Patent application number | Description | Published |
20080259553 | MOTHERBOARD - An exemplary motherboard includes a first slot arranged for mounting a first type of memory, a second slot arranged for mounting a second type of memory, a voltage regulator electronically connected to the first slot and the second slot, and a serial presence detect (SPD) unit connected to the voltage regulator. The first memory and the second memory alternatively mounted on the motherboard, the SPD detects which type of memory is mounted on the motherboard, and the voltage regulator outputs voltages suitable for the type of the memory mounted on the motherboard according to a detection result of the SPD. | 10-23-2008 |
20090046418 | MOTHERBOARD FOR SUPPORTING DIFFERENT TYPES OF MEMORIES - An exemplary motherboard includes a first slot arranged for mounting a first type of memory, a second slot arranged for mounting a second type of memory, and a voltage regulator electronically connected to the first slot and the second slot. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly. | 02-19-2009 |
20090086561 | MOTHERBOARD FOR SUPPORTING DIFFERENT TYPES OF MEMORIES - An exemplary motherboard includes a driving module, a first slot module arranged for mounting a first type of memory and connected to the driving module via a first channel, a second slot module arranged for mounting a second type of memory and connected to the driving module via a second channel, and a voltage regulator electronically connected to the first slot module and the second slot module. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly. | 04-02-2009 |
20090103385 | MOTHERBOARD FOR SUPPORTING DIFFERENT TYPES OF MEMORIES - An exemplary motherboard includes a driving module, at least two first slots arranged for mounting two first type of memories, at least two second slots arranged for mounting two second type of memories, and a voltage regulator. The driving module is electronically connected to the at least two first slots, the at least two second slots, and the voltage regulator in turn via a channel. The first type of memories and the second type of memories are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of memory mounted on the motherboard accordingly. | 04-23-2009 |
20100007429 | PRINTED CIRCUIT BOARD - A printed circuit board includes a plurality of differential pairs arranged thereon side-by-side. Each differential pair includes two transmission lines. Each transmission line includes a plurality of sections of equal length. Every two adjacent sections in each transmission line meet at an angle, and all angles are equal. The length of each section is determined by dividing the distance between two corresponding angles of the two transmission lines of each differential pair by the cosine of half of the angle. | 01-14-2010 |
20100012363 | PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF - A printed circuit board coupling includes a first layout layer, a second layout layer, a pair of connecting portions, a first component and a second component. The first layout layer has a pair of first conducting portions which is disposed thereon to couple with a control chip. The second layout layer has a pair of second conducting portions, third conducting portions, and fourth conducting portions all of which are sequentially disposed thereon. The connecting portions are coupled with the first conducting portions and the third conducting portions. In a first coupling mode, an electronic device is coupled with the second conducting portions, and first and second components are coupled with the third and fourth conducting portions. In a second coupling mode, the electronic device is coupled with the fourth conducting portions, and the first and the second components are coupled with the second and third conducting portions. | 01-21-2010 |
20100289601 | OVERDRIVE TOPOLOGY STRUCTURE FOR TRANSMISSION OF RGB SIGNAL - An overdrive topology structure for transmission of a RGB signal includes a signal sending terminal, a signal receiving terminal, and a transmission line to transmit the RGB signal from the signal sending terminal to the signal receiving terminal. The transmission line is divided into a number of section transmission lines. A node is formed between every two section transmission lines. An impedance of a first section transmission line approaching to the signal sending terminal is less than an impedance of a second section transmission line approaching to the first section transmission line to overdrive the RGB signal at a first node between the first and second section transmission lines. At least one node except the first node is grounded via a resistor. An equivalent resistance of the resistor is equal to a resistance of the first resistor. | 11-18-2010 |
Patent application number | Description | Published |
