Wen-Liang
Wen Liang Chuu, Taoyuan TW
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20090060794 | Eccentric rotating device - A motor driven rotating device is disclosed that includes a fixed base, an eccentric rotating mechanism above the base, first magnets in the base, and second magnets in the rotating mechanism. A polarity of each first magnet is opposite to that of each second magnet so as to maintain a gap between the base and the rotating mechanism. Also, the rotating mechanism is adapted to eccentrically rotate. | 03-05-2009 |
Wen Liang Li, Shenzhen CN
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20090195112 | STATOR FOR AN ELECTRIC MOTOR - A stator for an electric motor has a laminated stator core | 08-06-2009 |
20090267437 | SERVO MOTOR AND ROTOR THEREOF - A servo motor, comprising a stator and a rotor disposed within the stator. The rotor has a core and magnets, covering the periphery of the core, forming a plurality of axially extending rotor poles. The rotor poles comprise a plurality of the magnets arranged axially, and the centers of adjacent magnets of a rotor pole are staggered by a mechanical angle in the circumferential direction of the rotor. | 10-29-2009 |
20090302704 | ELECTRIC MOTOR - A universal motor has a stator and a rotor. The stator has stator core and a stator winding. The stator core has a yoke with two ends and two equivalent salient poles formed at the ends of the yoke respectively. The stator winding is wound on the yoke. | 12-10-2009 |
20100026112 | ELECTRIC MOTOR - An electric motor has a stator and a rotor. The stator has a housing with inlets and outlets. The rotor has a shaft, a rotor core and a commutator. A fan is fixed to the rotor. An end cap is fitted to the housing to close a first end of the housing and support electrical components, including brush gear. The brush gear includes two brush assemblies, each comprising a brush for making sliding electrical contact with the commutator and a brush guidance mechanism for resiliently urging the brush into contact with the commutator. The brush assemblies are accommodated in compartments of the end cap. Each compartment has vents on an axially facing side thereof and openings in a transverse wall thereof. An air guide guides a part of the airflow generated by the fan exiting from at least one of the outlets of the housing to flow into the compartments via the openings and exit the compartments via the vents to cool the brushes. | 02-04-2010 |
Wen Liang Lo, Tainan City TW
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20140037392 | Dust Collection Hood of Electric Hand Tool - A dust collection hood of an electric hand tool includes a hollow transparent hood body, with a flexible external wall, an end coupled to a hollow socket, a snap portions protruded from an internal wall of the socket and corresponding to a fixing end of the electric hand tool, such that the socket can be snapped to the fixing end of the electric hand tool, and an isolation portion formed at the middle of the hood body and having a through hole formed at the middle of the isolation portion for passing a drill bit of the electric hand tool, and the dust collection hood is provided for collecting dust, while isolating the dust from an actuating end of the electric hand tool, so as to prevent the dust from entering into the actuating end and preventing the dust from flying around in the air. | 02-06-2014 |
20140042771 | Waterproof Car Cover - A waterproof car cover includes a waterproof floor mat, a hollow interconnected side bar around the periphery of the floor mat, a waterproof inflation hole at an end of the sidebar, a waterproof cover body on a side of the floor mat, and a corresponding waterproof zipper on the cover body and the floor mat. Thus, after a car is parked on the floor mat, air enters from an inflation hole into the sidebar to expand the sidebar. The cover body covers the car, and a zipper of the cover body and the floor mat is zipped up to cover the car inside the waterproof cover, to isolate the car from the outside and to prevent the car from soaking water and to prevent a car body of the car from being scratched by drifting sand and stone, and to achieve the effect of floating and balancing the car body. | 02-13-2014 |
Wen Liang Tang, Shenzhen CN
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20140115700 | METHOD AND SYSTEM FOR DETECTING WEBSITE VISIT ATTEMPTS BY BROWSERS - A method and system of detecting website visit attempts by browsers includes monitoring networking operations generated by a client and intercepting a network address associated with the networking operations, detecting a type of website from the intercepted network address, and determining that a browser on the client has attempted to visit a website of the detected type based on the browser being in a running state and a website identified as historically visited by the browser matching the detected type of website. This can allow for the accurate detection of a browser's attempt to visit a restricted website, thereby accomplishing accurate monitoring of networking activities of the browser and enhancing the accuracy of subsequent prompting or intercepting of the networking activities of the browser. | 04-24-2014 |
20140137254 | MALICIOUS WEBSITE IDENTIFYING METHOD AND SYSTEM - The present disclosure discloses a method of identifying malicious websites. The method includes: filtering a target website using a local website-filtering list; if the target website is not on the local website-filtering list, filtering the target website using a server website-filtering list. The present disclosure also discloses, based on the above-described method, a system for identifying malicious websites. By using the disclosed malicious website identifying method and system, the number of times needed to access a network to identify malicious websites can be reduced effectively. That is, the number of times that the identification calculation is performed by a network server can be reduced and, thus, increasing the speed of the identification process and reducing network traffic. As a result, the efficiency of the malicious website identifying process can be improved. | 05-15-2014 |
