Patent application number | Description | Published |
20080262158 | Curable Organopolysiloxane Composition, Method of Curing Thereof, Semiconductor Device, and Adhesion Promoter - A curable organopolysiloxane composition comprising an organopolysiloxane containing alkenyl groups and phenyl groups, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, and a platinum catalyst; a curing process that consists of two or more stages of thermal curing; an optical semiconductor device that has a light-transmitting portion made from a cured body of the aforementioned composition; and an adhesion promoter that consists of a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups. | 10-23-2008 |
20090118441 | Curable Silicone Composition - A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO | 05-07-2009 |
20090203837 | Curable Silicone Composition And Electronic Components - A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R | 08-13-2009 |
20090214870 | Curable Silicone Composition And Electronic Device Produced Therefrom - A curable silicone composition comprising: (A) a diorganosiloxane represented by the following general formula: A-R | 08-27-2009 |
20100022704 | Curable Silicone Composition And Cured Body Thereof - A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane represented by the following general formula: X—R | 01-28-2010 |
20100063185 | Curable Silicone Composition and Electronic Component - A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion. | 03-11-2010 |
20100113667 | Curable Silicone Composition and Electronic Component - A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability. | 05-06-2010 |
20100140537 | Curable Silicone Composition - A curable silicone composition comprising at least the following components: (A) an organopolysiloxane that contains epoxy groups and, preferably, has a branched molecular structure; (B) a phenolic-type curing agent such as an organosiloxane having in one molecule at least two phenolic hydroxyl groups; and (C) an acidic-anhydride type curing agent such as a methylhexahydrophthalic anhydride, as well as an arbitrary components such as (D) a curing accelerator, (E) a filler, or (F) an organic epoxy compound; is characterized by excellent handleability and reduced oil-bleeding during curing, and, when cured, forms a cured body of excellent flexibility and adhesion. | 06-10-2010 |
20100213623 | Method Of Manufacturing A Semiconductor Device And A Semiconductor Device Produced Thereby - A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching. | 08-26-2010 |
20100276721 | Light Emitting Device Encapsulated with Silicones and Curable Silicone Compositions for Preparing the Silicones - A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device. | 11-04-2010 |
20100301377 | CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE - A curable organopolysiloxane composition comprising at least the following components: (A) a linear diorganopolysiloxane with a mass average molecular weight of at least 3,000, (B) a branched organopolysiloxane, (C) an organopolysiloxane having, on average, at least two silicon-bonded aryl groups and, on average, at least two silicon-bonded hydrogen atoms in one molecule, and (D) a hydrosilylation reaction catalyst; has excellent curability and, when cured, forms a flexible cured product of high refractive index, optical transmissivity, excellent adherence to various substrates, high hardness and slight surface tack. | 12-02-2010 |
20110188213 | THERMALLY CONDUCTIVE SILICONE COMPOSITION AND ELECTRONIC DEVICE - A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions. | 08-04-2011 |
20110227235 | Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device - A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition. | 09-22-2011 |