20100022224 | MOBILE PHONE ALERT SYSTEM AND METHOD - A mobile phone alert system sets one or more alert conditions of a mobile phone, and sets a response message corresponding to each of the alert conditions. The system further monitors communication status of the mobile phone when the mobile phone is communicating with a contact mobile phone, determines if an alert condition occurs by determining if the communication status meets the one or more alert conditions, retrieves and sending a corresponding response message to the contact mobile phone number via a first network, in response to a determination that the alert condition occurs to the mobile phone. Additionally, the system may further search a second available network, sends the response message and a request of sending the response message to the contact mobile phone number to a service center via the second network, in response to the response message has not been sent successfully via the first network. | 01-28-2010 |
20130162122 | ELECTRONIC DEVICE WITH CONNECTOR - An electronic device includes an enclosure body, a mounting apparatus, a securing apparatus, and a connector. The connector defines an engaging hole. The mounting apparatus includes a receiving housing and a first elastic member mounted in the receiving housing. The securing apparatus includes a sliding member mounted to the receiving housing and an engaging member. The engaging member is secured between the receiving housing and the sliding member. The engaging member is engaged in the engaging hole in a first position. The connector is received in the receiving housing and the first elastic member is compressed between the receiving housing and the connector in the first position. The connector moves out of the receiving housing from the first position to a second position when the sliding member slides relative to the receiving housing, to drive the engaging member to disengage from the engaging hole. | 06-27-2013 |
20130164992 | UNIVERSAL SERIAL BUS PLUG - A Universal Serial Bus (USB) plug includes a main body and a mating member. The main body includes a front side and a back side. The mating member extends from the front side of the main body. The mating member is adapted to insert into a USB port of an electronic device. The length of the main body is less than 3.16 millimeters and the total length of the main body and the mating member is less than 12.0 millimeters. | 06-27-2013 |
Patent application number | Description | Published |
20090305541 | CHIP CARD RETAINING MECHANISM AND PRINTED CIRCUIT BOARD MODULE INCORPORATING SAME - A chip card retaining mechanism includes a first holding frame, a second holding frame and a circuitry. The first holding frame includes a latching portion and a connecting board. The latching portion defines a first receiving room for receiving a first chip card. The second holding frame is attached to the connecting board of the first holding frame, and is perpendicular to the latching portion of the first holding frame. The second holding frame defines a second receiving room for receiving a second chip card. The circuitry is formed on the connecting board and the latching portion. The first chip card is electronically connected to the second chip card via the circuitry. | 12-10-2009 |
20090316342 | ACCESSORY HOLDING MECHANISM USED IN PORTABLE ELECTRONIC DEVICES - An accessory holding mechanism used in a portable electronic device for holding an accessory therein includes a housing, a sliding member, a positioning member and an elastic member. The sliding member is slidably assembled on the housing and receiving the accessory therein. The positioning member is movably mounted on the housing. The elastic member is mounted between the housing and the sliding member. The positioning member engages with the sliding member and the accessory to hold the accessory and the elastic member is elongated when the accessory is pushed into the sliding member, and the elastic member rebounds to drive the positioning member to release the accessory and drive the accessory to exit from the accessory holding mechanism through the sliding member after the held accessory is further pushed into the sliding member. | 12-24-2009 |
20100159729 | SIM CARD FIXING ASSEMBLY - A SIM card fixing assembly is used for fixing a SIM card to an electronic device. The electronic device includes a housing. The SIM card fixing assembly includes a receiving portion defined in the housing, a rotary member and a latching member. The rotary member is rotatable relative to the housing. The latching member is slidably fixed to the rotary member. A side surface of the receiving portion defines a retaining groove to receive an end of the SIM card. The rotary member includes a latching portion. The latching member includes a first plate and a second plate extending from an edge of the first plate. The first plate includes a resilient hook extending toward to the second plate. The second plate defines a latching slot to receive the other end of the SIM card. When the latching member is slid relative to the rotary member, the other end of the SIM card is latched into the latching slot, the resilient hook is engaged with the latching portion. | 06-24-2010 |
