Chih Wei
Chih Wei Chang, Taipei City TW
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20100029974 | Catalytic system and method for oxidative carbonylation reaction - A catalytic system for an oxidative carbonylation reaction is provided, which includes a metal organohalogen catalyst, at least one organic nitrogen-containing heterocyclic adjuvant, and an inorganic co-catalyst, wherein the inorganic co-catalyst is selected from carboxylates, nitrates, halides, oxides, and complexes of lead, lanthanum, titanium, tungsten, and dysprosium. The process for producing a dialkyl carbonate by performing a liquid-phase oxidative carbonylation reaction of an alcohol in the presence of the catalytic system is significantly improved, and the conversion and selectivity of the catalytic reaction are increased. | 02-04-2010 |
20100219873 | SIGNAL SOURCE DEVICES - A signal source device is provided and includes a plurality of latch units, an inverter unit, and a voltage-shifting unit, which may include a capacitance unit. The plurality of latch units are substantially cascaded. The inverter unit is coupled to the latch units. The voltage-shifting unit has a first terminal coupled to the inverter unit and one of the latch units and a second terminal receiving a first input signal, for shifting a voltage level at the first terminal according to the first input signal. | 09-02-2010 |
20110128899 | ELECTRONIC DEVICE AND POWER SAVING METHOD THEREOF - An electronic device and a power saving method thereof are provided. The electronic device includes a network module and a power saving module, wherein the network module connects to an access point (AP). The method includes executing an AP search operation at a predetermined time interval by the network module, and determining whether the electronic device is in a specific state by the power saving module. The method also includes disabling the network module from executing the AP search operation as long as the electronic device is still in the specific state. As a result, the unnecessary AP search operations can be avoided, and the purpose of saving power can be achieved. | 06-02-2011 |
Chih Wei Chang, Ta-Sheh TW
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20110152558 | PROCESS FOR PRODUCING DIARYL CARBONATES - The present invention relates to a process for producing diaryl carbonates, which is to synthesize diaryl carbonates by oxidative carbonylation of phenols with carbon monoxide and oxygen, and in particular, to synthesize diphenyl carbonate from phenol. The present invention is characterized in that a catalytic system comprising a metal halide catalyst and one or more cocatalysts of nitrogenous heterocyclic compounds is used to increase the convertibility, selectivity and yield of this catalytic reaction. | 06-23-2011 |
Chih Wei Chang, Bade City TW
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20140082426 | DETECTION CIRCUIT FOR FLEXIBLE PRINTED CIRCUIT CONNECTION INTEGRITY - Provided is a connection detector assembly for detecting a connected state between a keypad and a processor along a flexible circuit. The assembly comprises a keypad with a plurality of buttons, each button including button contacts. A flexible printed circuit having a plurality of electrical traces aligned along a width of the flexible printed circuit and includes a set of two or more button signal traces individually electrically coupled with a first button contact of a corresponding one of the plurality of buttons. A first diagnostic electrical trace and a second diagnostic electrical trace form a diagnostic circuit with one another. A receiving unit receives the flexible printed circuit. A processor electrically couples to the diagnostic electrical circuit performs a diagnostic check of the diagnostic circuit to determine a connected state, the connected state indicating whether or not a failure condition exists along a designated portion of the diagnostic circuit. | 03-20-2014 |
Chih Wei Chen, Hsinchu County TW
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20120320045 | Image Processing Method and Apparatus Thereof - An image processing method includes receiving a two-dimensional (2D) input image; detecting an image of a block in the 2D image to generate depth information for the block; and determining a depth of a sub-block image within the block according to the depth information, accurately estimating block-based depth information according to image characteristics of the block and obtaining a depth of a given block/pixel according to the depth information to generate improved stereoscopic images. | 12-20-2012 |
20130038789 | Frame Rate Conversion Method and Image Processing Apparatus Thereof - A frame rate conversion method includes detecting a plurality of input frames to determine an image mode corresponding to the plurality of input frames; performing motion estimation on the plurality of input frames to generate a motion estimation result; and interpolating a plurality of interpolated frames according to the determined image mode, the motion estimation result and the plurality of input frames to generate a plurality of converted output frames, wherein a frame rate of the outputted frames is different from that of the input frames. | 02-14-2013 |
Chih Wei Chou, Taipei TW
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20100020479 | ELECTRONIC APPARATUS - The invention discloses an electronic apparatus comprising a motherboard, a connector, a card member and a first holder. The connector is disposed on the motherboard and the card member is disposed on the connector. The motherboard comprises a first fixing portion and the card member comprises a second fixing portion. The first holder comprises a third fixing portion fixed to the first fixing portion of the motherboard and a fourth fixing portion fixed to the second fixing portion of the card member. Accordingly, once the motherboard or the card member is hit or pulled by an external force, since two ends of the first holder respectively fix the card member and the motherboard, the card member will not be detached from the connector, such that the card member can be connected to the connector well. | 01-28-2010 |
Chih Wei Huang, Taipei TW
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20100128352 | LIGHT-GUIDING PLATE AND MANUFACTURING METHOD THEREOF - The invention discloses a light-guiding plate and a manufacturing method thereof. The light-guiding plate includes a light-guiding substrate, a first shielding layer, and a second shielding layer. The light-guiding substrate has a first surface and a second surface opposite to the first surface. The first shielding layer is disposed on the first surface and includes a first light-transmitting portion. The second shielding layer is disposed on the second surface and includes a second light-transmitting portion. Thereby, light emitted from a light source could pass through the first light-transmitting portion, the light-guiding substrate, and the second light-transmitting portion, so that a light-halo phenomenon does not occur on the light-guiding plate. | 05-27-2010 |
20120285245 | SENSING APPARATUS - A sensing apparatus includes an acceleration sensing unit, for measuring an acceleration applied to a proof mass, further including: a proof mass; a carrier signal source, for providing a carrier signal; a capacitive half-bridge, including a first and a second capacitor, wherein each capacitor is coupled to the proof mass and the carrier signal source, one with a positive electrode and the other one with a negative electrode, and the acceleration applied to the proof mass makes the carrier signal flow through the first and the second capacitor so that the first capacitor and the second capacitor respectively generates a first voltage and a second voltage variation which have opposite phases with each other; and an instrumentation amplifier, for receiving and amplifying the first voltage and the second voltage variation, whereby the magnitude and the direction of the acceleration applied to the proof mass is determined. | 11-15-2012 |
20130091949 | PIEZORESISTIVE TYPE Z-AXIS ACCELEROMETER - A pizeoresistive type Z-axis accelerometer is provided, including a substrate; a plurality of anchors formed over the substrate; a plurality of cantilever beams, wherein the cantilever beams include a piezoresistive material; and a proof mass, wherein the proof mass is suspended over the substrate by respectively connecting the proof mass with the anchors, and the accelerometer senses a movement of the proof mass by the piezoresistive material. | 04-18-2013 |
20150096384 | Flow velocity meter - A flow velocity meter is disclosed. The flow velocity meter utilizes a phase locked loop to generate an output signal and outputs the output signal to a current under test. The flow velocity meter receives a reflection signal from the current under test to calculate a speed of the current under test according to a reflection signal and a frequency difference between the output signal and the reflection signal. The flow velocity meter further includes an inclinometer for measuring a depression angle between a water level and a normal direction of the flow velocity meter and measuring a horizontal angle. The flow velocity meter can be adjusted its orientation when being installed according to the measured angles. | 04-09-2015 |
Chih Wei Huang, Linyuan Township TW
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20100295070 | LIGHT EMITTING DEVICE - A light emitting device comprises a plurality of LED chips (“lateral” or “vertical” conducting) operable to generate light of a first wavelength range and a package for housing the chips. The package comprises: a thermally conducting substrate (copper) on which the LED chips are mounted and a cover having a plurality of through-holes in which each hole corresponds to a respective one of the LED chips. The holes are configured such that when the cover is mounted to the substrate each hole in conjunction with the substrate defines a recess in which a respective chip is housed. Each recess is at least partially filled with a mixture of at least one phosphor material and a transparent material. In a device with “lateral” conducting LED chips a PCB is mounted on the substrate and includes a plurality of through-holes which are configured such that each chip is directly mounted to the substrate. For a device with “vertical” conducting LED chips the LED chips are mounted on a diamond like carbon film. | 11-25-2010 |
20110180804 | SOLID STATE LIGHT EMITTING DEVICE - A light emitting device comprises: an LED chip array comprising a plurality of LEDs formed on a single die (monolithic chip array) and at least one discrete LED that is separate from the LED chip array connected in series with the LED chip array. In an AC-drivable device the LED chip array is AC-drivable and two or more discrete LEDs are configured to be AC-drivable. The device can further comprise a package in which the LED chip array and discrete LED(s) are mounted. The discrete LEDs are configured such that positive and negative half wave periods of an AC drive voltage are mapped onto oppositely connected LED such that oppositely connected LED chips are alternately operable on a respective half wave period. | 07-28-2011 |
20120018768 | LED-BASED LIGHT EMITTING DEVICES - An LED-based light emitting device comprises: a substrate; at least one LED die mounted to the substrate; at least one bond wire that electrically connects the LED die; and a light transmissive material (silicone) encapsulating the at least one LED die and at least one bond wire. The at least one bond wire has a hook-shaped portion that loops back on itself. | 01-26-2012 |
Chih Wei Huang, New Taipei City TW
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20140235773 | LED DEVICE, POLYSILOXANE COMPOUND AND BASE FORMULA FOR LED DEVICE - A polysiloxane compound for LED device includes (A) cage-shaped, mesh-shaped or chain-shaped polysiloxane containing alkenyl groups, (B) polysiloxane containing Si—H bonds, (C) a filler composition with a protective function, and (D) a catalyst with ene hydrogen silylation reaction. The filler composition with a protective function is selected from the group of high thermal conductivity material, flame retardant, anti-aging material, UV-resistant material, gas-barrier material, thermal expansion suppression material and/or high temperature-resistant material that are suitable for use in the base, lamp cup and/or encapsulation body of the LED device to effectively improves the lifespan and operational stability of the LED device. | 08-21-2014 |
Chih Wei Kuo, Yongkang City TW
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20110291995 | STERILIZING DEVICE AND MANUFACTURING METHOD FOR STERILIZING DEVICE - A sterilizing device comprises a light guiding member and an ultraviolet (UV) light source. The light guiding member has a surface. The UV light source emits UV light rays such that the UV light rays are guided into the guiding member based on a total internal reflection. When an object contacts or comes close to the surface, an evanescent wave from the UV light rays irradiates on the object. | 12-01-2011 |
Chih Wei Lee, Taipei TW
