Patent application number | Description | Published |
20100084747 | Zigzag Pattern for TSV Copper Adhesion - A system and method for forming a TSV contact is presented. A preferred embodiment includes a TSV in contact with a portion of the uppermost metal layer of a semiconductor die. The interface between the TSV conductor and the contact pad is preferably characterized by a non-planar zigzag pattern that forms a grid pattern of contacts. Alternatively, the contacts may form a plurality of metal lines that make contact with the contact pad. | 04-08-2010 |
20100171223 | Through-Silicon Via With Scalloped Sidewalls - A semiconductor device having one or more through-silicon vias (TSVs) is provided. The TSVs are formed such that sidewalls of the TSVs have a scalloped surface. In an embodiment, the sidewalls of the TSVs are sloped wherein a top and bottom of the TSVs have different dimensions. The TSVs may have a V-shape wherein the TSVs have a wider dimension on a circuit side of the substrate, or an inverted V-shape wherein the TSVs have a wider dimension on a backside of the substrate. The scalloped surfaces of the sidewalls and/or sloped sidewalls allow the TSVs to be more easily filled with a conductive material such as copper. | 07-08-2010 |
20110068465 | STRONG INTERCONNECTION POST GEOMETRY - A flip-chip packaging assembly and integrated circuit device are disclosed. An exemplary flip-chip packaging assembly includes a first substrate; a second substrate; and joint structures disposed between the first substrate and the second substrate. Each joint structure comprises an interconnect post between the first substrate and the second substrate and a joint solder between the interconnect post and the second substrate, wherein the interconnect post exhibits a width and a first height. A pitch defines a distance between each joint structure. The first height is less than half the pitch. | 03-24-2011 |
20110095436 | THROUGH SILICON VIA WITH DUMMY STRUCTURE AND METHOD FOR FORMING THE SAME - A through silicon via structure includes a top pad and a vertical conductive post that is connected to the top pad. The top pad covers a wider area than the cross section of the vertical conductive post. An interconnect pad is formed at least partially below the top pad. An under layer is also formed at least partially below the top pad. At least one dummy structure connects the top pad and the under layer to fasten the top pad and the interconnect pad. | 04-28-2011 |
20110186988 | Multi-Direction Design for Bump Pad Structures - An integrated circuit structure includes a semiconductor chip having a first region and a second region; a dielectric layer formed on the first region and the second region of the semiconductor chip; a first elongated under-bump metallization (UBM) connector formed in the dielectric layer and on the first region of the semiconductor chip and having a first longer axis extending in a first direction; and a second elongated UBM connector formed in the dielectric layer on the second region of the semiconductor chip and having a second longer axis extending in a second direction. The first direction is different from the second direction. | 08-04-2011 |
20110193232 | CONDUCTIVE PILLAR STRUCTURE FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE - A conductive pillar structure for a die includes a passivation layer having a metal contact opening over a substrate. A bond pad has a first portion inside the metal contact opening and a second portion overlying the passivation layer. The second portion of the bond pad has a first width. A buffer layer over the bond pad has a pillar contact opening with a second width to expose a portion of the bond pad. A conductive pillar has a first portion inside the pillar contact opening and a second portion over the buffer layer. The second portion of the conductive pillar has a third width. A ratio of the second width to the first width is between about 0.35 and about 0.65. A ratio of the second width to the third width is between about 0.35 and about 0.65. | 08-11-2011 |
20110217841 | METHOD OF FORMING THROUGH SILICON VIA WITH DUMMY STRUCTURE - A method of forming a through silicon via (TSV) structure includes forming an interconnect pad over a substrate. An under layer is formed over the interconnect pad. A vertical conductive post is formed at least partially through the substrate. At least one dummy structure is formed at least partially through the under layer. A top pad is formed over the dummy structure and the vertical conductive post. The top pad covers a wider area than a cross section of the vertical conductive post. The interconnect pad is electrically connected to the top pad. The dummy structure connects the top pad and the under layer thereby fastening the top pad and the interconnect pad. | 09-08-2011 |
