Patent application number | Description | Published |
20080259845 | METHOD AND SYSTEM FOR SUPPORTING MULTI MESH OPERATION MODES USING SINGLE WI-FI INTERFACING - A wireless-fidelity (Wi-Fi) interfacing method and a Wi-Fi interfacing system are provided. The Wi-Fi interfacing method includes: determining an interfacing operation mode related to a received packet, in interoperation with the receiving of the packet; and processing the packet via a single Wi-Fi interface, according to the determined interfacing operation mode. The Wi-Fi interfacing system includes: an operation mode determination unit determining an interfacing operation mode related to a received packet, in interoperation with the receiving of the packet; and a packet processing unit processing the packet via a single Wi-Fi interface, according to the determined interfacing operation mode. | 10-23-2008 |
20090053857 | SEMICONDUCTOR PACKAGING METHOD - The present invention relates to a semiconductor packaging method. The method comprises (S | 02-26-2009 |
20090088527 | ATTACH PASTE COMPOSITION FOR SEMICONDUCTOR PACKAGE - The present invention relates to an attach paste composition for a semiconductor package. The attach paste composition for a semiconductor package includes a mixed resin, or a blend of an elastic resin and an epoxy resin as a basic resin. At this time, preferably the basic resin includes 50 to 95 weight % of the elastic resin and 5 to 50 weight % of the epoxy resin. The present invention enables a conventional semiconductor packaging method using a die adhesive to eliminate a pre-drying process performed after application of a die adhesive through screen printing and a thermal hardening process performed after an encapsulation process, maintains the properties of the die adhesive, ensures reliability of semiconductor products, and realizes a simple process. | 04-02-2009 |
20090091044 | DICING DIE ATTACHMENT FILM AND METHOD FOR PACKAGING SEMICONDUCTOR USING SAME - A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer. | 04-09-2009 |
20090111469 | METHOD AND APPARATUS FOR HANDOVER BASED ON DYNAMIC BEAMFORMING SCHEME - A method and apparatus for handover based on a dynamic beamforming scheme, which is adapted to a mobile communication system including a mobile node and a base station, is provided. The apparatus includes a mobile profile information processor configured to process mobile profile information based on a location of the mobile node, and to generate a beamforming control signal according to the mobile profile information; a handover indication message processor configured to generate a first handover indication message incorporating the mobile profile information in preparation for a handover of the mobile node; a transceiver configured to transmit the first handover indication message; and a beamforming controller configured to control beamforming for transmission of the transceiver according to the beamforming control signal. | 04-30-2009 |
20090317191 | FISH WAY OF TURBINE STRUCTURE AND GATE STRUCTURE FOR TIDAL POWER PLANT - Fishways of turbine structures and gate structures for environmentally-friendly tidal power plant through which fish can pass through are provided. The fishway comprises of sea side fishways and lake side fishways to allow fish to move between the sea side and the lake side by forming inside stuffing space filled with seawater for shorter construction period and concrete reduced placing quantity in a certain section of the vertical middle walls installed on the base of which the bottom part is on the marine rock to form blocks of turbine structures and gate structures in a tidal power plant, and seawater on the sea side and the lake side is flown through the front and rear of such inside stuffing space. | 12-24-2009 |
20100014920 | TURBINE STRUCTURE AND GATE STRUCTURE HAVING FLEXIBLE JOINT AND INSIDE STUFFING FOR TIDAL POWER PLANT - A turbine structure and a gate structure for tidal power plants of the present invention features that middle walls which can be installed as two units of one block are installed with an inside stuffing and a flexible joint so as to absorb and reduce the internal and external effects of the buoyancy and mechanical vibration of the turbine structures and the gate structures on the tidal power plants, save construction costs by shortened construction period and reduced concrete placing quantity, and prevent the cracks of concrete and the generation of hydration heat. The turbine structure having the flexible joint and the inside stuffing for tidal power plants comprises a base which bottom part is on the submarine rock so that a turbine structure between lake and sea which is connected with a gate structure by the medium of a connection structure can be installed as two units of one block; vertical middle walls which are formed on the base, the top of which is closed by a concrete structure wherein a draft tube and a discharge tube by which seawater can move inside; turbine generators which are arranged between the middle walls through the draft tubes; an inside stuffing space which is formed in the middle walls on one side installed in a predetermined distance on the base of the gate structure and filled with seawater; and a flexible joint of connecting the middle walls on the other side. | 01-21-2010 |