20130017693 | POWER SUPPLY DEVICE AND POWER SUPPLY SYSTEM FOR SERVER RACKAANM LI; HAN-YUAACI Tu-ChengAACO TWAAGP LI; HAN-YU Tu-Cheng TWAANM ZHANG; NINGAACI Shenzhen CityAACO CNAAGP ZHANG; NING Shenzhen City CNAANM HE; GUANG-DONGAACI Shenzhen CityAACO CNAAGP HE; GUANG-DONG Shenzhen City CN - The power supply device includes a main bus-bar assembly, an assistant bus-bar assembly, and a plurality of connectors being electronically connected to the assistant bus-bar assembly. The main bus-bar assembly includes a first main bus-bar and a second main bus-bar attached to the first main bus-bar. The assistant bus-bar assembly includes a first assistant bus-bar and a second assistant bus-bar attached to the first assistant bus-bar. The first assistant bus-bar is electronically connected to the first main bus-bar, and the second assistant bus-bar is connected to the second main bus-bar. Each of the plurality of connector includes a first pin and a second pin. The first pin is engaged with the first assistant bus-bar, and the second pin is engaged with the second assistant bus-bar. | 01-17-2013 |
20130017699 | POWER SUPPLY DEVICE AND POWER SUPPLY SYSTEMAANM LI; HAN-YUAACI Tu-ChengAACO TWAAGP LI; HAN-YU Tu-Cheng TWAANM ZHANG; NINGAACI Shenzhen CityAACO CNAAGP ZHANG; NING Shenzhen City CNAANM WU; HAI-FENGAACI Shenzhen CityAACO CNAAGP WU; HAI-FENG Shenzhen City CN - A power supply device includes a power supply module, a main bus-bar module, an assistant bus-bar module, and a plurality of connectors. The power supply module, for supplying a direct current voltage, includes a positive terminal and a negative terminal for outputting the current voltage. The main bus-bar module includes a first main bus-bar and a second main bus-bar. The first main bus-bar is electronically connected to the positive terminal. The second main bus-bar is electronically connected to the negative terminal. The assistant bus-bar module includes a first assistant bus-bar electronically connected to the second main bus-bar, and a second assistant bus-bar electronically connected to the first main bus-bar. Each connector includes a first pin and a second pin. The first pin is inserted and electronically connected to the first assistant bus-bar. The second pin is inserted and electronically connected to the second assistant bus-bar. | 01-17-2013 |
20130023199 | FAN ASSEMBLY - A fan assembly includes a bracket, a fan and a cage. The bracket includes a ventilation plate. The fan is received in the bracket and secured to the ventilation plate. The cage is received in the bracket and secured to the fan. The cage defines an opening and includes a plurality of pieces rotatably received in the opening. The plurality of pieces cover the opening. The cage further includes a plurality of limiting pieces extending from an inner surface of the opening. The pressure of moving air from the fan is capable of rotating the plurality of pieces, but any over-rotation of the plurality of pieces is prevented by the plurality of limiting pieces. | 01-24-2013 |
20130039002 | SERVER RACK ASSEMBLY - A server rack assembly includes a server rack, a power supply device, and a bus-bar electronically connected to the power supply device. The server rack includes a bottom plate and a post substantially perpendicular to the bottom plate. The power supply device is attached to the post in a first direction that is substantially parallel to the bottom plate. The bus-bar includes a plurality of connectors adapted to electronically connect a plurality of servers. The bus-bar is attached to the post in a second direction that is substantially perpendicular to the bottom plate, and the plurality of connectors are arranged on the bus-bar in the second direction. | 02-14-2013 |
20130039003 | SERVER RACK ASSEMBLY - A server rack assembly receives a plurality of servers. The server rack assembly includes a server rack, a bus-bar, a power supply and a plurality of fan modules. The server rack includes a stand column. The server rack defines a plurality of server spaces for receiving the plurality of servers. A bus-bar is mounted to the server rack and includes a plurality of connectors aligned in a first direction substantially parallel to the stand column. The bus-bar is adapted to electronically plug to the plurality of servers. The power supply device is electronically connected to the bus-bar. The power supply device is adapted to output direct current to the bus-bar. Each of the plurality of fan modules is adapted to dissipate heat from three of the plurality of server spaces. | 02-14-2013 |
20130039004 | SERVER RACK ASSEMBLY - A server rack assembly receives a number of servers. The server rack assembly includes a server rack, a bus-bar, and a power supply. The server rack includes a stand column. The server rack defines a plurality of server spaces for receiving the plurality of servers. A bus-bar is mounted to the server rack and includes a plurality of connectors aligned in a first direction substantially parallel to the stand column. The bus-bar is adapted to electronically plug to the plurality of servers. The power supply device is pluggable to one of the plurality of connectors of the bus-bar along a second direction substantially perpendicular to the stand column The power supply device is adapted to output direct current to the bus-bar. | 02-14-2013 |
