Chiu, Taichung County
Chih-Chiang Chiu, Taichung County TW
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20140095900 | POWER SUPPLY SYSTEM - A power supply system for an information handling system is provided. The information processing system is electrically coupled to an AC power source and includes at least one computer unit. The power supply system includes: at least one AC power supply unit electrically coupled to the at least one computer unit and the AC power source; at least one DC power supply unit electrically coupled to the at least one computer unit; and a backup power unit electrically coupled to the at least one DC power supply unit. In response to the at least one AC power supply unit not supplying power, the at least one DC power supply unit supplies power to the at least one computer unit. A data center having the power supply system is further provided. | 04-03-2014 |
Chin Hung Chiu, Taichung County TW
Chin-Long Chiu, Taichung County TW
Chin Lung Chiu, Taichung County TW
Hsin-Hsiung Chiu, Taichung County TW
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20100070519 | LOCAL SEARCH METHOD AND SYSTEM - A local search method to be implemented by a portable electronic device is provided for searching a database that contains a plurality of data sets, each of which includes location information and content information. The local search method includes the steps of: (a) upon obtaining a search condition word string inputted by a user, determining whether the search condition word string contains a predefined symbol; and (b) when it is determined in step (a) that the search condition word string contains the predefined symbol, setting a string segment before the predefined symbol as a content condition, and a string segment after the predefined symbol as a location condition, and conducting a type-one search on the database, in which the database is searched for at least one data set whose content information corresponds to the content condition and whose location information corresponds to the location condition. | 03-18-2010 |
Hsin-Yen Chiu, Taichung County TW
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20090061584 | Semiconductor Process for Trench Power MOSFET - The present invention provides a semiconductor process for a trench power MOSFET. The semiconductor process includes providing a substrate, forming an EPI wafer on the surface, performing trench dry etching, performing HTP hard mask oxide deposition and channel self- align implant, performing boron (B) implant and completing the P-body region through a thermal process, performing arsenic (As) implant and completing the n+ source region through a thermal process, and depositing BPSG ILD, front side metal Al, and backside metal Ti/Ni/Ag. | 03-05-2009 |
20100055857 | METHOD OF FORMING A POWER DEVICE - A method of forming a power device includes providing a substrate, a semiconductor layer having at least a trench and being disposed on the substrate, a gate insulating layer covering the semiconductor layer, and a conductive material disposed in the trench, performing an ion implantation process to from a body layer, performing a tilted ion implantation process to from a heavy doped region, forming a first dielectric layer overall, performing a chemical mechanical polishing process until the body layer disposed under the heavy doped region is exposed to form source regions on the opposite sides of the trench, and forming a source trace directly covering the source regions disposed on the opposite sides of the trench. | 03-04-2010 |
20100117142 | Semiconductor Device for Improving the Peak Induced Voltage in Switching Converter - A power semiconductor device includes a backside metal layer, a substrate formed on the backside metal layer, a semiconductor layer formed on the substrate, and a frontside metal layer. The semiconductor layer includes a first trench structure including a gate oxide layer formed around a first trench with poly-Si implant, a second trench structure including a gate oxide layer formed around a second trench with poly-Si implant, a p-base region formed between the first trench structure and the second trench structure, a plurality of n+ source region formed on the p-base region and between the first trench structure and the second trench structure, a dielectric layer formed on the first trench structure, the second trench structure, and the plurality of n+ source region. The frontside metal layer is formed on the semiconductor layer and filling gaps formed between the plurality of n+ source region on the p-base region. | 05-13-2010 |
Ju Hui Chiu, Taichung County TW
Li-Ya Chiu, Taichung County TW
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20080263772 | Adjustable pad according user's weight - A pad includes an outer cover having an inner space and an opening is defined in a side of the outer cover so as to receive a valve therein. A deformable member is received in the inner space and includes a foam piece with gaps defined therein. The foam piece is spread or soaked with gel-type material which flows within the gaps. The air in the cover is expelled out from the valve when a user sits on the pad and the cap is then seals the valve. The air outside the pad cannot enter into the pad so that the shape of the deformed pad can be kept. | 10-30-2008 |
Pei-Ju Chiu, Taichung County TW
