Patent application number | Description | Published |
20120069685 | Semiconductor device having optical fuse and electrical fuse - A semiconductor device includes a plurality of first chips, a second chip that controls the first chips, and internal wiring that connects the first chips and the second chip. The first chips each include: an optical fuse; a first latch circuit that retains information on the optical fuse; a second latch circuit that retains information on an electrical fuse, the information being supplied from the second chip through the internal wiring; and a select circuit that selects the information retained in either one of the first and second latch circuits. A redundancy determination signal is generated from the information selected. The information on the electrical fuse is transferred from the second chip to the first chips through the internal wiring. | 03-22-2012 |
20120212254 | SEMICONDUCTOR DEVICE HAVING CALIBRATION CIRCUIT FOR ADJUSTING OUTPUT IMPEDANCE OF OUTPUT BUFFER CIRCUIT - Disclosed herein is a device that includes a replica buffer circuit that drives a calibration terminal, a reference-potential generating circuit that generates a reference potential, a comparison circuit that compares a potential appearing at the calibration terminal with the reference potential, and a control circuit that changes an output impedance of the replica buffer circuit based on a result of a comparison by the comparison circuit. The reference-potential generating circuit includes a first potential generating unit activated in response to an enable signal and a second potential generating unit activated regardless of the enable signal, and an output node of the first potential generating unit and an output node of the second potential generating unit are commonly connected to the comparison circuit. | 08-23-2012 |
20120212286 | SEMICONDUCTOR DEVICE THAT CAN CANCEL NOISE IN BIAS LINE TO WHICH BIAS CURRENT FLOWS - Disclosed herein is a device that includes a bias line to which a bias current flows, a switch circuit controlling an amount of the bias current based on a control signal, a control line to which the control signal is supplied, and a cancellation circuit substantially cancelling a potential fluctuation of the bias line caused by changing the control signal, the potential fluctuation propagating via a parasitic capacitance between the control line and the bias line. | 08-23-2012 |
20130088258 | SEMICONDUCTOR DEVICE INCLUDING OUTPUT CIRCUIT CONSTITUTED OF PLURAL UNIT BUFFER CIRCUITS IN WHICH IMPEDANCE THEREOF ARE ADJUSTABLE - The semiconductor device comprises an output circuit that includes a plurality of unit buffer circuits each of which has an adjustable impedance, a control circuit that selectively activates one or ones of the unit buffer circuits, and an impedance adjustment unit that adjusts the impedances of the unit buffer circuits and includes a power line, a replica circuit, which has a replica impedance that is substantially equal to the adjustable impedance of each of the unit buffer circuits, and a load current generation circuit, which changes current flowing therethrough in accordance with the number of activated the one or ones of the unit buffer circuits. The replica circuit and the load current generation circuit are connected in common to the power line. | 04-11-2013 |
20130249578 | SEMICONDUCTOR DEVICE HAVING PENETRATING ELECTRODES EACH PENETRATING THROUGH SUBSTRATE - Disclosed herein is a device that includes a semiconductor substrate, a check circuit and a through-substrate via. The check circuit includes a check line formed over the semiconductor substrate and including first and second parts each extending in a first direction and a third part extending in a second direction that crosses the first direction, the first and second parts being opposite to each other, the third part connecting one end of the first part with one end of the second part, a charge circuit coupled to a one end of the check line, and a comparator coupled to the other end of the check line at a first input node thereof. The through-substrate via penetrates through the semiconductor substrate and is located in an area that is between the first and second parts of the check line. | 09-26-2013 |
20140141543 | SEMICONDUCTOR DEVICE HAVING OPTICAL FUSE AND ELECTRICAL FUSE - A method for manufacturing a stacked semiconductor memory device includes testing a plurality of memory chips to detect first defective addresses, programming optical fuses with first defective address information on each of the plurality of memory chips that have the first defective addresses, stacking the plurality of memory chips, testing the stacked memory chips to detect second defective addresses, and programming electrical fuses with second defective address information. | 05-22-2014 |
20140152380 | SEMICONDUCTOR DEVICE THAT CAN CANCEL NOISE IN BIAS LINE TO WHICH BIAS CURRENT FLOWS - Disclosed herein is a device that includes a bias line to which a bias current flows, a switch circuit controlling an amount of the bias current based on a control signal, a control line to which the control signal is supplied, and a cancellation circuit substantially cancelling a potential fluctuation of the bias line caused by changing the control signal, the potential fluctuation propagating via a parasitic capacitance between the control line and the bias line. | 06-05-2014 |
