Patent application number | Description | Published |
20080221261 | LOW DIELECTRIC LOSS TANGENT RESIN COMPOSITION, CURABLE FILM AND CURED PRODUCT, ELECTRICAL PART USING THE SAME AND METHOD FOR PRODUCTION THEREOF - According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], | 09-11-2008 |
20080261472 | PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING THE SAME - A prepreg is thermosettable. The prepreg comprises a thermosetting resin composition A, a cured resin of the thermosetting resin composition exhibiting a dielectric tangent of 0.005 or less under 1 Hz or more, and a substrate B into which the resin A is impregnated, wherein the substrate B comprises polyolefin fiber C and a fiber D, which has a tensile strength higher than that of the polyolefin fiber C and a thermal expansion coefficient smaller than that of the fiber C, and wherein the substrate is a woven cloth and has a solubility rate into a hydrocarbon organic solvent is less than 5 wt %. | 10-23-2008 |
20090266591 | Prepreg and printed wiring board using thin quartz glass cloth - It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer. | 10-29-2009 |
20100156587 | THERMOSETTING RESIN COMPOSITION AND COIL FOR ELECTRIC MACHINE - A thermosetting resin composition comprises (A) a polymeric component having at least two polymerizable substituents in the molecule, (B) a compound having at least one polymerizable substituent in the molecule and (C) a living polymerization agent for curing the resin composition. | 06-24-2010 |
20100180934 | LOW SOFTENING POINT GLASS COMPOSITION, BONDING MATERIAL USING SAME AND ELECTRONIC PARTS - A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower. | 07-22-2010 |
20110088933 | LOW DIELECTRIC LOSS WIRING BOARD, MULTILAYER WIRING BOARD, COPPER FOIL AND LAMINATE - A wiring board comprising a copper wiring, and an insulating layer which is a cured product of a resin composition containing a compound having a carbon-carbon unsaturated double bond as a cross-linking component,
| 04-21-2011 |
20110316661 | UNSATURATED POLYESTER RESIN COMPOSITION FOR COIL ADHESION - It is an objective of the present invention to provide a highly adhesive unsaturated polyester resin composition for fixing or immobilizing coils. There is provided an unsaturated polyester resin composition for adhesion of a coil, which includes the ingredients of: A) an unsaturated polyester resin and/or a vinyl ester resin; B) a monomer including a vinyl group as a polymerizable substituent at at least one end thereof; C) an isocyanate; and D) a polymerization initiator. | 12-29-2011 |
20120037410 | THERMOPLASTIC RESIN COMPOSITION, ADHESIVE FILM AND WIRING FILM USING THE SAME - A thermoplastic resin composition including a polyphenylene ether-based polymer having hydroxyl groups in its chemical structure and having 2,6-dimethylphenylene ether as a repeating unit, an isocyanate compound having a plurality of isocyanate groups in its structure; or a reaction product of the polyphenylene ether-based polymer having 2,6-dimethylphenylene ether as a repeating unit and the isocyanate compound having a plurality of isocyanate groups in its structure; and a hydrogenated styrene-based elastomer, and an adhesive film and a wiring film using the same are disclosed. | 02-16-2012 |
20120097447 | ELECTRIC EQUIPMENT HAVING INSULATION STRUCTURE AT WELDING PARTS - An electric equipment of the present invention has an insulation structure at a welding part formed by joining end parts of a plurality of conductors with each other, the welding part having a rectangular cross section and being coated with an insulating coating, in which the insulating coating is voidless and has a coating thickness of 50 to 1000 μm in the welding part, and in which an edge cover ratio of the insulating coating is 20% or more. | 04-26-2012 |
20120138345 | ADHESIVE COMPOSITION, ADHESIVE FILM AND WIRING FILM USING THE SAME - An adhesive composition comprises 10 to 100 parts by weight of a first maleimide compound having a plurality of maleimide groups in a structure and having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and/or a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds based on 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in a structure. A heat resistant adhesive film formed by coating the adhesive composition on a substrate film, and a wiring film having a conductor wiring layer put between heat resistant adhesive films are also disclosed. | 06-07-2012 |
