Cho, Gyunggi-Do
Dong Hyun Cho, Gyunggi-Do KR
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20120006104 | High Temperature Chromatography Apparatus and Method Thereof - Disclosed herein are a high temperature chromatography apparatus and a method thereof. The high temperature chromatography apparatus includes: an eluent pump; a sample dissolving unit that uniformly dissolves an insoluble sample; an injecting unit that mixes and injects the sample and the eluent; a column unit that separates materials; a detector that detects materials; a temperature measuring unit that measures the temperature of the sample dissolving unit, the injecting unit, and the column unit; a heating device that increases or decreases the temperature of the sample dissolving unit, the injecting unit, and the column unit; a temperature controller that maintains the measured temperature and the setting temperature to be the same as each other; and a controller. | 01-12-2012 |
20120205250 | ELECTROLYTIC COPPER PLATING SOLUTION COMPOSITION - Disclosed is an electrolytic copper plating solution composition, which includes a copper salt, an acidic solution, and a PEG-PPG-PEG copolymer, and in which the PEG-PPG-PEG copolymer which is a non-ionic surfactant is added, thus decreasing the surface tension of the electrolytic copper plating solution, thereby enhancing plating wettability. | 08-16-2012 |
Dong Su Cho, Gyunggi-Do KR
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20130107417 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME | 05-02-2013 |
Hang Kyu Cho, Gyunggi-Do KR
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20140125194 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an oxide film formed on one surface of the ceramic body; first and second external electrodes formed on both sides of the oxide film on one surface of the ceramic body; a first internal electrode formed on the dielectric layer and including a first electrode lead-out portion exposed to the first external electrode and a first insulating lead-out portion exposed to the oxide film and having a composite-metal-oxide region formed in an exposed edge portion thereof; a second internal electrode facing the first internal electrode, having the dielectric layer interposed therebetween, and including a second electrode lead-out portion exposed to the second external electrode and a second insulating lead-out portion exposed to the oxide film, having a composite-metal-oxide region formed in an exposed edge portion thereof, and overlapped with the first insulating lead-out portion to form additional capacitance. | 05-08-2014 |
Hong Yeon Cho, Gyunggi-Do KR
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20100149769 | CIRCUIT BOARD DEVICE AND INTEGRATED CIRCUIT DEVICE - A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode. | 06-17-2010 |
Ho Yun Cho, Gyunggi-Do KR
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20130342193 | SENSOR FOR DIGITIZER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a sensor for a digitizer and a method of manufacturing the same. The sensor includes a magnetic layer having insulation; a first coil embedded in the magnetic layer; a second coil formed on one surface of the magnetic layer; and an insulating layer formed on one surface of the magnetic layer to cover the second coil. Thus, since the first coil and the second coil are formed on the magnetic layer formed of a magnetic material, a magnetic field is stably formed between coils and stability of signals transmitted and received between a coil and an input device is increased. | 12-26-2013 |
20130342477 | SENSOR FOR DIGITIZER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a sensor for a digitizer including a first magnetic layer, a first coil formed on one surface of the first magnetic layer, an insulating layer formed on one surface of the first magnetic layer, a second coil formed on one surface the insulating layer, and a second magnetic layer formed on one surface of the insulating layer, and a method for manufacturing the same. | 12-26-2013 |
20140035838 | DIGITIZER - Disclosed herein is a digitizer including: an input unit having a magnetic field shielding part embedded therein; a driving coil supplied with current to induce a magnetic line of force; a sensing coil to which voltage is induced by the magnetic line of force; and a control unit supplying current to the driving coil and measuring voltage induced to the sensing coil, wherein the control unit senses variation of voltage induced to the sensing coil to calculate coordinates of the input unit when the voltage induced to the sensing coil is changed by the magnetic field shielding part. | 02-06-2014 |
20140055404 | DIGITIZER - Disclosed herein is a digitizer including: a driving coil supplied with current to induce a magnetic line of force; a sensing coil disposed so as to intersect the driving coil to flow induced current in one direction by the magnetic line of force; and a control unit sensing variation of voltage induced to the sensing coil to calculate coordinates of the input unit when the voltage is changed due to an approach of an input unit. | 02-27-2014 |