20110227216 | Under-Bump Metallization Structure for Semiconductor Devices - An under-bump metallization (UBM) structure for a semiconductor device is provided. A passivation layer is formed over a contact pad such that at least a portion of the contact pad is exposed. A protective layer, such as a polyimide layer, may be formed over the passivation layer. The UBM structure, such as a conductive pillar, is formed over the underlying contact pad such that the underlying contact pad extends laterally past the UBM structure by a distance large enough to prevent or reduce cracking of the passivation layer and or protective layer. | 09-22-2011 |
20110241202 | Dummy Metal Design for Packaging Structures - An integrated circuit structure includes a semiconductor chip, a metal pad at a major surface of the semiconductor chip, and an under-bump metallurgy (UBM) over and contacting the metal pad. A metal bump is formed over and electrically connected to the UBM. A dummy pattern is formed at a same level, and formed of a same metallic material, as the metal pad. | 10-06-2011 |
20120178252 | Dummy Metal Design for Packaging Structures - A method of forming an integrated circuit structure is provided. The method includes forming a metal pad at a major surface of a semiconductor chip, forming an under-bump metallurgy (UBM) over the metal pad such that the UBM and the metal pad are in contact, forming a dummy pattern at a same level as the metal pad, the dummy pattern formed of a same metallic material as the metal pad and electrically disconnected from the metal pad, and forming a metal bump over the UBM such that the metal bump is electrically connected to the UBM and no metal bump in the semiconductor chip is formed over the dummy pattern. | 07-12-2012 |
20130056872 | Packaging and Function Tests for Package-on-Package and System-in-Package Structures - A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls. | 03-07-2013 |
20130119539 | Package Structures and Methods for Forming the Same - A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A solder region is disposed in the polymer region and electrically coupled to the redistribution line. The solder region includes a second flat top surface not higher than the first flat top surface. | 05-16-2013 |
20130140689 | Bump-on-Trace Structures in Packaging - A package component includes a metal trace on a top surface of the package component, and an anchor via underlying and in contact with the metal trace. The anchor via is configured not to conduct currents flowing through the metal trace. | 06-06-2013 |
20130181325 | Through-Assembly Via Modules and Methods for Forming the Same - A discrete Through-Assembly Via (TAV) module includes a substrate, and vias extending from a surface of the substrate into the substrate. The TAV module is free from conductive features in contact with one end of each of the conductive vias. | 07-18-2013 |
20130182402 | PoP Structures Including Through-Assembly Via Modules - A device includes a Through-Assembly Via (TAV) Module, which includes a substrate, a plurality of through-vias penetrating through the substrate, and a second plurality of metal posts at a bottom surface of the TAV module and electrically coupled to the plurality of through-vias. A polymer includes a first portion between and contacting sidewalls of the first package component and the TAV module, a second portion disposed between the first plurality of metal posts, and a third portion disposed between the second plurality of metal posts. A first plurality of Redistribution Lines (RDLs) is underlying a bottom surface of the second and the third portions of the polymer. A second plurality of RDLs is over the first package component and the TAV module. The first plurality of RDLs is electrically coupled to the second plurality of RDLs through the plurality of through-vias in the TAV module. | 07-18-2013 |
20130270682 | Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections - Methods and apparatus for package on package structures having stud bump through via interconnections. A structure includes an interconnect layer having a plurality of through via assemblies each including at least one stud bump are formed on conductive pads; and encapsulant surrounding the through via assembly, a first redistribution layer formed over a surface of the encapsulant and coupled to the through via assemblies and carrying connectors, and a second redistribution layer over interconnect layer at the other end of the through via assemblies, the through via assemblies extending vertically through the interconnect layer. In an embodiment the interconnect layer is mounted using the connectors to a lower package substrate to form a package on package structure. A first integrated circuit device may be mounted on the second redistribution layer of the interconnect layer. Methods for forming the interconnect layer and the package on package structures are disclosed. | 10-17-2013 |
20140076617 | Passive Devices in Package-on-Package Structures and Methods for Forming the Same - A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs. | 03-20-2014 |