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20090315793 | Electronic device, antenna thereof, and method of forming the antenna - The antenna of the invention includes a transceiver unit and a dielectric unit. The transceiver unit has a ground portion, a radial portion, a conductive portion and a feed portion. The ground portion and the radial portion are disposed apart in parallel, so as to form a space therebetween. The distance between the ground portion and the radial portion is defined as a transceiver unit height. The dielectric unit is disposed in the space. That is, the dielectric unit is disposed between the ground portion and the radial portion. The dielectric unit has a dielectric unit thickness less than the transceiver unit height. In one embodiment, the ratio of the dielectric unit thickness to the transceiver unit height is preferably between 0.4 and 0.7. | 12-24-2009 |
20100190528 | Signal Processing Device - The present disclosure provides a signal processing device comprising: a first substrate, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a second substrate, one side surface thereof being provided with at least an integrated circuit or an antenna; and a first connecting portion for connecting the first and second substrates; wherein the second and fourth contacts are electrically connected to the integrated circuit or antenna via the first connecting portion. | 07-29-2010 |
20100259904 | Signal Conversion Device - The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface. | 10-14-2010 |
20100309642 | SIGNAL CONVERSION DEVICE WITH DUAL CHIP - The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip. | 12-09-2010 |
20110065476 | ANTENNA DEVICE - The present invention provides an antenna device comprising: a contact substrate with a plurality of electrical contacts, an antenna substrate, and a connecting member connected between said contact substrate and said antenna substrate. Said connecting member is flexible and foldable and is provided with at least one corner portion. Said corner portion defines at least one horizontal section and at least one vertical section to render the antenna device better adaptability. | 03-17-2011 |
20110105183 | ELECTRONIC WALLET DEVICE - The present invention provides an electronic wallet device for a mobile phone comprising a SIM card interface, comprising: a processing unit configured to provide a top-up service interface to the mobile phone and to receive and convert a first transaction instruction from the mobile phone into a top-up instruction; an authentication unit provided with an electronic wallet and configured to receive and convert the top-up instruction into an authorized top-up instruction and to write an amount to the electronic wallet according to the authorized top-up instruction; and an NFC antenna electrically connected to the authentication unit. | 05-05-2011 |
20130170168 | SIGNAL CONVERSION DEVICE WITH DUAL CHIP - The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip. | 07-04-2013 |
Chih Wei Liao, Pingzhen TW
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20140161982 | EPOXY RESIN BLEND - An example method to prepare a prepreg is disclosed. In one embodiment, the method includes applying a mixture on a fibrous material and heating the mixture and the fibrous material to a temperature greater than about 225 degrees Celsius during a process of preparing the prepreg. The mixture includes an epoxy compound, a compound having a ring structure, and a crosslinking agent. | 06-12-2014 |
Chih Wei Lin, Yangmei TW
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20140035789 | MULTI-BAND ANTENNA - A multi-band antenna is provided in the present invention. The multi-band antenna includes a substrate, a first antenna module and a second antenna module. The first antenna module with an Industrial Scientific Medical band is formed on the substrate. The second antenna module with a V band is formed on the first antenna module. A vertical projecting plane of the second antenna module on the substrate is overlapped with the substrate. The second antenna module further includes at least two antenna units. Center lines of the antenna units are coplanar and are parallel each other with a distance or crossed at a point with an included angle. A height of each antenna unit is equal to an odd multiple of one-quarter effective wavelength. | 02-06-2014 |
Chih Wei Lu, Hsin-Chu City TW
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20140080306 | METHOD OF FORMING FINE PATTERNS - A method of forming a fine pattern comprises depositing a modifying layer on a substrate. A photoresist layer is deposited on the modifying layer, the photoresist layer having a first pattern. The modifying layer is etched according to the first pattern of the photoresist layer. A treatment is performed to the etched modifying layer to form a second pattern, the second pattern having a smaller line width roughness (LWR) and/or line edge roughness (LER) than the first pattern. The second pattern is then etched into the substrate. | 03-20-2014 |
20140127901 | LOW-K DAMAGE FREE INTEGRATION SCHEME FOR COPPER INTERCONNECTS - A method includes forming a sacrificial layer on a substrate. A hard mask layer is formed on the sacrificial layer. The hard mask layer and the sacrificial layer are etched to form a first plurality of openings in the hard mask layer and the sacrificial layer. A low-k dielectric layer is deposited in the first plurality of openings. The hard mask layer and the sacrificial layer are thereafter removed leaving behind a plurality of low-k dielectric pillar structures having second plurality of openings therebetween. The second plurality of openings are then filled with a copper-containing layer. | 05-08-2014 |
Chih Wei Lu, Hsinchu TW
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20140264896 | Structure and Method for a Low-K Dielectric with Pillar-Type Air-Gaps - A circuit device having an interlayer dielectric with pillar-type air gaps and a method of forming the circuit device are disclosed. In an exemplary embodiment, the method comprises receiving a substrate and depositing a first layer over the substrate. A copolymer layer that includes a first constituent polymer and a second constituent polymer is formed over the first layer. The first constituent polymer is selectively removed from the copolymer layer. A first region of the first layer corresponding to the selectively removed first constituent polymer is etched. The etching leaves a second region of the first layer underlying the second constituent polymer unetched. A metallization process is performed on the etched substrate, and the first layer is removed from the second region to form an air gap. The method may further comprise depositing a dielectric material within the etched first region. | 09-18-2014 |
Chih Wei Tsai, Hsinchu TW
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20090043945 | Non-Volatile Memory System and Method for Reading Data Therefrom - A non-volatile memory system and a method for reading data therefrom are provided. The data comprises a first sub-data and a second sub-data. The non-volatile memory system comprises a first storage unit and a second storage unit, adapted for storing the two sub-data respectively. The first storage unit reads a first command from the controller, and stores the first sub-data temporarily as the first temporary sub-data according to the first command. The second storage unit reads a second command from the controller, and stores the second sub-data temporarily as the second temporary sub-data according to the second command. The first temporary sub-data is read from the first storage unit. Then, the first storage unit reads a third command from the controller. The second temporary sub-data is also read from the second storage unit while reading the third command. The time for reading data from the non-volatile memory system is reduced. | 02-12-2009 |
20090106513 | Method for copying data in non-volatile memory system - A method for copying data in a non-volatile memory system is disclosed. The method includes calculating a number of errors of a first set of data from a source block of the non-volatile memory saved in the buffer of the controller, transmitting the first set of data saved in the buffer of the controller to a buffer of the non-volatile memory when the number of errors is lower than a threshold, and programming a destination block of the non-volatile memory with the first set of data saved in the buffer of the non-volatile memory when the number of errors is lower than the threshold. | 04-23-2009 |
20100030933 | NON-VOLATILE MEMORY STORAGE DEVICE AND OPERATION METHOD THEREOF - A non-volatile memory storage device has a non-volatile memory, e.g., a flash memory, and a controller coupled to the non-volatile memory. The controller comprises a plurality of control circuits and an arbitration circuit. Each control circuit is configured to generate a request to update the chip-enable (CE) signals for non-volatile memory, and the arbitration circuit is configured to determine when the requests are acknowledged. The arbitration circuit generates acknowledge signals to the control circuits when all of the requests of the control circuits have been received by the arbitration circuit. The CE signals for non-volatile memory are updated when requests are acknowledged. | 02-04-2010 |
Chih Wei Wang, Taipei City TW
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20110047328 | SIZE PLANNING METHOD FOR STORAGE DEVICE, AND READ AND ACCESS CORRECTING METHODS THEREOF - A size planning method for a storage device, and read and access correcting methods thereof are described. When a computer device is booted, a size of a physical storage device is managed. The management method includes the following steps. A physical storage device connected to a computer device is searched. When a size of the physical storage device is larger than a maximum disk size, a current disk having a specified size is partitioned from the physical storage device. Various parameters of a logical fixed disk parameter table (FDPT) extension table of the current disk are set. A residual size of the physical storage device is partitioned into several disks having the specified size, and the corresponding logical FDPT extension tables are set until the residual size is smaller than the maximum disk size. | 02-24-2011 |
Chih Wei Weng, Sindian City TW
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20080305828 | Dual-focus lens and electronic device having the same - A dual-focus lens includes a stop and at least two lenses. One of the lenses is relatively close to the stop, and formed with a first transmission area and a second transmission area. When the at least two lenses are fixed without shifting any lens, an image beam reflected from a first object distance can pass through the first transmission area to form a clear optical image on an image formation area located at a fixed position, and an image beam reflected from a second object distance can pass through the second transmission area to form a clear optical image on the same image formation area, so as to achieve a purpose of providing double focuses without any active elements or changing the image formation distance. Physical structures of the first transmission area and the second transmission area can be selected from the group consisting of two different thickness areas formed on an inner circle and an outer ring of one of said lenses, two different curvature areas formed on the inner circle and the outer ring, a glass having an inner circular opening close to one of said lenses to substantially provide two different thickness areas, and one Fresnel lens area and one normal lens area formed on the inner circle or the outer ring to provide two different curvature areas. | 12-11-2008 |
Chih-Wei Chan, Taoyuan Hsien TW
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20130056902 | MOTOR AND MANUFACTURING METHOD THEREOF AND FAN - A method for manufacturing a motor includes the following steps of: providing a substrate with an opening and a bushing; disposing the bushing within the opening of the substrate; providing a cushioning material disposed between the substrate and the bushing by injection molding. | 03-07-2013 |
Chih-Wei Chiang, Zhubei City TW
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20140042553 | PROFILE PRE-SHAPING FOR REPLACEMENT POLY GATE INTERLAYER DIELECTRIC - Some embodiments relate to an integrated circuit (IC). The IC includes a semiconductor substrate having an upper surface with a source region and drain region proximate thereto. A channel region is disposed in the substrate between the source region and the drain region. A gate electrode is disposed over the channel region and separated from the channel region by a gate dielectric. Sidewall spacers are formed about opposing sidewalls of the gate electrode. Upper outer edges of the sidewall spacers extend outward beyond corresponding lower outer edges of the sidewall spacers. A liner is disposed about opposing sidewalls of the sidewall spacers and has a first thickness at an upper portion of liner and a second thickness at a lower portion of the liner. The first thickness is less than the second thickness. Other embodiments are also disclosed. | 02-13-2014 |
20140349471 | PROFILE PRE-SHAPING FOR REPLACEMENT POLY GATE INTERLAYER DIELECTRIC - Some embodiments relate to an integrated circuit (IC). The IC includes a semiconductor substrate having an upper surface with a source region and drain region proximate thereto. A channel region is disposed in the substrate between the source region and the drain region. A gate electrode is disposed over the channel region and separated from the channel region by a gate dielectric. Sidewall spacers are formed about opposing sidewalls of the gate electrode. Upper outer edges of the sidewall spacers extend outward beyond corresponding lower outer edges of the sidewall spacers. A liner is disposed about opposing sidewalls of the sidewall spacers and has a first thickness at an upper portion of liner and a second thickness at a lower portion of the liner. The first thickness is less than the second thickness. Other embodiments are also disclosed. | 11-27-2014 |