Hwan Cho, Gyunggi-Do KR
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20140185343 | SWITCHING MODE POWER SUPPLY AND CONTROL METHOD THEREOF - There is provided a switching mode power supply having primary and secondary induction coils inductively coupled to each other and converting a voltage applied to the primary induction coil to supply the converted voltage to the secondary induction coil, the switching mode power supply including a power switching unit switching the voltage applied to the primary induction coil, a load information obtaining unit obtaining load information relating to a load connected to the secondary induction coil, a bias current controlling unit controlling a switching driving current based on the load information; and a driving unit driving the power switching unit based on the load information and the switching driving current. | 07-03-2014 |
Jae Choon Cho, Gyunggi-Do KR
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20100270064 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is a resin composition for a printed circuit board, composed of a complex epoxy resin including 41˜80 wt % of a naphthalene-modified epoxy resin having an average epoxy resin equivalent of 100˜200 and 20˜59 wt % of a phosphorus-based epoxy resin having an average epoxy resin equivalent of 400˜800, a bisphenol A curing agent used in an equivalent ratio of 0.3˜1.5 with respect to a total epoxy group equivalent of the complex epoxy resin, a curing accelerator used in an amount of 0.1˜1 part by weight based on 100 parts by weight of the complex epoxy resin and an inorganic filler used in an amount of 10˜40 parts by weight based on 100 parts by weight of the complex epoxy resin. A printed circuit board using the resin composition is also provided. | 10-28-2010 |
20100270065 | Resin Composition For Printed Circuit Board and Printed Circuit Board Using The Same - Disclosed is a resin composition for a printed circuit board, which includes a complex epoxy resin including a bisphenol A epoxy resin obtained by dispersing silicone elastomer particles having a core-shell structure in a diglycidyl ether of bisphenol A epoxy resin, a cresol novolac epoxy resin, and a phosphorus-based epoxy resin; a bisphenol A curing agent; a curing accelerator; and an inorganic filler. A printed circuit board using the resin composition is also provided. | 10-28-2010 |
20110028584 | CURABLE CYCLIC PHOSPHAZENE COMPOUND AND METHOD OF PREPARING THE SAME - Disclosed herein is a curable cyclic phosphazene compound having a low dielectric constant, a low dielectric loss index and high thermal stability, and a method of preparing the same. The curable cyclic phosphozene polymer prepared using the compound has a low dielectric constant and excellent thermal properties, compared to conventional phosphozene polymers. | 02-03-2011 |
20130329336 | CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT FABRICATED USING THE SAME - There are provided a conductive paste composition for an external electrode and a multilayer ceramic electronic component fabricated using the same, the conductive paste composition for an external electrode including: a conductive metal powder; and a resin mixture including at least one resin selected from a group consisting of an epoxy-based resin and a phenoxy-based resin, and a polyvinyl formal resin. | 12-12-2013 |
James Bumsik Cho, Gyunggi-Do KR
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20090167329 | METHODS AND APPARATUS FOR OPEN LAMP DETECTION IN ELECTRONIC CIRCUITS - Methods and apparatus for open lamp detection in electronic circuits are disclosed. An example apparatus to perform open circuit detection associated with an electrical component included in a device disclosed herein comprises a sampling circuit to attempt to pull a sampling current through the electrical component during initialization of the device, a comparator to compare a result produced by the sampling circuit to a reference value, and a timing circuit to cause the sampling circuit to attempt to pull the sampling current through the electrical component and to cause an output of the comparator to be stored after the comparator has compared the result produced by the sampling circuit to the reference value. | 07-02-2009 |
Je Hyung Cho, Gyunggi-Do KR
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20130162048 | POWER MODULE AND MULTI POWER SUPPLY APPARATUS HAVING THE SAME - There are provided a power module and a multi power supply apparatus having the same. The multi power supply apparatus includes a plurality of power modules connected in parallel with each other and supplying a preset power, each power module including: a DC/DC converting unit converting an input power into a preset DC power; an output controlling unit switched on or switched off according to a difference between a voltage level of the DC power of the DC/DC converting unit and a voltage level applied to a load end to control an output of the DC power; and a controlling unit starting a soft start operation of the DC/DC converting unit during a hot swap in which the power module is replaced and stopping the soft start operation of the DC/DC converting unit when the output controlling unit is switched on. | 06-27-2013 |
