Patent application number | Description | Published |
20080265386 | SEMICONDUCTOR DEVICE - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 10-30-2008 |
20080266404 | LENS BARREL AND IMAGE PICKUP APPARATUS - A lens barrel includes: an image pickup optical system; an image pickup element; and a plurality of reflection members including first to n-th reflection members in order from the subject. The first reflection member is arranged at a position to bend an optical path of an incident light flux to enter the image pickup optical system. An (n−1)-th reflection member is arranged at a position to bend an optical path in a direction in a plane perpendicular to the optical path of the incident light flux. The n-th reflection member is arranged at a position closest to the image plane to bend an optical path in a direction parallel to the optical path of the incident light flux. The lens barrel further includes an actuator for moving the image pickup element in a plane perpendicular to an optical path bent by the n-th reflection member for stabilizing an image. | 10-30-2008 |
20080300120 | CREASING DEVICE FOR CORRUGATED BOARD SHEET AND CORRUGATED-BOX MAKING MACHINE - A slotter-creaser unit includes an upper creasing head and a lower creasing head. A protruding portion is arranged on a periphery of the lower creasing head in a circumferential direction. A first pressing portion and a second pressing portion having different lengths and different curvature radiuses in a width direction are arranged opposite to each other across the protruding portion and in an alternate manner in the circumferential direction. | 12-04-2008 |
20090030841 | CONTENT DELIVERING METHOD, CONTENT DELIVERING SYSTEM, AND CONTENT DELIVERING PROGRAM - A content delivering system comprising: a center server for receiving order information relative to the rental of the content data from a user terminal through a network, a delivery server for creating a secret key valid only during a rental period based on the order information and delivering the secret key to a delivery destination terminal, and a content store server for storing a plurality of content data, specifying the content data to be delivered according to an instruction from the delivery server, encrypting the content data to be delivered with the secret key, and sending the same data to the delivery destination terminal. | 01-29-2009 |
20090068796 | SEMICONDUCTOR CONNECTION COMPONENT - There is a need for providing a technology capable of decreasing on-resistance of a power transistor in a semiconductor device that integrates the power transistor and a control integrated circuit into a single semiconductor chip. There is another need for providing a technology capable of reducing a chip size of a semiconductor device. A semiconductor chip includes a power transistor formation region to form a power transistor, a logic circuit formation region to form a logic circuit, and an analog circuit formation region to form an analog circuit. A pad is formed in the power transistor formation region. The pad and a lead are connected through a clip whose cross section is larger than that of a wire. On the other hand, a bonding pad is connected through the wire | 03-12-2009 |
20090165936 | METHOD AND APPARATUS FOR MANUFACTURING ELECTRODE ASSEMBLY FOR RECTANGULAR BATTERY - In a method of manufacturing an electrode assembly for a rectangular battery, in which positive electrodes and negative electrodes are alternately laminated so that a separator exists between the respective positive and negative electrodes, the manufacturing method includes the steps of: arranging a plurality of guide members in zigzag form in a perpendicular direction; inserting a continuous member of the separator between one and another one rows of the guide members; folding, into zigzag form, the continuous member by intersecting the rows of the guide members in a horizontal direction; inserting alternately the positive electrodes and the negative electrodes in respective valley grooves of the zigzag-folded continuous member; withdrawing the guide members from the respective valley grooves of the continuous member; and pressing, thereafter, the continuous member in the zigzag direction so as to make flat the continuous member. | 07-02-2009 |
20090204780 | DATA STORAGE UNIT, DATA STORAGE CONTROLLING APPARATUS AND METHOD, AND DATA STORAGE CONTROLLING PROGRAM - A data storage unit is provided in which all data are stored into a memory including a plurality of memory banks and a plurality of desired data is read simultaneously, without any load to the hardware. It includes a memory controlling means including a data storage controller ( | 08-13-2009 |
20100012734 | INTEGRATED CIRCUIT TAG - The present invention relates to integrated circuit (IC) tags. The IC tag ( | 01-21-2010 |
20100105174 | SEMICONDUCTOR DEVICE - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 04-29-2010 |
20100162418 | RECOMBINANT PROTEIN S COMPOSITION - A pharmaceutical agent for treating a disease such as inflammatory diseases, blood coagulation diseases associated with deficiency of Protein S has been required. The present invention provides a Protein S composition comprising recombinant Protein S molecules having complex type N-glycoside-linked sugar chains, wherein the Protein S has a higher binding activity to a receptor for advanced glycation end products (hereinafter referred to as “RAGE”) than native Protein S present in healthy human blood, and also has a higher ratio of sugar chains in which fucose is not bound to the complex type N-glycoside-linked sugar chains bound to Protein S than native Protein S present in healthy human blood. | 06-24-2010 |
