Liau, TW
Chau-Kuang Liau, Jhongli City TW
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20090035701 | Photoresist and pattern-forming process using the same - A photolithography process using a photoresist is as following. A substrate is provided for coating a photoresist thereon to form a photoresist layer and the photoresist is formed by mixing photocatalyst particles and polymer binder in a solvent. The photoresist layer is well-adhesive and has good mechanical strength. A light is illuminated on the photoresist layer through a photo mask having a pre-designed pattern thereon. Then, the portion of the photoresist layer where the light projects is removed by water or another environment-friendly solvent so as to reduce the harmful waste produced in the processes. | 02-05-2009 |
20090194765 | Ceramic MESFET device and manufacturing method thereof - A method of manufacturing a MESFET using ceramic materials includes providing a substrate; providing a ceramic semiconductor material to apply onto the substrate to form a first ceramic semiconductor layer; providing a ceramic semiconductor material which is blended with ions, wherein the ceramic semiconductor material is applied onto a central part of the first ceramic semiconductor layer to form a second ceramic semiconductor layer with ions; providing another ion-mixed ceramic semiconductor material is provided to apply over both sides of the first ceramic semiconductor layer to form a third ceramic semiconductor layer having ions; and respectively plating the second and third ceramic semiconductor layers with metal layers so that the second ceramic semiconductor layer has a gate electrode and the third ceramic semiconductor layer has a source and a drain. A transistor obtained by this method can be put into broader range of applications compared to III-V group transistor. | 08-06-2009 |
Chia-Hung Liau, Township TW
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20090116581 | PRE-CODING APPARATUS ON ACCOUNT OF ADAPTIVE ESTIMATION - A pre-coding process and apparatus on account of adaptive estimation is provided, which comprises a plurality of channel state information detectors, a reduction sampler, a plurality of adaptive estimators, an error-estimation averager, and a parallel/serial transducer. The pre-coding implementation of the present apparatus can be divided in an initial stage of acquisition and a following tracking stage. The present invention can be applied to Single-Input Single-Output (SISO) antenna system and Multiple-Input Multiple-Output (MIMO) antenna system, in order to advance the dependability and stability of the system, which also have advantage in further decreasing the complexity, power consumption and cost of the end-user host receiver, easy implementation, and high immunity from channel noise interference. | 05-07-2009 |
Chiyu Liau, Gilong TW
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20100192426 | ELECTRIC IRON CAPABLE OF QUICKLY COOLING - An electric iron capable of quickly cooling comprising: an ironing base and a housing, herein a soleplate is disposed on the bottom of the ironing base, while the housing comprising a shell covered on the upside of the soleplate of the ironing base, and a chamber enclosed by the shell. To improve the safety just after using, the present iron is characterized by that the shell is provided with a plurality of vents, and the soleplate is provided with a plurality of cooling fins which is protruded into the chamber, and a fan is installed in the chamber to emit the hot air to the chamber with the aid of the cooling fins, and discharge the hot air from the vent by the running of the fan, so as to cool quickly and improve the safety of the iron just after using. | 08-05-2010 |
Chung-Chi Liau, Taipei TW
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20090236217 | CAPILLARITRON ION BEAM SPUTTERING SYSTEM AND THIN FILM PRODUCTION METHOD - A capillaritron ion beam sputtering system and a thin film production method are disclosed. By utilizing reactive capillaritron ion beam sputtering deposition, argon and oxygen are passed through a capillaritron ion source simultaneously. Argon is being ionized and accelerated by a voltage to bombard a zinc target and create zinc atoms, while oxygen atoms are created at the same time. Zinc atom and oxygen atom are combined to form ZnO to deposit on a substrate. The stoichiometric properties, deposition rate, transmission properties, surface roughness and film density of the as-deposited film can be altered by adjusting capillaritron ion beam energy and oxygen partial pressure. Using preferred processing parameters, the root-mean-square surface roughness of the as-deposited film can be smaller than 1.5 nm, while the transmission coefficient at visible range can be greater than 80%. | 09-24-2009 |
20090252889 | NANOPIN MANUFACTURING METHOD AND NANOMETER SIZED TIP ARRAY BY UTILIZING THE METHOD - Methods to manufacture metal nanopins and metal oxide nanopins are disclosed. Metal nanopins are fabricated on a metal foil by capillaritron plasma source dry etching. The aspect ratio and the density of metal nanopins are controlled by adjusting the temperature of the metal foil during ion beam dry etching. The end radius of metal nanopins less than 10 nm and the aspect ratio of metal nanopins between 25 and 30 can be achieved. Besides, metal oxide nanopins are fabricated by ion implantation and thermal oxidation. The metal foil is implanted with ions and then thermally oxidized to form the metal oxide nanopins. It shows that the metal oxide nanopins fabricated with oxygen implantation exhibit better field emission properties. | 10-08-2009 |
