Patent application number | Description | Published |
20110056246 | OPTICAL CONNECTOR ASSEMBLING JIG AND OPTICAL CONNECTOR ASSEMBLING METHOD - An optical connector assembling jig and an optical connector assembling method includes an optical connection. The optical connector assembling jig includes a base and a guide. The base is provided in a longitudinal direction with an accommodation groove for accommodating an optical fiber, and a rear pressing member for restraining a rear part of the optical fiber accommodated in the accommodation groove. The rear part is set apart from an embedded fiber. The guide has a front holding portion for holding a front part of the optical fiber accommodated in the accommodation groove. The front part is near the embedded fiber, and the guide is capable of moving in the longitudinal direction. Moving the base toward the optical connector causes the intermediate section of the optical fiber to separate from the accommodation groove and bend. By moving the base further toward the optical connector, a buffered fiber in the optical fiber can be connected to the embedded fiber. | 03-10-2011 |
20110116745 | OPTICAL CONNECTOR, AND ASSEMBLING METHOD OF OPTICAL CONNECTOR - An optical connector according to an embodiment of the present invention comprises (a) a ferrule incorporating a short fiber; (b) a mechanical splice having a holding part and a fixing part, and adapted so that the fixing part mechanically fixes the short fiber extending from the ferrule held by the holding part, and an optical fiber in an optical cable to butt the short fiber; (c) an outer housing having a housing part in which the mechanical splice is located, and a pair of flexible arms located on both sides of the housing part, the pair of arms each being provided with a locking claw at a tip; and (d) a jacket fixture for fixing a cable jacket, the jacket fixture being coupled to the mechanical splice so that the cable jacket is inserted therein. | 05-19-2011 |
20110119904 | OPTICAL CONNECTOR CONSTRUCTION TOOL - There is provided an optical connector construction tool, which is constructed as a single component, and is compact in size and simple, wherein the construction tool allows an operation of withdrawing a wedge to be more reliably performed, and a manufacturing costs to be reduced. The optical connector construction tool comprises a base plate, a wedge provided to a bottom surface of the base plate and inserted into a mechanical splice part of an optical connector, a pair of arms extending from both sides of the base plate, and protrusions projecting from the arms toward the base plate, the protrusions engaging with the bottom of the base plate and deflecting the base plate upward as a result of the arms being laterally brought together. | 05-26-2011 |
20120128312 | OPTICAL CABLE GRIPPING MEMBER - An optical cable gripping member which prevents the kinds of splicing devices from being diversified, thereby enabling reduction of the labor of component management and lowering of the production cost to be realized is obtained. | 05-24-2012 |
20120195557 | CONNECTED OPTICAL FIBER AND METHOD FOR ASSEMBLING SAME - Provided is a connected optical fiber that is stable and has minimal connection loss even in a high-temperature or low-temperature environment, without involving an excessive amount of labor in the optical fiber connection process, and also provided is a method for assembling a connected optical fiber. The connected optical fiber includes a first optical fiber, a second optical fiber, and a mechanical splice, an end face of the first optical fiber and an end face of the second optical fiber being placed end to end and mechanically connected in the mechanical splice. In this connected optical fiber, at least one end face among the end face of the first optical fiber and the end face of the second optical fiber is formed having a convex curved surface shape in a direction angled with respect to a surface perpendicular to an axis of the optical fiber that has the end face. | 08-02-2012 |
20130266279 | OPTICAL CONNECTOR - In an optical connector of the invention, the rotation in a conventional angle polish connector can be prevented, while external force acting on the connector can be prevented from affecting a ferrule. The optical connector includes a ferrule | 10-10-2013 |
Patent application number | Description | Published |
20120001972 | PRINTING APPARATUS AND PRINTING POSITION ADJUSTING METHOD THEREOF - A printing apparatus prints by discharging inks from respective nozzle arrays, the printhead having a plurality of nozzle arrays including at least a first nozzle array, a second nozzle array, and a third nozzle array, and the first nozzle array and the second nozzle array being arrayed to be shifted in a nozzle arrayed direction. The printing apparatus controls the first and second nozzle arrays to discharge inks to form a plurality of first patterns. The printing apparatus controls the third nozzle array to discharge inks to form second patterns while changing a shift amount in a direction which intersects with the nozzle arrayed direction with respect to the plurality of first patterns. The printing apparatus calculates an adjustment value required to adjust relative printing positions between the first nozzle array and the third nozzle array in the intersecting direction using the first patterns and the second patterns. | 01-05-2012 |