20140289620 | METHOD AND DEVICE FOR TRIGGERING OPERATIONS VIA INTERFACE COMPONENTS - The present disclosure discloses method and device for triggering operations via interface components. The method comprises: triggering movement of a floating window corresponding to an interface component by operating on the floating window; moving the floating window to a first region; triggering a release command to release the floating window in the first region; running the interface component corresponding to the floating window in accordance with the release command. The device comprises: a triggering module that triggers movement of a floating window corresponding to an interface component by operating on the floating window; a movement module that moves the floating window to a first region; a release module that triggers a release command to release the floating window in the first region; and a running module that runs the interface component corresponding to the floating window in accordance with the release command. The present disclosure greatly enhances operational convenience. | 09-25-2014 |
Wen Liang Yan, Potomac, MD US
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20080260707 | Isolated homozygous stem cells, differentiated cells derived therefrom and materials and methods for making and using same - The present invention discloses and describes pluripotent homozygous stem (HS) cells, and methods and materials for making same. The present invention also provides methods for differentiation of HS cells into progenitor (multipotent) cells or other desired cells, groups of cells or tissues. Further, the applications of the HS cells disclosed herein, include (but are not limited to) the diagnosis and treatment of various diseases (for example, genetic diseases, neurodegenerative diseases, endocrine-related disorders and cancer), traumatic injuries, cosmetic or therapeutic transplantation, gene therapy and cell replacement therapy. | 10-23-2008 |
Wen-Liang Chang, New Taipei City TW
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20140286989 | COMPOUND, EXTRACT ISOLATED FROM ANTRODIA CAMPHORATE, AND METHOD OF INHIBITING CANCER CELL GROWTH - Disclosed is a compound isolated from | 09-25-2014 |
20140335122 | COMPOUND, EXTRACT ISOLATED FROM ANTRODIA CAMPHORATE, AND METHOD USING THE SAME - Disclosed is a compound isolated from | 11-13-2014 |
Wen-Liang Chang, Taipei City TW
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20120101157 | 4,5-Diamino-3-Halo-2-Hydroxybenzoic Acid Derivatives and Preparations Thereof - Disclosed are 4,5-diamino-3-halo-2-hydroxybenzoic acid derivatives and manufactures thereof. The 4,5-diamino-3-halo-2-hydroxybenzoic acid derivatives are presented by formula (I): | 04-26-2012 |
20120189719 | SCHISANDRAE FRUCTUS EXTRACTS FOR INHIBITION OR PREVENTION OF H1N1 INFLUENZA VIRUS INFECTION AND ITS APPLICATION THEREOF - Disclosed are an Schisandrae fructus extract for inhibition or prevention of influenza and its application, wherein the Schisandrae fructus extract is obtained by water, methanol, or ethanol extraction process and the extract comprises compounds such as schisandrone, benzoylgomisin P, wulignan A1, epigomisin O, epiwulignan A1, and tigloylgomisin P. The extracts and purified compounds of Schisandrae fructus has anti-influenza virus H1N1 and H1N1-TR (a Tamiflu drug resistant virus strain) activities, therefore the extracts and the purified compounds of Schisandrae fructus can be applied as an inhitibory agent of a pharmaceutical composition for treatment or prevention agent for influenza infection. | 07-26-2012 |
20140343167 | USE OF CITRAL FOR TREATING FOCAL SEGMENTAL GLOMERULOSCLEROSIS - The present invention relates to a new use of citral for manufacturing a medicament for treating focal segmental glomerulosclerosis (FSGS). Particularly, the present invention discloses that citral is effective in alleviating symptoms of FSGS, including reducing glomerular epithelial hyperplasia lesions (EPHLs), peri-glomerular inflammation or glomerular hyalinosis or sclerosis, and also reducing proteinuria or hematuria or lowering serum urea nitrogen level or serum creatinine level in the subject. | 11-20-2014 |
Wen-Liang Chang, Taipei TW
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20090111870 | Angelicae Sinensis Extracts Useful for Treatment of Cancers - An acetone extract, chloroform extract or hexane extract of | 04-30-2009 |
20090181904 | METHOD FOR REGULATING NUTRIENT ABSORPTION WITH GINSENOSIDES - The present application relates to a method of regulating nutrient absorption in a subject in need thereof with an isolated ginsenoside compound. | 07-16-2009 |
20090247496 | PHARMACEUTICAL COMPOSITION AND EXTRACT OF PORIA FOR ENHANCING UPTAKE OF NUTRIENTS - The present invention discloses a novel use of a lanostane having the following formula (I) in enhancing uptake of nutrients: | 10-01-2009 |
20100099633 | METHOD FOR ENHANCING NUTRIENT ABSORPTION WITH ASTRAGALOSIDES - The present application relates to a method for enhancing absorption of a nutrient in a subject in need thereof with an effective amount of an isolated astragaloside compound. | 04-22-2010 |
20100298283 | PHARMACEUTICAL COMPOSITION FOR ENHANCING IMMUNITY, AND EXTRACT OF PORIA - A pharmaceutical composition is used to enhance immunity of the human body. The composition contains potent components of lanostane compounds. A method is devised to obtain an extract from metabolite, sclerotium, or fermentation product of | 11-25-2010 |
20110053899 | USE OF LANOSTANE AND PORIA EXTRACT IN TREATING DIABETES - A pharmaceutical composition for treating diabetes is provided in this invention. The composition contains a lanostane compound as a potent component. A suitable source of the lanostane compound is a | 03-03-2011 |
20120196816 | METHOD FOR ENHANCING NUTRIENT ABSORPTION WITH ASTRAGALOSIDES - The present application relates to a method for enhancing absorption of a nutrient in a subject in need thereof with an effective amount of an isolated astragaloside compound. | 08-02-2012 |
20120196817 | METHOD FOR ENHANCING NUTRIENT ABSORPTION WITH ASTRAGALOSIDES - The present application relates to a method for enhancing absorption of a nutrient in a subject in need thereof with an effective amount of an isolated astragaloside compound. | 08-02-2012 |
20140065174 | PHARMACEUTICAL COMPOSITION FOR ENHANCHING IMMUNITY, AND EXTRACT OF PORIA - A pharmaceutical composition is used to enhance immunity of the human body. The composition contains potent components of lanostane compounds. A method is devised to obtain an extract from metabolite, sclerotium, or fermentation product of | 03-06-2014 |
Wen-Liang Chen, Kaohsiung City TW