20100258945 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a semiconductor device involving the step of bonding a metallic ribbon to a pad of a semiconductor chip, breakage of the metallic ribbon is to be prevented while ensuring the bonding strength even when the metallic ribbon becomes thin with reduction in size of the semiconductor chip. In bonding an Al ribbon to a pad of a semiconductor chip by bringing a pressure bonding surface of a wedge tool into pressure contact with the Al ribbon while applying ultrasonic vibration to the ribbon positioned over the pad, recesses | 10-14-2010 |
20100270509 | VINYLIDENE FLUORIDE BASED POLYMER POWDER AND USE THEREOF - A method for producing a vinylidene fluoride based polymer powder having a high molecular weight and excellent solubility in an organic solvent, which is useful as an electrode binder for nonaqueous cells, is provided. Methods for producing an NMP solution and an electrode mixture are also provided. | 10-28-2010 |
20110143500 | SEMICONDUCTOR CONNECTION COMPONENT - There is a need for providing a technology capable of decreasing on-resistance of a power transistor in a semiconductor device that integrates the power transistor and a control integrated circuit into a single semiconductor chip. There is another need for providing a technology capable of reducing a chip size of a semiconductor device. A semiconductor chip includes a power transistor formation region to form a power transistor, a logic circuit formation region to form a logic circuit, and an analog circuit formation region to form an analog circuit. A pad is formed in the power transistor formation region. The pad and a lead are connected through a clip whose cross section is larger than that of a wire. On the other hand, a bonding pad is connected through the wire | 06-16-2011 |
20110156274 | SEMICONDUCTOR DEVICE - The present invention provides a semiconductor device capable of suppressing degradation in connection reliability due to the decrease in thickness of a conductive adhesive caused by the movement of a connecting plate in a semiconductor device to which a power transistor is mounted. A step is provided in the thin part of the connecting plate connected to a lead post to lock the connecting plate by contacting the step to the tip of the lead post. Alternatively, a groove is provided in the thin part of the connecting plate to lock the connecting plate by connecting the lead post to only the part of the connecting plate on the tip side from the groove. | 06-30-2011 |
20110268983 | FILM-FORMING TREATMENT JIG, PLASMA CVD APPARATUS, METAL PLATE AND OSMIUM FILM FORMING METHOD - To provide a film-forming treatment jig for forming a thin film on a plate having a through hole of a micro diameter by a single plasma film-forming treatment. The film-forming treatment jig according to the present invention includes: a holding member | 11-03-2011 |
20120034742 | SEMICONDUCTOR DEVICE - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 02-09-2012 |
20130126793 | VAPOR-GROWN CARBON FIBER AGGREGATE - [Problems] To provide a vapor-grown carbon fiber aggregate, wherein the carbon fiber has a structure of two or more tubular graphene layers and of which the central portion in cross section of the fiber is hollow, has a little unevenness in the structure and exhibits excellent electric conductivity. | 05-23-2013 |
20130207252 | Semiconductor Device - To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire. | 08-15-2013 |
20140101928 | METHOD FOR PRODUCING AND APPARATUS FOR PRODUCING SECONDARY BATTERY - After a separator is brought into a tension-free state, a plurality of guide members are crossed in a horizontal direction between rows of the guide members to fold the separator or a superposed body zigzag. Positive electrode plates or negative electrode plates are inserted into the resulting furrows to produce a secondary battery. | 04-17-2014 |
20140230239 | METHOD FOR PRODUCING AND APPARATUS FOR PRODUCING SECONDARY BATTERY - A production apparatus is equipped with a supply unit which has a cassette member | 08-21-2014 |
20140299870 | ORGANIC TRANSISTOR AND METHOD FOR MANUFACTURING SAME - A method for manufacturing an organic transistor includes laminating a base insulating layer on a substrate; forming source/drain electrodes on the base insulating layer; laminating an organic semiconductor layer to cover the electrodes and be in contact with the base insulating layer; laminating a gate insulating layer on the organic semiconductor layer; forming a gate electrode on the gate insulating layer; and performing, before the organic semiconductor layer is formed, surface treatment on the surface of the base insulating layer which is in contact with the organic semiconductor layer. The surface treatment is performed such that, when W1 represents the work of adhesion between two laminated layers using the same material of the organic semiconductor layer, the work of adhesion W2 between the base insulating layer and the organic semiconductor layer when the organic semiconductor layer is formed on the surface-treated base insulating layer satisfies the relationship W1≧W2. | 10-09-2014 |
20140335281 | FILM-FORMING TREATMENT JIG, PLASMA CVD APPARATUS, METAL PLATE AND OSMIUM FILM FORMING METHOD - In a film-forming treatment jig for forming a thin film on a plate having a through hole of a micro diameter by a single plasma film-forming treatment, the film-forming treatment jig includes: a holding member | 11-13-2014 |