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Jeffrey D. Gelorme
BURLINGTON, CT US
1. 20090032962 CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WITH POWDERED MATERIALS FOR CIRCUIT FORMATION 02-05-20092. 20080230262 ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE 09-25-2008
3. 20080223604 PROCESS FOR PREPARING AN ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE 09-18-2008
4. 20080220998 REVERSIBLE THERMAL THICKENING GREASE - for microelectronic packages in which the grease contains filler particles 09-11-2008
5. 20080202386 SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COMPONENT IN THERMAL PASTE OR ADHESIVE 08-28-2008