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20140144286 | BICYCLE PEDALS WITH LOCKING FUNCTION - A bicycle pedal with a locking function has a base and a securing member. The base is positioned on a side of the bicycle and has a U-shaped main body and a through hole disposed on the main body. The securing member has a securing rod with an end attached to the bicycle and disposed through the through hole, and a stopping portion disposed at another end of the securing rod. wherein the main body is capable of sliding along the securing rod between a locking position and a non-locking position, and when the main body is at the locking position, the main body moves to one end of the securing rod and pushes against the stopping portion to prevent wheels from rotating, and when the main body is at the non-locking position, the main body moves to another end of the securing rod to release the wheels. | 05-29-2014 |
20140302716 | MULTIFUNCTION SOCKET DEVICE - A multifunction socket device is connected to a main AC power and comprises a frame unit, at least one power outlet, a cover unit and a first illuminating unit. The multifunction socket device can provide power source and illumination device, which bring more convenience and options to modern lifestyle. | 10-09-2014 |
Wen-Liang Chen, Taipei City TW
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20110244470 | ISOLATED TRANSGENIC MAMMALIAN NEURAL CELL FOR DETECTION OF A SAMPLE CONTAINING A CHEMICAL SUBSTANCE DAMAGE TO NEUROLOGICAL SYSTEM OR SELECTION OF DRUGS FOR TREATING NEURODEGENERATIVE DISORDERS - The invention is to provide an isolated transgenic mammalian neural cell, which comprises at least one heterologous vector expressing AhR/ARNT. Also provided is methods the detection of a sample containing a chemical substance damage to the nervous system and the selection of drugs for treating neurodegenerative disorders. | 10-06-2011 |
Wen-Liang Hsiao, New Taipei City TW
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20130075983 | CHIPPING HAMMER CLAMPING STRUCTURE FOR A PNEUMATIC TOOL - A chipping hammer clamping structure for a pneumatic tool includes primarily a grip which is filled in with high-pressure air, an air cylinder which is connected with the grip, a braking unit which is at a front end of the air cylinder, an inner rim of which is a support part and which can move along the air cylinder, and a shield which is sheathed at a rear rim of the air cylinder and is combined with the grip. When in use, as the air cylinder is formed integrally, the chipping hammer can be more robust to increase a striking force. Besides, dust and particles produced in operation are discharged from the groove at the front rim of the shield, thereby avoiding contamination to an operator. | 03-28-2013 |
Wen-Liang Hu, Taoyuan Hsien TW
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20130138520 | METHOD FOR ACQUIRING DATA FROM A POINT OF SALE (POS) SYSTEM BY AN ELECTRONIC LABEL SYSTEM, THE ELECTRONIC LABEL SYSTEM, AND POS LABEL MANAGEMENT SYSTEM - A method for acquiring data from a point-of-sale (POS) system is executed by an electronic label system. The electronic label system includes a host and a virtual printer unit operable to communicate with the host over a network. The POS system is operable to obtain sales information from a database thereof and to transmit the sales information to the virtual printer unit. In the method, the virtual printer unit is configured to convert the sales information into print data that can be recognized by the host, and to transmit the print data to the host through the network. | 05-30-2013 |
20130240616 | ELECTRONIC LABEL SYSTEM AND METHOD FOR THE SAME - An electronic label system includes a host and at least one electronic label. The host includes a first control unit for generating a text message, a first storage unit storing a graphic database, and a converting unit configured to convert the text message to a graphic message according to the graphic database. The electronic label is configured to communicate with the host for receiving the graphic message therefrom, and includes a display unit and a second control unit configured to control the display unit to display the graphic message. | 09-19-2013 |
Wen-Liang Huang, New Taipei City TW
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20150225283 | Glass Substrate and Method of Manufacturing the Same - A method of manufacturing the glass substrate is provided. First, a glass substrate having a target surface is provided. Next, an abrasive blasting process for the target surface is performed. After the abrasive blasting process, an etching process for the target surface is performed. The present invention further provides a glass substrate having a target surface. The target surface has an average etching depth between 1 μm and 100 μm, a roughness (Ra) between 0.05 μm and 1.5 μm, and a friction below 0.4. | 08-13-2015 |
Wen-Liang Huang, Taoyuan Shien TW
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20110157835 | Heat sink assembly - A heat sink assembly is provided. The heat sink assembly comprises a heat sink and a clip. The heat sink comprises a heat-dissipating baseboard and a plurality of heat-dissipating plates. The heat-dissipating baseboard is adapted to a heating element. The heat-dissipating plates are formed perpendicularly on the heat-dissipating baseboard and parallel to each other. The clip comprises a central portion, two winding portions and two locking portions. The central portion is placed in a containing space between two of the heat-dissipating plates and is riveted on the heat-dissipating baseboard. The length of the central portion is substantially the same as the length of the heating element. The winding portions are connected to the two ends of the central portion respectively and aren't contacted to the heat-dissipating baseboard. The locking portions are formed substantially perpendicularly on the two winding portions and each has a hook stretching out in opposite directions. | 06-30-2011 |
20120018139 | Cooling apparatus for server rack - A cooling apparatus for server rack is disclosed, which is disposed above at least one server rack. The cooling apparatus for server rack includes a fan module disposed at a back end above the least one server rack, a heat exchanger module disposed at a front end above the least one server rack, and an air guide connecting the fan module and the heat exchanger module. A hot air exhausted from the back end of the least one server rack is extracted by the fan module and is sent to the heat exchanger module through the air guide, and the hot air is cooled by the heat exchanger module, and a cool air is exhausted from the front end of the least one server rack. | 01-26-2012 |