20100087067 | METHOD FOR PACKAGING SEMICONDUCTOR - A method for packaging a semiconductor is provided to allow uniform coating of a die attachment paste, shorten a B-staging time, and improve die pick-up characteristics and die attachment characteristics. This method includes preparing a die attachment paste with a viscosity of 1,500 to 100,000 cps; rotating a wafer and applying the die attachment paste to an upper surface of the wafer into a predetermined thickness; and B-staging the paste applied on the wafer. This method makes it possible to reduce costs by substituting for WBL (Wafer Backside Lamination) film, uniformly apply a die attachment paste to a wafer, freely control a thickness of applied die attachment paste by adjusting viscosity and dosage of discharged paste and a speed of a spin coater, and also shorten a process time by decreasing a B-staging time. | 04-08-2010 |
20100232392 | METHOD FOR PERFORMING A HANDOVER FROM A WCDMA SYSTEM TO A CDMA SYSTEM IN A MULTI-MODE MOBILE COMMUNICATION TERMINAL - A method of performing a handover from a Wideband Code Division Multiple Access (WCDMA) system to a Code Division Multiple Access (CDMA) system in a multi-mode terminal having a WCDMA module and a CDMA module includes determining whether a handover to the CDMA system is necessary during a call through a WCDMA system; acquiring a pilot signal from the CDMA system by activating the CDMA module if it is determined that the handover to the CDMA system is necessary; receiving a sync signal if the pilot signal from the CDMA system is acquired; transmitting information for handover to the WCDMA system through the WCDMA module; allowing the CDMA module to enter a CDMA traffic state using handover information if the handover information is received from the WCDMA system through WCDMA module; and releasing a traffic state of the WCDMA module. | 09-16-2010 |
20100317155 | MULTIFUNCTIONAL DIE ATTACHMENT FILM AND SEMICONDUCTOR PACKAGING USING THE SAME - A multifunctional die attachment film used in a semiconductor packaging process includes a first die attachment film attached to a surface of a wafer having fine circuit patterns and solder bump patterns and having a first adhesive strength; and a second die attachment film attached on the first die attachment film and having a second adhesive strength with a wafer, a die chip, PCB and a flexible board, and the multifunctional die attachment film serves as a backgrinding tape in a backgrinding process, and after the backgrinding process is completed, the multifunctional die attachment film is not removed, but is used to attach a die chip to a connection member. And, the present invention utilizes the die attachment film as a backgrinding tape in the backgrinding process and concurrently a wafer protection means in a wafer dicing process, thereby preventing sawing burr, scratches or cracks. | 12-16-2010 |
20110019132 | Cholesteric liquid crystal display devices and methods of manufacturing the same - A cholesteric liquid crystal display device includes: a plurality of pixel units arranged two-dimensionally between two transparent substrates. Each of the plurality of pixel units includes a cholesteric liquid crystal layer having a single-layer structure. The cholesteric liquid crystal layer includes: a liquid crystal molecule; a chiral dopant; and an optically polymerizable polymer. The chiral dopant is mixed with the liquid crystal molecule to form a cholesteric phase and has a solubility that varies with respect to the liquid crystal molecule according to temperature. The optically polymerizable polymer is cured to fix a helix pitch of the cholesteric phase. | 01-27-2011 |
20110188423 | MULTI-MODE TERMINAL, SYSTEM, AND METHOD - Disclosed herein is a system and method for reducing power consumption of a multi-mode terminal, which can decrease power consumption of a multi-mode terminal that supports mobile communication and wireless local area network (LAN) functions and increase efficiency of the wireless LAN function. To this end, power is cut off or a low-power state is maintained if a wireless LAN service is not used, and power is applied to a wireless LAN modem if a user requests or a call reception message is received through a mobile communication modem. | 08-04-2011 |
