Patent application number | Description | Published |
20110292153 | IMAGE FORMING APPARATUS - According to one embodiment, there is provided an image forming apparatus, including an accommodation unit, an image forming unit, an image reading unit, an image erasing unit, a first medium processing unit, and a second medium processing unit. The first medium processing unit forms the image on the recording medium carried from the accommodation unit and discharges the recording medium on which the image is formed, based on the setting of a first image process mode. The second medium processing unit forms a test image on the recording medium carried from the accommodation unit, reads the test image, erases the test image, and returns the recording medium to the accommodation unit, based on a setting of a second image process mode. | 12-01-2011 |
20110299867 | IMAGE FORMING APPARATUS AND METHOD OF CONTROLLING THE IMAGE FORMING APPARATUS - According to one embodiment, an image forming apparatus includes: a first paper feeding unit; a second paper feeding unit; a fixing unit configured to fix a developer image transferred onto a sheet; a conveying path configured to convey sheets; a receiving unit configured to receive an execution instruction for duplex printing for continuously printing an image on one surface and on the other surface of a sheet; an acquiring unit configured to acquire, in the printing on one surface, information concerning presence or absence of an image on the other surface; and a processor configured to change, in the printing on one surface, if a result of the acquisition concerning the sheet fed from the first paper feeding unit indicates that an image is present, a paper feeding unit from the first paper feeding unit to the second paper feeding unit and performs control for re-executing the duplex printing. | 12-08-2011 |
Patent application number | Description | Published |
20120113465 | IMAGE FORMING APPARATUS, DEVICE COOPERATION SYSTEM, AND DEVICE COOPERATION METHOD - An image forming apparatus includes an input unit that inputs print conditions; a search unit that searches for image forming apparatuses that can execute the print conditions; a display unit that displays icons of the found image forming apparatuses; a generating unit that generates a print job when an icon corresponding to one of the image forming apparatuses is operated; a sending unit that sends the print job to the one of the image forming apparatuses; and a management unit configured to manage progress situation information of print jobs. When an icon of a second image forming apparatus is operated after a print job is sent to a first image forming apparatus and before the first image forming apparatus completes the print job, print jobs are regenerated to distribute a remaining number of sheets between the first image forming apparatus and the second image forming apparatus. | 05-10-2012 |
20130006983 | IMAGE FORMING APPARATUS AND FILE MANAGEMENT SYSTEM - An image forming apparatus is connected to an information processing apparatus via a network. The information processing apparatus may be configured to accumulate files. The information processing apparatus may include a communicating part configured to communicate with the information processing apparatus; a data obtaining part configured to obtain data to be accumulated; an encrypting part configured to encrypt the data to be accumulated; a metadata generating part configured to transmit the encrypted data to be accumulated to the information processing apparatus, and set metadata, which is received or generated by an operation receiving part, in a property of the data to be accumulated according to a WebDAV protocol; and an access control information setting part configured to set access control information which defines whether to permit an edit, an addition or a deletion of the metadata as well as an access entity according to the WebDAV protocol. | 01-03-2013 |
20130243467 | IMAGE FORMING APPARATUS, ENERGY SAVING CONTROL METHOD, AND MEDIUM - An image forming apparatus includes a UI application that configures functions supported in an energy saving mode and in a normal mode, an energy saving memory control service that manages settings of the configured functions supported in the energy saving mode, and a filtering service that filters external access to the image forming apparatus in the energy saving mode along with the settings. In the energy saving mode, the filtering service determines whether the image forming apparatus remains in the energy saving mode or returns to the normal mode in order to process the access using the settings. | 09-19-2013 |
Patent application number | Description | Published |