Jia-Guann Liau, Taichung TW
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20130167692 | OPEN WRENCH - The present invention discloses an open wrench including handle and driving head connected thereto. The driving head has clamping opening and opening. The driving head has a stepped outer flat surface and an inner flat surface which is arranged in U shape and located along the clamping opening. The outer flat surface is higher than the handle. The inner flat surface is higher than the outer flat surface. The outer flat surface and inner flat surface have an included angle respectively. | 07-04-2013 |
20130205953 | WRENCH - A wrench includes a handle having a driving head which has a clamping hole. The driving head has a top surface and a bottom surface. The outer periphery of the top surface is tangent to an inside of a first circle and the outer periphery of the bottom surface is located on a second circle. The first circle is larger than the second circle. The second circle is larger than the clamping hole. When the first and second circles are projected on a horizontal plane, the second circle is located within the first circle and is tangent to the second first circle at a tangent point. The clamping hole and the first circle are located on a common axis which is located on a vertical plane. The two respective centers of the first and second circles and the tangent point are located on the vertical plane. | 08-15-2013 |
20140060261 | DRIVING HEAD FOR OPEN WRENCH - An open wrench includes integral handle and first driving head. The first driving head has a U-shaped body which has a mounting hole defined therein and an opening communicates with the mounting hole. Each of top surface and bottom surface of the first driving head has a first face and a second face. The second face is a U-shaped face and located along with the mounting hole. The first face is a U-shaped face and located outside of the second face. A U-shaped groove is defined between the first and second faces. | 03-06-2014 |
Jiann-Jong Liau, Hsinchu TW
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20100152858 | Structure improvement of orthopaedic implant - A structure improvement of orthopaedic implant includes a tibial baseplate, a tibial insert, and a reinforcement. The tibial baseplate forms a recess having a bottom that has a central portion defining a through hole extending through the tibial baseplate. The through hole has a top circumference that defines a circumferential groove extending outward. The tibial insert has a bottom forming a projection corresponding to the recess of the tibial baseplate for press-fitting to the tibial baseplate. A support is formed on at a central portion of a top of the tibial insert and defines a bore that extends through the tibial insert. The tibial insert forms two curved surfaces on opposite sides of the support to support contact and rolling. The reinforcement is inset in the tibial insert and includes a sleeve and a bolt. | 06-17-2010 |
20130304222 | Structure Improvement Of Orthopaedic Implant - A structure improvement of orthopaedic implant for connecting a distal femur and a proximal tibia, and a stem was implanted into the proximal tibia, inwhich formed to allow inter-engagement between the stem of the tibia and the structure improvement of orthopaedic implant. The structure improvement of orthopaedic implant includes a tibial baseplate, a tibial insert, and a reinforcement. The tibial baseplate forms a recess having a bottom that has a central portion defining a through hole extending through the tibial baseplate. The tibial insert includes a support, a through region, and a projection, wherein an end of the tibial insert forming the projection corresponding to the recess of the tibial baseplate for press-fitting to the tibial baseplate. The reinforcement is inset in the tibial insert and includes a sleeve and a bolt. As such, the advantages of stable coupling includes force resistance, avoids insert loosening then extends prosthetic longevity. | 11-14-2013 |
Jiun-Jie Liau, Kaohsiung County TW
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20110135313 | OPTICAL FIBER COMMUNICATION METHOD AND TRANSMITTING DEVICE - An optical fiber communication method for communication between a transmitting terminal and a receiving terminal includes the steps of: providing an optical fiber to be coupled to the transmitting terminal and including a core that is provided with at least one second-order Bragg grating structure and a cladding that surrounds the core; configuring the transmitting terminal to output a data-carrying optical signal to one end of the core of the optical fiber for subsequent wireless transmission of the data-carrying optical signal via radiation through the second-order Bragg grating structure of the optical fiber; and configuring the receiving terminal to receive the signal radiated by the second-order Bragg grating structure of the optical fiber. A transmitting device is also disclosed. | 06-09-2011 |
Jiun-Shiung Liau, New Taipei TW