20130105107 | ENERGY SAVING AIR CONDITIONING SYSTEM AND AIR CONDITIONING METHOD THEREOF | 05-02-2013 |
Wen-Liang Huang, Hsinchu TW
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20120081853 | MEDICAL ANTIBACTERIAL FULL-FLAT TOUCH SCREEN - A medical antibacterial full-flat touch screen comprises an antibacterial housing, an antibacterial rubber strip and an antibacterial full-flat panel, wherein a recessed edge is configured around the periphery at the bottom of the antibacterial rubber strip which recessed edge encompassing the periphery of the antibacterial full-flat panel, and a plurality of upright buckle holes are configured on the inner side of the periphery of the antibacterial full-flat panel. In addition, a groove is configured around the periphery at the top of the antibacterial rubber strip such that the antibacterial housing can be directly inserted into the groove, and a plurality of bumps configured on the inner side of the antibacterial housing can be positioned into the upright buckle holes thereby allowing the antibacterial housing and the antibacterial full-flat panel to combine together. Furthermore, the antibacterial rubber strip closely joined between the antibacterial housing and the antibacterial full-flat panel can effectively prevent the breeding of bacteria inside the gap of the assembled body and the infiltration of any liquid into the body as well. | 04-05-2012 |
20120084728 | BUTTON CONTROL SYSTEM FOR MEDICAL TOUCH SCREEN AND METHOD THEREOF - A button control system for medical touch screen and method thereof comprises a central control module, a touch signal input module, a lock time control module, a button lock module, a button unlock module and a cleanse display module, wherein the central control module determines the signal inputted by the touch signal input module, and selects to control the button lock module or the button unlock module thereby locking or unlocking a touch button; furthermore, the lock time control module is configured to set up the lock time for the touch button so as to preset the lock time of the touch button as cleansing the touch screen by the user, and after pressing down the cleanse touch button on the touch screen, it allows to control to lock or unlock other touch buttons and also to effectively prevent the occurrence of the situation where the screen button is erroneously touched as performing the cleanse process. | 04-05-2012 |
Wen-Liang Huang, Hsinchu City TW
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20130106000 | ALIGNMENT ACCURACY MARK | 05-02-2013 |
20140132283 | OVERLAY MARK AND MEASUREMENT METHOD THEREOF - An overlay mark including at least one first overlay mark and at least one second overlay mark is provided. The first overlay mark includes a plurality of first bars and a plurality of first spaces arranged alternately, and the first spaces are not constant. The second overlay mark includes a plurality of second bars and a plurality of second spaces arranged alternately, and the second spaces are constant. Besides, the second overlay mark partially overlaps with the first overlay mark. | 05-15-2014 |
20150072532 | PATTERNING METHOD - A patterning method is provided. First, a material layer is formed over a substrate. Thereafter, a plurality of directed self-assembly (DSA) patterns are formed on the material layer. Afterwards, a patterned photoresist layer is formed by using a single lithography process. The patterned photoresist layer covers a first portion of the DSA patterns and exposes a second portion of the DSA patterns. Further, the material layer is patterned by an etching process, using the patterned photoresist layer and the second portion of the DSA patterns as a mask. | 03-12-2015 |
20150118602 | PHOTOMASK AND FABRICATION METHOD THEREOF - A photomask including first opaque patterns and second opaque patterns is provided. The first opaque patterns are distributed in a first plane defined in the photomask, while the second opaque patterns are disposed above the first opaque patterns and spaced apart from the first opaque patterns. In other words, the first opaque pattern and second opaque pattern are not distributed in the same plane. | 04-30-2015 |
Wen-Liang Hung, Nantou County TW
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20090113092 | SIGNAL CONVERTER FOR DEBUGGING THAT EXPANDS FIFO CAPACITY - A signal converter includes an interconnect interface, a FIFO set, which comprises a transmitter FIFO and a receiver FIFO respectively connected to the interconnect interface through a data bus, a parallel/serial converter connected to the transmitter FIFO and the receiver FIFO by two data buses respectively and kept apart from the FIFO set, and a serial I/O interface connected to the parallel/serial converter. | 04-30-2009 |
Wen-Liang Lai, Pingtung County TW
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20150090902 | Method for Analyzing Mushrooms - The invention discloses a method for rapidly quantitative and qualitative analyzing active ingredients of mushrooms. The method for analyzing mushrooms uses a 3-D fluorescence-detecting system to analyze a sample of mushrooms, with an excitation wavelength and an emission wavelength being 250 nm and 310 nm, respectively. | 04-02-2015 |
Wen-Liang Liu, Dali City TW
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20090160835 | SIGNAL PROCESSING CIRCUIT AND METHOD - A signal processing method is provided and includes the following steps. A first synchronizing signal having a synchronizing frequency and a next expected pulse with an expected rising edge is provided. A second synchronizing signal having a selected frequency being within a frequency range is produced when the synchronizing frequency of the first synchronizing signal is out of a frequency range. A third synchronizing signal having a first pulse with a first rising edge is produced when the synchronizing frequency is within the frequency range, wherein the first rising edge is produced at an expected time point. Whether the next expected pulse appears in a period from the expected time point to a certain time point is detected as a detecting result. And a first falling edge of the first pulse is produced based on the detecting result. A picture-field flicker phenomenon of an LCD is eliminated through the method. | 06-25-2009 |