20110112019 | METHOD FOR PROMOTING HAIR GROWTH OR HAIR REGENERATION BY MAINTAINING OR INCREASING EXPRESSION OF CELL-ADHESION FACTOR - An object of the present invention is to promote hair growth or hair regeneration by promoting formation and/or regeneration of hair follicles. A method is provided for promoting formation and/or regeneration of hair follicles, comprising maintaining or increasing expression of one or a plurality of genes involved in cell adhesion in dermal papilla cells. | 05-12-2011 |
20130004533 | PLATELET-DERIVED GROWTH FACTOR-BB PRODUCTION PROMOTOR, AND MESENCHYMAL STEM CELL PRODUCTION ACCELERATOR, STEM CELL STABILIZER AND DERMAL REGENERATOR COMPRISING THE SAME - An agent comprising one or more components selected from among cowberry derivatives, mangosteen derivatives, | 01-03-2013 |
20130184348 | SKIN ACTIVATION BY ACCELERATION OF PDGF-BB ACTIVITY - This method, which screens drugs that activate the skin, is characterized by causing candidate drugs to act on vascular endothelial cells, and selecting drugs that enhance the expression of PDGF-BB by the cells as a skin activation agent. | 07-18-2013 |
20160002724 | SKIN ACTIVATION BY ACCELERATION OF PDGF-BB ACTIVITY - This method, which screens drugs that activate the skin, is characterized by causing candidate drugs to act on vascular endothelial cells, and selecting drugs that enhance the expression of PDGF-BB by the cells as a skin activation agent. | 01-07-2016 |
Patent application number | Description | Published |
20090052496 | Temperature testing apparatus and temperature testing method - A temperature testing apparatus includes a housing, a first fan, a second fan, a heat source device, a module, and a test unit. The housing has an inlet and an outlet. The first fan is placed near the inlet and sucks air into the housing through the inlet. The second fan is placed near the outlet and exhausting the air out of the housing through the outlet. The heat source device provides hot air to the first fan. The module is installed into the housing and the module is placed at a position near the first fan. The module is placed on hot air path formed between the inlet and the outlet. And the test unit performs an evaluation test on the module. | 02-26-2009 |
20090108728 | Display unit manufacturing method and display unit - According to an aspect of an embodiment, a display unit manufacturing method for manufacturing a display unit, the method includes: forming a first resin film having a first electrode terminal and a first conductive film on one of surfaces of the first resin film, forming a second resin film having a second electrode terminal and a second conductive film on one of surfaces of the second resin film, arranging a display element on the first conductive film of the first resin film, arranging the second conductive film of the second resin film to the display element, forming a groove on another surface of the second resin film adjacent to the first electrode terminal, and tearing off a part of the second resin film along the groove so as to expose at least a part of the first electrode terminal. | 04-30-2009 |
20090146652 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20090146653 | Slider tester - A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part | 06-11-2009 |
20090241335 | WIRING WORK SUPPORT DEVICE - A wiring work support device includes a database storing information of an object lead or an object pad, an image input part taking an image of a printed-circuit board, a position specification part specifying a position of the object lead or the object pad on the printed-circuit board on the basis of information stored in the database and image data from the image input part and a position teaching part. The position teaching part superposes, marks and displays the position on the printed-circuit board, specified by the position specification part, on an actual printed-circuit board or an image in which the printed-circuit board is displayed. | 10-01-2009 |
20110001974 | ALIGNMENT APPARATUS AND FABRICATION APPARATUS FOR PLANAR MEMBER AND ALIGNMENT METHOD AND FABRICATION METHOD FOR PLANAR MEMBER - An alignment apparatus for a planar member includes, an image capturing unit which captures an image of a rotationally asymmetrical alignment mark provided on the planar member, a position detection unit which detects a position of the alignment mark from the image, a position adjusting unit which adjusts, based on the detected position of the alignment mark, the position of the planar member relative to a reference position, and an orientation detection unit which detects an orientation of the planar member based on the rotational asymmetry of the alignment mark captured in the image. | 01-06-2011 |
20110061225 | MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR AN ELECTRONIC COMPONENT - A manufacturing apparatus for an electronic component includes a plurality of press members contacting a housing of a connector, pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, and provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit provided to the respective arm sections and adapted to measure a stress generated when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit. | 03-17-2011 |
