Patent application number | Description | Published |
20080267233 | RESISTIVE HEATING ELEMENT FOR ENABLING LASER OPERATION - Heating resistor used to control laser operation. A laser package, such as a Transmitter Optical Subassembly (TOSA) includes a substrate. A laser is disposed on the substrate. A resistive heating element is disposed on the substrate with the laser. Control circuitry is connected to the resistive heating element. The control circuitry is configured to cause current flow through the resistive heating element based on temperature conditions. Current flow through the resistive heating element causes an increase in the operating temperature of the laser. This can be used to increase the effective operating temperature range of a laser. | 10-30-2008 |
20090028579 | FIBER OPTIC LINK HAVING AN INTEGRATED LASER AND PHOTODETECTOR CHIP - A fiber optic communications link is disclosed that can include first and second nodes operably connected by a multi-mode optical fiber and that utilizes two distinct optical wavelengths for enabling the bidirectional transfer of data via the optical fiber between the first and second nodes. Each node can include an integrated transmitter/receiver chip that includes a substrate, an optical receiver or transmitter, a filter, and an optical transmitter or receiver. The transmitter of the chip at the first node can be configured to transmit, via the optical fiber, optical data on one wavelength for conversion to an electrical signal by the receiver of the chip at the second node. Simultaneously, the transmitter of the chip at the second node can be configured to transmit, via the optical fiber, optical data on another wavelength for conversion to an electrical signal by the receiver of the chip at the first node. | 01-29-2009 |
20090034982 | INTEGRATED LASER AND PHOTODETECTOR CHIP FOR AN OPTICAL SUBASSEMBLY - A semiconductor device with an integrated optical transmitter and optical receiver is disclosed that can be used in an optical subassembly. The device may include a substrate, a first component, an optical filter, and a second component, wherein the first component comprises an optical transmitter and the second component comprises an optical receiver, or vice versa. The first component can be configured to emit (or be sensitive to) a first optical signal having a first wavelength while the second component can be configured to be sensitive to (or emit) a second optical signal having a second wavelength. The optical filter can be configured to allow transmission therethrough of optical signals having the first wavelength while blocking optical signals having the second wavelength. | 02-05-2009 |
20090232456 | Mini Optical Subassembly - A low-cost, high-speed micro-connector replacement for current electrical inter-connects and intra-connects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. The micro-connector is mounted on a PCB in alignment with the transmitting or receiving modules and provides appropriate alignment and stop positioning of an optical fiber used for optical transmitting between transmitting/receiving modules. | 09-17-2009 |
20090232511 | Optical Micro-Connector - A low-cost, high-speed micro-connector replacement for current electrical inter-connects and intra-connects on printed circuit boards is provided. The invention permits fast and reliable information transmission over a single fiber through the utilization of an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. The micro-connector is mounted on a PCB in alignment with the transmitting or receiving modules and provides appropriate alignment and stop positioning of an optical fiber used for optical transmitting between transmitting/receiving modules. | 09-17-2009 |
20090232514 | Optical Interconnect Solution - A low-cost, high-speed optical interconnect replacement for current electrical interconnects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. A bare optical fiber is then used to transmit the signal from an optical encoding source to an optical receiver, providing a high-speed method of replacement for traditional electrical interconnects. | 09-17-2009 |
20090263074 | DISTRIBUTED FEEDBACK LASER ARRAY - The present invention provides a low-cost, high-bandwidth optical laser array where subsequent streams of data are injected in a serial fashion. The invention permits the creation of multiple channels of data on a single optical substrate without the use of costly multiplexer arrays to consolidate various optical signals. Further, the serial array eliminates the need for the parallel alignment of optical data sources, such as lasers, and instead allows for the serial alignment of the optical data sources, resulting in decreased footprint applications. | 10-22-2009 |
20100172650 | DIRECTLY MODULATED LASER WITH INTEGRATED OPTICAL FILTER - An integrated optical source includes a Directly Modulated Laser (DML) and a filter which is positioned with the DML on a common substrate. The filter is configured to receive an input signal in the form of a modulated chirped optical signal. The filter is further configured to provide an output optical signal in the form of an amplitude and/or phase modulated optical signal, optimized for long-distance transmission in optical fiber. | 07-08-2010 |
20110013912 | HEADER ASSEMBLY FOR COMMUNICATIONS MODULE - In one example, a header assembly for use in a communication device has a base that includes a plurality of single ports through which a corresponding plurality of leads extends. The leads are retained in their respective single ports by a retainer material. Additionally, the base includes one or more plural ports through which two or more leads extend. | 01-20-2011 |
20120039572 | ELECTRONIC MODULE HAVING MULTIPLE FLEX CIRCUIT CONNECTORS - In one example embodiment, an electronic module comprises a plurality of components and flex circuit connectors each electrically connected to respective components of the electronic module. The electronic module may be an optical subassembly of an optical transceiver. Moreover, one of the flex circuit connectors may be physically connected to another of the flex circuit connectors. | 02-16-2012 |
20130163917 | OPTICAL SUBASSEMBLY WITH AN EXTENDED RF PIN - An optical subassembly (OSA) with an extended radio frequency (RF) pin. In one example embodiment, an OSA includes a header, a metallic ring, an RF insulator eyelet, and an RF pin. The header defines an insulator opening and includes an internal header surface. The metallic ring extends above the internal header surface and includes a metallic ring inner diameter substantially equivalent to a diameter of the insulator opening. The RF insulator eyelet is positioned partially in the insulator opening and partially in the metallic ring and defines an RF pin opening. The RF pin is positioned in the RF pin opening and extends through the insulator opening and the metallic ring. | 06-27-2013 |
20130235542 | 3-D INTEGRATED PACKAGE - In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes. | 09-12-2013 |
20130279139 | TRANSISTOR OUTLINE CAN WITH IN-LINE ELECTRICAL COUPLINGS - An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection. | 10-24-2013 |