Patent application number | Description | Published |
20100214754 | RIBBON BONDING IN AN ELECTRONIC PACKAGE - A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test. | 08-26-2010 |
20120080507 | SOLAR SUBSTRATE RIBBON BONDING SYSTEM - An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates. | 04-05-2012 |
20120273554 | SOLAR SUBSTRATE RIBBON BONDING SYSTEM - An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates. | 11-01-2012 |
20130042960 | ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME - An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate. | 02-21-2013 |
20130134577 | RIBBON BONDING IN AN ELECTRONIC PACKAGE - A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test. | 05-30-2013 |
20130140346 | ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME - An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is movable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell. | 06-06-2013 |
20130299559 | ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME - An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate. | 11-14-2013 |
20130306708 | ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME - An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is moveable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell. | 11-21-2013 |
20140048584 | ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME - An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece. | 02-20-2014 |
20150017878 | SYSTEMS AND METHODS FOR PROCESSING SOLAR SUBSTRATES - A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer. | 01-15-2015 |
Patent application number | Description | Published |
20090297786 | RIBBON BONDING TOOL AND PROCESS - An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon. | 12-03-2009 |
20110308545 | SYSTEMS AND METHODS FOR PROCESSING SOLAR SUBSTRATES - A method of removing at least a portion of an interaction layer on an electrode region of a solar substrate is provided. The method includes a step of providing a solar substrate including an absorbing region and an electrode region. The absorbing region including an absorbing layer configured to convert light energy into electrical energy. The electrode region is substantially free of the absorbing layer, and the electrode region includes an interaction layer. The method also includes a step of brushing the electrode region to remove at least a portion of the interaction layer. | 12-22-2011 |
20120085812 | SOLAR SUBSTRATE RIBBON BONDING SYSTEM - An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates. | 04-12-2012 |
20120205028 | SOLAR SUBSTRATE RIBBON BONDING SYSTEM - An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates. | 08-16-2012 |
20130112735 | ULTRASONIC BONDING SYSTEMS INCLUDING WORKHOLDER AND RIBBON FEEDING SYSTEM - An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation. | 05-09-2013 |
Patent application number | Description | Published |
20080262651 | HOLDING RACK FOR DOSAGE UNITS WITH AN ACTIVE USER-GUIDING MEANS - A holding rack ( | 10-23-2008 |
20080283555 | Dosage-Dispensing Device For Substances In Powder-Or Paste Form - A dosage-dispensing device, for substances in powder- or paste form, includes a supply container and a dosage-dispensing head that is connected or connectable to the supply container. A housing has an outlet orifice of circular cross-section and a delivery- and closure element with a closure portion serving to close off the outlet orifice. The device further has a conveying tool with at least one conveying element that serves to direct the substance to the outlet orifice, wherein the outlet orifice and the delivery- and closure element are arranged on the central lengthwise axis of the dosage-dispensing head. The conveying tool is rotatable about the central lengthwise axis in relation to the housing and the at least one conveying element is designed to move on a circular path about the central lengthwise axis. The delivery- and closure element includes a delivery portion which serves to deliver a substance that is to be dispensed, and the delivery- and closure element is configured to be rotatable about the central lengthwise axis in relation to the housing and to be capable of translatory displacement along the central lengthwise axis relative to the outlet orifice. The at least one conveying element of the conveying tool which serves for the delivery of substance is slanted in the direction of its rotation at an acute angle to the plane of its circular path. | 11-20-2008 |
20080302835 | DEVICE FOR DISPENSING DOSAGES OF SUBSTANCES IN POWDER- OR PASTE FORM - A dosage-dispensing device has a drive unit and a receiver for a dosage-dispensing unit. The drive unit has a drive shaft. The dosage-dispensing unit has a delivery orifice with a closure element that is disposed in the delivery orifice. The closure element is coupled to the drive shaft when the device is in an operating state. The closure element provides the delivery orifice with an aperture cross-section that varies between a closed position and a maximally open position. To couple the drive shaft to the closure element and to open the delivery orifice, the drive unit linearly advances towards the dosage-dispensing unit. A closure spring holds the closure element in a closed position up to the point of complete coupling. To prevent premature opening of the delivery orifice during the coupling process, the drive shaft has limited linear mobility in a direction away from the dosage-dispensing unit. | 12-11-2008 |
20080308579 | Dosage-Dispensing Device for Substances in Powder- or Paste Form - A dosage-dispensing device for substances in powder- or paste form is equipped with a supply container and a dosage-dispensing head which is connected or connectable to the supply container and which has a housing with an outlet orifice of circular cross-section. The dosage-dispensing head further has a delivery- and closure element, wherein the outlet orifice and the delivery- and closure element are arranged on the central lengthwise axis of the dosage-dispensing head, and the delivery- and closure element is designed to be rotatable about the central lengthwise axis in relation to the housing and to be capable of translatory displacement along the central lengthwise axis relative to the outlet orifice. The delivery- and closure element in its basic configuration is of a cylindrical shape and has at least two closure portions that are arranged at a distance from each other along the central lengthwise axis and serve to close off the outlet orifice and further has, between the closure portions, a delivery portion that serves to deliver the substance to be dispensed, wherein said delivery portion comprises at least one recess that is indented from the cylinder wall. | 12-18-2008 |
20090145510 | TRANSFER DEVICE FOR LABORATORY CONTAINERS - A device connects a storage container to a working reservoir for transferring a substance from the storage container to the working reservoir. The device includes a housing which is joined to the storage container with either a fixed connection or a coupling means. A passage opening is formed on the housing, and a shutter that is movably connected to the housing serves to close the passage opening. The shutter has a connector port for each working reservoir. The shutter moves in a rotary or sliding manner relative to the housing between an open position and a closed position. In the closed position, the passage opening is closed off by the shutter, and in the open position the interior space of the storage container is connected through the passage opening to the interior space of the working reservoir which is seated in the at least one connector port. | 06-11-2009 |
20090159153 | LABORATORY INSTRUMENT WITH A DOSAGE MATERIAL FUNNELING DEVICE - A laboratory instrument with a dosage-dispensing device for the delivery of measured doses of a dosage material in the form of a powder, paste or granulate into at least one target container is equipped with dosage material funneling device which is arranged between an outlet opening of the dosage-dispensing device and the target container. The dosage material funneling device includes an agitating means and at least one funnel holder arranged on the agitating means, wherein the funnel holder serves to receive an exchangeable funnel which in its installed condition in the laboratory instrument, when the latter is ready for operation, presents a profile which decreases in width in the direction of gravity. | 06-25-2009 |