20110120619 | FILM STICKING DEVICE, FILM STICKING METHOD, AND ELECTRONIC PAPER MANUFACTURING METHOD - Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate. | 05-26-2011 |
20120060356 | APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT - An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component. | 03-15-2012 |
20120164909 | DISPLAY DEVICE MANUFACTURING METHOD AND APPARATUS - The present disclosure is directed to a method of manufacturing a display device including a first substrate including a conductive layer and a terminal, a second substrate, and a display element disposed between the first substrate and the second substrate. | 06-28-2012 |
Patent application number | Description | Published |
20090162685 | Rolled Copper or Copper Alloy Foil with Roughened Surface and Method of Roughening Rolled Copper or Copper Alloy Foil - Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of a temperature of 20 to 50° C. and a current density of 10 to 100 A/dm | 06-25-2009 |
20110259848 | Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same - Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the rolled copper foil or the electrolytic copper foil comprises a nickel alloy layer with lower etching rate than copper, which is formed on an etching side of the copper foil, and the nickel alloy layer contains zinc. This invention aims to prevent sagging caused by the etching, to form a uniform circuit having the intended circuit width, and to shorten the time of forming a circuit by etching as much as possible, when forming a circuit by etching a copper foil of the copper-clad laminate; and also aims to make the thickness of the nickel alloy layer as thin as possible, to inhibit oxidation when exposed to heat, to prevent tarnish (discoloration) known as “YAKE”, to improve the etching properties in pattern etching, and to prevent the occurrence of short circuits and defects in the circuit width. | 10-27-2011 |
20110284496 | Method of Forming Electronic Circuit - Provided is a method of forming an electronic circuit, wherein a nickel or nickel alloy layer is formed on an etching side of a rolled copper foil or an electrolytic copper foil, the rolled copper foil or the electrolytic copper foil is bonded to a resin substrate to obtain a copper-clad laminate, a resist pattern for forming a circuit is subsequently applied on the copper foil, any unwanted portion of the copper foil and the nickel or nickel alloy layer of the copper-clad laminate other than the portion to which the resist pattern was applied is removed using an etching solution of an aqueous ferric chloride, the resist is further removed, and soft etching is additionally performed in order to remove the remnant nickel or nickel alloy layer and thereby form a circuit in which the space between copper circuit lines is of a width that is double or more from the thickness of copper. This invention aims to form a circuit with a uniform circuit width, improve the etching properties in pattern etching, and prevent the occurrence of short circuits and defects in the circuit width. | 11-24-2011 |
20110293960 | Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same - Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a heat resistance layer composed of zinc or zinc alloy or its oxide formed on an etching side of the rolled copper foil or electrolytic copper foil, and a layer of nickel or nickel alloy, which is a metal or alloy with a lower etching rate than copper, formed on the heat resistance layer. This invention aims to prevent sagging caused by the etching, to form a uniform circuit having the intended circuit width, and to shorten the time of forming a circuit by etching as much as possible, when forming a circuit by etching a copper foil of the copper-clad laminate; and also aims to make the thickness of the nickel or nickel alloy layer as thin as possible, to inhibit oxidation when exposed to heat, to prevent tarnish (discoloration) known as “YAKE”, to improve the etching properties in pattern etching, and to prevent the occurrence of short circuits and defects in the circuit width. | 12-01-2011 |
20110297641 | Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same - Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a nickel or nickel alloy layer with a lower etching rate than copper formed on an etching side of the rolled copper foil or electrolytic copper foil, and a heat resistance layer composed of zinc or zinc alloy or its oxide formed on the nickel or nickel alloy layer. This invention aims to prevent sagging caused by the etching, to form a uniform circuit having the intended circuit width, and to shorten the time of forming a circuit by etching as much as possible, when forming a circuit by etching a copper foil of the copper-clad laminate; and also aims to make the thickness of the nickel or nickel alloy layer as thin as possible, to inhibit oxidation when exposed to heat, to prevent tarnish (discoloration) known as “YAKS”, to improve the etching properties in pattern etching, and to prevent the occurrence of short circuits and defects in the circuit width. | 12-08-2011 |