20140286109 | SEMICONDUCTOR DEVICE INCLUDING OUTPUT CIRCUIT CONSTITUTED OF PLURAL UNIT BUFFER CIRCUITS IN WHICH IMPEDANCE THEREOF ARE ADJUSTABLE - A semiconductor device includes an output circuit having a plurality of unit buffer circuits, an impedance of each unit buffer circuit of the plurality of unit buffer circuits being adjustable, a control circuit configured to selectively activate one or more unit buffer circuits of the plurality of unit buffer circuits, and an impedance adjustment unit configured to adjust the impedance of each of the unit buffer circuits of the plurality of unit buffer circuits. The impedance adjustment unit includes a first power line, a replica circuit, and a load current generation circuit. The replica circuit and the load current generation circuit are coupled in common to the first power line, the replica circuit has a replica impedance that is substantially equal to the impedance of the output circuit, and the load current generation circuit changes current flowing therethrough. | 09-25-2014 |
Patent application number | Description | Published |
20120249969 | POLARIZATION BEAM SPLITTING ELEMENT AND IMAGE PROJECTION APPARATUS - The polarization beam splitting element splits an entering beam according to polarization directions. The element includes, in order from a beam entrance side, an entrance side multi-layered film layer constituted by laminated multiple dielectric films, and a one-dimensional grating structure having a grating period smaller than a wavelength of the entering beam and formed of a metal. When a medium existing on the beam entrance side further than the entrance side multi-layered film layer is referred to as an entrance medium, the multiple dielectric films constituting the entrance side multi-layered film layer include at least one dielectric film having a higher refractive index than that of the entrance medium and at least one dielectric film having a lower refractive index than that of the entrance medium. | 10-04-2012 |
20120249970 | POLARIZATION BEAM SPLITTING ELEMENT AND IMAGE PROJECTION APPARATUS - The polarization beam splitting element includes a one-dimensional grating structure having a grating period smaller than a wavelength of an entering beam and including a metal grating portion, and two light-transmissive members each having a refractive index higher than that of air. The one-dimensional grating structure is disposed between the two light-transmissive members. The grating period of the one-dimensional grating structure is 120 nm or less, a thickness of the one-dimensional grating structure is 100 nm or less and an inter-grating portion of the one-dimensional grating structure is formed as a vacuum space or formed of air or a dielectric material. The grating period Λ [nm], a filling factor FF that is a ratio w/Λ of a width w [nm] of the grating portion to the grating period, a refractive index n | 10-04-2012 |
20120257168 | POLARIZATION BEAM SPLITTING ELEMENT AND IMAGE PROJECTION APPARATUS - The polarization beam splitting element is configured to reflect or transmit an entering beam according to its polarization direction. The element includes, in order from a beam entrance side, a base member having a light transmissive property, a first one-dimensional grating structure formed of a dielectric material and having, in a first direction, a first grating period smaller than a wavelength of the entering beam, and a second one-dimensional grating structure formed of a metal and having, in a second direction orthogonal to the first direction, a second grating period smaller than the wavelength of the entering beam. | 10-11-2012 |
20130027779 | OPTICAL ELEMENT, AND OPTICAL SYSTEM AND OPTICAL APPARATUS USING SAME - The optical element of the present invention has an anti-reflection film formed on a substrate. Here, the anti-reflection film comprises a first layer formed on the substrate; a second layer formed on the first layer and consisting of a material different from that of the first layer; and a third layer formed on the second layer and consisting of a concave-convex structure. Also, the third layer has three regions of which a refractive index for each thickness changes at a constant rate by continuously changing the space filling factor of the concave-convex structure. | 01-31-2013 |
20140177059 | OPTICAL ELEMENT, OPTICAL SYSTEM AND OPTICAL APPARATUS HAVING ANTIREFLECTION COATING - An optical element includes a transparent substrate and an antireflection coating on the substrate. The antireflection coating includes an intermediate layer on the substrate, and an undulation layer that is formed on the intermediate layer and has a plurality of convexes arrayed with spacing shorter than a shortest wavelength. The undulation layer has a portion where refractive index increases from a light incident side to the substrate. The intermediate layer has a first layer closest to the substrate, and a second layer formed on the first layer. A refractive index n1 of the first layer, a refractive index n2 of the second layer, and a refractive index ns of the substrate satisfy the following conditional equations: | 06-26-2014 |
Patent application number | Description | Published |
20100065303 | ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE AND METHOD FOR PRODUCING THE JOINED STRUCTURE - Provided is an anisotropic conductive film having enhanced adhesion strength to a circuit member and attaining high conduction reliability; a joined structure; and a method for producing the joined structure | 03-18-2010 |
20100080995 | METHOD FOR CONNECTING ELECTRONIC PART AND JOINED STRUCTURE - A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles. | 04-01-2010 |