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20080238538 | RECEIVING DEVICE AND RELATED METHOD FOR CALIBRATING DC OFFSET - A receiving device includes a mixer, an AC coupling circuit, a post-stage circuit, and a DC offset calibration circuit. The mixer is utilized for mixing an input signal with a local oscillating (LO) signal from an oscillator to generate a converted signal. The AC coupling circuit is coupled to the mixer and utilized for reducing at least one portion of DC offset of the converted signal to generate a filtered signal. The post-stage circuit is coupled to the AC coupling circuit and utilized for processing the filtered signal to generate an output signal. The DC offset calibration circuit is coupled to the post-stage circuit and utilized for providing at least a compensation current for the post-stage circuit to reduce DC offset of the output signal. | 10-02-2008 |
Peter Chiu, Taichung County TW
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20120018327 | PROTECTION STRIP FOR TOOL BOX - A tool box includes a case having a recessed area defined in an outside thereof, and the recessed area includes a first recessed corner, a second recessed corner and a connection recess portion connected between the first and second recessed corners. A stop is formed on at least one side of the connection recessed portion and two grooves are defined in the outside of the case. A protection strip is engaged with the recessed area and includes a first corner, a second corner and a connection portion is connected between the first and second corners. Each of the first and second corners has a hook which is engaged with the groove corresponding thereto so as to protect the corner of the tool box. | 01-26-2012 |
Shao-Chen Chiu, Taichung County TW
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20100214781 | HIGH EFFICIENCY LIGHT EMITTING DIODE APPARATUS - The high efficiency light emitting diode apparatus mainly comprises a connector, a heat dissipating body, a light generator, a central venting portion, and a transparent casing. This connector has a flow guider, a flow chamber and a vent. The light generator contains several LEDs. The heat dissipating body includes an inner passage and an outer passage. The central venting portion has a central channel. An inner flow path and an outer flow path are formed. So, the heat dissipating effect of the flow paths is excellent. The structure forming two flow paths can enhance the heat dissipating effect. The auxiliary element can strengthen the overall illuminating effect. Plus, the auxiliary element can make the light more uniformly. | 08-26-2010 |
20110111176 | SHELL BODY WITH A PLASTIC MEMBER MOLDED ONTO A GLASS PANEL, AND METHOD FOR MANUFACTURING THE SHELL BODY - A method for manufacturing a shell body includes the steps of: a) processing a glass substrate to form a glass panel having a top surface, a bottom surface, and a peripheral face extending between the top and bottom surfaces, the peripheral face being formed with a coupling portion, the coupling portion being one of a protrusion protruding from the peripheral face and a recess indented from the peripheral face; and b) molding a plastic member onto the glass panel, the plastic member being coupled fittingly to the coupling portion of the glass panel. A shell body with a plastic member molded onto a glass panel is also disclosed. | 05-12-2011 |
Shao-Yu Chiu, Taichung County TW
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20090081855 | FABRICATION METHOD OF POLYSILICON LAYER - A fabrication method of a polysilicon layer is provided. First, a substrate is provided. Then, an amorphous silicon layer is formed on the substrate. After that, a patterned photomask having a light transmitting area and a light shielding area is provided, and the amorphous silicon layer is irradiated with a light by using the patterned photomask as a mask, wherein the amorphous silicon layer corresponding to the light transmitting area is transformed into a hydrophilic amorphous silicon layer, and the amorphous silicon layer corresponding to the light shielding area remains as a hydrophobic amorphous silicon layer. Next, a hydrophilic metal catalyst is provided and disposed on the hydrophilic amorphous silicon layer. After that, an annealing process is performed to transform the hydrophilic metal catalyst into a metal catalyst layer, and the metal catalyst layer reacts with the amorphous silicon layer to form a polysilicon layer. | 03-26-2009 |
Te-Sheng Chiu, Taichung County TW
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20100177059 | SENSING CIRCUIT AND METHOD FOR A CAPACITIVE TOUCH PANEL - A sensing method and circuit for a capacitive touch panel sense the capacitance variation of a lateral capacitor formed at the intersection of two traces of the capacitive touch panel, to distinguish a real point from a ghost point. A sensing cycle includes two non-overlapping clock phases. In the first clock phase, the voltages across the lateral capacitor and across a sensing capacitor are set. In the second clock phase, the voltage at a first terminal of the lateral capacitor is changed, and a second terminal of the lateral capacitor is connected to a first terminal of the sensing capacitor, causing a voltage variation at a second terminal of the sensing capacitor. This voltage variation is used to determine whether the intersection is touched. The sensing method and circuit reflect the status of the lateral capacitor in real-time and prevent the location of the touch point from being misjudged. | 07-15-2010 |