20110300401 | Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same - A rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, characterized in comprising a layer of metal of one or more types among a platinum group, gold and silver with an etching rate that is lower than the copper formed on an etching surface side of the rolled copper foil or the electrolytic copper foil, or alternatively comprising a layer of an alloy having the above-described metal as its main component. This invention aims to achieve the following upon forming a circuit by etching a copper foil of a copper clad laminate; specifically, to prevent sagging caused by the etching; to form a uniform circuit of the intended circuit width; to shorten the time of forming a circuit by etching as much as possible; to improve the etching properties in pattern etching; and to prevent the occurrence of short circuits and defects in the circuit width. | 12-08-2011 |
20120012463 | Method of Roughening Rolled Copper or Copper Alloy Foil - A rolled copper or copper alloy foil having a roughened surface formed of fine copper particles is obtained by subjecting a rolled foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1 to 150 g/L of sulfuric acid, and one or more additives selected among sodium octyl sulfate, sodium decyl sulfate, and sodium dodecyl sulfate under the conditions of temperature of 20 to 50° C. and current density of 10 to 100 A/dm | 01-19-2012 |
20120318568 | ELECTRONIC CIRCUIT, METHOD FOR FORMING SAME, AND COPPER CLAD LAMINATE FOR FORMING ELECTRONIC CIRCUIT - Provided is an electronic circuit as a laminated body configured from a layer (A) which is made of a copper or copper alloy foil formed on one surface or both surfaces of a resin substrate, a copper or copper alloy plated layer (B) formed on a part or whole surface of the (A) layer, a plated layer (C) formed on a part or whole surface of the (B) layer and having a slower etching rate than that of copper relative to a copper etching solution, and a copper or copper alloy plated layer (D) formed on the layer (C) and which has a thickness of 0.05 μm or more and less than 1 μm, and which is made of a copper circuit formed by etching and removing a part of the laminated portion of the (A) layer, the (B) layer, the (C) layer and the (D) layer up to the resin substrate surface. It is thereby possible to form a circuit having a uniform circuit width, improve the etching properties in pattern etching, and prevent the occurrence of short-circuits and defects in the circuit width. | 12-20-2012 |
20130071652 | LAMINATE FOR FLEXIBLE WIRING - A laminate for flexible wiring in which copper plating is entirely or locally applied on a copper foil that is cladded on an insulating resin substrate, characterized in that a ratio A=[(200)/{(111)+(200)+(220)+(311)}]×100, i.e. a ratio of an area intensity of a peak in the X-ray diffraction of the copper plating surface is more than 90. The present invention can provide the laminate for flexible wiring in which copper plating is entirely or locally applied on a copper foil cladded on an insulating resin substrate, characterized in having particularly high bendability and enables the formation of fine patterns, namely, high dense patterns of wiring. | 03-21-2013 |
20130270218 | Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same - A rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, characterized in comprising a layer of metal of one or more types among a platinum group, gold and silver with an etching rate that is lower than the copper formed on an etching surface side of the rolled copper foil or the electrolytic copper foil, or alternatively comprising a layer of an alloy having the above-described metal as its main component. The following can be achieved upon forming a circuit by etching a copper foil of a copper clad laminate: sagging caused by the etching is prevented; a uniform circuit of the intended circuit width is formed; the time required to form a circuit by etching is reduced; etching properties in pattern etching are improved; and the occurrence of short circuits and defects in the circuit width are prevented. | 10-17-2013 |
Patent application number | Description | Published |
20080219308 | Quantum cascade laser - A quantum cascade laser is composed of a semiconductor substrate, and an active layer provided on the semiconductor substrate and having a cascade structure formed by multistage-laminating unit laminate structures | 09-11-2008 |