20140091471 | Apparatus and Method for a Component Package - A component package and a method of forming are provided. A first component package may include a first semiconductor device having a pair of interposers attached thereto on opposing sides of the first semiconductor device. Each interposer may include conductive traces formed therein to provide electrical coupling to conductive features formed on the surfaces of the respective interposers. A plurality of through vias may provide for electrically connecting the interposers to one another. A first interposer may provide for electrical connections to a printed circuit board or subsequent semiconductor device. A second interposer may provide for electrical connections to a second semiconductor device and a second component package. The first and second component packages may be combined to form a Package-on-Package (“PoP”) structure. | 04-03-2014 |
20140103488 | POP Structures and Methods of Forming the Same - A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line. | 04-17-2014 |
20140185264 | METHODS AND APPARATUS FOR FORMING PACKAGE-ON-PACKAGES - Methods and apparatus are disclosed for a package or a package-on-package (PoP) device. An IC package or a PoP device may comprise an electrical path connecting a die and a decoupling capacitor, wherein the electrical path may have a width in a range from about 8 um to about 44 um and a length in a range from about 10 um to about 650 um. The decoupling capacitor and the die may be contained in a same package, or at different packages within a PoP device, connected by contact pads, redistribution layers (RDLs), and connectors. | 07-03-2014 |
20140191390 | Metal Routing Architecture for Integrated Circuits - A device includes a substrate, a metal pad over the substrate, and a metal trace electrically disconnected from the metal pad. The metal pad and the metal trace are level with each other. A passivation layer includes a portion overlapping an edge portion of the metal pad. A metal pillar is overlying the metal pad, and is electrically connected to the metal pad. The metal trace has a portion overlapped by the metal pillar. | 07-10-2014 |
Patent application number | Description | Published |
20080283959 | Tapered through-silicon via structure - An integrated circuit structure includes a substrate; a through-silicon via (TSV) in the substrate, the TSV being tapered; a hard mask region extending from a top surface of the substrate into the substrate, wherein the hard mask encircles a top portion of the TSV; dielectric layers over the substrate; and a metal post extending from a top surface of the dielectric layers to the TSV, wherein the metal post comprises same materials as the TSV. | 11-20-2008 |
20080290526 | Test patterns for detecting misalignment of through-wafer vias - A semiconductor chip including a test pattern is provided. The semiconductor chip includes a semiconductor substrate; a through-wafer via in the semiconductor substrate; and a plurality of conductive patterns over the semiconductor substrate and adjacent to each other. The bottom surfaces of the plurality of conductive patterns and a top surface of the through-wafer via are substantially coplanar. The through-wafer via is at least adjacent to the plurality of conductive patterns. The semiconductor chip further includes a plurality of bonding pads on a surface of the semiconductor chip, each being connected to one of the plurality of conductive patterns. | 11-27-2008 |
20080296763 | Multi-Die Wafer Level Packaging - A semiconductor die package is provided. The semiconductor die package includes a plurality of dies arranged in a stacked configuration. Through-silicon vias are formed in the lower or intermediate dies to allow electrical connections to dies stacked above. The lower die is positioned face up and has redistribution lines electrically coupling underlying semiconductor components to the through-silicon vias. The dies stacked above the lower die may be oriented face up such that the contact pads are facing away from the lower die or flipped such that the contact pads are facing the lower die. The stacked dies may be electrically coupled to the redistribution lines via wire bonding or solder balls. Additionally, the lower die may have another set of redistribution lines on an opposing side from the stacked dies to reroute the vias to a different pin-out configuration. | 12-04-2008 |
20090051039 | THROUGH-SUBSTRATE VIA FOR SEMICONDUCTOR DEVICE - A semiconductor device including a substrate having a front surface and a back surface is provided. A plurality of interconnect layers are formed on the front surface and have a first surface opposite the front surface of the substrate. A tapered profile via extends from the first surface of the plurality of interconnect layers to the back surface of the substrate. In one embodiment, a insulating layer is formed on the substrate and includes an opening, and wherein the opening includes conductive material providing contact to the tapered profile via. | 02-26-2009 |