20100328262 | DETECTOR AND DETECTION METHOD FOR A CAPACITIVE TOUCHPAD TO IDENTIFY A REAL TOUCH POINT - A two-step detection for a capacitive touchpad to identify a real touch point first detects the self capacitances from multiple capacitance sensor traces of the capacitive touchpad to identify any touch point on the capacitive touchpad and then, if multiple touch points are detected, further detects the mutual capacitance at one of the detected touch points to identify whether it is a real touch point. | 12-30-2010 |
20110037723 | FRONT-END SIGNAL DETECTOR AND METHOD FOR IMPROVING NOISE IMMUNITY OF A CAPACITIVE TOUCH SENSOR - A front-end signal detector and a method for improving noise immunity of a capacitive touch sensor start counting a preset time to trigger an interrupt signal responsive to a positive or negative edge of a periodic noise, to break the path through which a demodulated signal comes into a low-pass filter, to prevent noise from accumulating in the low-pass filter, and consequently mitigate the influence of the noise on the detection signal generated by the front-end signal detector. | 02-17-2011 |
20130194234 | SENSING CIRCUIT AND METHOD FOR A CAPACITIVE TOUCH PANEL - A sensing method and circuit for a capacitive touch panel sense the capacitance variation of a lateral capacitor formed at the intersection of two traces of the capacitive touch panel, to distinguish a real point from a ghost point. A sensing cycle includes two non-overlapping clock phases. In the first clock phase, the voltages across the lateral capacitor and across a sensing capacitor are set. In the second clock phase, the voltage at a first, terminal of the lateral capacitor is changed, and a second terminal of the lateral capacitor is connected to a first terminal of the sensing capacitor, causing a voltage variation at a second terminal of the sensing capacitor. This voltage variation is used to determine whether the intersection is touched. The sensing method and circuit reflect the status of the lateral capacitor in real-time and prevent the location of the touch point from being misjudged. | 08-01-2013 |
Wei-Chun Chiu, Taichung County TW
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20120000803 | TOOL BOX WITH ANTI-SLIP SURFACE - A tool box includes a plastic case formed by way of blow molding and a flexible piece is integrally formed on an outside of the plastic case during processes of the blow molding. The flexible piece is connected to an inside of a female mold and the melted plastic material is inflated and matches the insides of the male and female molds. The flexible piece is securely connected to the melted plastic material high temperature and pressure so that flexible piece and the melted plastic material are not separated. After the tool box is formed, the tool box includes an anti-slip and flexible piece on the outside thereof. | 01-05-2012 |
Yen Hung Chiu, Taichung County TW
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20120046387 | SLURRY FOR PREPARING BORON NITRIDE AGGREGATES OF SPHERICAL GEOMETRY AND APPLICATION THEREOF - The present invention provides a slurry for preparing boron nitride aggregates of spherical geometry, comprising: 3 wt %˜25 wt % of boron nitride; 1 wt %˜25 wt % of a nano-ceramic material; and a solvent as a complement to 100 wt %. In comparison with conventional preparation methods, preparation of boron nitride aggregates of spherical geometry at relatively low temperature can be achieved by using the slurry. Therefore, the demands of energy conservation and low cost are fulfilled. Besides, the present invention also provides a method for preparing boron nitride aggregates of spherical geometry. | 02-23-2012 |
Yu-Chuan Chiu, Taichung County TW
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20120027978 | MULTI-ELEMENT OPTICAL SUBSTRATE AND ITS PREPARATION METHOD, LENS MODULE USING THE MULTI-ELEMENT OPTICAL SUBSTRATE - A multi-element optical substrate preparation method includes the steps of: a) preparing a first element having a center hole and a core positioning device defining a first element center line; b) preparing a mold having a mold cavity and a cavity center line, and then placing the first element in the mold to keep a predetermined part of the first element in contact with the mold cavity; c) calibrating the position of the core positioning device of the first element in the mold cavity subject to the reference of the cavity center line of the mold; d) filling a transparent plastic material into the mold cavity of the mold for enabling the transparent plastic material to be molded on the first element and cured into a second element so that the first element and the second element form an optical substrate; and e) opening the mold and taking the optical substrate out of the mold. | 02-02-2012 |
Yueh-Hsia Chiu, Taichung County TW
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20100047935 | LED PACKAGING METHOD USING A SCREEN PLATE - A LED packaging method includes a procedure of placing a screen plate having stepped holes on a substrate carrying LED chips, a procedure of reversing the screen plate with respect to the substrate, and a procedure of packaging the LED chips with a first packaging adhesive and a second packaging adhesive by means of applying the first packaging adhesive to the small diameter portion of each stepped hole when the first side of the screen plate is attached to the substrate and then applying the second packaging adhesive to the big diameter portion of each stepped hole after the screen plate is reversed. | 02-25-2010 |