20110024721 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a semiconductor substrate and an active layer which is formed on the substrate and has a cascade structure formed by multistage-laminating unit laminate structures | 02-03-2011 |
20110026556 | QUANTUM CASCADE LASER - A quantum cascade laser is configured to include a semiconductor substrate and an active layer which is provided on the substrate and has a cascade structure formed by multistage-laminating unit laminate structures | 02-03-2011 |
20120134380 | QUANTUM CASCADE LASER - A quantum cascade laser is configured to include a semiconductor substrate, and an active layer that is provided on the substrate and has a cascade structure formed by alternately laminating emission layers and injection layers by multistage-laminating unit laminate structures each consisting of the quantum well emission layer and the injection layer, and generates light by intersubband transition in a quantum well structure. In a laser cavity structure for light with a predetermined wavelength generated in the active layer, a front reflection film with a reflectance of not less than 40% and not more than 99% for laser oscillation light is formed on the front end face that becomes a laser beam output surface, and a back reflection film with a reflectance higher than that of the front reflection film for the laser oscillation light is formed on the back end face. | 05-31-2012 |
20150053922 | PHOTODETECTOR - A photodetector | 02-26-2015 |
Patent application number | Description | Published |
20100032928 | INTERIOR STRUCTURE OF VEHICLE EQUIPPED WITH CURTAIN AIRBAG - A second tether member is made of a long cloth member. Its rear end is fixed to a specified lower-side position of a fifth pillar which is located below the middle portion of this pillar in the vertical direction (i.e., at the position which is away from the top end of the fifth pillar by a distance of about 100 mm or greater) via a fixing pin. Its front end is fixed to a body portion of a curtain member via a seam portion. Accordingly, there can be provided the interior structure of a vehicle equipped with a curtain airbag which can properly form the tension line at the curtain member. | 02-11-2010 |
20100182425 | VEHICLE INTERIOR STATE RECOGNITION DEVICE - A vehicle interior state recognition device comprises an illuminating means for illuminating infrared rays into a vehicle compartment, an image pick-up means for picking up an image inside the vehicle compartment into which the infrared rays are illuminated by the illuminating means, and a recognizing means for recognizing specified information based on the image picked up by the image pick-up means. Objects of the image picked up by the image pick-up means include a seat which is movable relative to a vehicle body and a passenger seated in the seat, and the recognizing means determines a size of the passenger by comparing contour of the seat with contour of the passenger on the image picked up. Accordingly, the body size of the passenger seated in the seat can be determined accurately. | 07-22-2010 |
20110241321 | INTERIOR STRUCTURE OF VEHICLE - An interior structure of a vehicle comprises a shock absorbing member attached to a vehicle body inside a roof trim above a pillar trim, a curtain airbag device including a curtain airbag stored in a roof trim and an inflator to supply gas to the curtain airbag, wherein the curtain airbag has a bending portion in which a rear end portion of the curtain airbag bends forwardly in a storage state, a gas supply portion of the inflator is provided in front of the bending portion of the curtain airbag, and the shock absorbing member holds the bending portion of the curtain airbag inserted into an inside from a vehicle front side with an opening, a holding clip and a storage portion. | 10-06-2011 |
Patent application number | Description | Published |
20090135575 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components. | 05-28-2009 |
20090146314 | Semiconductor Device - A semiconductor device includes a first wiring board having a semiconductor element connection pad; a semiconductor element connected to the semiconductor element connection pad; and a second wiring board facing the semiconductor element and the first wiring board, the second wiring board being electrically connect to the first wiring board. The semiconductor element includes an electrode configured to electrically connect a first surface of the semiconductor element and a second surface of the semiconductor element to each other. The first surface of the semiconductor element faces the first wiring board. The second surface of the semiconductor element faces the second wiring board. The first wiring board and the second wiring board are electrically connected to each other via the electrode. | 06-11-2009 |
