Patent application number | Description | Published |
20100200193 | COOLING DEVICE AND CONSTRUCTION MACHINE OR WORKING MACHINE EQUIPPED WITH THE SAME - A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; and a ring having an inner circumferential wall and an outer circumferential wall. The inner circumferential wall is provided on the shroud and adjacent to an outer circumference of the cooling fan. The outer circumferential wall surrounds the inner circumferential wall, and an air-flow-direction downstream side end of the outer circumferential wall is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. An air-flow-direction downstream side end of an outer circumferential edge of the cooling fan is positioned at a further downstream position in the air flow direction than the air-flow-direction downstream side end of the inner circumferential wall. | 08-12-2010 |
20100200194 | COOLING DEVICE AND CONSTRUCTION MACHINE OR WORKING MACHINE EQUIPPED WITH THE SAME - A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; an inner circumferential wall provided on the shroud and adjacent to the outer circumference of the cooling fan; and an outer circumferential wall provided to surround the inner circumferential wall. An air-flow-direction downstream side end of the outer circumferential wall is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. An air-flow-direction downstream side end of the cooling fan is positioned at a further downstream position than the air-flow-direction downstream side end of the inner circumferential wall. A ratio between a length of the outer circumferential wall and a length of the inner circumferential wall in the air flow direction is 1.07 or more and 1.81 or less, and a width between the outer circumferential wall and the inner circumferential wall is 15 mm or more and 55 mm or less. | 08-12-2010 |
20100206525 | COOLING DEVICE AND CONSTRUCTION MACHINE OR WORKING MACHINE EQUIPPED WITH THE SAME - A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; an inner circumferential wall provided on the shroud and adjacent to the outer circumference of the cooling fan so as to surround the cooling fan; an outer circumferential wall provided to surround the inner circumferential wall. An air-flow-direction downstream side end of the outer circumferential wall is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. The cooling fan is rotatable within a space provided on a radially inner side of the inner circumferential wall. The air-flow-direction downstream side end of the outer circumferential wall is provided at a further upstream position in the air flow direction than an air-flow-direction downstream side end of the cooling fan. | 08-19-2010 |
20100206526 | COOLING DEVICE AND CONSTRUCTION MACHINE OR WORKING MACHINE EQUIPPED WITH THE SAME - A cooling device includes: a cooling fan; a shroud provided at an outer circumferential side of the cooling fan; an inner circumferential wall provided on the shroud and adjacent to the outer circumference of the cooling fan; and an outer circumferential wall provided to surround the inner circumferential wall. An air-flow-direction downstream side end of an outer circumferential edge of the cooling fan is positioned at a further downstream position in an air flow direction than an air-flow-direction downstream side end of the inner circumferential wall. An angle between: an line connecting the air-flow-direction downstream side end of the inner circumferential wall to the air-flow-direction downstream side end of the outer circumferential wall in cross section along the air flow direction of the inner circumferential wall and the outer circumferential wall; and a line orthogonal to the air flow direction, is 9 degrees or more and 45 degrees or less. | 08-19-2010 |
Patent application number | Description | Published |
20110215306 | ORGANIC SEMICONDUCTOR ELEMENT AND ORGANIC ELECTRODE - To provide an organic semiconductor element, containing: a source electrode containing a first organic compound layer and a second organic compound layer, at least one of the layers having an organic semiconductor active region; and a drain electrode containing the first organic compound layer and the second organic compound layer, as well as providing an organic electrode, containing: a laminated film, in which a layer of a tetrathiafulvalene derivative expressed by the following general formula I and a layer of an electron accepting compound are laminated: | 09-08-2011 |