Chih-Wei Chiang, Tainan City TW
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20120242818 | METHOD FOR OPERATING ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING THE SAME - An electronic device includes a first image sensor and a central processing unit (CPU). The first image sensor detects at least one frame on the user's side. The CPU determines an expression of the user by the at least one frame on the user's side, and determines whether the expression of the user matches a predetermined expression defining a function operation of the electronic device. The CPU performs the functional operation when the expression of the user matches the predetermined expression. | 09-27-2012 |
Chih-Wei Chiang, Hsin-Chu City TW
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20080311690 | ELIMINATE RELEASE ETCH ATTACK BY INTERFACE MODIFICATION IN SACRIFICIAL LAYERS - Methods of making a microelectromechanical system (MEMS) device are described. In some embodiments, the method includes forming a sacrificial layer over a substrate, treating at least a portion of the sacrificial layer to form a treated sacrificial portion, forming an overlying layer over at least a part of the treated sacrificial portion, and at least partially removing the treated sacrificial portion to form a cavity situated between the substrate and the overlying layer, the overlying layer being exposed to the cavity. | 12-18-2008 |
20110188109 | ELECTROMECHANICAL DEVICE WITH OPTICAL FUNCTION SEPARATED FROM MECHANICAL AND ELECTRICAL FUNCTION - A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element. | 08-04-2011 |
20130069958 | ELECTROMECHANICAL DEVICE WITH OPTICAL FUNCTION SEPARATED FROM MECHANICAL AND ELECTRICAL FUNCTION - A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element. | 03-21-2013 |
Chih-Wei Chien, Nantou County TW
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20110166753 | WALKING ASSISTANCE DEVICE WITH DETECTION MEMBERS - The present invention relates to a walking assistance device with detection function, which includes a movable frame, a power transmission device mounted under the frame, a detachable power unit mounted on the frame, at least one signal transmitter and at least one signal receiver for detecting the distances from a first portion and a second portion on the user's body to a correspond position of the frame respectively. According to the distances detected, a control unit sends signals to the power transmission device to maintain the distance between the user and the frame within a preset range, therefore to provide supporting forces when the user needs. | 07-07-2011 |
Chih-Wei Chien, Tainan City TW
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20120002155 | METHOD AND SYSTEM FOR REPAIRING FLAT PANEL DISPLAY - The present invention provides a method and system for repairing flat panel display, which repairing hot pixels of the flat panel display by femtosecond laser. The flat panel display comprises a LCD module and a color filter disposed on the top of the LCD module, wherein the surface of the color filter corresponding to the LCD module further has a color photoresist layer. The femtosecond laser is projected onto the color photoresist layer corresponding to the hot pixels such that a phenomenon of nonlinear multiple photons absorption can be occurred to change property of the color photoresist layer so as to transform the hot pixels into dead pixels. | 01-05-2012 |
Chih-Wei Chien, New Taipei TW
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20140118900 | ELECTRONIC DEVICE WITH COMPACT FITTING OF DISK DRIVE - An electronic device includes a main body having a top wall, a bottom wall and a front sidewall, and a hard disk drive received in the main body adjacent to the front sidewall. The hard disk drive includes a first end adjacent to the front sidewall and a second end parallel to and opposite to the first end. The hard disk drive is mounted at a slant to the top wall, at an angle of α, and the distance between the first end and the top wall is less than the distance between the second end and the top wall, to slant up the hard disk drive, allowing the thickness of a front portion of the main body adjacent to the front sidewall to be thinner and cosmetically sleeker. | 05-01-2014 |
20140131208 | METALLIC SHELL AND METHOD FOR ETCHING PATTERN - A metallic shell includes a metal layer having an outer surface. The outer surface defines at least one engraving portion. Each engraving portion includes a base portion and a sidewall connected between the outer surface and the base portion. The metallic shell further includes a protective layer with a first color. The protective layer coats the outer surface and the base portion. A second antioxidation coating with a second color different from the first color is coated on the sidewall of the at least one engraving portion. A method for etching a pattern on a metallic shell is also provided. | 05-15-2014 |
Chih-Wei Chiu, Miaoli County TW
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20150157799 | NEEDLELESS CONNECTOR MODULE - A needleless connector module comprises: a sleeve tube, an elastic valve, and a flow guiding unit. The elastic valve sleeves an upper guiding tube of the flow guiding unit. A hollow shoulder portion of the elastic valve abuts a slanted retaining wall of the sleeve tube. Under a first usage condition, the hollow head portion of the elastic valve encloses the upper guiding tube narrow portion, hiding the first guiding opening in the airtight seam. Under a second usage condition, an injection tube presses the top face of the elastic valve, a hollow head portion of the elastic valve presses downward, driving the valve inner wall to abut a waist platform formed on the guiding tube, such that the first guiding opening is exposed outside the airtight seam, and such that the first guiding opening is connected to an injection opening of the injection tube. | 06-11-2015 |
20150157800 | NEEDLELESS CONNECTOR MODULE - A needleless connector module comprises: a sleeve tube, an elastic valve, a flow guiding unit and an extension unit. The elastic valve sleeves a guiding tube of the flow guiding unit. A hollow shoulder portion of the elastic valve abuts a slanted retaining wall of the sleeve tube. Under a first usage condition, the hollow head portion of the elastic valve encloses the guiding tube narrow portion, hiding the first guiding opening in the airtight seam. Under a second usage condition, an injection tube presses the top face of the elastic valve, a hollow head portion of the elastic valve presses downward, driving the valve inner wall to abut a waist platform formed on the guiding tube, such that the first guiding opening is exposed outside the airtight seam, and such that the first guiding opening is connected to an injection opening of the injection tube. | 06-11-2015 |
Chih-Wei Chou, Taichung TW
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20110278497 | NANOMETAL DISPERSION AND METHOD FOR PREPARING THE SAME - A nanometal dispersion and a method for preparing a nanometal dispersion are provided. The method comprises mixing a metal seed crystal aqueous solution, a polysaccharide aqueous solution, and a metal compound aqueous solution, followed by allowing the resulting mixture to conduct a reduction-oxidation reaction to form a nanometal. The produced nanometal dispersion comprises a polysaccharide and a nanometal. The polysaccharide is composed of N-actyl-D-glucosamine and glucuronic acid, and the nanometal has multimorphology. | 11-17-2011 |
20110281991 | CORE-SHELL METAL NANOPARTICLES AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing core-shell metal nanoparticles is provided. The method comprises providing a first solution containing a metal ion; providing a second solution containing Arabinogalactan and having a pH value ranging from about 1 to about 13; mixing the first solution and the second solution to form a third solution; and enabling the third solution to perform an oxidation-reduction reaction to form the core-shell metal nanoparticles. The core-shell metal nanoparticles comprise a core composed of metal; and a shell, composed of Arabinogalactan, covering the surface of he core. | 11-17-2011 |
Chih-Wei Chou, Taipei City TW
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20120063080 | SERVER - A server includes a casing, a motherboard, a power supply unit and a pair of expansion modules. The motherboard is disposed in the casing, and the motherboard includes two slots disposed in the casing. The power supply unit is disposed in the casing and under the motherboard. The expansion modules are disposed in the casing, and each of the expansion modules includes a connecting card and a plurality of expansion cards. When the connecting card is electrically coupled to one of the slots of the motherboard, the expansion modules are disposed at two opposite sides of the motherboard correspondingly. | 03-15-2012 |
Chih-Wei Ho, Zhongli City TW
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20130307137 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - Embodiments of the present invention provide a chip package including: a semiconductor substrate having a first surface and a second surface; a device region formed in the semiconductor substrate; a dielectric layer disposed on the first surface; and a conducting pad structure disposed in the dielectric layer and electrically connected to the device region; a cover substrate disposed between the chip and the cover substrate, wherein the spacer layer, a cavity is created an surrounded by the chip and the cover substrate on the device region, and the spacer layer is in direct contact with the chip without any adhesion glue disposed between the chip and the spacer layer. | 11-21-2013 |
20130341747 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a chip including: a semiconductor substrate having a first surface; a device region formed in the semiconductor substrate; and a plurality of micro-lenses on the first surface and the device region; a cover substrate disposed on the chip, wherein the cover substrate is a transparent substrate; a spacer layer disposed between the chip and the cover substrate, wherein the spacer layer, the chip, and the cover substrate collectively surround a cavity in the device region; and at least one main lens on the cover substrate and in the cavity, wherein a width of the main lens is greater than that of each of the micro-lenses. | 12-26-2013 |
20150099357 | METHOD OF FABRICATING WAFER-LEVEL CHIP PACKAGE - A method of fabricating a wafer-level chip package is provided. First, a wafer with two adjacent chips is provided, the wafer having an upper surface and a lower surface, and one side of each chip includes a conducting pad on the lower surface. A recess and an isolation layer extend from the upper surface to the lower surface, which the recess exposes the conducting pad. A part of the isolation layer is disposed in the recess with an opening to expose the conducting pad. A conductive layer is formed on the isolation layer and the conductive pad, and a photo-resist layer is spray coated on the conductive layer. The photo-resist layer is exposed and developed to expose the conductive layer, and the conductive layer is etched to form a redistribution layer. After stripping the photo-resist layer, a solder layer is formed on the isolation layer and the redistribution layer. | 04-09-2015 |
Chih-Wei Ho, New Taipei City TW
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20120303976 | DATA STORAGE APPARATUS - A data storage apparatus includes a storage unit; a read/write console connected electrically to an external power supply source; a storage function unit; a power switch connected electrically to the power supply source, the storage unit and the storage function unit in such a manner that in a normal condition, the storage unit is charged electrically by the power supply source via the power switch, and that in an abnormal condition, the storage unit is supplied with electrical power from the power switch via the storage function unit so as to permit continuation of the read/write operation within the storage unit. A current detection unit detects current of the storage function unit in the abnormal condition and upon detecting current of the storage function unit reaching below a predetermined threshold value, the current detection unit generates and transmits a reset signal to the read/write console such that the read/write console orders a reset of the read/write operation. | 11-29-2012 |
Chih-Wei Hsiung, Grand Cayman KY
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20110291211 | IMAGE SENSOR AND RELATED FABRICATING METHOD THEREOF - A fabricating method of an image sensor includes the steps of: providing a substrate; forming sensing elements on the substrate; forming microlenses on the sensing elements; filling a stuffed material on the microlenses, and air regions are formed in the stuffed material; and forming optical filters on the stuffed material. | 12-01-2011 |