20120013664 | INKJET PRINTER AND INKJET PRINTING METHOD - The present invention relates to an inkjet printer that prints an image by a forward scan and a backward scan of printing heads. In the present invention, it is determined whether or not a color unevenness occurrence value set on the basis of values of unit image data constituting image data is more than a predetermined threshold value. If the color unevenness occurrence value is less than the threshold value, data that enable a dot to be formed in a unit area corresponding to the unit image data by the forward scan and the backward scan of the printing heads are generated. If the color unevenness occurrence value is more than the threshold value, data that enable a dot to be formed in the unit area only by any one of the forward scan and the backward scan by the printing heads are generated. | 01-19-2012 |
20120154469 | INKJET RECORDING APPARATUS AND INKJET RECORDING METHOD - An inkjet recording apparatus recording image data by causing a recording head to scan in the going-and-returning directions of a certain direction includes a record unit that finishes recording with a first scan involving a discharge of ink and a second scan involving the ink discharge in the returning direction, to first and second regions in the going direction, and that varies the number of scanning which does not involve the ink discharge between the first and second regions, a generation unit generating record data specifying the ink discharge or the ink non-discharge for each pixel region of the first and second regions, and a determination unit determining the going-direction recording ratio and the returning-direction recording ratio in the pixel regions, wherein the generation unit generates the record data based on the determined going-direction recording ratio and returning-direction recording ratio. | 06-21-2012 |
20120169810 | PRINTING APPARATUS AND ADJUSTMENT PATTERN PRINTING METHOD - The present invention provides an printing apparatus including a pattern printing unit for causing printing elements in partial regions of first and second printing element arrays to print adjustment patterns on a print medium, the adjustment patterns being for acquiring an amount of printing position shift of the second print head with respect to a printing position of the first print head, an acquisition unit for acquiring an amount of relative inclination between the first and second print element arrays, and a selection unit for selecting positions of the partial regions of the first and second printing element arrays based on the amount of relative inclination between the first and second print element arrays. As a result, consumption of media and ink upon a registration process and the amount of time required for the registration process can be reduced. | 07-05-2012 |
20120268752 | DATA PROCESSING APPARATUS, DATA PROCESSING METHOD AND INKJET PRINTING APPARATUS - A data processing apparatus, a data processing method and an inkjet printing apparatus are offered that are capable of reducing, in any kind of image, the occurrence of color unevenness while achieving a high speed output via a bi-directional printing. In order to achieve this, forward scan print ratio and backward scan print ratio with respect to a predetermined area comprising a plurality of pixels is set based on multi-value image data of the predetermined area. Next, binary print data for the forward scans and binary print data for the backward scans at the predetermined area is generated based on the multi-value image data and the set print ratios. According to such a configuration it is possible to increase the ratio of bi-directional printing with respect to areas at which color unevenness appears with difficulty, and increase the ratio of one-directional printing at areas where color unevenness appears with ease. | 10-25-2012 |
20120287203 | INK JET PRINTING APPARATUS AND INK JET PRINTING METHOD - Even if colors are printed in the same order for each band, time difference unevenness is suppressed which results from a difference in duration from the end of the first scan until the beginning of the second scan. An ink jet printing apparatus completely prints a scan area with a width corresponding to a predetermined length of a nozzle line. The ink jet printing apparatus includes conveying means for moving the print medium, generation means for generating print data in such a manner that in the two scans for completely printing the scan area with the width corresponding to the predetermined length, a print duty for the first scan is higher than a print duty for the second scan, and print control means for carrying out the first scan in an identical direction for all the scan areas completely printed by the two scans. | 11-15-2012 |
20140218427 | INKJET PRINTING APPARATUS AND INKJET PRINTING METHOD - An apparatus including: a print head having a plurality of nozzle arrays; a scanning unit configured to perform scanning by the print head in a first direction and in a second direction; an adjusting unit configured to adjust an amount of the ink ejection from a first nozzle unit consisted from predetermined number of nozzles arranged in one of end positions of a first nozzle array, the number of nozzle arrays arranged in a side of the first direction from the first nozzle array is lower than the number of nozzle arrays arranged in a side of the second direction from the first nozzle array; and a control unit, the adjusting unit adjusts the amount of the ink ejection such that amount of ink ejection in the scan of the first direction is smaller than amount of ink ejection in the scan of the second direction. | 08-07-2014 |