Ji Sung Cho, Gyunggi-Do KR
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20120044613 | Electrolyte for lithium ion capacitor and lithium ion capacitor including the same - There are provided an electrolyte for a lithium ion capacitor, and a lithium ion capacitor including the same. The electrolyte includes a lithium salt having divalent anions. The lithium ion capacitor including the electrolyte may have high capacitance and stability, even at high temperatures. | 02-23-2012 |
Kwang Seung Cho, Gyunggi-Do KR
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20090021179 | BACKLIGHT DRIVING SYSTEM FOR LIQUID CRYSTAL DISPLAY - There is provided a backlight driving system for a liquid crystal display that can reduce size and weight of a product because a DC-DC converter is not used when commercial AC power is converted into lamp driving power. A backlight driving system for a liquid crystal display according to an aspect of the invention includes a power supply unit converting commercial alternating current (AC) power into direct current (DC) power having a voltage level set beforehand, an inverter unit converting the DC power from the power supply unit into AC power at a one-to-one conversion ratio set beforehand, a boosting unit boosting the AC power from the inverter unit into lamp lighting power set beforehand; and a lamp group receiving the lamp lighting power from the boosting unit to emit light. | 01-22-2009 |
Kyu Beom Cho, Gyunggi-Do KR
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20130093947 | CAMERA MODULE - Disclosed herein is a camera module. The camera module according to preferred embodiments of the present invention includes: a lens barrel; a housing; an IR filter; an image sensor; a circuit substrate; a shield can; a heat transfer member mounted in the image sensor to transfer heat generated from the image sensor; and a protective cover mounted between the housing and the shield can while surrounding the bottom of the heat transfer member and connecting the housing and the shield can. | 04-18-2013 |
Min Jung Cho, Gyunggi-Do KR
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20100314755 | PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD OF MANUFACTURING THE SAME - Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided. | 12-16-2010 |
20110061231 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer. | 03-17-2011 |
20120298412 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The method of manufacturing a printed circuit board includes: preparing a base substrate having first circuit layers formed on one surface or both surfaces thereof; forming a plating resist having openings for a first via layer on the base substrate; forming first via layers in the openings for a first via layer; forming insulating layers having outer metal layers on the base substrate having the first via layers formed thereon; forming openings for a second via layer over the first via layer on the insulating layers and the outer metal layers; and completing multi-layer vias by forming second via layers in the openings. | 11-29-2012 |
20140090245 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer. | 04-03-2014 |
Myong Soo Cho, Gyunggi-Do KR
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20120299042 | SEMICONDUCTOR LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE USING THE SAME - There is provided a semiconductor light emitting device, a method of manufacturing the same, and a semiconductor light emitting device package using the same. A semiconductor light emitting device having a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a second electrode layer, and insulating layer, a first electrode layer, and a conductive substrate sequentially laminated, wherein the second electrode layer has an exposed area at the interface between the second electrode layer and the second conductivity type semiconductor layer, and the first electrode layer comprises at least one contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer. | 11-29-2012 |
Sang Ik Cho, Gyunggi-Do KR
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20140017508 | INSULATING BASE PLATED WITH METAL LAYER, PLATING METHOD THEREOF, AND TRANSPARENT ELECTRODE INCLUDING INSULATING BASE - Disclosed herein are an insulating base plated with a metal layer, a plating method thereof, and a transparent electrode including the insulating base. During the manufacture of a polymer layer, a structure of an interface layer between a surface of the polymer layer and a metal layer is modified, adhesion with metal is excellent and the polishability of the interface layer is reduced, and thus, the reflectivity of the metal layer is reduced and particular color impression of metal is reduced to obtain black-oxide treated properties. When the metal layer formed on the insulating base is used in a mesh-type transparent electrode having a fine pattern, sufficient adhesion with metal for forming a pattern is obtained and the reflectivity of an adhesion layer of the metal layer is reduced, thereby increasing the visibility. Accordingly, the insulating base may be suitable for products such as transparent electrodes or touch panels. | 01-16-2014 |