20120193691 | BACK-SIDE ILLUMINATION IMAGE SENSOR - A back side illumination (BSI) image sensor includes at least one pixel. The pixel area includes a photo diode and a transfer transistor. The transfer transistor has a control electrode made of a gate poly and a gate oxide for receiving a control instruction, a first electrode coupled to the photo diode, and a second electrode, wherein an induced conduction channel of the transfer transistor partially surrounds a recessed space which is filled with the gate poly and the gate oxide of the first transistor. | 08-02-2012 |
Chih-Wei Hu, Miaoli County TW
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20140021628 | METHOD FOR FORMING INTERLAYER CONNECTORS IN A THREE-DIMENSIONAL STACKED IC DEVICE - A method is used with an IC device including a stack of dielectric/conductive layers to form interlayer connectors extending from a surface of the device to the conductive layers. Contact openings are created through a dielectric layer to a first conductive layer. N etch masks, with 2 | 01-23-2014 |
20150109844 | INTEGRATED CIRCUIT AND OPERATING METHOD FOR THE SAME - An integrated circuit and an operating method for the same are provided. The integrated circuit comprises a stacked structure and a conductive structure. The stacked structure comprises a conductive strip. The conductive structure is disposed above the stacked structure and electrically connected to the conductive strip. The conductive structure and the conductive strip have various gap distances between corresponding points of different pairs according to a basic axis. | 04-23-2015 |
20150109864 | INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING AND OPERATING THE SAME - An integrated circuit and methods for manufacturing and operating the same are provided. The integrated circuit comprises a fork architecture and a first conductive structure. The fork architecture comprises a handle portion and prong portions extending from the handle portion. The fork architecture comprises a stacked structure and a dielectric layer. The dielectric layer is between the first conductive structure and the handle portion of the stacked structure. | 04-23-2015 |
Chih-Wei Hu, Taoyuan City TW
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20120161099 | NITIRDE SEMICONDUCTOR LIGHT EMITTING DIODE - A nitride semiconductor LED device including an N-type doped layer, an active layer and a P-type doped layer is provided. The active layer is disposed on the N-type doped layer and includes at least one quantum well structure. The quantum well structure includes two quantum barrier layers and a quantum well sandwiched between the quantum barrier layers. The quantum barrier layer is a super-lattice structure including a quaternary nitride semiconductor. The P-type doped layer is disposed on the active layer. | 06-28-2012 |
Chih-Wei Hu, Toufen Township TW
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20140131838 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor structure and a method for manufacturing the same are provided. The method comprises following steps. Semiconductor units are arranged on a substrate. A material layer is formed on the semiconductor units. A first patterned mask layer is formed on the semiconductor units. The first patterned mask layer has a mask opening corresponding to a portion of the semiconductor units and exposing the material layer. A portion of the material layer exposed by the mask opening is removed to remain a portion of the material layer on a sidewall of each of the semiconductor units exposed by the mask opening to form spacer structures. | 05-15-2014 |
20140264898 | 3-D IC Device with Enhanced Contact Area - A device includes a substrate with a recess, having a bottom and sides, extending into the substrate from the substrate's upper surface. The sides include first and second sides oriented transversely to one another. A stack of alternating active and insulating layers overlie the substrate's surface and the recess. At least some of the active layers have an upper and lower portions extending along upper and lower planes over and generally parallel to the upper surface and to the bottom, respectively. The active layers have first and second upward extensions positioned along the first and second sides to extend from the lower portions of their respective active layers. Conductive strips adjoin the second upward extensions of the said active layers. The conductive strips can comprise sidewall spacers on the sides of the second upward extensions, the conductive strips connected to overlying conductors by interlayer conductors. | 09-18-2014 |
Chih-Wei Hu, Taichung TW
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20130075042 | LAMINATOR WITH A CORNER CUTTER - The present invention provides a laminator with a corner cutter including a main body, a laminating device and a cutting device. The main body includes a receiving space. The main body is horizontally formed with an entering slot, an exiting slot, a penetrating groove and a corner-cutting recess. The main body having two lateral sides formed between the entering slot and the exiting slot, the corner-cutting recess being disposed at one of the lateral sides. The laminating device disposed in the receiving space includes two rolling rods, a driving portion and two heaters. The two rolling rods are heated by the two heating members. The driving portion drives the two rolling rods to rotate. The cutting device includes a pushing portion and a cutting portion. The cutting device is disposed at one side of the receiving space where corresponding to the corner-cutting recess. | 03-28-2013 |
Chih-Wei Hung, Hsin-Chu City TW
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20090086540 | METHOD OF OPERATING NON-VOLATILE MEMORY ARRAY - A method of operating a non-volatile memory array is provided. The non-volatile memory array includes a substrate, a number of rows of memory cells, a number of control gate lines, a number of select gate lines, a number of source lines, and a number of drain lines. The operating method includes applying 5V voltage to a selected source line, 1.5V voltage to a selected select gate line, 8V voltage to non-selected select gate lines, 10-12V voltage to a selected control gate line and 0-−2V voltage to non-selected control gate lines and the substrate. The drain lines are grounded so that source-side injection (SSI) is triggered to inject electrons into a floating gate of the selected memory cell in a programming operation. | 04-02-2009 |
20090109762 | METHOD FOR PROGRAMMING NON-VOLATILE MEMORY - A method for programming non-volatile memory utilizes substrate hot carrier effect to conduct programming operations. A forward bias voltage is applied between an N-type well region and a P-type well region so as to inject electrons in the N-type well region into the P-type well region. After that, the electrons are accelerated by a depletion region established by a voltage applied to a source region and a drain region, and a vertical electrical field established between a control gate and the P-type well region further forces the electrons to be injected into a charge storage layer. Since the present invention adopts the substrate hot carrier effect to inject carriers into the charge storage layer, the required program operation voltage is low, which benefits to save power consumption and enhance the reliability of the device. | 04-30-2009 |
20090142910 | MANUFACTURING METHOD OF MULTI-LEVEL NON-VOLATILE MEMORY - A manufacturing method of a multi-level non-volatile memory includes following steps. First, a tunneling dielectric layer and a charge storage layer are sequentially formed on the substrate. At least two stacked layers are formed on the charge storage layer. Every two stacked layers include an inter-gate dielectric layer, a control gate, and a cap layer in sequence. Next, the charge storage layer between the two stacked layers is removed to form a first trench. After spacers are formed at the sidewalls of the two stacked layers and of the first trench, the charge storage layer outside the two stacked layers is removed. Thereafter, a dielectric layer is formed on the substrate. An assist gate is formed between the two stacked layers and a select gate is respectively formed on the sidewalls outside the two stacked layers. A doped region is then formed in the substrate outside the two stacked layers. | 06-04-2009 |
20090238002 | NAND TYPE NON-VOLATILE MEMORY AND OPERATING METHOD THEREOF - A NAND type non-volatile memory having a plurality of bit lines and a dummy bit line is provided. The intersections of each of the bit lines with a first select gate line, a plurality of word lines, and a second select gate line are corresponding to a memory cell row. The intersections of the dummy bit line with the first select gate line, the word lines, and the second select gate line are corresponding to a dummy memory cell row. A source line is disposed on the substrate at one side of the memory cell rows, wherein the dummy memory cell row and the dummy bit line are served as a current path for connecting the source line. | 09-24-2009 |
20100277986 | NON-VOLATILE FIELD PROGRAMMABLE GATE ARRAY - A non-volatile memory device includes a first metal-oxide-semiconductor (CMOS) device coupled to a bit line and a word line and a second CMOS device coupled to the first CMOS device. The second CMOS device is also coupled to a complementary bit line and a complementary word line. The first and second CMOS devices are complementary to one another. An output node is coupled between the first CMOS device and the second CMOS device. A method of programming a non-volatile field programmable gate array (NV-FPGA) includes coupling an information handling system to the FPGA, performing a block erase of a plurality of memory cells in the FPGA, verifying that the block erase is successful, programming an upper page of the FPGA, verifying that the upper page programming is successful, programming a lower page of the FPGA and verifying that the lower page programming is successful. | 11-04-2010 |
20120025869 | NON-VOLATILE FIELD PROGRAMMABLE GATE ARRAY - A non-volatile memory device includes a first metal-oxide-semiconductor (CMOS) device coupled to a bit line and a word line and a second CMOS device coupled to the first CMOS device. The second CMOS device is also coupled to a complementary bit line and a complementary word line. The first and second CMOS devices are complementary to one another. An output node is coupled between the first CMOS device and the second CMOS device. A method of programming a non-volatile field programmable gate array (NV-FPGA) includes coupling an information handling system to the FPGA, performing a block erase of a plurality of memory cells in the FPGA, verifying that the block erase is successful, programming an upper page of the FPGA, verifying that the upper page programming is successful, programming a lower page of the FPGA and verifying that the lower page programming is successful. | 02-02-2012 |
Chih-Wei Kuo, Taoyuan County TW
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20150156382 | MULTI-CHANNEL GLARE-SUPPRESSION DEVICE OF A DIGITAL IMAGE SYSTEM - A multi-channel glare-suppression device of a digital image system first acquires a spatial image, and at least one first lens set then collects light from the spatial image and generates an optical image. The optical image then passes through or is reflected by an optical modulation module to generate a modulated image. At least one second lens set further scales the modulated image and focuses the modulated image to generate a scaled image on a photo-sensing module for the photo-sensing module to convert the scaled image into an image signal. A processing module senses the photo-sensing module. When detecting a current higher than a threshold generated in a region of the photo-sensing module, the processing module then generates the control signal to modulate a region of the modulated image so as to attenuate the glare in the region of the modulated image. | 06-04-2015 |
Chih-Wei Lee, Hsinchu TW
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20090116294 | METHOD OF PROGRAMMING CELL IN MEMORY AND MEMORY APPARATUS UTILIZING THE METHOD - A method of programming a first cell in a memory, wherein the first cell has a first S/D region and shares a second S/D region with a second cell that has a third S/D region opposite to the second S/D region. The channels of the first and the second cells are turned on, a first voltage is applied to the first S/D region, a second voltage is applied to the second S/D region and a third voltage is applied to the third S/D region. The second voltage is between the first voltage and the third voltage, and the first to third voltages make carriers flow from the third S/D region to the first S/ID region and cause hot carriers in the channel of the first cell to be injected into the charge storage layer of the first cell. | 05-07-2009 |
Chih-Wei Lee, Nan-Tou Hsien TW
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20090195264 | High temperature test system - A high temperature test system is adapted for testing a device under test (DUT) under a high temperature environment. The high temperature test system includes a preheating unit, a first moving unit, a testing unit, and a second moving unit. The preheating unit is adapted for preheating the DUT. The first moving unit is adapted for removing the preheated DUT from the preheating unit. The testing unit is adapted for placement of the DUT removed by the first moving unit, for testing the DUT, and for providing the high temperature environment to the DUT during testing. The second moving unit is adapted for removing the DUT that has passed testing from the testing unit. | 08-06-2009 |