Wen-Liang Liu, Hsinchu City TW
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20080303550 | INTEGRATED CIRCUIT WITH PLURAL LEVEL SHIFTERS - An integrated circuit is provided. The integrated circuit includes N level shifting devices. Each level shifting device receives a first digital signal and a second digital signal, and includes a first level shifter converting a first voltage of the first digital signal into a third voltage and converting a second voltage of the first digital signal into a fourth voltage, and a second level shifter converting a first voltage of the second digital signal into a fifth voltage and converting a second voltage of the second digital signal into a sixth voltage. | 12-11-2008 |
20090018269 | FLUORINATED CYCLIC OLEFINIC GRAFT POLYMER - The present invention provides a graft polymer and compositions comprising a cyclic olefin polymer characterized by having a glass transition temperature of about 60° C. to 250° C and a molecular weight of about 400 to 300000, and a fluorocarbon alkyl group grafted on the cyclic olefin polymer. | 01-15-2009 |
20090121785 | DEVICE AND METHOD FOR REDUCING INPUT NOISE - A device and a method for reducing input noise providing at least a microcontroller. The microcontroller comprises: at least a noise reduction device, at least an analog switch and at least a signal output unit. The noise reduction device connected to the ground or a voltage is turned on to charge or discharge a stray capacitor existing on a turned off analog switch so that the amount of charge stored in the stray capacitor is zero or a specific value. Thereby, the noise in a touch switch is reduced and the cost of layout on the PCB is saved. | 05-14-2009 |
20100245132 | COMPENSATION METHOD FOR TOUCH SENSOR SYSTEM - A compensation method devoid of operating voltage calibration, establishing fundamental linearity calibration table and inputting, and detecting the actual operating voltage is disclosed. The compensation method comprises the steps of: a) turning off a switch in a touch sensor system; b) initializing the touch sensor system and measuring a reference frequency outputted from a oscillator in the touch sensor system; c) turning on the switch and measuring a first frequency outputted from the oscillator; and d) deducting the first frequency from the reference frequency so as to obtain a frequency difference; and e) comparing the difference with a predetermined value, and judging based upon the difference if the touch sensor system is touched by a foreign object. | 09-30-2010 |
20100250180 | COMPENSATION METHOD FOR TOUCH SENSOR SYSTEM - A compensation method devoid of operating voltage calibration, establishing fundamental linearity calibration table and inputting, and detecting the actual operating voltage is disclosed. The compensation method comprises the steps of: a) turning off a switch in a touch sensor system; b) initializing the touch sensor system and measuring a reference frequency outputted from a oscillator in the touch sensor system; c) turning on the switch and measuring a first frequency outputted from the oscillator; and d) deducting the first frequency from the reference frequency so as to obtain a frequency difference; and e) comparing the difference with a predetermined value, and judging based upon the difference if the touch sensor system is touched by a foreign object. | 09-30-2010 |
20110036827 | APPARATUS FOR CONTROLLING AN ELECTRICAL COOKER AND RELATED METHOD THEREOF - The present invention provides a micro-control device, which comprises a RC oscillator for generating a reference clock, a plurality of analog switches coupled to the touch switches for controlling transmission of the transition signal and a plurality of counters for counting time, all of the counters stop counting when one of the counters overflows and content of all counters being read, wherein ON/OFF of the analog switches controlled by a software. | 02-17-2011 |
20110240402 | UNIT WITH A SOUND ISOLATION/VIBRATION ISOLATION STRUCTURE, ARRAY EMPLOYING THE SAME, AND METHOD FOR FABRICATING THE SAME - The disclosure provides a unit with a sound isolation/vibration isolation structure, an array employing the same, and a method for fabricating the same. The unit with a sound isolation/vibration isolation structure includes: a hollow frame surrounding an inside space; a film disposed within the inside space, vertically contacting an inside wall of the hollow frame; and a body mass disposed on a top surface of the film. Particularly, the horizontal area of the inside space is larger than the area of the top surface of the film. | 10-06-2011 |
Wen-Liang Tseng, Toufen Township TW
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20110091048 | Method for virtual bass synthesis - This invention relates to a method for virtual bass synthesis. The low frequency signal is attained by applying a low pass filter to the original. In order to reduce the operations, process of down sampling the low frequency signal, moving the low frequency signal to a series of harmonics whose frequencies are integral times as large as the frequency of low frequency signals, and then up sampling them are provided. By means of psycho-acoustic theory, the weights of harmonics are attained and applied to the harmonics. Finally the weighted harmonics are combined to produce the bass signal. As the result, the virtual bass effect which is almost the same as the low frequency of the original audio signal can be accomplished. Because the harmonic signals are high frequency ones, the virtual effect can be made in the panel speakers or ordinary low-end speakers. | 04-21-2011 |
Wen-Liang Tseng, Hukou TW
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20110181182 | TOP VIEW LIGHT EMITTING DEVICE PACKAGE AND FABRICATION METHOD THEREOF - A top view light emitting device package and fabrication method thereof include a bilateral circuit is provided for emitting two far light fields with no requirement for multiple devices. Moreover, the top view light emitting device package of the disclosure also provides depressions and reflectors formed on the surfaces of the silicon substrate to enhance the reflective efficiency and fix a specific light field. | 07-28-2011 |