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20150281290 | INTERNET PROTOCOL PHONE AND CALL FORWARDING METHOD - An Internet protocol (IP) phone which can remotely configure call forwarding in a distant IP phone requires the IP phone detecting a phone number of the distant IP phone and transmitting a first signal to the distant IP phone to request the distant IP phone to enable call forwarding mode. Upon the distant IP phone responding, the IP phone transmits a second signal including password to the distant IP phone to confirm that the distant IP phone has capabilities and has successfully enabled call forwarding mode. When the distant IP phone, responding to a correct password, makes a response the IP phone transmits a third signal to the distant IP phone to complete the call forwarding process. | 10-01-2015 |
Jung-Shiung Liau, Taipei Hsien TW
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20110019191 | Display Inspection Tool, Display Inspection Module, and Display Inspecting Method - A display inspection tool includes a securing member and a color detector securing unit. The securing member includes a top edge securing portion that is adapted for disposing on a top edge of a display, and a bottom edge securing portion that is adapted for abutting against a bottom edge of the display. By disposing the top edge securing portion on the top edge of the display, and bringing the bottom edge securing portion into abutment against the bottom edge of the display, the securing member can be quickly mounted on the display. The color detector securing unit is provided on a rear face of the securing member and is adapted for securing a color detector so as to perform color detection when the securing member is mounted on the display. | 01-27-2011 |
20110019434 | SIDELIGHT-TYPE BACKLIGHT MODULE - A sidelight-type backlight module includes a casing body, a light-guiding plate, a reflector plate, a light-emitting unit, and a reflector component. The reflector plate is disposed at a surface of the light-guiding plate, and has an extension part extending beyond a side edge of the light-guiding plate that faces toward the light-emitting unit. The reflector component has a light-reflecting face spaced apart from the reflector plate. The light-emitting unit is disposed between the extension part and the light-reflecting face. The extension part and the light-reflecting face reflect light of the light-emitting unit into the light-guiding plate so that a lamp reflector can be omitted. Preferably, the reflector component is formed integrally with the casing body. | 01-27-2011 |
20110170314 | LIGHT EMITTING DIODE DEVICE AND DISPLAY DEVICE - A display device includes a housing, a panel unit disposed in the housing, a light emitting diode module disposed between the housing and the panel unit, and a heat conducting layer. The light emitting diode module includes a circuit board, and a plurality of light emitting diodes disposed on the circuit board. The circuit board includes a board body formed with a plurality of through holes, and a first conducting unit and a second conducting unit disposed on the board body. Each of the light emitting diodes has a bottom portion disposed in a respective one of the through holes, and is coupled between each conducting parts of the first and second conducting units. The heat conducting layer contacts the housing, contacting parts of the first and second conducting units, and the bottom portions of the light emitting diodes. | 07-14-2011 |
Jung-Shiung Liau, New Taipei City TW
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20110280003 | BACKLIGHT MODULE AND DISPLAY DEVICE WITH TWO-SIDED LIGHT EMITTING STRUCTURE - A backlight module includes a flexible circuit board. The flexible circuit board includes a conductive layer and an insulating layer covering the conductive layer. The backlight module further includes a plurality of light emitting diodes respectively disposed on two sides of the flexible circuit board and electrically connected to the conductive layer of the flexible circuit board for emitting light towards the two sides of the flexible circuit board. | 11-17-2011 |
20130021790 | LIGHT BAR STRUCTURE AND LIGHT SOURCE DEVICE - A light bar structure is disclosed in the present invention. The light bar structure includes a housing whereinside an accommodating space is formed, and the accommodating space is for accommodating a light unit. The light bar structure further includes a first buckling component disposed on an inner side of the accommodating space. The buckling component includes a first base disposed on a bottom inside the housing for supporting the light unit, a first arm connected to the first base and disposed on a first lateral wall inside the housing, and a first constraining portion disposed on the first arm for contacting against the light unit, so as to constrain a movement of the light unit relative to the first base. | 01-24-2013 |
20130021791 | LIGHT BAR STRUCTURE AND LIGHT SOURCE DEVICE - A light bar structure is disclosed in the present invention. The light bar structure includes a housing whereinside an accommodating space is formed, and the accommodating space is for accommodating a light unit. The housing includes an engaging portion for engaging with the light unit to constrain a movement of the light unit at a first direction, and a contacting portion for contacting against the light unit to constrain a movement of the light unit at a second direction different from the first direction. The light bar structure further includes an isolating component disposed on a bottom inside the housing, and two conductive components disposed on the isolating component for electrically connecting two electrodes of the light unit. | 01-24-2013 |