Chih-Wei Lee, Taipei City TW
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20130155583 | DOCKING STATION, ELECTRONIC SYSTEM AND OPERATING METHOD OF RELEASING CONNECTION BETWEEN TWO DEVICES - A docking station suitable for detachably assembling to an electronic device is provided. A bracket of the docking station includes a housing, a pushing element, a restoring element, and a main hook. When the pushing element is slid relative to the housing through the restoring element so the main hook is buckled to a main groove of the electronic device, a main hook relation between the bracket and the electronic device is established. When the pushing element is slid relative to the housing so the main hook departs from the main groove, a secondary hook of the docking station establishes a secondary hook relation between the bracket and the electronic device. When the electronic device is removed from the bracket until the secondary hook relation between the bracket and the electronic device is released, the restoring element restores the pushing element relative to the housing. | 06-20-2013 |
Chih-Wei Lee, Taoyuan County TW
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20130142225 | MOBILE COMMUNICATION DEVICE CAPABLE OF CONTROLLING OUPUT POWER AND METHOD THEREOF - A mobile communication device and a method thereof. The mobile communication device includes a processor, a transceiver circuit, an amplifier circuit, and a control logic circuit. The processor generates a baseband signal and a gain control signal. The transceiver circuit converts the baseband signal to an analog form, and amplifies the converted baseband signal to output a first transmission signal. The amplifier circuit amplifies the first transmission signal to output a second transmission signal. The control logic circuit controls the transceiver circuit and the amplifier circuit based on the gain control signal to generate the second transmission signal. The transceiver circuit adopts one of a first plurality of power gain levels at an increasing sequence when the amplifier circuit adopts a lowest level of a second plurality of power gain levels. | 06-06-2013 |
Chih-Wei Liang, Fusing Township TW
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20110007568 | NAND TYPE ROM - The invention discloses a NAND type ROM. The NAND type ROM comprises a plurality of bit lines, a plurality of word lines, a first source line, a second source line, and a plurality of NAND strings. The bit lines comprise a plurality of upper bit lines, first lower and second lower bit lines. The first lower and second lower bit lines are alternately arranged in parallel, and the plurality of word lines are vertically arranged to each bit lines. The first and second source line are respectively connected to the plurality of first and second lower bit lines. The plurality of NAND strings comprise a plurality of first and second NAND strings. The first NAND strings are connected to the upper bit lines, word lines, and first lower bit lines. The second NAND strings are connected to the upper bit lines, word lines, and second lower bit lines. | 01-13-2011 |
Chih-Wei Liu, Hsinchu TW
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20080208944 | DIGITAL SIGNAL PROCESSOR STRUCTURE FOR PERFORMING LENGTH-SCALABLE FAST FOURIER TRANSFORMATION - A digital signal processor structure by performing length-scalable Fast Fourier Transformation (FFT) discloses a single processor element (single PE), and a simple and effective address generator are used to achieve length-scalable, high performance, and low power consumption in split-radix-2/4 FFT or IFFT module. In order to meet different communication standards, the digital signal processor structure has run-time configuration to perform for different length requirements. Moreover, its execution time can fit the standards of Fast Fourier Transformation (FFT) or Inverse Fast Fourier Transformation (IFFT). | 08-28-2008 |
20100254161 | STRUCTURE FOR CHRISTMAS LIGHT - A structure for LED Christmas light is provided, including a light holder, being a hollow body having a separating part connected to the inner wall of the light holder to divide the hollow interior of the light holder into two cavities. Each of the two opposite sides of the inner wall of the light holder connected to the separating part forms a slot and face the surface of the separating part of the two cavities, with each having a guiding channel. Two wire sets are fixed inside the two cavities. An LED light bulb has a positive pin and a negative pin inserted inside the guiding channel, respectively, and being electrically connected to the wire sets. A light cap has a holding part passing the LED light bulb to tightly engage to the top of the light holder so as to fix the LED light bulb to the light holder. | 10-07-2010 |
20130311529 | ARITHMETIC MODULE, DEVICE AND SYSTEM - An arithmetic module is provided, including a first adder, a first shifter coupled to the first adder, a multiplier coupled to the first shifter for receiving an external coefficient signal, a digit alignment unit coupled to the multiplier, a second adder coupled to the digit alignment unit, and a second shifter coupled to the second adder. The arithmetic module reduces the overall computation time effectively, as compared with a scalar processor, by employing a serial data connection design, and also significantly reduces power consumption of the digital signal processor by requiring fewer input and output ends than those of a multi-issue processor. | 11-21-2013 |
Chih-Wei Liu, Hsinchu City TW
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20090172683 | MULTICORE INTERFACE WITH DYNAMIC TASK MANAGEMENT CAPABILITY AND TASK LOADING AND OFFLOADING METHOD THEREOF - A multicore interface with dynamic task management capability and a task loading and offloading method thereof are provided. The method disposes a communication interface between a micro processor unit (MPU) and a digital signal processor (DSP) and dynamically manages tasks assigned by the MPU to the DSP. First, an idle processing unit of the DSP is searched, and then one of a plurality of threads of the task is assigned to the processing unit. Finally, the processing unit is activated to execute the thread. Accordingly, the communication efficiency of the multicore processor can be effectively increased while the hardware cost can be saved. | 07-02-2009 |
20100050184 | MULTITASKING PROCESSOR AND TASK SWITCHING METHOD THEREOF - A multitasking processor and a task switching method thereof are provided. The task switching method includes following steps. A first task is executed by the multitasking processor, wherein the first task contains a plurality of switching-point instructions. An interrupt event occurs. Accordingly, the multitasking processor temporarily stops executing the first task and starts to execute a second task. The multitasking processor executes a handling process of the interrupt event and sets a switching flag. After finishing the handling process of the interrupt event, the multitasking processor does not perform task switching but continues to execute the first task, and the multitasking processor only performs task switching to execute the second task when it reaches a switching-point instruction in the first task. | 02-25-2010 |
20150113027 | METHOD FOR DETERMINING A LOGARITHMIC FUNCTIONAL UNIT - A method for determining a logarithmic functional unit comprises providing a segment number; using the segment number to determine a piecewise linear approximation on a plurality of corresponding intervals for approximating a function for converting a fraction; providing a bit precision; converting endpoints separating the plurality of intervals to corresponding binary endpoints separating an additional plurality of intervals in the bit precision; determining an adjusted piecewise linear approximation that has an approximation error less than a threshold and is on the additional plurality of intervals; encoding coefficients of the adjusted piecewise linear approximation; determining a less precise approximation from the adjusted piecewise linear approximation as a candidate linear approximation, wherein the less precise approximation uses an argument value having a least bit-width while still being able to have an approximation error less than the threshold; and implementing the less precise approximation to obtain an implementation circuit. | 04-23-2015 |
Chih-Wei Liu, New Taipei City TW
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20140166503 | METHOD AND DEVICE FOR MEASURING HEMATOCRIT - An approach is provided for a method and device for measuring Hematocrit (Hct) are disclosed that measures current variations from reactions of Electrochemistry on the electrodes. The method comprises acts of giving a blood sample on a pair of electrodes, obtaining a response current by providing a voltage on the electrodes, and determining an Hct value from the obtained current based on a predetermined rule. Therefore, the present disclosure provides higher reliable and precise measurement compared to the conventional measuring apparatus. | 06-19-2014 |
Chih-Wei Lo, Chungho City TW
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20100013929 | Event Data Recorder with Lane Departure Warning Function - An event data recorder with a function of lane departure warning is revealed. The device combines a LDWS (Lane Departure Warning System) with a EDR (Event Data Recorder). The LDWS uses at least one image sensor to capture road images that are sent to a DSP for being processed and identified. The EDR uses image/audio sensors to capture images in front of the car and/or sounds of surrounding. The data is sent to a recorder and is compressed for being saved into a storage device. Thus the device not only has both functions of the EDR as well as the LDWS, it further records vehicle signals, numbers of lane departure issues, and surrounding conditions of car accidents for finding out human or vehicle faults that cause the accident. Therefore, functions and efficiency of the EDR are improved. | 01-21-2010 |
20110096413 | Five-lens image lens system - A five-lens image lens system is revealed. The five-lens image lens system includes a first lens group with a negative power and a second lens group with a positive power. Along an optical axis in order from an object plane to an image plane, the first lens group includes a negative first lens and a negative second lens while at least one of optical surfaces of the first lens and the second lens is an aspherical optical surface. The second lens group includes a positive third lens, a positive fourth lens, and a negative fifth lens from the object plane to the image plane while an image-side lens surface of the positive fourth lens is glued with an object-side lens surface of the negative fifth lens. The image lens system satisfies the following conditions: 2R2>R4>R2, 2|F12|<|F34|, and Vd1>Vd2, Vd4>Vd5; wherein R2, R4 respectively represent curvature radius of the image-side lens surface of the negative first lens and the negative second lens; f12, f34 respectively represent focal length of the negative first lens and the negative second lens; Vd1, Vd2, Vd4, Vd5 respectively are Abbe numbers of the first lens, the second lens, the fourth lens, and the fifth lens. Thus the image lens system has features of wide viewing angle, small Fno, high brightness, high resolution, and effectively minimized length (through the lens, TTL). Therefore, the applications and effects of the image lens system are improved and especially suitable for lens of EDR (Event Data Recorder) of car safety systems. | 04-28-2011 |
Chih-Wei Lo, Jhonghe City TW
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20090323332 | LED ILLUMINATION DEVICE - A LED illumination device is revealed. The LED illumination device includes a LED array and a holder. The LED array is formed by a plurality of LED arranged in a specific pattern. The holder is covered in front of the LED array for waterproof protection. A hole array is disposed on a corresponding plate of the holder and the corresponding plate faces the LED array. A plurality of second lenses for LED are respectively mounted into each hole of the hole array so as to form a second lens array. Thus light emitted from the LED array passes through the second lens array to be projected. | 12-31-2009 |
20100149801 | LED OPTICAL LENS AND ILLUMINATION DEVICE THEREOF - A LED optical lens and an illumination device thereof are revealed. The optical lens includes a light-source side surface and an image side surface of the LED optical lens that both are designed respectively according to mathematical expressions of freeform surfaces such as Anamorphic formula and Toric formula Thus the optical lens has different curvatures along different axes. After light from LED emitting into the optical lens at a fixed incident angle, emergent light with different divergence angles along different axes is generated. For example, the divergence angle along the long axis is larger than that along the short axis. Therefore a uniform and near rectangular distribution pattern is formed on the target area Moreover, a plurality of optical lenses aligned along the same axes is arranged at a holder to form a lens array. The lens array is used together with a LED array so as to form a LED illumination device. | 06-17-2010 |