Seong Min Cho, Gyunggi-Do KR
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20110138621 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities. | 06-16-2011 |
20110180205 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing to the carrier and maintaining the compatibility between the substrate and manufacturing facilities. | 07-28-2011 |
20110315745 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities. | 12-29-2011 |
Soon Jin Cho, Gyunggi-Do KR
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20090025581 | Mask for screen printing and screen printing method using the same - This invention relates to a mask for screen printing, which includes a mask body composed of a plurality of pattern areas having holes for screen printing and a peripheral area surrounding the outside of the pattern areas; and a protrusion portion formed in the peripheral area of a back surface of the mask body, and to a screen printing method using the same. | 01-29-2009 |
20090297801 | Heat radiation substrate having metal core and method of manufacturing the same - Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed. | 12-03-2009 |
20100096177 | Coreless substrate having filled via pad and method of manufacturing the same - Disclosed herein is a coreless substrate having filled via pads and a method of manufacturing the same. Insulating layers are formed on both sides of a build-up layer, and via-pads are embedded in the insulating layers such that the via-pads are flush with the insulating layers. The via pads are not separated from a substrate, and thus reliability of the pads is increased. Flatness of bumps is increased, and thus bonding of flip chips becomes easy. | 04-22-2010 |
20110115121 | Method of manufacturing heat radiation substrate having metal core - A method of manufacturing a heat radiation substrate having a metal core, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed. | 05-19-2011 |
Suk Hyeon Cho, Gyunggi-Do KR
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20110005824 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced. | 01-13-2011 |
20110048786 | PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board. | 03-03-2011 |
20110163064 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided. | 07-07-2011 |
20120111728 | METHOD OF MANUFACTURING CIRCUIT BOARD - Disclosed herein is a method of manufacturing a circuit board. The method of manufacturing a circuit board according to a preferred embodiment of the present invention is configured to include (A) forming a cavity | 05-10-2012 |
20120210576 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced. | 08-23-2012 |
Sung Min Cho, Gyunggi-Do KR
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20120266673 | INERTIAL SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an inertial sensor. The inertial sensor includes a sensor unit including a flexible substrate part on which a driving electrode and a sensing electrode are formed, a mass displaceably mounted on the flexible substrate part, and a support body coupled with the flexible substrate part in order to support the mass in a floated state and made of silicon; and a lower cap covering a bottom portion of the mass and made of silicon, wherein the lower cap and the sensor unit are coupled by a silicon direct bonding method, whereby the inertial sensor and the method of manufacturing the same may be obtained to improve the convenience in manufacturing and the reliability of the sensor by bonding the sensor unit and the lower cap by the silicon direct bonding method. | 10-25-2012 |
20140092524 | CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a capacitor, including: a substrate part including a first substrate having a groove portion and a second substrate positioned above the first substrate and having a protrusion portion; a first capacitance part formed on one surface of the first substrate and having a shape corresponding to that of the groove portion; and a second capacitance part formed on one surface of the second substrate and having a shape corresponding to that of the protrusion portion. | 04-03-2014 |
Sung Nam Cho, Gyunggi-Do KR
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20130112471 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board and a method of manufacturing the same. The printed circuit board includes preparing a base substrate; forming a pattern layer for forming via holes on the base substrate by printing ink for forming via holes; forming an insulating layer on the base substrate including the pattern layer for forming via holes; and removing the pattern layer for forming via holes. | 05-09-2013 |
20130118787 | EPOXY RESIN COMPOSITION FOR FORMING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD MANUFACTURED THEREFROM, AND METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD - Disclosed herein is an epoxy resin composition including a core-shell structure of microemulsion silica surrounded by surfactant. By using the epoxy resin, surface roughness of a printed circuit board can be formed in an ecofriendly and economic manner. Further, high-reliability microcircuits can be realized by enhancing interface adhesive strength between a resin substrate and a metal layer in a buildup type printed circuit board. | 05-16-2013 |