20130039005 | SERVER RACK ASSEMBLY - A server rack assembly receives a plurality of servers. The server rack assembly includes a server rack, a bus-bar, and a power supply. The server rack includes a stand column. The server rack defines a plurality of server spaces for receiving the plurality of servers. A bus-bar is mounted to the server rack and includes a plurality of connectors aligned in a first direction substantially parallel to the stand column. The bus-bar is adapted to electronically plug to the plurality of servers. The power supply device is electronically connected to one of the plurality of connectors of the bus-bar. The power supply device is adapted to output direct current to the bus-bar. The power supply is approximately twice the height of each of the plurality of server spaces. | 02-14-2013 |
20130039006 | SERVER RACK ASSEMBLY - A server rack assembly receives a plurality of servers. The server rack assembly includes a server rack, a bus-bar, and a power supply. The server rack includes a stand column. The server rack defines a plurality of server spaces for receiving the plurality of servers. A bus-bar is mounted to the server rack and includes a plurality of connectors aligned in a first direction substantially parallel to the stand column. The bus-bar is adapted to electronically plug to the plurality of servers. The power supply device is electronically connected to a middle portion of the bus-bar. The power supply device is adapted to output direct current to the bus-bar. | 02-14-2013 |
20130107436 | POWER SUPPLY UNIT AND POWER SUPPLY SYSTEM FOR SERVERS | 05-02-2013 |
20130111098 | POWER SUPPLY UNIT AND POWER SUPPLY SYSTEM FOR SERVERS | 05-02-2013 |
20130134845 | MOUNTING APPARATUS FOR DATA STORAGE DEVICE - A mounting apparatus includes a bracket, a cage, and a hand. The bracket includes two sidewalls and two positioning posts extending from the two sidewalls. Each sidewall defines a first cutout. The cage secures a data storage device and defines two sliding slots and a positioning hole. The handle includes a positioning portion and two mounting portions. Each positioning post is received in each sliding slot. The handle is slidable relative to the cage between a locked position and an unlocked position. When the handle is in the locked position, the positioning portion is engaged in the positioning hole, and each mounting portion is engaged in the first cutout. When the handle is in the unlocked position, the positioning portion is disengaged from the positioning hole, the mounting portion is disengaged from the first cutout, and the two positioning post are movable in the two sliding slots. | 05-30-2013 |
Patent application number | Description | Published |
20100316524 | MAGNESIUM ALLOY AND METHOD FOR MAKING THE SAME - A magnesium alloy includes 8.7 to 11.8 wt % aluminum, 0.63 to 1.93 wt % zinc, 0.1 to 0.5 wt % manganese, 0.5 to 1.5 wt % rare earth elements, and a remainder of said magnesium alloy being composed of magnesium and unavoidable impurities. | 12-16-2010 |
20110126915 | FLUID RECOVERY DEVICE AND RECOVERY METHOD USING THE SAME - A fluid recovery device includes a receiving vessel for receiving a recovered fluid, a pump, a fluid container, and a conduit communicating the receiving vessel, the pump, and the fluid container successively, and the pump is turned on or off at a predetermined time interval. A method for recovering fluid uses the fluid recovery device. | 06-02-2011 |
20110143052 | SPRAYING METHOD FOR FORMING COATING LAYER ON WORKPIECE - A spraying method for forming a coating layer on a surface of a workpiece includes spraying the surface of the workpiece with a liquid coating having a viscosity in a range from about 1 to 8 centipoises, preheating the workpiece at about 60 to 80° C. for about 10 to 90 seconds, heating the workpiece at about 30 to 50° C. for about 1 to 4 minutes, while the surface of the workpiece is inclined at an angle defined between the surface of the workpiece and a horizontal surface of less than 20°, and then drying the workpiece at about 50 to 80° C. for about 5 to 15 minutes. | 06-16-2011 |
20120070331 | MAGNESIUM ALLOY AND METHOD FOR MAKING THE SAME - Magnesium-based alloys having good mechanical properties, such as mechanical strength, ductility, and castability, and methods of making the magnesium alloys are disclosed. The magnesium alloys comprise 8.7 to 11.8 wt % aluminum, 0.63 to 1.93 wt % zinc, 0.1 to 0.5 wt % manganese, 0.5 to 1.5 wt % rare earth elements, and a remainder of said magnesium alloy being composed of magnesium and unavoidable impurities. | 03-22-2012 |
20120269674 | MAGNESIUM ALLOY AND METHOD OF MAKING THE SAME - A magnesium alloy includes about 7.2 to about 7.8 wt % aluminum, about 0.45 wt % to about 0.90 wt % zinc, about 0.17 wt % to about 0.40 wt % manganese, about 0.30 wt % to about 1.5 wt % rare earth elements, about 0.00050 wt % to about 0.0015 wt % beryllium, and the rest being magnesium and unavoidable impurities. A method of making the magnesium alloy is further provided. | 10-25-2012 |
20130101458 | MAGNESIUM ALLOY AND METHOD FOR MAKING THE SAME - A magnesium alloy includes about 7.0 to about 8.0 wt % aluminum, about 0.45 wt % to about 0.90 wt % zinc, about 0.17 wt % to about 0.40 wt % manganese, about 0.50 wt % to about 1.5 wt % rare earth elements, about 0.00050 wt % to about 0.0015 wt % beryllium, and the rest being magnesium and unavoidable impurities. A method for making the magnesium alloy is also provided. | 04-25-2013 |