20100265325 | LANE DEPARTURE WARNING SYSTEM - A lane departure warning system (LDWS) installed on vehicles is revealed. The LDWS includes a camera that captures road images and the data of images is sent to an electronic control unit (ECU) for processing and recognition. The ECU is directly connected with a global positioning system (GPS) that provides vehicle speed signals so as to check whether dangerous driving occurs. Once the dangerous driving occurs, a warning unit is turned on to send an alert. The conventional LDWS that complicatedly connects with vehicles parts such as turn signal lights or speedometers is replaced by connection with a GPS. Thus the convenience of installation of LDWS in vehicles is improved. | 10-21-2010 |
Chih-Wei Lu, Chung Li TW
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20130284222 | AUXILIARY DEVICE FOR DISABLED PERSONNEL TO GET OFF BED - An auxiliary device for helping disabled person to get off bed has a handle, a telescopic rod extended directly from a bottom of the handle and a foot support pivotally connected to a distal end of the telescopic rod. | 10-31-2013 |
Chih-Wei Su, Taipei City TW
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20130148650 | COMMUNICATION NETWORK SYSTEM, CALLING TERMINAL AND VOICE CALL ESTABLISHING METHOD THEREOF - A communication network system, a calling terminal and a voice call establishing method thereof are provided. The communication network system comprises a called terminal, the calling terminal and a session initiation protocol (SIP) server. The calling terminal generates and transmits an invite message including IPv4 connection information and IPv6 connection information of the calling terminal. The SIP server is communicatively connected to the calling terminal and the called terminal. The SIP server receives the invite message from the calling terminal and forwards the invite message to the called terminal. The called terminal establishes a voice call with the calling terminal according to one of the IPv4 connection information and the IPv6 connection information of the calling terminal. | 06-13-2013 |
Chih-Wei Sung, Kuei Shan Hsiang TW
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20130106978 | VIDEO CONFERENCE SYSTEM | 05-02-2013 |
20130106979 | IMAGE CAPTURING FOR VIDEO CONFERENCE SYSTEM | 05-02-2013 |
20140348076 | COMMUNICATION SYSTEM AND METHOD - A communication system and method are provided. In the communication system, a first electrical device has an end point which is configured to connect to a plurality of 3G dongles, wherein the 3G dongles have different IP addresses; a cloud server integrates the IP addresses to generate an integrated IP address when the cloud server detects that the first electrical device is connected to the 3G dongles; and a second electrical device transmits data packets with the first electrical device via the integrated IP address through the cloud server. | 11-27-2014 |
Chih-Wei Tsai, Tainan City TW
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20130335314 | Intelligent Reminding Apparatus and Method Thereof - An intelligence reminding apparatus and a method thereof. The intelligence reminding method comprises: using an image capturing unit to preview a preview-image or capture a dynamic image; detecting at least one face image of the preview-image or the dynamic image to obtain a face image; recognizing the face image according to a face photo of a database which comprises at least one face photo and at least one corresponding information; acquiring the corresponding information if the face image matches the face photo. Wherein the face recognition is proceeding during the image preview or dynamic image capturing; reminding the corresponding information to users in a display mode, or reminding in a voice mode via a connected earphone or a connected voice apparatus if the connected earphone or the connected voice apparatus is detected. | 12-19-2013 |
Chih-Wei Tsai, New Taipei City TW
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20140095756 | HIGH-SPEED DATA TRANSMISSION INTERFACE CIRCUIT AND DESIGN METHOD OF THE SAME - A high-speed data transmission interface circuit used in a network switch device is provided. The high-speed data transmission interface circuit comprises a main circuit hoard, a connector and a daughter circuit board. The main circuit board comprises a transmission port interface module and a first wire. The transmission port interface module comprises a reduced pin extended attachment unit interface (RXAUI). The first wire connects the connector and the main circuit board. The daughter circuit board comprises a high definition multimedia interface (HDMI) module and a second wire. The HDMI module is connected to an external network device through a HDMI signal wire. The second wire connects the connector and the HDMI module. The transmission port interface module communicates with the external network device through the connector and the daughter board. | 04-03-2014 |
Chih-Wei Tsai, Hsinchu City TW
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20130128367 | ELECTRODE STRUCTURE FOR DIELECTRIC LIQUID LENS - An electrode structure, applied to a liquid lens, comprises: a first annular body; a plurality of first connecting parts, connected to the first annular body and extended radially outward from the center of the first annular body; a second annular body; and a plurality of the second connecting parts, connected the second annular body and extended radially inward into the center of the second annular body. Wherein, the first annular body and the second annular body are on the same plane, the center of the first annular body is concentric with the center of the second annular body, the first connecting parts and the second connecting parts are mutually interlaced and arranged in circular permutation. | 05-23-2013 |
20140300803 | IMAGE-CAPTURING SYSTEM - An image-capturing system for automatically adjusting divergence angle includes an image-capturing unit, an auxiliary lighting unit and a control unit. The image-capturing unit includes an image sensor and a zoom lens adjacent to the image sensor. The image sensor is applied to capture images of at least one body through the zoom lens, and the zoom lens has a first variable focus. The auxiliary lighting unit includes at least one light-emitting element for generating light beams and at least one electrically-controlled zoom lens module adjacent to the light-emitting element, and the electrically-controlled zoom lens module has a second variable focus. The light beams generated by the light-emitting element can pass through the electrically-controlled zoom lens module to form a projection light source that can be projected onto the body. The control unit includes a voltage controlling module electrically connected between the image-capturing module and the auxiliary lighting device. | 10-09-2014 |
20140307330 | LIQUID LENS DRIVING METHOD - A liquid lenses driving method to control the focus of a liquid lens by inputting voltages to specific electrodes. The liquid lens includes a first liquid, a second liquid having a lower refractive index than and immiscible with the first liquid, a plurality of driving electrodes (M), an container, and a transparent cover. M is greater than or equal to 2. The first liquid is positioned above the plurality of electrodes. The electrodes are concentrically configured and annular in shape. The outermost electrode is a first electrode and the innermost electrode is an M | 10-16-2014 |
20140355128 | LIQUID LENS PACKAGE STRUCTURE - A liquid lens package structure includes a first light-transmitting element, a second light-transmitting element, a first elastic surrounding body, a second elastic surrounding body and a package unit. The first elastic surrounding body is disposed between the first and the second light-transmitting elements to form an enclosed space among the first light-transmitting element, the second light-transmitting element and the first elastic surrounding body for receiving and enclosing two unmingled predetermined liquids. The second elastic surrounding body is disposed on the second light-transmitting element. The package unit includes a first retaining seat and a second retaining seat mated with each other. The first retaining seat has a first opening, and the second retaining seat has a second opening. The first light-transmitting element, the first elastic surrounding body, the second light-transmitting element and the second elastic surrounding body are stacked sequentially between the first and the second retaining seats. | 12-04-2014 |
Chih-Wei Tsai, Taipei TW
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20090135570 | METHOD FOR IMPROVING EBG STRUCTURES AND MULTI-LAYER BOARD APPLYING THE SAME - A method for improving EBG (electromagnetic bandgap) structures is provided. First, a multi-layer board having at least one EBG unit is provided. Then, a maximum input impedance of the EBG unit under a predetermined frequency band is measured, in which a frequency corresponding to the maximum input impedance is a resonance frequency, and a capacitance is determined based on the resonance frequency. Besides, a minimum input impedance of the EBG unit is measured, and a logarithmic value corresponding to the maximum input impedance and a logarithmic value corresponding to the minimum input impedance are obtained so as to determine a resistance. Finally, an electronic device having the capacitance and the resistance is coupled to the EBG unit in parallel. | 05-28-2009 |
20090310295 | HEAT-DISSIPATING MECHANISM FOR USE WITH MEMORY MODULE - A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device. | 12-17-2009 |
20100060379 | DELAY LINE FOR PRINTED CIRCUIT BROAD - A delay line for a printed circuit board (PCB) is disclosed. The delay line includes a first straight line, a second straight line and a third straight line. The second and third straight lines are respectively disposed at two sides of the first straight line. The first, second and third straight lines are parallel to each other and form a delay path. The current direction of the second straight line is opposite to that of the third straight line. | 03-11-2010 |
20100302732 | HEAT-DISSIPATING MECHANISM FOR USE WITH MEMORY MODULE - A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device. | 12-02-2010 |
Chih-Wei Tsai, Taipei City TW
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20080264673 | Differential signal layout printed circuit board - A positive differential signal trace and a negative differential signal trace are formed on different layers of a printed circuit board. A first ground trace is formed on the layer on which the positive differential signal trace is formed, and a second ground trace is formed on the layer on which the negative differential signal trace is formed. An insulation layer is positioned between the two layers and has a predetermined thickness. A differential mode impedance and a common mode impedance of differential signals are dependent on the predetermined thickness of the insulation layer, width and thickness of each differential signal trace, and a space between each differential signal trace and the corresponding ground trace formed on the same layer. | 10-30-2008 |
Chih-Wei Wang, Zhonghe City TW
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20090266623 | REMOTE SENSING CONTROLLER - A remote sensing controller having a detection area, wherein the remote sensing controller comprises: a plurality of electromagnetic wave generators, a sensor, a determining module and a controlling module. The plurality of electromagnetic wave generators are to generate an electromagnetic wave respectively, wherein at least one reflected electromagnetic wave is further generated according to the reflection of the plurality of electromagnetic waves from an object within the detection area, wherein the number of the reflected electromagnetic wave is related to a displacing condition of the object. The sensor is to sense the reflected electromagnetic wave to generate a sensing result. The determining module is to determine the displacing condition of the object according to the sensing result. And the controlling module is to generate a command corresponding to the displacing condition according to a relation table and further control at least one external electronic device according to the command. | 10-29-2009 |
Chih-Wei Wang, Hsinchu TW
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20090015529 | LIQUID CRYSTAL DISPLAY PANEL WITH COLOR WASHOUT IMPROVEMENT BY SCANNING LINE COUPLING AND APPLICATIONS OF SAME - A liquid crystal display (LCD) panel with color washout improvement. In one embodiment, the LCD panel includes a common electrode, a plurality of scanning lines, a plurality of data lines, and a plurality of pixels formed by the plurality of data lines crossing the plurality of scanning lines, each pixel comprising two or more sub-pixels, each sub-pixel comprising a sub-pixel electrode, a transistor electrically coupled to a corresponding scanning line, a corresponding data line and the sub-pixel electrode, a liquid crystal capacitor electrically coupled between the sub-pixel electrode and the common electrode, and a storage capacitor, wherein at least one of the storage capacitors of the two or more sub-pixels is electrically coupled between its corresponding sub-pixel electrode and a scanning line immediately prior or next to the corresponding scanning line, and the rest of the storage capacitors of the two or more sub-pixels each is coupled between its corresponding sub-pixel electrode and the common electrode. | 01-15-2009 |
