Trezza, US
John Trezza, Manalapan, NJ US
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20090137116 | ISOLATING CHIP-TO-CHIP CONTACT - An apparatus has two slabs of substrate material joined to each other, the two slabs including a pair of contacts joined to each other having a shape separating a first area from a second area. | 05-28-2009 |
20090174079 | PLATED PILLAR PACKAGE FORMATION - A device includes a first plurality of interconnects, a first fill material surrounding the first plurality of interconnects, a first plurality of traces, and a first chip. The first plurality of interconnects extend from a first side of the fill material to an opposite side of the fill material. Each of the traces is connected to at least two of the first plurality of interconnects. The first chip is coupled to at least one of the first plurality of traces. | 07-09-2009 |
20100320365 | MULTICOLOR DETECTORS AND APPLICATIONS THEREOF - In one aspect, the present invention provides photodetectors and components thereof having multi-spectral sensing capabilities. In some embodiments, photodetectors of the present invention provide a first photosensitive element comprising at least one accessway extending through the element and an electrical connection at least partially disposed in the accessway, the electrical connection accessible for receiving a second photosensitive element. | 12-23-2010 |
John Trezza, Nashau, NH US
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20100304565 | PROCESSED WAFER VIA - An apparatus involves a semiconductor wafer that has been back-end processed, the semiconductor wafer including a substrate, electronic devices and multiple metalization layers, a via extending from an outer surface of the substrate through the substrate to a metalization layer from among the multiple metalization layers, and an electrically conductive material within the via, the electrically conductive material forming an electrically conductive path from the metalization layer to the outer surface. A method of processing a semiconductor wafer that has been front-end and back-end processed involves forming a via in the semiconductor wafer extending from a surface of the wafer, into and through semiconductor material, to a metalization layer formed during the back-end processing by etching the semiconductor wafer; and making the via electrically conductive so as to form an electrical path within the via extending from the surface of the wafer to the metalization layer. | 12-02-2010 |
Richard Trezza, Mendham, NJ US
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20160048923 | METHOD AND SYSTEM FOR ESTIMATING ECONOMIC LOSSES FROM HAIL STORMS - The present invention relates to systems and methods for estimating economic losses from hail storms. Accordingly, provided herein are methods for insurance underwriting of hail risk. Also provided are systems and computer-readable storage media configured for performing the disclosed methods. | 02-18-2016 |
Ronald Trezza, Melville, NY US
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20080229691 | Thin brick and tile drainage system - A sheet is provided for placing a brick or tile facing on a support structure that has an arrangement of apertures for the passage of fluids such as water. The sheet has an approximately rectangular conformation that includes a front and a back. The sheet defines channels between longitudinally aligned parallel partitions that are separated by a wall. Each channel receives the thin bricks or tiles. The structure of the partitions varies and can include an upward facing first portion that has an arrangement of apertures and a downward facing second portion. A liquid, such as water, that drains down the front of the sheet passes through the apertures in the first portion to the sloped second portion and is then redirected to the back of the sheet. The apertures also provide for the circulation of air. A method is provided for the drainage of liquid from the front of the sheet to the back of the sheet by providing a partition in the sheet that has at least one aperture that passes liquid from the front to the back of the sheet. | 09-25-2008 |
Thomas A. Trezza, Plano, TX US
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20090263553 | METHOD FOR DEVELOPING A DAIRY PROTEIN CAKE - A method for producing a shelf-stable protein-based pellet that is capable of expansion into a light, crispy snack cake, while providing a good source of protein and calcium. The method, in preferred embodiments, involves making dough from tapioca and potato starches and a milk protein derivative consisting of whey protein isolate, milk protein isolate or calcium caseinate. The mixture is extruded, sliced and dried in a series of dyers. The method produces a shelf-stable pellet having a moisture level of approximately 9-13% by weight which is further processed to produce a puffed dairy protein snack product, having a moisture level typically less than 2%. | 10-22-2009 |
20120088015 | Processing Of Whole Fruits And Vegetables, Processing Of Side-Stream Ingredients Of Fruits And Vegetables, And Use Of The Processed Fruits And Vegetables In Beverage And Food Products - Processing and use of whole fruits and vegetables or side-stream ingredients of juice extraction, paste, or ketchup process, or canning industry, in particular, the processing of the by-products, including pomace, and its use in beverage and food products. | 04-12-2012 |
Thomas Anthony Trezza, Plano, TX US
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20090258113 | PELLET DRYING PROCESS - A method for making an expandable half-product or pellet suitable for cooking by microwave oven (or other method such as frying) that results in a non-uniform, random design, while having a distinct pattern or style. The half product design is achieved by inducing stress cracks in the half product. The stress cracks are created by a controlled drying process whereby extruded half-products are first case hardened to create an outer skin that requires an internal build-up of pressure to penetrate. After creation of the outer skin, by drying in an oven or in ambient air, the half-product is heated to permit the vapor pressure of the moisture inside the half-product to break through the outer skin and escape. Such escape points induce stress cracks in random places in the half-product. The general pattern of the stress cracks can be varied by manipulation of the time-temperature profile of the case hardening and stress cracking steps. | 10-15-2009 |
20110104345 | METHOD OF REDUCING ACRYLAMIDE BY TREATING A FOOD INGREDIENT - Disclosed is a method for making low acrylamide food ingredients. When the treated food ingredient powders or flakes made by the present invention are used to make a low moisture, shelf stable food product, the level of acrylamide will be lower than if untreated food ingredient powders or flakes are used. The present invention is directed towards making dehydrated food ingredients from raw foods having relatively high levels of reducing sugars by making a dryable puree. Optionally an acrylamide reducing agent can be added to the puree before drum drying and grinding the dried puree into a powder. | 05-05-2011 |