20090057823 | Semiconductor Structure with a Discontinuous Material Density for Reducing Eddy Currents - A semiconductor structure includes an inductor; and a semiconductor substrate underlying the inductor, having a discontinuous material density across a plane underneath and in parallel with the inductor, thereby reducing eddy currents induced by an electrical current flowing through the inductor. | 03-05-2009 |
20090155957 | Multi-Die Wafer Level Packaging - A semiconductor die package is provided. The semiconductor die package includes a plurality of dies arranged in a stacked configuration. Through-silicon vias are formed in the lower or intermediate dies to allow electrical connections to dies stacked above. The lower die is positioned face up and has redistribution lines electrically coupling underlying semiconductor components to the through-silicon vias. The dies stacked above the lower die may be oriented face up such that the contact pads are facing away from the lower die or flipped such that the contact pads are facing the lower die. The stacked dies may be electrically coupled to the redistribution lines via wire bonding or solder balls. Additionally, the lower die may have another set of redistribution lines on an opposing side from the stacked dies to reroute the vias to a different pin-out configuration. | 06-18-2009 |
20090269905 | Tapered Through-Silicon Via Structure - An integrated circuit structure includes a substrate; a through-silicon via (TSV) in the substrate, the TSV being tapered; a hard mask region extending from a top surface of the substrate into the substrate, wherein the hard mask encircles a top portion of the TSV; dielectric layers over the substrate; and a metal post extending from a top surface of the dielectric layers to the TSV, wherein the metal post comprises same materials as the TSV. | 10-29-2009 |
20110263120 | THROUGH-SUBSTRATE VIA FOR SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device including providing a substrate having a front surface and a back surface. A masking element is formed on the front surface of the substrate. The masking element includes a first layer having a first opening and a second layer having a second opening of a greater width than the first opening. The second opening is a tapered opening. The method further includes etching a tapered profile via extending from the front surface to the back surface of the substrate using the formed masking element. | 10-27-2011 |
20150371777 | MAGNETIC CAPACITOR STRUCTURES - The present disclosure provides a magnetic capacitor structure including a first electrode, a second electrode opposite to the first electrode, a dielectric layer disposed between the first electrode and the second electrode, a first magnetic layer disposed between the first electrode and the dielectric layer, a second magnetic layer disposed between the second electrode and the dielectric layer, a first oxide layer disposed between the first electrode and the first magnetic layer, and a second oxide layer disposed between the second magnetic layer and the dielectric layer. | 12-24-2015 |
Patent application number | Description | Published |
20110135448 | FAN MODULE WITH VIBRATION-RESISTENT MOUNTING - A fan module includes a cooling fan, a support rack, and four fasteners fixing the cooling fan to the support rack. The fasteners are vibration-resistant material, and are disposed between the support rack and the cooling fan, and below the cooling fan. | 06-09-2011 |
20110228968 | LOUDSPEAKER DEVICE WITH SOUND ENHANCING STRUCTURE - A loudspeaker device comprising: a loudspeaker and a reflecting member positioned opposite to the loudspeaker, the loudspeaker comprising an electromagnet actuator, a dish-like frame and a vibrating drum, the electromagnetic actuator being attached on one side of the frame, the vibrating drum adhered to an inner side of the dish-like frame, the electromagnetic actuator being configured for driving the vibrating drum to vibrate, the vibrating drum being configured for generating sound of different frequencies and intensities; and the reflecting member shaped in a bowl configuration, comprising a concave shaped reflecting surface opposite to the vibrating drum; wherein the area of the reflecting surface is larger than an area of the vibrating drum. | 09-22-2011 |
20110243723 | FAN GUARD - A fan guard includes a bracket, a guide sheet and at least two guide ribs. The bracket defines a vent in the center of the bracket. The guide sheet is located in the center of the vent. The at least two guide ribs interconnect the bracket and the guide sheet. Each guide rib includes a first connecting portion and a second connecting portion connecting the first connecting portion. The first connecting portion and the second connecting portion cooperatively define a first angle therebetween. | 10-06-2011 |
