De Amicis
Alberto De Amicis, Milan IT
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20110113777 | TANK FOR CONTAINING LIQUIDS - The present invention relates to a tank for the containment of a liquid, preferably a molten salt, said tank being associable to an aspiration pump of said liquid, wherein said tank comprises a bottom from which a lateral wall raises and wherein said aspiration pump requires a minimum level of liquid in said tank for operating, characterized in that it comprises at least an element occupying a volume and placeable inside said tank with at least a portion of said volume arranged at a height, with respect to said bottom, which is lower than said minimum level. The improved tanks of the present invention are suitable as storage tanks for liquids at elevated temperature such as molten salts to be used in heat storage systems in connection with solar power plants. | 05-19-2011 |
Alberto De Amicis, San Donato Milanese IT
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20130298449 | METHOD FOR REDUCING EMISSION OF POLLUTANTS FROM AN INTERNAL COMBUSTION ENGINE, AND FUEL EMULSION COMPRISING WATER AND A LIQUID HYDROCARBON - A fuel emulsion has a liquid hydrocarbon fuel, water, at least one emulsifier and at least one oxygen-containing water soluble organic compound. In the fuel emulsion, water is present in an amount not greater than 15% by weight, and the emulsifier is selected from a product obtained by reacting (a1) a polyolefin oligomer functionalized with at least one group deriving from a dicarboxylic acid, or a derivative thereof, with (a2) a polyoxyalkylene comprising linear oxyalkylene units. In the fuel emulsion, the oxygen-containing water soluble organic compound is present in a predetermined amount so as to obtain an amount of water soluble organic oxygen of from 0.1 to 5% by weight. A considerable reduction of particulate emissions is obtained by using this fuel emulsion while maintaining or even further reducing the NOx level which is already reduced by the engine itself. | 11-14-2013 |
Francesca De Amicis, Buttrio (ud) IT
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20150284738 | ARTIFICIAL DNA SEQUENCE WITH OPTIMIZED LEADER FUNCTION IN 5' (5'-UTR) FOR THE IMPROVED EXPRESSION OF HETEROLOGOUS PROTEINS IN PLANTS - A nucleotide leader sequence 5′-UTR comprises elements favorable to gene expression, such as repeated CAA trinucleotide elements in combination with repeated CT dinucleotide elements. | 10-08-2015 |
Gene Edward De Amicis, Mt. Pleasant, SC US
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20130099123 | TIRE SURFACE ANOMALY DETECTION - A tire surface anomaly detection system and method are disclosed. The system and method are generally based on the principle that a tire surface anomaly will have a different heat transfer rate than that of the uniform mass surrounding the tire surface anomaly. Embodiments of the present disclosure apply thermal energy to the surface of a tire and monitor the infrared energy at the surface of the tire to generate one or more infrared images of the surface of the tire. The infrared images are analyzed by an image processing system to determine and locate thermal gradients on the surface of the tire. The presence of a thermal gradient in the infrared images generally indicates the presence of an anomaly in the surface of the tire. In this manner, the present disclosure provides an objective technique for identifying, locating, and classifying tire surface anomalies. | 04-25-2013 |
Giovanni De Amicis, L'Aquila IT
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20130001728 | BACKSIDE ILLUMINATED IMAGE SENSORS WITH VERTICAL LIGHT SHIELDS - Methods for forming backside illuminated (BSI) image sensors having vertical light shields are provided. Vertical light shields may be configured such that incoming light is blocked from reaching a portion of a pixel array formed on the backside illuminated image sensor. Vertical light shields may include horizontal portions that block direct illumination of dark pixels in the pixel array and vertical portions that block illumination of the dark pixels by reflected light. Vertical light shields may be formed from a dielectric layer, a layer of patterned light shield material formed over the dielectric layer and a passivation layer formed over the patterned light shield material. Vertical light shields may be formed by first etching a vertical trench in a device wafer layer over a portion of the pixel array and filling the vertical trench with light shield material to form the vertical light shield. | 01-03-2013 |
20130009268 | ALIGNMENT MARKS AND ALIGNMENT METHODS FOR ALIGNING BACKSIDE COMPONENTS TO FRONTSIDE COMPONENTS IN INTEGRATED CIRCUITS - An imaging system may include an imager integrated circuit with frontside components such as imaging pixels and backside components such as color filters and microlenses. The imager integrated circuit may be mounted to a carrier wafer with alignment marks. Bonding marks on the carrier wafer and the imager integrated circuit may be used to align the carrier wafer accurately to the imager integrated circuit. The alignment marks on the carrier wafer may be read, by fabrication equipment, to align backside components of the imager integrated circuit, such as color filters and microlenses, with backside components of the imager integrated circuit, such as photodiodes. | 01-10-2013 |
20130009269 | ALIGNMENT MARKS AND ALIGNMENT METHODS FOR ALIGNING BACKSIDE COMPONENTS TO FRONTSIDE COMPONENTS IN INTEGRATED CIRCUITS - An imaging system may include an imager integrated circuit with frontside components such as imaging pixels and backside components. The imager integrated circuit may also include mirrored alignment marks formed with the frontside components. As part of forming the backside components, the integrated circuit may be flipped over such that the mirrored alignment marks are no longer mirrored and are readable by alignment systems. The formerly mirrored alignment marks may be used by the alignment systems in aligning the backside components with the frontside components in the imager integrated circuit (e.g., in forming the backside components in alignment with the frontside components). | 01-10-2013 |
20150102445 | ALIGNMENT MARKS AND ALIGNMENT METHODS FOR ALIGNING BACKSIDE COMPONENTS TO FRONTSIDE COMPONENTS IN INTEGRATED CIRCUITS - An imaging system may include an imager integrated circuit with frontside components such as imaging pixels and backside components such as color filters and microlenses. The imager integrated circuit may be mounted to a carrier wafer with alignment marks. Bonding marks on the carrier wafer and the imager integrated circuit may be used to align the carrier wafer accurately to the imager integrated circuit. The alignment marks on the carrier wafer may be read, by fabrication equipment, to align backside components of the imager integrated circuit, such as color filters and microlenses, with backside components of the imager integrated circuit, such as photodiodes. | 04-16-2015 |