20110261562 | TRAFFIC LIGHT - A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing. | 10-27-2011 |
20110266570 | LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF - In a light emitting device package and manufacturing method thereof, a multi-layer structure is allocated upon a substrate, of which at least two films with different refractive indices are alternately stacked together. | 11-03-2011 |
20110278601 | LIGHT EMITTING DIODE PACKAGE - An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip. | 11-17-2011 |
20110291135 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip. | 12-01-2011 |
20120043576 | LED PACKAGE STRUCTURE - An LED package structure includes a substrate with a concave groove therein, an LED die received in the concave groove, a heat conductive pillar, two electrically conductive pillars, a heat conductive plate, and two contact pads. The heat conductive pillar extends through the substrate and thermally connects with the LED die and the heat conductive plate. The electrically conductive pillars extend through substrate and electrically connect with the LED die, respectively. The electrically conductive pillars and the heat conductive pillar are spaced from each other. The contact pads respectively and electrically connect with the electrically conductive pillars. The contact pads are spaced from each other. | 02-23-2012 |
20120187436 | LIGHT EMITTING DIODE DEVICE AND MANUFACTURING METHOD THEREOF - A light emitting diode (LED) device includes a substrate, a supporting member, an electrode layer, an LED chip and an encapsulant. The substrate has a first surface and a second surface. The substrate defines a hole extending through the first surface and the second surface. The supporting member is attached to the second surface of the substrate and covers the hole. The supporting member and the substrate cooperatively define a cavity. The electrode layer is arranged on the first surface of the substrate and an inner surface of the cavity. The encapsulant is arranged on the electrode layer and covers the LED chip. | 07-26-2012 |
20120211786 | LED PACKAGE STRUCTURE WITH A WIDE OPTICAL FIELD - An LED package structure with a wide optical field comprises a substrate, an LED chip, and an encapsulation. The substrate has at least two electrodes and a carrier. The carrier has a carrier surface. The carrier surface is higher than a top surface of the substrate and higher than the electrodes. The LED chip is mounted on the carrier surface. The LED chip electrically connects with the electrodes via wires. The encapsulation covers the LED chip. The LED chip has a wide light emitting angle. | 08-23-2012 |
20120214264 | MANUFACTURING METHOD FOR LED PACKAGE - The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element. | 08-23-2012 |
20120228646 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING THE SAME - An LED package includes a substrate; a plurality of LED units formed on the substrate; and a phosphor tape arranged on the LED units. Light from the LED units travels to an external environment through the phosphor tape. The phosphor tape has phosphor particles evenly distributed therein. A method for forming the LED package is also provided. | 09-13-2012 |
20120235192 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode package comprises a light emitting diode chip, a first luminescent conversion layer and a separate second luminescent conversion layer on the first luminescent conversion layer. The first luminescent conversion layer has a first luminescent conversion element surrounding the light emitting diode chip. The second luminescent conversion layer has a second luminescent conversion element located above the light emitting diode chip. An excitation efficiency of the first luminescent conversion element is higher than that of the second luminescent conversion element. | 09-20-2012 |
20120244651 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE - A method for manufacturing light emitting diodes includes steps: providing a substrate having an upper conductive layer and a lower conductive layer formed on a top face and bottom face thereof; dividing each of the upper conductive layer and the lower conductive layer into first areas and second areas; defining cavities in the substrate through the first areas of the upper conductive layer to expose the lower conductive layer; forming conductive posts within the substrate; forming an overlaying layer to connect the first areas of the upper and lower conductive layers; mounting chips on the overlaying layer within the cavities and electrically connecting each chip with an adjacent first area and post; forming an encapsulant on the substrate to cover the chips; and cutting the substrate into individual packages. | 09-27-2012 |
20120280639 | PLANAR LIGHTING MODULE - A planar lighting module comprises a substrate, at least one light guide device and a driver. A frame is located on the substrate for fastening the at least one light guide device and the driver. By manipulation and binding, the planar lighting module can be easily assembled or dismantled, no screws or welded joints are used, and it is also convenient to service. | 11-08-2012 |
20120305960 | LED PACKAGE AND METHOD FOR MAKING THE SAME - An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allytrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane. | 12-06-2012 |
20130001613 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING THE SAME - A light emitting diode package includes a substrate with a first metal layer, a second metal layer and an insulating layer between the first metal layer and the second metal layer. A cavity is defined in the insulating layer and the second metal layer. The second metal layer surrounding the cavity is divided into a first conductive portion and a second conductive portion. An LED chip is positioned inside the cavity and on an upper surface of the first metal layer. The LED chip has two electrodes electrically connected to the first conductive portion and the second conductive portion respectively. The cavity is filled with an encapsulation to cover the LED chip. A method for manufacturing the LED package is also disclosed. | 01-03-2013 |
20130020607 | LED MODULE AND METHOD FOR MANUFACTURING THE SAME - An LED (light emitting diode) module includes a circuit board and a plurality of LEDs mounted on the circuit board. The circuit board includes a support layer, an insulative layer and a conductive layer sequentially stacked on each other. The circuit board is embossed to form a plurality of pleats on top and bottom surfaces thereof, to thereby increase heat dissipation area of the circuit board. | 01-24-2013 |