20120114461 | FAN MODULE AND VIBRATION-DAMPING MOUNTING THEREFOR - A fan module with vibration-damping mounting includes a cooling fan, a support frame and a clip detachably fixing the cooling fan to the support frame. The clip includes a mounting portion fixed to the support frame, fixing portions supporting the cooling fan, and vibration reducing portions. Each of the vibration reducing portions is connected between a corresponding fixing portion and the mounting portion. The fixing portions are spaced from the support frame, to prevent a vibration of the cooling fan from being transferred to the support frame. | 05-10-2012 |
20120133257 | SIDE PLATE ASSEMBLY FOR A DEVICE CASING - An exemplary side plate assembly includes a side plate and an elongated reinforcing member. The side plate includes a main portion and two mounting portions at two opposite sides of the main portion. The reinforcing member is arranged at a middle of a side of the side plate. Two ends of the reinforcing member are respectively connected to the two mounting portions of the side plate. An inner side of the reinforcing member abuts the main portion of the side plate. | 05-31-2012 |
20120162886 | RACK SERVER CENTER - A rack server center includes servers, an air conditioning system for bringing cooling air to the rack server, and an air exhaust system located outside the rack server. The air exhaust system includes an exhaust fan, branch pipes, controlling valves, and a main pipe. Each branch pipe is connected with a corresponding server via a corresponding controlling valve. The branch pipes are connected with an inlet of the exhaust fan. The main pipe is connected with an outlet of the exhaust fan. The exhaust fan is configured for exhausting heated air generated by the servers out of the rack server via the branch pipes. Each server is configured for controlling the amount of the heated air entering a corresponding branch pipe by controlling the controlling valve connected with the corresponding branch pipe. | 06-28-2012 |
20130028709 | FAN MODULE - A fan module includes a cooling fan, a supporting rack, and a number of fasteners sandwiched between the cooling fan and the supporting rack. The fasteners are made of vibration-resistant material. The supporting rack includes two opposite supporting walls. An installing portion protrudes out from a top of each supporting plate. Each fastener is sandwiched between the cooling fan and the corresponding installing portion. An extension portion extends from each fastener to resist against an outside surface of the cooling fan. | 01-31-2013 |
20140049903 | FASTENING DEVICE FOR HARD DISK DRIVE - A fastening device includes a bracket, two hook devices, and an operation member. The bracket includes two parallel clamping arms sandwiching an HDD, and a connection plate connected between the clamping arms. Each clamping arm defines a through slot. Each hook includes an end portion engaging in an inner side of the corresponding clamping arm, a locking portion received in the corresponding through slot, and a slanting connection portion connected between the end portion and the locking portion. Two locking poles extend from the locking portion to engage in locking holes defined in the HDD. The operation member is slidably connected to the connection plate. When the operation member is manipulated toward the connection plate, the connection plate abuts against the connection poles of the hook devices. The connection poles are deformed away from the HDD, to disengage the locking poles from the HDD. | 02-20-2014 |
Patent application number | Description | Published |
20130249091 | Multi-Direction Design for Bump Pad Structures - An integrated circuit structure includes a semiconductor chip having a first region and a second region; a dielectric layer formed on the first region and the second region of the semiconductor chip; a first elongated under-bump metallization (UBM) connector formed in the dielectric layer and on the first region of the semiconductor chip and having a first longer axis extending in a first direction; and a second elongated UBM connector formed in the dielectric layer on the second region of the semiconductor chip and having a second longer axis extending in a second direction. The first direction is different from the second direction. | 09-26-2013 |
20140220776 | Multi-Direction Design for Bump Pad Structures - An integrated circuit structure includes a semiconductor chip having a first region and a second region; a dielectric layer formed on the first region and the second region of the semiconductor chip; a first elongated under-bump metallization (UBM) connector formed in the dielectric layer and on the first region of the semiconductor chip and having a first longer axis extending in a first direction; and a second elongated UBM connector formed in the dielectric layer on the second region of the semiconductor chip and having a second longer axis extending in a second direction. The first direction is different from the second direction. | 08-07-2014 |