Shyi-Ching Liau, Hsinchu County TW
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20080264899 | INTERCONNECT STRUCTURE WITH STRESS BUFFERING ABILITY AND THE MANUFACTURING METHOD THEREOF - An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic device; a second surface, connected to a device selected form the group consisting of the substrate and the electronic device; a supporting part, sandwiched between and interconnecting the first and the second surfaces while enabling the areas of the two ends of the supporting part to be small than those of the first and the second surfaces in respective; and a buffer, arranged surrounding the supporting part for absorbing and buffering stresses. | 10-30-2008 |
20100020502 | Wafer-To-Wafer Stacking - a wafer-to-wafer stacking having a hermetic structure formed therein is provided. The wafer stacking includes a first wafer, including a first substrate and a first device layer having thereon at least one chip and at least one low-k material layer, a second wafer disposed above the first wafer and having a second substrate, and a closed structure disposed on the at least one chip and arranged inside a cutting edge of the at least one chip, wherein the closed structure is extended from one side of the first device layer far from the first substrate to the other side thereof adjacent to the first substrate. | 01-28-2010 |
Shyi-Ching Liau, Hsinchu TW
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20090156001 | Structure for reducing stress for vias and fabricating method thereof - A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block. | 06-18-2009 |
20110156249 | WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL - An electronic device having a stacked structure is provided. The electronic device includes a first electronic layer, a second electronic layer disposed on the first electronic layer, and at least a post. The first electronic layer has a first interface, and including a first substrate and a first device layer disposed on the first substrate. The first interface is located between the first substrate and the first device layer, and the first device layer has a surface opposite to the first interface. The post is arranged in the first device layer, and extending from the first interface to the surface of the first device layer. | 06-30-2011 |
20120178212 | WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL - A novel three dimensional wafer stack and the manufacturing method therefor are provided. The three dimensional wafer stack includes a first wafer having a first substrate and a first device layer having thereon at least one chip, a second wafer disposed above the first wafer and having a second substrate, and at least one pedestal arranged between and extending from the first substrate to the second substrate. The pedestal arranged in the device layer is used for preventing the low-k materials existing in the device layer from being damaged by the stresses. | 07-12-2012 |
20130161829 | WAFER-TO-WAFER STACK WITH SUPPORTING POST - A wafer stack includes: a first wafer having a first substrate and a first device layer having therein at least a chip; a second wafer having a second substrate disposed above the first wafer; and at least a first metal post existing in the first device layer, and arranged between the first and the second substrates, without being electrically connected to the chip. | 06-27-2013 |
Teh-Chau Liau, Hsinchu County TW
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20130016411 | EIT-BASED PHOTONIC LOGIC GATEAANM LIAU; Teh-ChauAACI Hsinchu CountyAACO TWAAGP LIAU; Teh-Chau Hsinchu County TWAANM SHEN; Jian-QiAACI ZhejiangAACO CNAAGP SHEN; Jian-Qi Zhejiang CNAANM WU; Jin-JeiAACI Tainan CityAACO TWAAGP WU; Jin-Jei Tainan City TWAANM YANG; Tzong-JerAACI Hsinchu CityAACO TWAAGP YANG; Tzong-Jer Hsinchu City TW - The present invention provides an EIT-based photonic logic gate, which is constituted by EIT-based stack layers of periodic array of photonic crystal (PCs) layers and EIT (Electromagnetic Induced Transparent) material layers. The input probe signals are incident on the first photonic crystal layer, passing through one or more than one PCs-EIT interfaces and transmitted out from the last EIT material layer. Control filed as the enable signals are incident on each EIT layer to activate the optical logic gate. By varying the detune frequency of probe field and Rabi frequency of control field, its band gap structure can be adjusted. Henceforth, the tunable optical EIT-based photonic logic gate can be achieved as user required. | 01-17-2013 |
Wan-Lai Liau, Taipei TW
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20100194123 | Window lock - A window lock is composed of a base and a rotating element. When a force-exertion part of the rotating element is exerted with force to rotate clockwise or counterclockwise by an angle with a central shaft as an axis, a camshaft rotates with the rotating element synchronously, allowing two convex parts to be abutted respectively on inner surfaces of first and second elastic spring leaves, and the first and second elastic spring leaves to be expanded elastically. When the two convex parts are escaped from the inner surfaces of the first and second elastic spring leaves, the first and second elastic spring leaves are restored elastically. | 08-05-2010 |