20130131248 | ORGANIC-INORGANIC COMPOSITE MATERIALS CONTAINING TRIAZINE RINGS AND ELECTRICAL DEVICES USING THE SAME - The present invention provides an organic-inorganic composite material having excellent thermal stability, electrical insulation and adhesiveness. The organic-inorganic composite material includes a resin composed of a triazine ring and obtained by thermally curing a varnish containing a mixture of a layered clay mineral (clay) subjected to interlayer modification with a curing catalyst for a cyanate ester compound and a cyanate ester compound, wherein the amount of the clay is from 0.1 to 12 wt % of the amount of the cyanate ester compound. The invention also provides a varnish which gives the organic-inorganic composite material, and an electrical device and a semiconductor device, each of which includes the organic-inorganic composite material. | 05-23-2013 |
20130209802 | THERMOSETTING RESIN COMPOSITION, CURED MATERIAL, CONDUCTIVE WIRE, COIL FOR ELECTRICAL DEVICE, AND ELECTRICAL DEVICE - An object of the present invention is to provide a resin composition showing high heat resistance even in low-temperature curing and an electrical device using the resin composition. The object is solved by a thermosetting resin composition comprising (A) a compound of an oligomer having two or more of radical-polymerizable substituent X of which binding energy of repeated structure is higher than binding energy of carbon-carbon formed by the substituent X; (B) a compound having a polymerizable substituent highly reactive with the substituent X; and (C) a polymerization initiator. | 08-15-2013 |
20130333748 | LOW SOFTENING POINT GLASS COMPOSITION, BONDING MATERIAL USING SAME ADN ELECTRONIC PARTS - A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower. | 12-19-2013 |
Patent application number | Description | Published |
20130220674 | Adhesive Composition, Varnish, Adhesive Film and Wiring Film - Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight. | 08-29-2013 |
20130220677 | Thermosetting Adhesive Composition, and Heat Resistant Adhesive Film and Wiring Film Using the Same - Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film. | 08-29-2013 |
Patent application number | Description | Published |
20140141254 | SELF-REPAIRING LAMINATED STRUCTURE AND SELF-FUSING INSULATED WIRE - Provided is a laminated structure having excellent self-repairing performance, which can be prepared by an inexpensive and simple method; also provided are a self-bonding insulated wire and electrical machine using the same. A self-repairing laminated structure in which a self-repairing resin layer is formed on a base material and a thermosetting resin topcoat is formed on an outer layer thereof is characterized in that the self-repairing resin layer includes an uncured cross-linkable or curable thermoplastic resin, and the thermosetting resin topcoat includes a cross-linking agent, curing agent, or curing catalyst of the cross-linkable thermoplastic resin. | 05-22-2014 |
20140211373 | ORGANIC-INORGANIC COMPOSITE AND METHOD FOR MANUFACTURING THE SAME - The purpose of the present invention is to provide composite particulates and a method for manufacturing the composite particulates, the particulates including an organic substance and a metal having exceptional adhesiveness to a substrate, allowing easier control over metallic particle dispersion, facilitating control over electrical conductivity, and exhibiting high electroconductivity. The metallic particulates are characterized in that they have a thiol compound coordinated on the surfaces thereof, they are adsorbed onto a substrate with a silane compound interposed therebetween, and the thiol compound on the surfaces is subjected to oxidative polymerization, thereby yielding a structure in which an electroconductive polymer is coordinate-bonded to the surface of the metallic particulates. | 07-31-2014 |
20140378580 | Epoxy-Vinyl Copolymerization Type Liquid Resin Composition, Cured Product of the Same, Electronic/Electric Apparatus using the Cured Product, and Method of Producing the Cured Product - The present invention provides an epoxy-vinyl copolymerization type liquid resin composition and a cured product of the same. The resin composition contains: an epoxy resin having an epoxy resin equivalent of not more than 200 g/eq; an acid anhydride having an unsaturated double bond that is liquid at normal temperature or the acid anhydride having an unsaturated double bond that is liquid at normal temperature and maleic anhydride; a polyfunctional monomer which is liquid at normal temperature; an epoxy resin curing catalyst which accelerates a curing reaction of the epoxy resin with the acid anhydride or with the acid anhydride and maleic anhydride; and a radical polymerization catalyst which accelerates a curing reaction of the polyfunctional monomer. This makes it possible to reduce varnish viscosity and to enhance heat resistance of the cured product. Further, it is also possible to provide a cured product formed by curing the thermosetting resin composition, and to provide an electronic/electric apparatus in which the cured product is used as an insulating material or/and a structural material. | 12-25-2014 |