Patent application number | Description | Published |
20120266609 | CAN HEATING AND COOLING DEVICE - An exemplary can heating and cooling device includes a container made of thermally conductive material, a heat spreader with a heat spreading portion and a heat exchanging portion, and a heat exchanger with a thermoelectric cooling chip and a heat sink. The container includes an outer side wall with a planar thermal contacting section of the container. The heat spreading portion of the heat spreader contacts the outer side wall of the container. The heat exchanging portion of the heat spreader contacts the planar thermal contacting section of the container. The thermoelectric cooling chip includes a first surface thermally connected with the heat exchanging portion of the heat spreader, and a second surface thermally connected with the heat sink. | 10-25-2012 |
20130133862 | HEAT DISSIPATION DEVICE WITH FIXING MEMBER FOR HEAT PIPE THEREOF - An exemplary heat dissipation device includes a heat absorbing base, a heat pipe thermally connected to the heat absorbing base, and a fixing member including a main body abutting to the heat absorbing base and two clamps extending from the main body, the heat pipe is sandwiched between the main body and the heat absorbing base, each of the clamps includes an arm portion and a curved portion extending from the arm portion toward the heat absorbing base, the arm portions of the two clamps clamp two opposite lateral sides of the heat absorbing base, the curved portions of the two clamps elastically clamp edges of the heat absorbing base away from the main body. | 05-30-2013 |
20130153178 | HEAT DISSIPATION DEVICE WITH FAN - A heat dissipation device includes a bracket, a fan with an air inlet and an air outlet, and a heat sink mounted on the bracket. The bracket includes a plurality of rivets and clasps. Each of the clasps includes a mounting portion, an arm extending upwards from the mounting portion, and a hook portion extending from a top end of the arm and towards the mounting portion. The mounting portion is riveted on the bracket by a corresponding rivet. The fan includes a plurality of ears corresponding to the clasps. The hook portions of the clasps abut on top surfaces of the ears to fix the fan on the bracket. The fan defines a plurality of channels communicating the outlet of the fan. | 06-20-2013 |
20130201630 | ELECTRONIC DEVIEC HAVING HEAT DISSIPATION DEVICE - An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate. | 08-08-2013 |
20130299213 | ELECTRONIC DEVICE WITH HEAT DISSIPATION DEVICE ASSEMBLY - A heat dissipation device assembly for dissipating heat from an electronic component located on a printed circuit board (PCB), includes a heat dissipation module and a fixing device for fixing the heat dissipation module to the PCB board. The heat dissipation module includes a heat pipe, and the heat pipe includes an evaporating section for directly contacting the electronic component and a condensing section. The fixing device includes a base, and a plurality of latches extending from a bottom surface of the base. The latches cooperatively define a space matching with the evaporating section of the heat pipe and partially receiving the evaporating section. The base abuts on the evaporating section thereby pressing the evaporating section to firmly and directly contact the electronic component. | 11-14-2013 |
20130342994 | ELECTRONIC DEVICE HAVING FIXING MEMBER - An exemplary electronic device includes an electronic component, a heat dissipation device, a fixing member and a casing contained the electronic component, the heat dissipation device and the fixing member therein. The heat dissipation device thermally contacts the electronic component. The fixing member includes a main body and an engaging portion extending from the main body. The engaging portion fixes the heat dissipation device to the fixing member. Fasteners extend through the casing and engage the main body of the fixing member to secure the fixing member on the casing. | 12-26-2013 |
20140048241 | HEAT SINK ASSEMBLY - An exemplary heat sink assembly includes a base plate for thermally contacting an electronic component and fins protruded from the base plate to dissipate heat transferred from the base plate by nature convection and thermal radiation. A heat conductive film is formed on an outer surface of the heat sink. A thermal radiation wavelength region of a far and middle infrared ray is located in a thermal radiation wavelength region of the heat conductive film. | 02-20-2014 |
Patent application number | Description | Published |
20090242176 | HEAT DISSIPATION DEVICE WITH HEAT PIPE - A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction. | 10-01-2009 |
20090284927 | HEAT SINK AND METHOD OF MANUFACTURING THE SAME - A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture. | 11-19-2009 |
20100078154 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device. | 04-01-2010 |