Chih-Wei Wang, Tao Yuan Shien TW
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20140231875 | INTEGRATED CIRCUITS WITH ESD PROTECTION DEVICES - An integrated circuit with ESD protection comprises at least one ESD protection circuit block, which comprises a DC blocking capacitor connected in parallel with at least one compound semiconductor enhancement mode FET as an ESD protection device. The ESD protection circuit block that is built in an integrated circuit provides ESD protection while minimizing the generation of unwanted nonlinear signals resulting from the ESD protection. An integrated circuit comprises a high frequency circuit, a switching element, and two ESD protection circuit blocks, in which the high frequency circuit is connected between a first terminal and a second terminal for inputting or outputting the RF signals, the first ESD protection circuit block is connected from a branch node between the first terminal and the high frequency circuit to the switching element, and the second ESD protection circuit block is connected from the switching element to the ground. | 08-21-2014 |
Chih-Wei Wen, Hsinchu County TW
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20140292698 | TOUCH DEVICE - A touch device includes a display module and a first polarizer sheet. The first polarizer sheet is close to a light-emitting side of the display module. The touch device further includes a touch sensing electrode for receiving a gesture command from a user. The touch sensing electrode is directly formed on the first polarizer sheet. The touch sensing electrode is made of metal. | 10-02-2014 |
Chih-Wei Wu, Zhuangwei Township TW
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20130009316 | Apparatus and Methods for Dicing Interposer Assembly - Methods and apparatus for performing dicing of die on wafer interposers. Methods are disclosed that include receiving an interposer assembly including one or more integrated circuit dies mounted on a die side of an interposer substrate and having scribe areas defined in spaces between the integrated circuit dies, the interposer having an opposite side for receiving external connectors; mounting the die side of the interposer assembly to a tape assembly, the tape assembly comprising an adhesive tape and preformed spacers disposed between and filling gaps between the integrated circuit dies; and sawing the interposer assembly by cutting the opposite side of the interposer in the scribe areas to make cuts through the interposer, the cuts separating the interposer into one or more die on wafer assemblies. Apparatuses are disclosed for use with the methods. | 01-10-2013 |
20130049195 | Three-Dimensional Integrated Circuit (3DIC) Formation Process - A method includes performing a laser grooving to remove a dielectric material in a wafer to form a trench, wherein the trench extends from a top surface of the wafer to stop at an intermediate level between the top surface and a bottom surface of the wafer. The trench is in a scribe line between two neighboring chips in the wafer. A polymer is filled into the trench and then cured. After the step of curing the polymer, a die saw is performed to separate the two neighboring chips, wherein a kerf line of the die saw cuts through a portion of the polymer filled in the trench. | 02-28-2013 |
20130075937 | Apparatus and Methods for Molding Die on Wafer Interposers - Methods and apparatus for performing molding on die on wafer interposers. A method includes receiving an interposer assembly having a die side and an opposite side including two or more integrated circuit dies mounted on the die side of the interposer, the interposer assembly having spaces formed on the die side of the interposer between the two or more integrated circuit dies; mounting at least one stress relief feature on the die side of the interposer assembly in one of the spaces between the two or more integrated circuit dies; and molding the integrated circuit dies using a mold compound, the mold compound surrounding the two or more integrated circuit dies and the at least one stress relief feature. An apparatus is disclosed having integrated circuits mounted on a die side of an interposer, stress relief features between the integrated circuits and mold compound over the integrated circuits. | 03-28-2013 |
20130122659 | Assembly Method for Three Dimensional Integrated Circuit - A method comprises attaching a first side of an interposer on a carrier wafer. The first side of the interposer comprises a plurality of bumps. The carrier wafer comprises a plurality of cavities formed in the carrier wafer. Each bump on the first side of the interposer can fit into its corresponding cavity on the carrier wafer. Subsequently, the method comprises attaching a semiconductor die on the second side of the interposer to form a wafer stack, detaching the wafer stack from the carrier wafer and attaching the wafer stack to a substrate. | 05-16-2013 |
20130285241 | Apparatus For Dicing Interposer Assembly - Apparatus for performing dicing of die on wafer interposers. Apparatuses are disclosed for use with the methods of dicing an interposer having integrated circuit dies mounted thereon. An apparatus includes a wafer carrier mounted in a frame and having a size corresponding to a silicon interposer, a fixture mounted to the wafer carrier and comprising a layer of material to provide mechanical support to the die side of the silicon interposer, the fixture being patterned to fill spaces between integrated circuit dies mounted on an interposer; and an adhesive tape disposed on a surface of the fixture for adhering to the surface of a silicon interposer. Additional alternative apparatuses are disclosed. | 10-31-2013 |
20130307149 | Three-Dimensional Integrated Circuit (3DIC) - An embodiment 3DIC device includes a semiconductor chip, a die, and a polymer. The semiconductor chip includes a semiconductor substrate, wherein the semiconductor substrate comprises a first edge, and a low-k dielectric layer over the semiconductor substrate. The die is disposed over and bonded to the semiconductor chip. The polymer is molded onto the semiconductor chip and the die. The polymer includes a portion level with the low-k dielectric layer, wherein the portion of the polymer comprises a second edge vertically aligned to the first edge of the semiconductor substrate and a third edge contacting the low-k dielectric layer, wherein the second and the third edges are opposite edges of the portion of the polymer. | 11-21-2013 |
20140038360 | Apparatus and Methods for Molding Die on Wafer Interposers - Methods and apparatus for performing molding on die on wafer interposers. A method includes receiving an interposer assembly having a die side and an opposite side including two or more integrated circuit dies mounted on the die side of the interposer, the interposer assembly having spaces formed on the die side of the interposer between the two or more integrated circuit dies; mounting at least one stress relief feature on the die side of the interposer assembly in one of the spaces between the two or more integrated circuit dies; and molding the integrated circuit dies using a mold compound, the mold compound surrounding the two or more integrated circuit dies and the at least one stress relief feature. An apparatus is disclosed having integrated circuits mounted on a die side of an interposer, stress relief features between the integrated circuits and mold compound over the integrated circuits. | 02-06-2014 |
20140248745 | Three-Dimensional Integrated Circuit (3DIC) - An embodiment 3DIC device includes a semiconductor chip, a die, and a polymer. The semiconductor chip includes a semiconductor substrate, wherein the semiconductor substrate comprises a first edge, and a dielectric layer over the semiconductor substrate. The die is disposed over and bonded to the semiconductor chip. The polymer is molded onto the semiconductor chip and the die. The polymer includes a portion level with the dielectric layer, wherein the portion of the polymer comprises a second edge vertically aligned to the first edge of the semiconductor substrate and a third edge contacting the dielectric layer, wherein the second and the third edges are opposite edges of the portion of the polymer. | 09-04-2014 |
20150014844 | Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same - A semiconductor package includes an interposer chip having a frontside, a backside, and a corner area on the backside defined by a first corner edge and a second corner edge of the interposer chip. A die is bonded to the frontside of the interposer chip. At least one dam structure is formed on the corner area of the backside of the interposer chip. The dam structure includes an edge aligned to at least one the first corner edge and the second corner edge of the interposer chip. | 01-15-2015 |
20150130072 | STACKING OF MULTIPLE DIES FOR FORMING THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC) STRUCTURE - The embodiments described provide methods and structures for forming support structures between dies and substrate(s) of a three dimensional integrated circuit (3DIC) structures. Each support structure adheres to surfaces of two neighboring dies or die and substrate to relieve stress caused by bowing of the die(s) and/or substrate on the bonding structures formed between the dies or die and substrate. The cost of the support structures is much lower than other processes, such as thermal compression bonding, to reduce the effect of bowing of dies and substrates on 3DIC formation. The support structures improves yield of 3DIC structures. | 05-14-2015 |
20150145133 | Apparatus for Dicing Interposer Assembly - Apparatus for performing dicing of die on wafer interposers. Apparatuses are disclosed for use with the methods of dicing an interposer having integrated circuit dies mounted thereon. An apparatus includes a wafer carrier mounted in a frame and having a size corresponding to a silicon interposer, a fixture mounted to the wafer carrier and comprising a layer of material to provide mechanical support to the die side of the silicon interposer, the fixture being patterned to fill spaces between integrated circuit dies mounted on an interposer; and an adhesive tape disposed on a surface of the fixture for adhering to the surface of a silicon interposer. Additional alternative apparatuses are disclosed. | 05-28-2015 |
Chih-Wei Wu, Kaohsiung City TW
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20130134601 | SEMICONDUCTOR DEVICE HAVING SHIELDED CONDUCTIVE VIAS AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a semiconductor device having a shielding layer and a method for making the same. The semiconductor device includes a substrate, an inner metal layer, a shielding layer, an insulation material, a metal layer, a passivation layer and a redistribution layer. The inner metal layer is disposed in a through hole of the substrate. The shielding layer surrounds the inner annular metal. The insulation material is disposed between the inner metal layer and the shielding layer. The metal layer is disposed on a surface of the substrate, contacts the shielding layer and does not contact the inner metal layer. The redistribution layer is disposed in an opening of the passivation layer so as to contact the inner metal layer. | 05-30-2013 |
Chih-Wei Wu, Hsinchu City TW
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20110302045 | AUTOMATIC PATENT TRANSACTION SYSTEM - The invention discloses an automatic patent transaction system. The invention comprises a patent database, a member database, a match computing device, a share computing device, a non-member database, and a licensing and transacting computing device. The operation method of the invention also comprises a method for the participation of member and non-member, and a method for the participation of member only. Thus, the invention is able to increase the trade efficiency of the patent and reduce the trade cost of the patent. | 12-08-2011 |
20140110741 | LIGHT-EMITTING DEVICE - A light-emitting device, includes: a substrate; a light-emitting structure formed on the substrate and including a first portion, and a second portion where no optoelectronic conversion occurs therein; and a first electrode located on both the first portion and the second portion. | 04-24-2014 |
Chih-Wei Wu, Keelung TW
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20110149286 | LIQUID CORE WAVEGUIDE ASSEMBLY AND DETECTING SYSTEM INCLUDING THE SAME - A liquid core waveguide assembly includes: a waveguide-forming body formed with a waveguide channel and first and second fiber channels, transparent first and second partition walls, and a liquid inlet in fluid communication with the waveguide channel, the waveguide channel having a first end spaced apart from the first fiber channel by the first partition wall, and a second end spaced apart from the second fiber channel by the second partition wall; and at least one first optical fiber and at least one second optical fiber extending into the first and second fiber channels, respectively. A detecting system including the liquid core waveguide assembly is also disclosed. | 06-23-2011 |
Chih-Wei Wu, Taipei City TW