20100096175 | ADHESIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE - An adhesive film, containing a first adhesive layer in which conductive particles are dispersed, and a second adhesive layer adhered to the first adhesive layer, wherein the lowest viscosity of the first adhesive layer attained at or below the curing temperature is higher than that of the second adhesive layer attained at or below the curing temperature, where the curing temperature is a temperature at which the adhesive layer starts to cure, wherein the first and second adhesive layers are respectively disposed to a substrate side and an electronic part side, and the adhesive film is configured to join the electronic part and the substrate by heating and pressurizing the substrate and the electronic part with the adhesive layer being therebetween, and wherein the first adhesive layer has a thickness which is less than two times of an average particle diameter of the conductive particles. | 04-22-2010 |
20100116533 | ADHESIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE - An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise. | 05-13-2010 |
20110088935 | CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND JOINING METHOD - The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive reliability not only with respect to ITO substrates, but also with respect to IZO substrates, an anisotropic conductive film provided with the conductive particles, a joined structure provided with the anisotropic conductive film, and a joining method using the anisotropic conductive film. The conductive particles of the present invention include polymer fine particles, and a conductive layer formed on surfaces of the polymer fine particles, wherein an outermost surface shell of the conductive layer is a nickel-palladium alloy layer. | 04-21-2011 |
20110120767 | ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING CONNECTION ASSEMBLY USING THE SAME - An anisotropic conductive film that may give rise to high connection reliability, and a method for manufacturing a connection assembly with the use of the anisotropic conductive film, are disclosed. An anisotropic conductive film ( | 05-26-2011 |
20110223430 | CONNECTING FILM, AND JOINED STRUCTURE AND METHOD FOR PRODUCING THE SAME - To provide a connecting film including an organic resin layer which contains a color-erasing pigment, a curable organic resin, a curing agent and a conductive particle. | 09-15-2011 |
20120055703 | Joined Structure and Method for Producing the Same - A method for producing a joined structure, containing: after placing an anisotropic conductive film in the predetermined manner, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate; and heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region. | 03-08-2012 |
20120090882 | CONDUCTIVE PARTICLE, AND ANISOTROPIC CONDUCTIVE FILM, BONDED STRUCTURE, AND BONDING METHOD - To provide a conductive particle, containing: a core particle; and a conductive layer formed on a surface of the core particle, wherein the core particle is a nickel particle, and wherein the conductive layer is a nickel plating layer a surface of which has a phosphorous concentration of 10% by mass or lower, and the conductive layer has an average thickness of 1 nm to 10 nm. | 04-19-2012 |
20120279781 | CONDUCTIVE PARTICLE, AND ANISOTROPIC CONDUCTIVE FILM, BONDED STRUCTURE, AND BONDING METHOD - To provide a conductive particle, which contains a core particle, and a conductive layer formed on a surface of the core particle, where the core particle is formed of a resin, or a metal, or both thereof, and the conductive layer contains a phosphorus-containing hydrophobic group at a surface thereof. | 11-08-2012 |
20120285603 | ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE AND METHOD FOR PRODUCING THE JOINED STRUCTURE - A method for producing a joined structure, the method involving pressure-bonding first and second circuit members together via an anisotropic conductive film while the circuit members are being heated, to thereby join the circuit members with each other. The anisotropic conductive film electrically connects the first circuit member with the second circuit member having a nitrogen atom-containing film on a surface facing the first circuit member, wherein the anisotropic conductive film, the first layer and the second layer are further defined including the provisions that at least one of the first and second layers includes conductive particles, and the difference in maximum exothermic peak temperature between the first and second layers is within the range up to 20° C. | 11-15-2012 |
20130077266 | CONNECTION METHOD AND CONNECTION STRUCTURE OF ELECTRONIC COMPONENT - A connection method and a connection structure of electronic components by which high connection reliability can be obtained. An anisotropic conductive film is temporarily disposed, and thermally compressed and bonded, in such manner that a boundary of a circuit protection area and a terminal area of a second electronic component is positioned on a single layer area of the anisotropic conductive film; and the terminal area of the second electronic component is positioned on a double-layer area of the anisotropic conductive film. | 03-28-2013 |