20140248722 | Packaging and Function Tests for Package-on-Package and System-in-Package Structures - A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls. | 09-04-2014 |
20140264337 | PACKAGING MECHANISMS FOR DIES WITH DIFFERENT SIZES OF CONNECTORS - Embodiments of mechanisms for testing a die package with multiple packaged dies on a package substrate use an interconnect substrate to provide electrical connections between dies and the package substrate and to provide probing structures (or pads). Testing structures, including daisy-chain structures, with metal lines to connect bonding structures connected to signals, power source, and/or grounding structures are connected to probing structures on the interconnect substrate. The testing structures enable determining the quality of bonding and/or functionalities of packaged dies bonded. After electrical testing is completed, the metal lines connecting the probing structures and the bonding structures are severed to allow proper function of devices in the die package. The mechanisms for forming test structures with probing pads on interconnect substrate and severing connecting metal lines after testing could reduce manufacturing cost. | 09-18-2014 |
20140264769 | PACKAGING MECHANISMS FOR DIES WITH DIFFERENT SIZES OF CONNECTORS - Embodiments of mechanisms for forming a die package with multiple packaged dies on a package substrate use an interconnect substrate to provide electrical connections between dies and the package substrate. The usage of the interconnect substrate enables cost reduction because it is cheaper to make than an interposer with through silicon vias (TSVs). The interconnect substrate also enables dies with different sizes of bump structures to be packaged in the same die package. | 09-18-2014 |
20150069595 | Apparatus and Method for a Component Package - A component package and a method of forming are provided. A first component package may include a first semiconductor device having a pair of interposers attached thereto on opposing sides of the first semiconductor device. Each interposer may include conductive traces formed therein to provide electrical coupling to conductive features formed on the surfaces of the respective interposers. A plurality of through vias may provide for electrically connecting the interposers to one another. A first interposer may provide for electrical connections to a printed circuit board or subsequent semiconductor device. A second interposer may provide for electrical connections to a second semiconductor device and a second component package. The first and second component packages may be combined to form a Package-on-Package (“PoP”) structure. | 03-12-2015 |
20150072476 | Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections - Methods and apparatus for package on package structures having stud bump through via interconnections. A structure includes an interconnect layer having a plurality of through via assemblies each including at least one stud bump are formed on conductive pads; and encapsulant surrounding the through via assembly, a first redistribution layer formed over a surface of the encapsulant and coupled to the through via assemblies and carrying connectors, and a second redistribution layer over interconnect layer at the other end of the through via assemblies, the through via assemblies extending vertically through the interconnect layer. In an embodiment the interconnect layer is mounted using the connectors to a lower package substrate to form a package on package structure. A first integrated circuit device may be mounted on the second redistribution layer of the interconnect layer. Methods for forming the interconnect layer and the package on package structures are disclosed. | 03-12-2015 |
20150093881 | Through-Assembly Via Modules and Methods for Forming the Same - A discrete Through-Assembly Via (TAV) module includes a substrate, and vias extending from a surface of the substrate into the substrate. The TAV module is free from conductive features in contact with one end of each of the conductive vias. | 04-02-2015 |
20150155203 | POP Structures and Methods of Forming the Same - A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line. | 06-04-2015 |
20150262898 | Packaging Mechanisms for Dies with Different Sizes of Connectors - Embodiments of mechanisms for testing a die package with multiple packaged dies on a package substrate use an interconnect substrate to provide electrical connections between dies and the package substrate and to provide probing structures (or pads). Testing structures, including daisy-chain structures, with metal lines to connect bonding structures connected to signals, power source, and/or grounding structures are connected to probing structures on the interconnect substrate. The testing structures enable determining the quality of bonding and/or functionalities of packaged dies bonded. After electrical testing is completed, the metal lines connecting the probing structures and the bonding structures are severed to allow proper function of devices in the die package. The mechanisms for forming test structures with probing pads on interconnect substrate and severing connecting metal lines after testing could reduce manufacturing cost. | 09-17-2015 |
