring unit, the inverter units and a plurality of intermediate data handling units are connected to the central monitoring unit in a communication network of logical tree architecture. The tree architecture branches towards the inverter units, and several inverter units are connected to each intermediate unit. The operation data from each inverter unit are forwarded to that intermediate unit to which the inverter unit is connected; and, in each intermediate unit connected between the inverter units from which the operation data are forwarded and the monitoring unit, operation data of the same type forwarded from the inverter units connected to the intermediate unit are merged to reduce their data volume, and only the merged operation data are forwarded towards the monitoring unit. | 09-22-2011 |