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20080259535 | SLIDING OPEN/CLOSED DEVICE - A sliding open/closed device includes a first module and a second module. When the first module is closed with the second module, a first magnetic component disposed inside the first module is attracted by a second magnetic component disposed inside the second module. When a sliding component disposed inside the first module is located at a second position, the first magnetic component is attracted by the second magnetic component and is repelled by a third magnetic component disposed inside the second module so that the first module can be closed with the second module. | 10-23-2008 |
Chih-Wei Wu, Hsinchu TW
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20080265389 | Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications - A substrate for multi-chip stacking and a multi-chip stack package utilizing the substrate and its applications are disclosed. The substrate comprises a first wire-bonding finger, a second wire-bonding finger, a trace configured for electrical transmission and a loop wiring on a same surface. The first wire-bonding finger and the second wire-bonding finger are adjacent each other and to a die-attaching area of the substrate. The loop wiring connects the first wire-bonding finger with the second wire-bonding finger in series and connected to the trace. The loop wiring can be selectively broken or not when at least two chips are stacked on the die-attaching area and electrically connected to the first and second wire-bonding fingers respectively. Accordingly, the chips can operate respectively and independently without mutual interference if one of the chips is fail. Moreover, there is merit to apply the multi-chip stack package utilizing the substrate because it can be repaired after molding and without removing any bonding wire during semiconductor packaging processes. | 10-30-2008 |
20140240302 | Common voltage compensation in a display apparatus - A method and a circuit component for suppressing crosstalk associated with the common voltage in a liquid crystal display are disclosed. In particular, in a liquid crystal display where the crosstalk is mainly caused by various control signals generated by a timing control circuit, one or more timing control signals are extracted from the timing control circuit and processed to become a compensation signal. The compensation signal is provided to display area of the liquid crystal display. The timing control signals generated by the timing control circuit include a start signal and a plurality of clock signals. The steps for processing these signals may include summing, inverting, high-pass filtering and amplitude adjustment, to be carried out in different orders and/or combinations. When the timing control signals are current signals, the steps for processing these signals may include current-to-voltage conversion, summing and inverting. | 08-28-2014 |
20150076536 | LIGHT-EMITTING ELEMENT HAVING A PLURALITY OF LIGHT-EMITTING STRUCTURES - A light-emitting element comprises a first semiconductor layer, a first light-emitting structure and a second light-emitting structure on the first semiconductor layer, a first electrode on the first semiconductor layer, a second electrode on the first light-emitting structure, and a first trench between the first light-emitting structure and the second light-emitting structure, exposing the first semiconductor layer, wherein the first trench is devoid of the first electrode and the second electrode formed therein. | 03-19-2015 |
Chih-Wei Wu, Taoyuan County TW
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20120042140 | METHOD FOR PROVIDING VIRTUAL OPTICAL DISK FUNCTION IN PORTABLE STORAGE DEVICE AND PORTABLE STORAGE DEVICE WITH VIRTUAL OPTICAL DISK FUNCTION - The present invention provides a method for providing a virtual optical disk function in a portable storage device and a portable storage device with a virtual optical disk function. The method for providing the virtual optical disk function in the portable storage device provided by the present invention can make a general standard portable storage device (such as flash drive, memory card, and external hard drive, etc.) to simulate functions of a conventional optical disk device, and have disk ejecting function and disk changing function. In addition, the portable storage device with the virtual optical disk function provided by the present invention can replace the conventional optical disk device to reduce the weight and volume of a computer system (such as notebook computer and desktop personal computer, etc.), and also can replace the virtual optical disk software of the computer system, to avoid occupying memory resource of the computer system. | 02-16-2012 |
20130110786 | DISTRIBUTED FILE SYSTEM AND METHOD OF SELECTING BACKUP LOCATION FOR THE SAME | 05-02-2013 |
Chih-Wei Yang, Hsinchu TW
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20090278581 | DELAY LOCK LOOP AND PHASE ANGLE GENERATOR - The provided delay lock loop delaying an input signal includes a quadrature generator, a voltage controller and a delay cell. The input signal is inputted into the quadrature generator and the delay cell. A phase-changing signal from the quadrature generator and a delay signal respectively from the delay cell are inputted into the voltage controller at the same time so that a control voltage inputted into the delay cell to control a delay time of the delay signal is generated. Also, the provided phase angle generator generates an output signal in an arbitrary phase. | 11-12-2009 |
Chih-Wei Yang, Yangmei City TW
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20130214297 | HIGH VOLTAGE LIGHT EMITTING DIODE CHIP AND ITS MANUFACTURING METHOD - A high voltage light emitting diode chip and its manufacturing method are provided. The high voltage light emitting diode chip can be manufactured by forming a plurality of light emitting diode units on a substrate and electrically connecting the light emitting diode units, wherein a trench with a width of about 0.5 μm to about 7 μm is present between every two adjacent light emitting diode units to isolate the light emitting diode units. The procedure for manufacturing the high voltage light emitting diode chip is simple and the high voltage light emitting diode chip that is produced can exhibit satisfying luminous efficiency. | 08-22-2013 |
Chih-Wei Yang, New Taipei City TW
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20110292589 | HIGH-DENSITY COMPUTER SYSTEM - A high-density computer system comprises: a chassis, having a main backplane, and a main control circuit and a plurality of main backplane slots installed and formed on the main backplane respectively; at least one expansion card module inserted and installed in the chassis, and the expansion card module includes a sub-backplane having a sub-control circuit and a plurality of second sub-backplane slots, and an end of the sub-backplane has a first sub-backplane slot corresponding to the main backplane slot, and the first sub-backplane slot and the sub-control circuit and the second sub-backplane slots being electrically coupled; a plurality of CPU cards installed on the expansion card module, each being inserted to the second sub-backplane slot, and the CPU card having a CPU, such that the computer system can have a powerful modular assembling function to enhance the economic benefits and product competitiveness. | 12-01-2011 |
20140127024 | CENTRIFUGAL FAN IMPELLER STRUCTURE - A centrifugal fan impeller structure includes a hub and a blade body set. The hub has an extension section. The blade body set has multiple blade bodies. The blade bodies outward extend from the extension section of the hub. Each two adjacent blade bodies define therebetween a flow way, an air outlet and an air inlet. The air outlet and the air inlet are respectively positioned at two ends of the flow way in communication with the flow way. The air outlets are arranged at unequal intervals so as to greatly reduce noise in operation. | 05-08-2014 |
20140127029 | CENTRIFUGAL FAN IMPELLER STRUCTURE - A centrifugal fan impeller structure includes a hub having multiple blades. The blades extend from a circumference of the hub in a direction away from the hub. Each two adjacent blades define therebetween a flow way, an air outlet and an air inlet. The air outlet and the air inlet are respectively positioned at two ends of the flow way in communication with the flow way. The air outlets are arranged at unequal intervals so as to greatly reduce noise in operation. | 05-08-2014 |
Chih-Wei Yang, Kao-Hsiung Hsien TW
Chih-Wei Yang, Hsinchu City TW
Chih-Wei Yao, Sunnyvale, CA US
Patent application number | Description | Published |
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20140035637 | REFERENCE CLOCK COMPENSATION FOR FRACTIONAL-N PHASE LOCK LOOPS (PLLS) - In one embodiment, a method includes determining a phase difference between a reference clock and a feedback clock in even and odd cycles for a phase lock loop (PLL). The even and odd cycles are alternating clock periods. A delta value based on the phase difference is determined. The method then adjusts a division value used by a divider to generate the feedback clock during the even cycle based on the delta value where the delta value is of a first polarity. Also, the method adjusts the division value used by the divider to generate the feedback clock during the odd cycle based on the delta value where the delta value is of a second polarity. | 02-06-2014 |
20140198884 | COMMUNICATION SYSTEM WITH FREQUENCY SYNTHESIS MECHANISM AND METHOD OF OPERATION THEREOF - A communication system includes: a frequency synthesizer, configured to reference a radio frequency (RF) signal, in a device including: a ring oscillator with track-and-hold circuit electrically connected to a reference clock, a bank of comparators, electrically connected to the ring oscillator with track-and-hold circuit, configured to measure a coarse timing, and an analog-to-digital converter, electrically connected to the ring oscillator with track-and-hold circuit, configured to generate a fine timing; a communication interface, electrically connected to the frequency synthesizer, is configured to receive a device transmission; and a control unit, electrically connected to the communication interface, is configured to display a receiver data from the a radio frequency (RF) signal. | 07-17-2014 |
20140240012 | REFERENCE CLOCK COMPENSATION FOR FRACTIONAL-N PHASE LOCK LOOPS (PLLS) - In one embodiment, a method includes determining a phase difference between a reference clock and a feedback clock in even and odd cycles for a phase lock loop (PLL). The even and odd cycles are alternating clock periods. A delta value based on the phase difference is determined. The method then adjusts a division value used by a divider to generate the feedback clock during the even cycle based on the delta value where the delta value is of a first polarity. Also, the method adjusts the division value used by the divider to generate the feedback clock during the odd cycle based on the delta value where the delta value is of a second polarity. | 08-28-2014 |
Chih-Wei Yeh, Hsinchu TW
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20140269056 | SOLID STATE DRIVE ENCOUNTERING POWER FAILURE AND ASSOCIATED DATA STORAGE METHOD - A solid state drive and its associated data storage method are provided. The data storage method comprising steps of: receiving data-for-writing from a host, and transforming the data-for-writing to data-for-storage; comparing a supply voltage and a predetermined voltage; and when the supply voltage is lower than the predetermined voltage, proceeding a strong-page programming procedure for storing the data-for-storage to a blank area of a multi-level cell flash memory. | 09-18-2014 |
Chih-Wei Yen, Hsinchu City TW
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20110042953 | EMBEDDED TURBINE GENERATOR SET - This disclosure relates to a turbine generator set, in which an axial-flow turbine and a generator are embedded inside a flow channel. In an exemplary embodiment of the disclosure, the turbine generator set comprises: a flow channel being provided with a front end as an inlet duct and a back end as an outlet duct; an axial-flow turbine, being single-stage or multi-stage, capable of transforming thermal and pressure energies of a working fluid inside the flow channel into rotational energy; and a generator, comprising a rotor and a stator, being capable of transforming the rotational energy into electricity. A shaft of the turbine and a shaft of the generator can be coupled directly or by way of a gear set. Electricity is transmitted from the flow channel by way of a bunch of cables passing through the flow channel. | 02-24-2011 |
20120085089 | CHANGEABLE DAMPING WAVE POWER CAPTURING DEVICE DRIVEN BY BIDIRECTIONAL SCREW ROD - A changeable damping wave power capturing device driven by bidirectional screw rod is provided, which uses the ball screw device to capture the wave power and prevents the energy lost caused by complex mechanism. In addition, bidirectional reciprocating rectilinear motion is changed to unidirectional rotation by the ratchet wheel device, and then the rotating energy is imported to the generating set. Besides, the wave power capturing device driven by bidirectional screw rod uses the control device to detect wave energy and choose different generator, the control device could change the damping value and improve the efficiency that transforming wave energy. | 04-12-2012 |