20130135838 | ANISOTROPIC CONDUCTIVE MATERIAL AND METHOD FOR MANUFACTURING THE SAME - The present invention provides an anisotropic conductive material in which lower continuity resistance and higher adhesive strength are obtained, and a method for manufacturing the same. When a glass substrate and a metal wiring material are thermally compressed and bonded, in an interface between the glass substrate and an anisotropic conductive material, Si on a surface of the glass substrate reacts on an alkoxyl group (OR) at an end of disulfide silane modified by hydrophobic silica, and chemically binds thereto. Furthermore, at an interface between the metal wiring material and the anisotropic conductive material, a part of S—S bonds (disulfide bonds) in disulfide silane dissociates due to the heat at the time of thermocompression bonding, and the dissociated sulfide silane chemically binds to metal Me. | 05-30-2013 |
20140168919 | ANISOTROPIC CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE FILM PRODUCTION METHOD, CONNECTING METHOD, AND BONDED STRUCTURE - To provide an anisotropic conductive film, which contains conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a substrate with a terminal of an electronic component, wherein the conductive particles are conductive particles, in each of which a metal plated layer and an insulating layer are sequentially provided on a surface of a resin particle, or conductive particles, in each of which an insulating layer is provided on a metal particle, or both thereof, and wherein 3.0 to 10.0 conductive particles are linked together on average. | 06-19-2014 |
Patent application number | Description | Published |
20090027867 | High-speed signal transmission apparatus - A high-speed signal transmission apparatus comprises: a housing; a plurality of daughter boards juxtaposed to one another in the housing; board-side connectors each provided on corresponding each of the juxtaposed daughter boards; and cable-side connectors fixed in the housing; wherein each of the board-side connectors is insertable/removable into/from corresponding each of the cable-side connectors, and wherein a cable group whose impedance matching can be achieved makes connection between the predetermined cable-side connectors. | 01-29-2009 |
20110083877 | DIFFERENTIAL SIGNALING CABLE, TRANSMISSION CABLE ASSEMBLY USING SAME, AND PRODUCTION METHOD FOR DIFFERENTIAL SIGNALING CABLE - A differential signaling cable according to the present invention comprises: a pair of signal conductors provided in parallel; an insulator which covers the periphery of the pair of signal conductors in a batch; and a shield conductor provided on the outer periphery of the insulator, in which an interval between the pair of signal conductors is specified so that even-mode impedance becomes 1.5 to 1.9 times odd-mode impedance. | 04-14-2011 |
20140154927 | CABLE CONNECTOR AND CABLE ASSEMBLY, AND METHOD OF MANUFACTURING CABLE ASSEMBLY - A cable connector and a cable assembly in which electrical characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which are easily connectable by reducing the number of parts, and a method of manufacturing the cable assembly are provided. Respective ground contacts and respective signal line contacts positioned between the respective ground contacts through a space are provided in a connector main body. Front-side arm portions and rear-side arm portions mutually extending toward the respective signal line contacts are integrally provided with end portions of the respective ground contacts protruded from a side wall portion of the connector main body. And, under a state that respective signal line conductors are arranged in the respective signal line contacts, an outer conductor is held by the front-side arm portions and the rear-side arm portions. | 06-05-2014 |
20140154928 | CABLE CONNECTOR AND CABLE ASSEMBLY, AND METHOD OF MANUFACTURING CABLE ASSEMBLY - Provided is a cable connector, a cable assembly, and a method of manufacturing the cable assembly, in which electric characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which is easily connectable by reducing the number of parts. In a ground contact, an outer-conductor adhering portion which is protruded from a side wall portion of a connector main body and which is adhered with an outer conductor by a conductive adhesive is provided. In this manner, elastic deformation of a cable for differential signal transmission is suppressed, so that electric characteristics can be stabilized. Also, connecting work between the outer conductor and the ground contact can be simplified as reducing the number of parts. Further, the cable for differential signal transmission is not exposed to a high temperature of soldering or others, and therefore, thermal deformation thereof does not occur, either. | 06-05-2014 |
20140305676 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND MULTIPAIR DIFFERENTIAL SIGNAL TRANSMISSION CABLE - A differential signal transmission cable includes two core wires arranged in parallel, each of the two core wires having an insulation layer on an outer periphery of a conductor; and an outer conductor provided so as to cover the two core wires all together. The insulation layer includes sequentially an inner skin layer of a non-foamed resin, a foam layer of a foamed resin, and an outer skin layer of a non-foamed resin on the outer periphery of the conductor. The outer skin layer has a higher relative permittivity than the inner skin layer. The multipair differential signal transmission includes a plurality of differential signal transmission cables and a protective jacket provided around the plurality of differential signal transmission cables. | 10-16-2014 |