20150137526 | CLOSURE LATCH - A latch comprising a base, a handle, a socket, a nut, a threaded shank, and a hollow shaft is provided. The base includes a central through hole and a side recess. The handle includes a toothed holed end. The socket includes an upper toothed section, a lower extension, an intermediate annular flange, a tab extending outward from the flange, an axial channel through the socket, a top hole on the socket and communicating with the channel, and a shoulder between the channel and the top hole. The nut includes a hexagonal top hole and an internally threaded hole. The threaded shank includes an upper section, a lower section, an adjustment section extending downward from the lower section, and an intermediate annular flange between the upper section and the lower section; and the shaft includes an internally threaded hole. | 05-21-2015 |
Wan-Lai Liau, Taipei City TW
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20130048930 | RIVETED STRUCTURE FOR A PULLEY SEAT - An improved riveted structure for a pulley seat is provided. The riveted structure essentially includes a panel and a base. The bottom surface of the panel is bilaterally provided with hot-forged rivets, and the base is bilaterally provided with through holes corresponding in position to the rivets. The riveted structure is characterized in that the through holes of the base are elliptical to facilitate insertion of the rivets. In addition, a washer is mounted around each rivet before the rivets are stamped. Thus, once the rivets are stamped to connect the panel to the base, the stamped rivets leave no traces on the surface of the panel. Also, production efficiency and the riveting effect can both be increased. | 02-28-2013 |
Wei-Lung Liau, Hsinchu City TW
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20120015115 | DISPLAY PANEL - A display panel includes a first substrate, a second substrate, a liquid crystal material between the first and second substrates, and an alignment layer on at least one of the first and second substrates. The liquid crystal material includes 10-90 wt % of a non-polar liquid crystal compound and 10-90 wt % of a polar liquid crystal compound, wherein a total amount of the non-polar and the polar liquid crystal compounds is 100 wt %. The non-polar liquid crystal compound has a dielectric anisotropy (Δε) of −1≦Δε≦1, and the polar liquid crystal compound has a dielectric anisotropy (Δε) of Δε≧1. The alignment layer has at least one of a polyamic acid and a cyclodehydration of the polyamic acid, wherein the polyamic acid is obtained by reacting a diamine compound with a tetracarboxylic acid dianhyhydirde compound. | 01-19-2012 |
Wen-Bin Liau, Hsinchu TW
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20090115126 | Feed Detecting System - A feed detecting system includes a sending element, a receiving element, a filtering-amplifying circuit, a peak-holding circuit, an A/D converter and a processing unit. The receiving element receives an ultrasonic signal sent by the sending element, and then outputs an electric signal, the filtering-amplifying circuit receives, filters and amplifies the electric signal, the A/D converter converts the electric signal to a digital signal, the processing unit reads the digital signal and compares the digital signal with a standard value stored in the processing unit. In this present invention, the A/D converter can be a low frequency A/D converter, so the cost of the feed detecting system is reduced. | 05-07-2009 |
20090136147 | METHOD FOR COMPRESSING IMAGE DATA - A method for compressing image data is used to process image data. The method includes the following steps as sampling pixels expressing an image, transforming the sampling data into transformed data by forward discrete cosine transformation, quantifying the transformed data according to a quantification table into quantified data, encoding the quantified data according to Huffman table, and generating a frame data. When the frame data is processed along the reverse pipeline, the frame data is decompressed to the image data. | 05-28-2009 |
Wen-Jen Liau, Nantou Hsien TW
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20090116206 | PORTABLE ELECTRONIC DEVICE - A portable electronic device includes: a printed circuit board having opposite first and second surfaces and provided with at least one electronic component, the first surface being provided with at least one conductive pad that is electrically coupled to the electronic component; and a flexible circuit board having a main part stacked on the second surface of the printed circuit board, and an extension part extending and folded from the main part and stacked on the first surface of the printed circuit board. The extension part is provided with at least one conductive bump thereon. An outer surface of the main part is provided with at least one input key that is electrically coupled to the conductive bump. The conductive pad is bonded to the conductive bump. | 05-07-2009 |
You-Cheng Liau, Hsinchu City TW
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20150061082 | CONTACT PLUG AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a contact plug is provided. The method includes providing a silicon substrate having at least one opening. A titanium layer is conformably formed in the opening. A first barrier layer is conformably formed on the titanium layer in the opening. A rapid thermal process is performed on the titanium layer and the first barrier layer. After performing the rapid thermal process, a second barrier layer is conformably formed on the first barrier layer in the opening. | 03-05-2015 |