20120081644 | Cholesteric Liquid Crystal Display Devices And Methods Of Manufacturing The Same - In a method of manufacturing a single-layer cholesteric liquid crystal display device, a liquid crystal composition of a cholesteric phase is formed between a first substrate and a second substrate. A plurality of liquid crystal layers are formed by sequentially adjusting the temperature of the cholesteric phase liquid crystal composition and performing a plurality of optical curing processes on the cholesteric phase liquid crystal composition. Each of the plurality of liquid crystal layers corresponds to one of the plurality of subpixels. | 04-05-2012 |
20120112097 | METHOD AND APPARATUS FOR QUANTITATIVE ANALYSIS OF THE EXTENT OF MEMBRANE FOULING BY USING FLUORESCENT PROTEIN STRUCTURES - Disclosed are a method and an apparatus for quantitative analysis of the extent of separation membrane fouling using a fluorescent protein structure, allowing easy quantitative analysis of the extent of separation membrane fouling and improving accuracy thereof. The disclosed method for quantitative analysis of the extent of separation membrane fouling using a fluorescent protein structure includes: preparing a solution containing a fluorescent protein structure; passing the solution containing the fluorescent protein structure through a separation membrane so as to adsorb the fluorescent protein structure onto the separation membrane; and quantitatively analyzing the fluorescent protein structure adsorbed onto the separation membrane by measuring fluorescence emitted by the fluorescent protein structure adsorbed to the separation membrane. | 05-10-2012 |
20120138993 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - A light emitting device is disclosed. The light emitting device includes a first conductive type semiconductor layer, an active layer disposed on the first conductive type semiconductor layer, a tunnel junction layer comprising a second conductive type nitride semiconductor layer and a first conductive type nitride semiconductor layer disposed on the active layer, wherein the first conductive type nitride semiconductor layer and the second conductive type nitride semiconductor layer are PN junctioned, a first electrode disposed on the first conductive type semiconductor layer, and a second electrode disposed on the first conductive type nitride semiconductor layer, wherein a portion of the second electrode is in schottky contact with the second conductive type nitride semiconductor layer through the first conductive type nitride semiconductor layer. | 06-07-2012 |
20120176077 | SOLAR CELL MODULE HAVING WHITE BACK SHEET - The present invention relates to a solar cell module having a white back sheet. According to one aspect of the present invention, provided is a solar cell module having a white back sheet including: a solar cell; an encapsulation sheet for covering and protecting an upper part of the solar cell while transmitting light; and a back sheet for supporting the solar cell and having a white reflection layer for reflecting the light transmitted through the solar cell, wherein the light reflected from the white reflection layer of the back sheet is reused to be photoelectrically converted by the solar cell. | 07-12-2012 |
20120240984 | SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME - A solar cell module comprises a rear contact solar cell in which positive (+) and negative (−) electrode patterns are alternately formed on a rear surface of a solar cell; insulating layers formed on both sides of the rear surface of the solar cell to be vertical to the electrode patterns; and a pair of conductive pattern bars that is disposed in a gap between both sides of the rear surface of the solar cell. Each conductive pattern bar includes a stem part formed on the each insulating layer and a plurality of branch parts extending from the stem part to be electrically connected to the same electrode patterns on the rear surface of the solar cell; and an encapsulant layer that protects the conductive pattern bars and at least the rear surface of the solar cell. | 09-27-2012 |
20120244656 | METHOD AND APPARATUS FOR PRODUCING SOLAR CELL - Disclosed herein are a method and an apparatus for producing a solar cell. The method includes: (a) preparing a rear contact solar cell substrate having electrode patterns formed on a rear surface thereof; (b) performing scribing on a front surface of the substrate on which the electrode patterns are not formed, by using laser; and (c) cutting the substrate in each cell along the scribing so as to form the solar cell. Further, an apparatus for producing a solar cell is operated by the method for producing a solar cell. | 09-27-2012 |