20130069101 | METHOD FOR MANUFACTURING LED AND LED OBTAINED THEREBY - A method for manufacturing a light emitting diode is disclosed. Firstly, two leads each including a plateau are provided. A blocking layer is then formed on each plateau. A base is molded on the leads to embed the two leads therein, wherein the two blocking layer are exposed from the base. The blocking layers are removed from the plateaus so that the two plateaus are exposed. A light emitting chip is bonded on one plateau with a wire connecting the chip with the other plateau. Finally, an encapsulant is formed on the base to seal the chip and the wire. | 03-21-2013 |
20130082293 | LED PACKAGE DEVICE - An LED package device comprises a substrate, an LED chip, a reflector and a covering layer. The covering layer completely encapsulates the reflector, the LED chip and the substrate to enhance the robustness and unitary integrity of the LED package device; two electrodes comprising two bulges penetrate through the covering layer to reach a base of the LED package device. The LED package device is able to function as a side emitting type of LED package. Front sides of the two bulges are level with a front side of the LED package device and configured for being mounted to a printed circuit board and electrically connecting therewith. | 04-04-2013 |
20130107511 | LED ILLUMINATION MODULE | 05-02-2013 |
20130161673 | LIGHT EMITTING DIODE PACKAGE HAVING FLUORESCENT FILM DIRECTLY COATED ON LIGHT EMITTING DIODE DIE AND METHOD FOR MANUFACTURING THE SAME - A method for packaging an LED, includes steps: providing a supporting board and then dripping a gel mixed with fluorescent therein on the supporting board; scraping the gel over the supporting board with a scraper form a gelatinous fluorescent film on the supporting board, and solidifying the gelatinous fluorescent film pieces to form a solidified fluorescent film; cutting the solidified fluorescent film into individual pieces, and peeling the solid fluorescent films from the supporting board; attaching one piece of the fluorescent film on a light outputting surface of an LED die; mounting the LED die on a substrate, and electrically connecting the LED die to the circuit structure; and forming an encapsulation on the substrate to cover the LED die. | 06-27-2013 |
20130178003 | METHOD FOR PACKAGING LIGHT EMITTING DIODE - A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively define a receiving space among the fluorescent film, the mold and the supporting board, the substrate and the LED dies being received in the receiving space; exhausting air in the receiving space to attach the gelatinous-state fluorescent film on the LED dies; solidifying the gelatinous-state fluorescent film and removing the mold; forming an encapsulation on the substrate to cover the LED dies; cutting the substrate and removing the supporting board to obtain several individual LED packages. | 07-11-2013 |
20130217160 | METHOD FOR MANUFACTURING PHOSPHOR FILM AND METHOD FOR MAKING LED PACKAGE HAVING THE PHOSPHOR FILM - A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted. | 08-22-2013 |
20130244355 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer. | 09-19-2013 |
20140049955 | LED ILLUMINATION DEVICE - An exemplary LED illumination device includes a lighting member and a supporting member. The lighting member includes a base plate allowing light passing therethrough and LEDs mounted on a top surface of the base plate. The supporting member includes a bottom wall allowing light passing therethrough and side walls extending upwardly from edges of the bottom wall. The side walls and the bottom plate cooperatively define a receiving chamber therebetween to receive the base plate therein. Light generated by the LEDs radiates upwardly, downwardly and laterally from the LED illumination device. | 02-20-2014 |
20140061697 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes adjacent first and second electrodes, first and second extension electrodes protruding sideward from the first and second electrodes, a molded body surrounding the first and second electrodes and an LED die. The molded body forms a reflecting cup located over the first and second electrodes, with each reflecting cup defining a receiving cavity in a top face thereof to receive the LED die. The first and second extension electrodes are exposed from an outer periphery of the molded body. The first electrode has a first bottom face. The second electrode has a second bottom face. The first and second bottom faces of the first and second electrodes are exposed out from a bottom face of the molded body. A method for manufacturing the LED package is also provided. | 03-06-2014 |
20140061698 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An LED package includes a first electrode, a second electrode adjacent to the first electrode, a molded body surrounding and encapsulating the first and second electrodes, and an LED die mounted on the second electrode. The molded body includes a reflecting cup located over the first and second electrodes and the reflecting cup defines a receiving cavity in a top face to receive the LED die. A first extension electrode protrudes sideward from the first electrode and a second extension electrode protrudes sideward from the second electrode. The first and second extension electrodes are exposed from an outer periphery of the molded body. A method for manufacturing the LED package is also provided. | 03-06-2014 |
20140071675 | LED LAMP HAVING A LARGE ILLUMINATION ANGLE - An LED bulb includes a connecting member having an Edison male screw base and an LED module engaging with the connecting member. The LED module includes a circuit board, a first LED and a plurality of second LEDs mounted on the circuit board. The first LED is arranged on a center of the circuit board. The second LEDs are located surround the first LED. The LED bulb furthermore includes a plurality of lens. Each lens covers a corresponding second LED. Each lens includes a light-guiding portion which includes a light input surface and a light output surface. Light emitted from each of the second LEDs travels into the lens via the light input surface, and is refracted out to lateral directions of the LED bulb by the light output surface of the light-guiding portion to obtain a wider illumination range. | 03-13-2014 |