20120035364 | TETRATHIAFULVALENE DERIVATIVE, AND ORGANIC FILM AND ORGANIC TRANSISTOR USING THE SAME - A tetrathiafulvalene derivative expressed by General Formula (I): General Formula (I) in General Formula (I), X represents an atom selected from a carbon atom, a sulfur atom, and a nitrogen atom, and Xs may be the same or different; provided that when X is the carbon atom or the nitrogen atom, R | 02-09-2012 |
20120119195 | NOVEL ORGANIC SEMICONDUCTIVE MATERIAL AND ELECTRONIC DEVICE USING THE SAME - To provide an organic semiconductive material, expressed by the following general formula I: General Formula I where R | 05-17-2012 |
20120153271 | LEAVING SUBSTITUENT-CONTAINING COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, ORGANIC SEMICONDUCTOR FILM CONTAINING THE MATERIAL, ORGANIC ELECTRONIC DEVICE CONTAINING THE FILM, METHOD FOR PRODUCING FILM-LIKE PRODUCT, PI-ELECTRON CONJUGATED COMPOUND AND METHOD FOR PRODUCING THE PI-ELECTRON CONJUGATED COMPOUND - A leaving substituent-containing compound including a partial structure represented by the following General Formula (I): where a pair of X | 06-21-2012 |
20130095605 | LEAVING SUBSTITUENT-CONTAINING COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL FORMED THEREFROM, ORGANIC ELECTRONIC DEVICE, ORGANIC THIN-FILM TRANSISTOR AND DISPLAY DEVICE USING THE ORGANIC SEMICONDUCTOR MATERIAL, METHOD FOR PRODUCING FILM-LIKE PRODUCT, PI-ELECTRON CONJUGATED COMPOUND AND METHOD FOR PRODUCING THE PI ELECTRON CONJUGATED COMPOUND - A leaving substituent-containing compound represented by General Formula (I), wherein the leaving substituent-containing compound can be converted to a compound represented by General Formula (Ia) and a compound represented by General Formula (II), by applying energy to the leaving substituent-containing compound, in General Formulas (I), (Ia) and (II), X and Y each represent a hydrogen atom or a leaving substituent, where one of X and Y is the leaving substituent and the other is the hydrogen atom; Q | 04-18-2013 |
20130096320 | ORGANIC SEMICONDUCTIVE MATERIAL PRECURSOR CONTAINING DITHIENOBENZODITHIOPHENE DERIVATIVE, INK, INSULATING MEMBER, CHARGE-TRANSPORTING MEMBER, AND ORGANIC ELECTRONIC DEVICE - An organic semiconductive material precursor containing a dithienobenzodithiophene derivative expressed by General Formula I: in General Formula I, X and Y represent groups bonded together, upon application of external stimulus, to form X—Y which is eliminated from the compound expressed by General Formula I; R | 04-18-2013 |
20140024841 | ORGANIC SEMICONDUCTIVE MATERIAL PRECURSOR CONTAINING DITHIENOBENZODITHIOPHENE DERIVATIVE, INK, INSULATING MEMBER, CHARGE-TRANSPORTING MEMBER, AND ORGANIC ELECTRONIC DEVICE - An ink containing an organic semiconductive material precursor containing a dithienobenzodithiophene derivative of the following formula: | 01-23-2014 |
20140175416 | LEAVING SUBSTITUENT-CONTAINING COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, ORGANIC SEMICONDUCTOR FILM CONTAINING THE MATERIAL, ORGANIC ELECTRONIC DEVICE CONTAINING THE FILM, METHOD FOR PRODUCING FILM-LIKE PRODUCT, PI-ELECTRON CONJUGATED COMPOUND AND METHOD FOR PRODUCING THE PI-ELECTRON CONJUGATED COMPOUND - A leaving substituent-containing compound including a partial structure represented by the following General Formula (I): | 06-26-2014 |
20140187797 | LEAVING SUBSTITUENT-CONTAINING COMPOUND, ORGANIC SEMICONDUCTOR MATERIAL, ORGANIC SEMICONDUCTOR FILM CONTAINING THE MATERIAL, ORGANIC ELECTRONIC DEVICE CONTAINING THE FILM, METHOD FOR PRODUCING FILM-LIKE PRODUCT, PI-ELECTRON CONJUGATED COMPOUND AND METHOD FOR PRODUCING THE PI-ELECTRON CONJUGATED COMPOUND - A leaving substituent-containing compound including a partial structure represented by the following General Formula (I): | 07-03-2014 |
20140194591 | DECOMPOSABLE POLYMER - A decomposable polymer represented by General Formula (1): | 07-10-2014 |