Patent application number | Description | Published |
20110095871 | Forklift radio frequency identification systems for tracking pallet stacks - A forklift RFID system on a forklift for a stack of pallets comprising:
| 04-28-2011 |
20120126954 | Forklift radio frequency identification apparatus - A forklift RFID system on a forklift for reading individual plastic pallets having identical RFID tags in each corner in a stack of pallets. The forklift has a body, a mast mounted to the body and a fork assembly including forks moveably mounted on the mast. A RFID antenna assembly is secured in a fixed position on each side of the forklift above the wheel wells of the forklift and a RFID reader is positioned on the fork and hard wired to the RFID antenna assembly. The antenna assembly has a patch antenna mounted in a cylindrical body which has a bracket secured thereto. The distal end of the bracket has a magnet secured thereto which is mounted on the forklift body. | 05-24-2012 |
20120223812 | Double wide forklift radio frequency - A forklift RFID system on a double wide forklift for a stack of plastic pallets comprising: a double wide forklift comprising a body, a mast mounted to the body and at least two fork assemblies including forks moveably mounted on the mast. A RFID reader having a low power which does not read RFID tags outside of five feet is secured in a fixed position on the forklift body outside the forks of the forklift when the forks are in a closed position. A user interface assembly including a touch-panel display, with the reader being hardwired to the touch-panel display is mounted on the forklift body and software is utilized to provide information to the touch-panel display describing which RFID tags have been interrogated by the reader. | 09-06-2012 |
20130060622 | Electronic wallet coupon redemption method - A method for preventing fraudulent use of electronic coupons, discount certificates, and similar opportunities in mobile electronic commerce. Once a user has received an opportunity via the user's mobile device, the coupon, certificate, etc. may be redeemed. Redemption mechanisms may include a bar code which appears on the screen of the mobile device which is simply scanned at the point-of-sale or an alphanumeric code may be sent which the clerk types into her register. Thereafter, the user hands his device to the cashier, retailer, etc. whereupon the cashier undertakes the necessary actions to complete the process, for example, by selecting a “redeem” option appearing on the screen and entering a code. | 03-07-2013 |
Patent application number | Description | Published |
20100001382 | MANUFACTURING METHOD FOR INTEGRATING A SHUNT RESISTOR INTO A SEMICONDUCTOR PACKAGE - An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads. | 01-07-2010 |
20110033985 | Manufacturing Method for Integrating a Shunt Resistor into a Semiconductor Package - An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads. | 02-10-2011 |
20120199951 | INTEGRATED SHUNT RESISTOR WITH EXTERNAL CONTACT IN A SEMICONDUCTOR PACKAGE - An integrated circuit package that comprises a lead frame | 08-09-2012 |
20130154148 | Electronic Device And Method Of Making - Circuits and methods of fabricating circuits are disclosed herein. A method of fabricating an electronic circuit includes placing an electronic component on a substrate. A ferromagnetic material is mixed into a mold compound to produce a mixed mold compound having an increased permeability over the mold compound. The mixed mold compound is applied to the substrate by way of a transfer mold process, wherein the mixed mold compound encapsulates the electronic component. | 06-20-2013 |
20130192655 | THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD - A circuit board with an embedded thermoelectric device with hard thermal bonds. A method of embedding a thermoelectric device in a circuit board and forming hard thermal bonds. | 08-01-2013 |
20130233609 | INTERPOSER WITH EXTRUDED FEED-THROUGH VIAS - A method of forming interposers includes positioning a plurality of extruded metal wires across a first platten and second platten, which secures the extruded metal wires. A sealing material is added to sidewalls of a volume having the plurality of extruded metal wires within, with the first and second plattens as end plates to form a holding volume. The holding volume is filled with a filling material. The filling material is heated to a sufficient temperature to form a heat treated filled volume. After removing the sealing material, the heat treated filled volume is sawed into a plurality of slices having a predetermined thickness to form a plurality of interposer substrates having a plurality of feed-thru conducting features provided by the plurality of extruded metal wires. | 09-12-2013 |
Patent application number | Description | Published |
20100019361 | Multi Lead Frame Power Package - According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy. | 01-28-2010 |
20100091472 | SEMICONDUCTOR PACKAGE - Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities. | 04-15-2010 |
20100237489 | Structure and Method for Sealing Cavity of Micro-Electro-Mechanical Device - A cavity package ( | 09-23-2010 |
20120015479 | Semiconductor Package with a Mold Material Encapsulating a Chip and a Portion of a Lead Frame - Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities. | 01-19-2012 |
20120086112 | Multi-Component Electronic System Having Leadframe with Support-Free Cantilever Leads | 04-12-2012 |