20120313265 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a plurality of connection pads, which are electrically connected to connection terminals of a mounted component that is mounted on the semiconductor package, and recognition marks. The recognition marks are formed respectively within the area of each of at least two of the connection pads. Each recognition mark has an area that is smaller than the area of the connection mark in which it is formed. | 12-13-2012 |
Patent application number | Description | Published |
20100331571 | MOLDING AND METHOD FOR PRODUCING THE SAME, AND CATALYST AND METHOD FOR PRODUCING THE SAME - An object of the present invention is to provide a molding and a method for producing the same; a catalyst for the production of an unsaturated aldehyde and an unsaturated carboxylic acid, and a method for producing the same; and a catalyst for the production of methacrylic acid, and a method for producing the same. | 12-30-2010 |
20110124484 | PROCESS FOR PRODUCING ALUMINUM TITANATE-BASED CERAMICS - The invention is to provide a process for producing an aluminum titanate-based ceramic such as aluminum titanate or aluminum magnesium titanate having excellent thermal decomposition resistance and having a smaller coefficient of thermal expansion. The invention is a process for producing an aluminum titanate-based ceramic, comprising firing a starting material mixture containing a titanium source compound, an aluminum source compound and preferably a magnesium source compound, and a glass frit having a deformation point of 700° C. or more and/or a viscosity at 900° C. of 1.0×10 | 05-26-2011 |
20130241120 | METHOD FOR PRODUCING FIRED BODY AND FIRING FURNACE USED THEREFOR - The method for producing a fired body of the invention has the steps of: preparing a starting material mixture; molding the mixture to obtain a green molded body; a first heating step to make the molded body contain residual carbon-containing substances in a furnace by increasing the temperature of the furnace while introducing an oxygen containing gas; and a second heating step to obtain a fired body by further increasing the temperature of the furnace without introducing the oxygen containing gas; wherein the conditions for the first heating step are set so that when the molded body is allowed to stand after the first heating step in an oxygen-containing atmosphere at 900° C., the temperature at the center section of the molded body is at least 20° C. higher than the temperature of the atmosphere in the furnace. | 09-19-2013 |
20130269303 | GREEN FORMED BODY, AND PROCESS FOR PRODUCTION OF HONEYCOMB STRUCTURE - The present invention provides a green molded body capable of easily controlling the porosity of a honeycomb structure. One aspect of the present invention is a green molded body composed of a honeycomb-shaped cylindrical body | 10-17-2013 |
Patent application number | Description | Published |
20160130687 | CERMET AND CUTTING TOOL - A cermet contains hard phase particles containing Ti and a binding phase containing at least one of Ni and Co. 70% or more of the hard phase particles have a cored structure containing a core and a peripheral portion around the core. The core is composed mainly of at least one of Ti carbide, Ti nitride, and Ti carbonitride. The peripheral portion is composed mainly of a Ti composite compound containing Ti and at least one selected from W, Mo, Ta, Nb, and Cr. The core has an average particle size α, the peripheral portion has an average particle size β, and α and β satisfy 1.1≦β/α≦1.7. The hard phase particles in the cermet have an average particle size of more than 1.0 μm. | 05-12-2016 |
20160130688 | CERMET, METHOD FOR PRODUCING CERMET, AND CUTTING TOOL - A cermet contains hard phase particles containing Ti and a binding phase containing at least one of Ni and Co, and 70% or more (by number) of the hard phase particles have a cored structure containing a core and a peripheral portion around the core. The core is composed mainly of at least one of Ti carbide, Ti nitride, and Ti carbonitride, and the peripheral portion is composed mainly of a Ti composite compound containing Ti and at least one selected from W, Mo, Ta, Nb, and Cr, The core has an average particle size α, the peripheral portion has an average particle size β, and α and β satisfy 1.1≦β/α≦1.7. | 05-12-2016 |
Patent application number | Description | Published |
20120216984 | RADIATOR COOLING STRUCTURE FOR WATER-COOLED POWER UNIT - Disclosed is a radiator cooling structure for cooling a radiator of a water-cooled power unit mounted on a small vehicle and disposed on a laterally outer side of the small vehicle, which radiator cooling structure improves the efficiency of cooling an internal combustion engine by using a head wind. The radiator is provided with a radiator cover having a louver for guiding cooling air to the radiator. The louver is formed such that a rear part thereof is more protruded laterally outward than a front part thereof. The louver of the radiator cover has parallel slats tilting forward, and a lower body cover is provided with a cooling air intake opening capable of guiding a head wind toward the louver positioned obliquely above and rearward of the cooling air intake opening. | 08-30-2012 |