Patent application number | Description | Published |
20140328686 | FAN - Fan includes a hub, a mounting ring encircling the hub, a plurality of connection poles rotatably connected to the mounting ring, and a plurality of blades fastened to the connection poles. A center of lift of each blade is located between a lower end of the blade and the connection pole fastened to the blade. | 11-06-2014 |
20140353444 | FIXING APPARATUS FOR HARD DISK DRIVE - A fixing apparatus for fixing a hard disk drive includes a first frame, a second frame, and a latching device. The first frame includes a first mounting arm and a first connecting arm. The first mounting arm includes a number of fixing columns for inserting into fixing holes of the hard disk drive. The first connecting arm defines a hole. The first connection arm defines an elongated slot on an outer surface thereof, and the elongated slot defines an inclined slot beside the hole. The second frame includes a second mounting arm and a second connecting arm, which is slidably received in the elongated slot. The latching device is attached to the second frame and, includes a pressing member, which can slide along the inclined slot and insert into or withdraw from the hole. A spring is provided between the pressing member and the second connecting arm. | 12-04-2014 |
20140363286 | FAN MODULE - A fan module includes an aerofoil fan and an air duct. The aerofoil fan includes a shell defining a vent extending through two opposite ends of the shell and a fan rotatably received in the vent. The air duct is mounted on an end of the shell aligning with the vent. The air duct includes a tapered pipe and a number of latching plates mounted on the pipe. A smaller end of the pipe is located adjacent to the vent of the shell. One end of each latching plate is mounted to a bigger end of the pipe, and the other end of each latching plate is mounted to the shell. | 12-11-2014 |
20150131817 | LOUDSPEAKER - A loudspeaker includes a base, a sound-reflecting member located at a side of the base, a sound generator mounted to the sound-reflecting member, an adjusting member including a number of magnetic pieces and located at an opposite side of the base, a connecting member connected between the sound-reflecting member and the adjusting member, a supporting member, and a controlling apparatus. The supporting member includes a number of first electromagnets mounted to the magnetic pieces. The controlling apparatus is electrically coupled to the first electromagnets. The controlling apparatus controls the first electromagnets to attract the magnetic pieces, to allow the adjusting member to swing, and the adjusting member drives the connecting member to rotate, thereby swinging the sound-reflecting member. | 05-14-2015 |
20150131818 | LOUDSPEAKER - A loudspeaker includes a circuit board defining a receiving hole, a supporting bracket received in the receiving hole and mounted to the circuit board, a sound-reflecting member, a connecting plate, a sound generator mounted to the sound-reflecting member, and a controller. The supporting bracket includes a hemispherical receiving portion. The sound-reflecting member includes a sound-reflecting plate received in the receiving portion and a number of magnetic pieces extending out from a circumference of the sound-reflecting plate. A number of electromagnets are mounted on the circuit board, and face the magnetic pieces. The connecting plate is slidably engaged with an outer surface of the receiving portion and connected to the sound-reflecting member. The controller is coupled to the electromagnets. The controller controls the electromagnets to attract the magnetic pieces, to allow the sound-reflecting plate to swing. | 05-14-2015 |
20150139454 | LOUDSPEAKER WITH ROTATABLE SOUND-REFLECTING MEMBER - A loudspeaker includes a circuit board, a base mounted on a rear side of the circuit board, a positioning apparatus slidably installed between the base and the circuit board, a sound-reflecting member positioned at a front side of the circuit board, a connecting member connected between the base and the sound-reflecting member, a sound generator, and a controller. The sound-reflecting member includes a sound-reflecting plate and a number of magnetic pieces around the sound-reflecting plate. Many first electromagnets are mounted on the front side of the circuit board, aligning with the magnetic pieces. The position apparatus includes a positioning bracket. The connecting member includes a rotating portion rotatably connected to the base. A second electromagnet is mounted to the circuit board, to move the positioning bracket. The controller controls one or more of the first electromagnets to attract the corresponding magnetic pieces, to allow the sound-reflecting member to swing. | 05-21-2015 |