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Avgerinos V. Gelatos
REDWOOD CITY, CA US
1. 20090280640 DEPOSITION AND DENSIFICATION PROCESS FOR TITANIUM NITRIDE BARRIER LAYERS 11-12-20092. 20090142474 RUTHENIUM AS AN UNDERLAYER FOR TUNGSTEN FILM DEPOSITION 06-04-2009
3. 20090081866 VAPOR DEPOSITION OF TUNGSTEN MATERIALS - Embodiments of the invention provide an improved process for depositing tungsten-containing materials 03-26-2009
4. 20090056626 APPARATUS FOR CYCLICAL DEPOSITING OF THIN FILMS 03-05-2009
5. 20090053893 ATOMIC LAYER DEPOSITION OF TUNGSTEN MATERIALS 02-26-2009
6. 20080206987 PROCESS FOR TUNGSTEN NITRIDE DEPOSITION BY A TEMPERATURE CONTROLLED LID ASSEMBLY 08-28-2008
7. 20080202425 TEMPERATURE CONTROLLED LID ASSEMBLY FOR TUNGSTEN NITRIDE DEPOSITION 08-28-2008