20140084312 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package. | 03-27-2014 |
20140084313 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate. | 03-27-2014 |
20140153236 | LIGHT EMITTING DIODE BULB - A light emitting diode (LED) bulb includes a connecting body having a first end and a second end opposite to the first end, a mounting base located at a second end of the connecting body and a plurality of LED units mounted on the mounting base. The mounting base has a top face distant from the second end of the connecting body and an inclined lateral face located between the top face of the mounting base and the second end of the connecting body. The inclined lateral face of the mounting base extends downwardly and inwardly from a periphery of the top face of the mounting base towards the second end of the connecting body. The plurality of LED units mounted on the first top face and the inclined lateral face of the mounting base, respectively. | 06-05-2014 |
20150036321 | OPTICAL LENS AND BACKLIGHT MODULE INCORPORATING THE SAME - An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. The light from the LED light source enters into the optical lens through the first optical surface, most of the entering light is directly refracted out of the optical lens through the second optical surface, and a part of the entering light that strikes the third optical surface is first reflected by the third optical surface towards the second optical surface via total internal reflection and then refracted out of the optical lens through the second optical surface. A backlight module incorporating the optical lens is also provided. | 02-05-2015 |
20150162497 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACURING THE SAME - A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die and the coating layer. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of each of the connecting pins is smaller than that of the conductive sheet. A top surface of each of the connecting pins is lower than that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer. | 06-11-2015 |
20150162498 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of the connecting pin is smaller than that of the conductive sheet. A top surface of the connecting pin is coplanar with that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer. | 06-11-2015 |
20150188005 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING SAME - A method for packaging an light emitting diode, includes: arranging one or more light emitting diode dies on a film; encapsulating the one or more light emitting diode dies on the film; removing the film from the one or more encapsulated light emitting diode dies to expose a surface of the one or more encapsulated light emitting diode dies; forming an isolating layer on the exposed surface encapsulation surface portion of the one or more encapsulated light emitting diode dies so as to define a plurality of recesses; and forming a plurality of leads in the plurality of recesses of the one or more encapsulated light emitting diode dies, with each one of the plurality of leads being connected to one of the un-encapsulated electrodes of the one or more light emitting diode dies. | 07-02-2015 |
Wen-Liang Tseng, Hukou, Hsinchu TW
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20140051193 | LIGHT-EMITTING ELEMENT PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module. | 02-20-2014 |
Wen-Liang Wen, Chung Ho City TW
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20100022141 | ELECTRICAL CONNECTOR - An electrical connector includes a rubber core body having a plurality of terminal holes and a plurality of open holes, the terminal holes penetrating front and rear sides of the rubber core body, the open holes being provided on upper and lower sides of the rubber core body and are in communication with the terminal holes respectively; and a plurality of conductive terminals inserted into the terminal holes of the rubber core body. Via this arrangement, the area between the conductive terminals is filled with air instead of solid media, which reduces permittivity. Therefore, the capacitance of conductive terminals is reduced and the impendence is increased. | 01-28-2010 |
Wen-Liang Xiao, Beijing CN
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20150104114 | METHOD OF PROCESSING PHOTOS FROM MULTIPLE SOURCES AND ITS APPARATUS - The present invention relates to photo processing. Disclosed is a method for processing photos from multiple sources and its apparatus. In the present invention, the method of processing photos from multiple sources include: obtaining photo files from at least two sources; for the obtained photo files, merging the photo files originating from the same primitive photo into one photo object for post-processing in the unit of photo objects, each photo object contains pointer(s) to the photo file(s) corresponding with the photo object. In the present invention, while substantial contents of photo files from different sources are identical, the photo files are merged into one photo object, then users can operate in the unit of photo objects, a system automatically processes respective files of the photo objects according to different operation types, and users do not need to care about the detail of the level of the photo files, such as the sources of the photo files etc., which simplifies the user operations. | 04-16-2015 |
Wen-Liang Yang, Taichung City TW
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20130232748 | PROCESSING MACHINE - A processing machine that combines the functions of mounting press and grinding for metallographic analysis and includes a main frame at least one shaft and a drive device horizontally mounted on the main frame. A mounting press unit and a grind unit are mounted on the main frame. The grind unit including a base secured on the main frame and linearly corresponds to the mounting press unit and the corresponding line parallel to the at least one shaft. The grind unit includes a headstock slidably mounted on the at least one shaft the and reciprocally moved on the at least one shaft to selectively align with the base of the grind unit and the mounting press unit when the drive device is operated. A control unit disposed in the grind unit for controlling the mounting press unit and the grind unit. | 09-12-2013 |