20120247551 | SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a solar cell module and a method for manufacturing the same. According to an exemplary embodiment of the present invention, there is provided a solar cell module, including: a solar cell having electrode patterns formed on at least one surface thereof; and a parylene coating layer(s) forming a light transmissive passivation layer on at least a front surface of the solar cell. According to another exemplary embodiment of the present invention, there is provided a method for manufacturing a solar cell module, including: (a) preparing a solar cell having electrode patterns formed on at least one surface thereof; and (b) forming a light transmissive passivation layer by coating parylene on at least a front surface of the solar cell. | 10-04-2012 |
20120248335 | METHOD AND APPARATUS FOR INSPECTING SOLAR CELL - Disclosed herein are a method and an apparatus for inspecting solar cells. According to an exemplary embodiment of the present invention, a method for inspecting solar cells includes: (a) preparing solar cells; (b) obtaining a photoluminescence image(s) by irradiating light to the prepared solar cells; and (c) determining a conversion efficiency rating of each solar cell according to brightness of the obtained image. Further, an apparatus for inspecting solar cells includes a stage unit that transfers solar cells; a light source unit that irradiates light to a surface of the solar cell transferred through the stage unit; a camera unit that obtains a photoluminescence image according to the light irradiated from the light source unit; and an efficiency determination unit that determines a conversion efficiency rating of each solar cell based on brightness of an image obtained from the camera unit according to preset programs. | 10-04-2012 |
20120281172 | LIQUID CRYSTAL DISPLAY - A liquid crystal display according to an exemplary embodiment of the present invention includes: a first substrate; a pixel electrode disposed on the first substrate; a first alignment layer disposed on the first substrate and the pixel electrode; a second substrate facing the first substrate; a common electrode disposed on the second substrate; a second alignment layer disposed on the second substrate and the common electrode; and a liquid crystal layer disposed between the first substrate and the second substrate, wherein the common electrode has a plurality of cutouts having a cross shape, and when viewing the first substrate and the second substrate upward, the edge of the cutout is protruded from the edge of the pixel electrode. | 11-08-2012 |
20120281173 | LIQUID CRYSTAL DISPLAY - A liquid crystal display according to an exemplary embodiment of the present invention includes a first substrate, a pixel electrode disposed on the first substrate, a first alignment layer disposed on the first substrate and the pixel electrode, a second substrate facing the first substrate, a common electrode disposed on the second substrate, a second alignment layer disposed on the second substrate and the common electrode, and a liquid crystal layer disposed between the first substrate and the second substrate, in which the common electrode has a first opening having a cross shape, an edge of the first opening protrudes beyond an edge of the pixel electrode, and the pixel electrode includes a second opening disposed adjacently to at least one of the edges of the pixel electrode. | 11-08-2012 |
20120319609 | LIGHT EMITTING DIODE DRIVER HAVING OFFSET VOLTAGE COMPENSATING FUNCTION - There is provided a light emitting diode (LED) driver having an offset voltage compensating function compensating for an offset voltage generated at the time of driving of an LED, the LED driver including: a driving unit detecting a current flowing in an LED unit having at least one LED, as a voltage and controlling the current flowing in the LED unit according to a comparison result between the detected voltage and a reference voltage having a preset voltage level; and an offset compensating unit integrating a voltage difference between the detected voltage and the reference voltage and adding or subtracting a compensating current according to an integration result to thereby compensate for an offset. | 12-20-2012 |
20130033191 | LIGHT EMITTING DIODE DRIVING DEVICE AND METHOD THEREOF - There are provided a light emitting diode (LED) driving device allowing for an increase in an LED driving rate by discharging a charge stored in a capacitor during a certain period of time and a method thereof. The LED driving device includes: a driving unit detecting a current, as a voltage, the current flowing across an LED unit having at least one LED, controlling the current flowing across the LED unit according to a comparison result between the detected voltage and a reference voltage having a pre-set voltage level, and having a capacitor stabilizing an operation of the LED unit when the LED unit is driven; and a discharging unit discharging a charge stored in the capacitor during a pre-set discharge time when the LED unit is initially driven. | 02-07-2013 |
