Mikhail, MN
Amanda E. Mikhail, Rochester, MN US
Patent application number | Description | Published |
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20080318455 | BACKPLANE CONNECTOR WITH HIGH DENSITY BROADSIDE DIFFERENTIAL SIGNALING CONDUCTORS - Embodiments of the present invention address deficiencies of the art in respect to backplane connectivity and provide a backplane connector for high density broadside differential signaling. In an embodiment of the invention, a backplane connector can be provided. The backplane connector can include a signal header assembly and a signal receptacle assembly. The signal header assembly can include pairs of differential signaling conductors arranged in columns for broadside signaling. Comparably, the signal receptacle assembly can include pairs of conductor receptacles arranged in columns to receive corresponding ones of the pairs of the differential signaling conductors. Finally, a surface mount (SMT) lead can be provided for each of the conductor receptacles and each of the signaling conductors | 12-25-2008 |
20100241400 | Determining Component Failure Rates Using Accelerated Life Data - A method of statistical analysis is based on an accelerated degradation model for estimating the failure rate from a set of accelerated life data (e.g. stress, humidity, temperature, voltage, resistance, vibration, etc.). The method re-samples randomly distributed data and organizes it into subsets that may be ordered. The maximum is found for each subset. From the maximums a parametric LEV distribution is determined. Maximum Likelihood Estimation methods may be used to find the parameters employed in the determined LEV distribution. The failure rate is calculated using the determined LEV distribution of the sample maximums. | 09-23-2010 |
20120179388 | SYSTEM, METHOD AND PROGRAM FOR EARLY DETECTION OF FAN FAILURE BY MONITORING GREASE DEGRADATION - A system for predicting a fan failure has a sensor to detect a gas emitted from grease in the fan. A concentration level of the emitted gas is indicative of grease degradation. The system also has circuitry coupled to the sensor to compare the level of the detected gas to a predetermined level. The system also has an alert apparatus coupled to the circuitry to generate an alert after the circuitry determines that the level of the detected gas exceeds the predetermined level. | 07-12-2012 |
20120208380 | CONTACT RELIABILITY IN SEPARABLE ELECTRICAL INTERFACES - A separable electrical interface is provided, the interface having a circuit card having one or more electrically conductive card edge tabs. Each of the card edge tabs has a raised, curved top surface profile. The separable electrical interface also includes one or more connector contacts. Each of the one or more connector contacts has a curved surface profile. The curved surface of each of the one or more connector contacts is positioned relative to a corresponding card edge tab to selectively engage the raised curved surface of the corresponding card edge tab at the point of final contact. | 08-16-2012 |
20140217574 | COMPOSITES COMPRISED OF ALIGNED CARBON FIBERS IN CHAIN-ALIGNED POLYMER BINDER - A method for enhancing internal layer-layer thermal interface performance and a chip stack of semiconductor chips using the method. The method includes adding a thermosetting polymer to the thermal interface material, dispersing a plurality of nanofibers into the thermal interface material, and un-crosslinking the thermosetting polymer in the thermal interface material. The method further includes extruding the thermal interface material through a die to orient the conductive axis of the nanofibers and polymer chains in the desired direction, and re-crosslinking the thermosetting polymer in the thermal interface material. The chip stack includes a first chip with circuitry on a first side, a second chip coupled to the first chip by a grid of connectors, and a thermal interface material pad between the chips. The thermal interface includes nanofibers and a polymer that allows for optimal alignment of the nanofibers and polymer chains. | 08-07-2014 |
20140268603 | AREA ARRAY DEVICE CONNECTION STRUCTURES WITH COMPLIMENTARY WARP CHARACTERISTICS - A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component. | 09-18-2014 |
Amanda E.e. Mikhail, Rochester, MN US
Patent application number | Description | Published |
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20080220624 | METHOD AND APPARATUS FOR RESTRICTING ROTATIONAL MOMENT ABOUT A LONGITUDINAL AXIS OF SMT CONNECTORS - Ali apparatus for supporting at least one electrical connector body, the apparatus includes a mechanical frame assembly mountable to a printed circuit board (PCB) and separable from the at least one connector body and the PCB. The frame assembly includes at least one base member for attachment to the PCB; and a plurality of rigid body members each spaced apart from one another and extending from the at least one base member or an adjacent rigid body member. The plurality of rigid body members receive a grouping of one or more connector bodies and a pair of adjacent rigid body members are configured to receive and support at least a portion of an entire length of respective opposing side surfaces defining each connector body. When a lateral force is applied to the connector body, the frame assembly acts as a support and transfers the lateral force to the PCB, thereby reducing a rotational moment at a base of each connector body connected to the PCB. | 09-11-2008 |
20080220634 | APPARATUS FOR RESTRICTING ROTATIONAL MOMENT ABOUT A LONGITUDINAL AXIS OF SMT CONNECTORS - An electrical connector includes a first connector body having an interlocking feature extending therefrom. The interlocking feature interlocks the first connector body with a complimentary interlocking feature extending from an adjacent second connector body to distribute a lateral force on either the first or second connector bodies across the adjacent connector body thereby reducing a rotational moment at a base of each electrical connector connected to a printed circuit board (PCB). | 09-11-2008 |
Amanda E. E. Mikhail, Rochester, MN US
Patent application number | Description | Published |
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20100173505 | Topography compensating land grid array interposer - LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography. For those LGAs made of metal springs, cantilevers, armatures and the like, the desired topography is imposed by shaping of the buttons during or after fabrication using a sizing die with the desired topography. | 07-08-2010 |
Amanda Elisa Ennis Mikhail, Rochester, MN US
Patent application number | Description | Published |
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20080259572 | Mounting a Heat Sink in Thermal Contact with an Electronic Component - A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap. | 10-23-2008 |
20080264603 | Mounting a Heat Sink in Thermal Contact with an Electronic Component - A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap. | 10-30-2008 |
20080282539 | Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member - A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB). | 11-20-2008 |
20100184305 | COMPENSATION OF THERMAL EXPANSION IN SMT INTERCONNECTS - The present invention relates to a method of providing end and center locating connectors in interconnects between surface mount technology (SMT) connectors and printed circuit boards (PCBs). The connectors are adapted to maintain their connection even when the printed circuit board and/or the SMT connector expands or contracts. | 07-22-2010 |