20150070427 | PRINTING APPARATUS AND PRINTING POSITION ADJUSTING METHOD THEREOF - A printing apparatus prints by discharging inks from respective nozzle arrays, the printhead having a plurality of nozzle arrays including at least a first nozzle array, a second nozzle array, and a third nozzle array, and the first nozzle array and the second nozzle array being arrayed to be shifted in a nozzle arrayed direction. The printing apparatus controls the first and second nozzle arrays to discharge inks to form a plurality of first patterns. The printing apparatus controls the third nozzle array to discharge inks to form second patterns while changing a shift amount in a direction which intersects with the nozzle arrayed direction with respect to the plurality of first patterns. The printing apparatus calculates an adjustment value required to adjust relative printing positions between the first nozzle array and the third nozzle array in the intersecting direction using the first patterns and the second patterns. | 03-12-2015 |
Patent application number | Description | Published |
20080227297 | CHEMICAL MECHANICAL POLISHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A chemically mechanically polishing method is provided, which includes slide-contacting a polishing film with a polishing pad while feeding a first chemical liquid and a second chemical liquid to the polishing pad. The first chemical liquid contains an electrolyte and bubbles having a diameter ranging from 10 nm to 1000 μm, and the second chemical liquid contains abrasive particles. | 09-18-2008 |
20090124076 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is provided, the method includes forming a coated film by coating a solution containing a solvent and an organic component above an insulating film located above a semiconductor substrate and having a recess, baking the coated film at a first temperature which does not accomplish cross-linking of the organic component to obtain an organic film precursor, polishing the organic film precursor using a slurry containing resin particles to leave the organic film precursor in the recess, baking the left organic film precursor at a second temperature which is higher than the first temperature to remove the solvent to obtain a first organic film embedded in the recess, forming a second organic film on the insulating film, thereby obtaining an underlying film, forming an intermediate layer and a resist film successively above the underlying film, and subjecting the resist film to patterning exposure. | 05-14-2009 |
20090156000 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is provided, which includes forming a coated film by coating a solution containing a solvent and an organic component above an insulating film located above a semiconductor substrate and having a recess, baking the coated film at a first temperature which does not accomplish cross-linking of the organic component to obtain an organic film precursor, polishing the organic film precursor using a first slurry containing first resin particles and a water-soluble polymer to planarize a surface of the organic film precursor, and polishing the organic film precursor where the surface is planarized using a second slurry containing second resin particles and a water-soluble polymer to leave the organic film precursor in the recess, thereby exposing the insulating film, an average particle diameter of the second resin particles being smaller than that of the first resin particles. | 06-18-2009 |
20090239373 | CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A chemical mechanical polishing method comprises polishing an organic film using a slurry including polymer particles having a surface functional group and a water-soluble polymer. | 09-24-2009 |
20100075501 | CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION AND CHEMICAL MECHANICAL POLISHING METHOD - A chemical mechanical polishing aqueous dispersion is used to polish a polishing target that includes an interconnect layer that contains tungsten. The chemical mechanical polishing aqueous dispersion includes: (A) a cationic water-soluble polymer; (B) an iron (III) compound; and (C) colloidal silica particles. The content (M | 03-25-2010 |
20100115479 | Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program - A method for generating a pattern includes reading out an interconnect layout and a hole layout, the interconnect layout prescribing interconnect patterns, the hole layout prescribing hole patterns configured to connect to the interconnect patterns; extracting one of the hole patterns to be connected within the same interconnect layer level to one of the interconnect patterns in a pattern processing area; extracting a first processing area including the extracted hole pattern; calculating a first pattern density of the interconnect patterns included in the first processing area; and generating first additional patterns in the first processing area based on the first pattern density. | 05-06-2010 |
20110081832 | POLISHING DEVICE AND POLISHING METHOD - In one embodiment, a polishing device includes: a rotatable turntable, a holding unit, a separation wall, a slurry supply tube, and a cooling medium supply tube. On an upper surface of the rotatable turntable, a polishing pad is attached. The holding unit rotatably holds an object to be polished and disposes a polished surface of the object to be polished in a manner to face the polishing pad. The separation wall abuts on the upper surface of the polishing pad and sections the polishing pad into a polished region in which the holding unit is provided and an unpolished region in which the holding unit is not provided. The slurry supply tube supplies a slurry to the upper surface of the polishing pad in a polished region side. The cooling medium supply tube supplies a cooling medium to the upper surface of the polishing pad in the unpolished region. | 04-07-2011 |
20110217906 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing. | 09-08-2011 |