20130075383 | TRANSPARENT HEATING DEVICE - Disclosed herein is a transparent heating device. The transparent heating device according to exemplary embodiments of the present invention includes a transparent heating unit disposed on one side portion of the window to generate heat so as to remove and prevent frost or condensation over the window. | 03-28-2013 |
20130146906 | ULTRAVIOLET SEMICONDUCTOR LIGHT EMITTING DEVICE - An ultraviolet light emitting device includes a first conductive semiconductor layer; an active layer under the first conductive semiconductor layer; a first reflective layer under the active layer; and a second conductive semiconductor layer under the first reflective layer. The first reflective layer comprises a plurality of compound semiconductor layers. The compound semiconductor layer comprises at least two semiconductor materials. The contents of the at least two semiconductor materials are different from each other. | 06-13-2013 |
20130177024 | CONTENT-CENTRIC NETWORK AND METHOD OF PERFORMING ROUTING BETWEEN DOMAINS THEREFOR - A Content-Centric Network and a method of performing routing between domains therefor are provided. The method includes identifying a route from an anchor hub in a first domain to one or more hubs in the first domain, the anchor hub being configured to store routing information between a first border hub of the hubs in the first domain and a second border hub in a second domain, detecting, by each of the hubs in the first domain, a neighboring hub based on a sync direction corresponding to the identified route, and sharing the routing information with the neighboring hub, the sharing of the routing information including performing a sync operation between the neighboring hub and each of the hubs in the first domain. | 07-11-2013 |
20140292825 | MULTI-LAYER DISPLAY APPARATUS AND DISPLAY METHOD USING IT - The present invention relates to a multi-layer display apparatus and a display method using the same, and more particularly, relates to a multi-layer display apparatus for adjusting a color value and an object size in an overlapping part so as to maintain an original color when a background image displayed on a general LCD panel and an exhibition image displayed on a transparent LCD panel are superimposed in a structure where the general LCD panel and the transparent LCD panel are disposed in order, and a display method using the same. To this end, the multi-layer display apparatus according to the present invention includes a first display panel for displaying a background image, a second display panel disposed in front of the first display panel and displaying an exhibition image, and a control box for correcting a color value and a coordinate value of a pixel position where the background image and the exhibition image are superimposed, and outputting an image reflecting the corrected color value and coordinate value. | 10-02-2014 |
20150048464 | SEMICONDUCTOR DEVICE HAVING PINNED LAYER WITH ENHANCED THERMAL ENDURANCE - A semiconductor device is provided having a free layer and a pinned layer spaced apart from each other. A tunnel barrier layer is formed between the free layer and the pinned layer. The pinned layer may include a lower pinned layer, and an upper pinned layer spaced apart from the lower pinned layer. A spacer may be formed between the lower pinned layer and the upper pinned layer. A non-magnetic junction layer may be disposed adjacent to the spacer or between layers in the upper or lower pinned layer. | 02-19-2015 |
20150085238 | LIQUID CRYSTAL DISPLAY - A liquid crystal display according to an exemplary embodiment of the present invention includes a first substrate, a pixel electrode disposed on the first substrate, a first alignment layer disposed on the first substrate and the pixel electrode, a second substrate facing the first substrate, a common electrode disposed on the second substrate, a second alignment layer disposed on the second substrate and the common electrode, and a liquid crystal layer disposed between the first substrate and the second substrate, in which the common electrode has a first opening having a cross shape, an edge of the first opening protrudes beyond an edge of the pixel electrode, and the pixel electrode includes a second opening disposed adjacently to at least one of the edges of the pixel electrode. | 03-26-2015 |