20120240902 | EVAPORATED FUEL TREATMENT DEVICE FOR MOTORCYCLE - A charge pipe passage includes a second pipe passage part which is connected to a fuel tank by way of a first pipe passage part and extends toward the other side from one side in the vehicle widthwise direction, and a third pipe passage part which is communicably connected with the second pipe passage part on the other side in the vehicle widthwise direction and has a highest part arranged at a highest position of the charge pipe passage at an intermediate position thereof. A first check valve is interposed on the third pipe passage part downstream of the highest part, an atmospheric air introducing pipe passage is connected to the third pipe passage part upstream of the first check valve, and a second check valve is interposed on the atmospheric air introducing pipe passage at a position higher than the highest part. | 09-27-2012 |
20120240903 | EVAPORATED FUEL TREATMENT DEVICE FOR MOTORCYCLE - A charge pipe passage includes: a first engine-side pipe passage part which extends vertically; a second engine-side pipe passage part which is connected to a lower end of the first engine-side pipe passage part on one side in the vehicle widthwise direction and extends from one side to the other side in the vehicle widthwise direction above the engine body; and a third engine-side pipe passage part which is communicably connected to the second engine-side pipe passage part on the other side in the vehicle widthwise direction and is connected to the engine body, and at least a part of the charge pipe passage between a frame-side support part and an engine-side support part is formed of an elastic tube. | 09-27-2012 |
20120240905 | EVAPORATED FUEL TREATMENT DEVICE FOR MOTORCYCLE - A charge pipe passage includes a first tank-side pipe passage part which is connected to an upper surface of a fuel tank, and a second tank-side pipe passage part which is connected with the first tank-side pipe passage part and extends toward the other side of the fuel tank from one side of the fuel tank in the vehicle widthwise direction on an end portion thereof on a fuel tank side, and the first and second tank-side pipe passage parts, are fixed to the upper surface of the fuel tank. | 09-27-2012 |
20120289370 | COOLING AIR INTAKE STRUCTURE FOR V-BELT DRIVE CONTINUOUSLY VARIABLE TRANSMISSION - Disclosed is a cooling air intake structure for a V-belt drive continuously variable transmission, which is disposed beside the rear wheel of a small vehicle and which does not permit muddy water and dust to enter therein. A cooling air inlet through which cooling air is taken in is formed at a position beside a transmission case and above a cooling fan side opening formed in the transmission case opposite to a drive pulley. A cooling air passage extending from the cooling air inlet to the side opening is formed so as to surround the side opening. Cooling air taken in through the cooling air inlet is guided so as to flow upward first and then flows downward along a U-shaped cooling air passage to the side opening of the transmission case beside the cooling fan. | 11-15-2012 |
Patent application number | Description | Published |
20090131480 | Dihydropyridine Compounds for Neurodegenerative Diseases and Dementia - The invention provides methods for treating and/or preventing cognitive impairments, dementia, or neurodegenerative diseases and disorders (e.g., Alzheimer's disease, Parkinson's disease, Huntington's disease, amyotrophic lateral sclerosis) in patients by administering therapeutically effective amounts of an AMPA receptor antagonist (e.g., 1,2-dihydropyridine compounds) and therapeutically effective amounts of nootropics (e.g., cholinesterase inhibitors) to patients. The invention also provides combinations, commercial packages, and pharmaceutical compositions comprising therapeutically effective amounts of AMPA receptor antagonists (e.g., 1,2-dihydropyridine compounds) and therapeutically effective amounts nootropics (e.g., cholinesterase inhibitors). The 1,2-dihydropyridine compound may be, for example, 3-(2-cyanophenyl)-5-(2-pyridyl)-1-phenyl-1,2-dihydropyridin-2-one. The cholinesterase inhibitor may be, for example, donepezil. | 05-21-2009 |
20090137629 | Sigma receptor binding agent containing indanone derivative - A method for treatment of a mental disorder containing the step of administering a therapeutically effective amount of a sigma receptor binding agent containing an indanone compound represented by the following formula (I), a pharmacologically acceptable salt thereof or a hydrate of them. | 05-28-2009 |