20130133926 | BUILD-UP PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a build-up printed circuit board (PCB), the method including: providing a first resin substrate; forming a roughness by coating an epoxy emulsion solution on a surface of the first resin substrate; and providing a core layer by forming a core circuit layer on the first resin substrate on which the roughness is formed. According to the present invention, roughness of a substrate can be formed in an environment-friendly and economical way by introducing a process of coating epoxy emulsion on a resin substrate. Further, a highly reliable fine circuit can be implemented by enhancing an adhesive bond between a build-up board material and a metal circuit layer. | 05-30-2013 |
20130209760 | ALKYL SULFONATED TETRAZOLE COMPOUND, PREPARING METHOD THEREOF, AND EPOXY RESIN CONTAINING THE SAME, AND SUBSTRATE PRODUCED THEREFROM - The present invention provides an alkyl sulfonated tetrazole compound, a method of preparing the same, an epoxy resin containing the same and a substrate produced therefrom. The epoxy resin is usefully used as a raw material of printed circuit boards, and has high adhesion to metal. | 08-15-2013 |
Won Jin Cho, Gyunggi-Do KR
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20130051082 | SWITCHING POWER SUPPLY - Disclosed herein is a switching power supply including: N sub switching power supplying unit each converting a direct current (DC) power supplied from a power source into an alternate current (AC) power, boosting or bucking the AC power using a resonant circuit and a contactless transformer, converting the boosted or bucked AC power into a DC power, and outputting the converted DC power; and a balance circuit connecting between the resonant circuits of the N sub switching power supplying units to thereby allow currents to be balanced between the resonant circuits. | 02-28-2013 |
20140117937 | POWER SUPPLY APPARATUS AND POWER SUPPLY APPARATUS FOR ELECTRIC VEHICLE - There are provided an all-in-one power supply apparatus capable of concurrently supplying battery charging power and main power, in particular, main power for driving an electric vehicle, and a power supply apparatus for an electric vehicle. The power supply apparatus and the power supply apparatus for an electric vehicle respectively including: a charging unit; a main power supplying unit; and an auxiliary power supplying unit. | 05-01-2014 |
Won Woo Cho, Gyunggi-Do KR
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20140191907 | PRINTED CIRCUIT BOARD INCLUDING ELECTROMAGNETIC BANDGAP STRUCTURE - Embodiments of the present invention provide a printed circuit board, which includes an electromagnetic bandgap structure disposed around an antenna, so as to prevent noise from being transmitted to the antenna. The printed circuit board includes an antenna, a circuit chip, a plurality of metal layers and a plurality of dielectric layers, a pair of transmission lines for transmitting a signal to the antenna, and an electromagnetic bandgap structure disposed between the antenna and the circuit chip and for preventing an electromagnetic wave from being transmitted from the circuit chip to the antenna. | 07-10-2014 |
Yong Hun Cho, Gyunggi-Do KR
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20110318668 | MEMBRANE-ELECTRODE ASSEMBLY FOR FUEL CELL, FUEL CELL AND MANUFACTURING THE METHOD THEREOF - Disclosed herein are a membrane-electrode assembly for a fuel cell, a fuel cell, and a manufacturing method thereof. The present invention forms a micro current collecting layer between a gas diffusion layer and a micro porous layer and surface-contacts a pair of laminates for an electrode so that each electrolyte layer formed by applying an electrolyte solution thereon contacts with each other, thereby shortening a moving distance of electrons to minimize the current collecting resistance and loss and reduce the interface resistance. | 12-29-2011 |
Yong Wan Cho, Gyunggi-Do KR
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20130134806 | SWITCHED RELUCTANCE MOTOR - Disclosed herein is a switched reluctance motor including: a shaft forming the rotation center of the motor; a rotor part rotatably coupled onto the shaft; a first stopper coupled to an upper portion of the rotor part in the axial direction to support the rotor part; and a second stopper coupled to a lower portion of the rotor part in the axial direction to support the rotor part, wherein the first stopper or the second stopper has a separate internal space formed at an inner side thereof. A weight member is coupled to the internal space, thereby making it possible to secure stable and reliable rotation balancing even at the time of high speed rotation of the motor. | 05-30-2013 |
20140042846 | MOTOR HOUSING - Disclosed herein is a motor housing including: a housing body accommodating a stator and a rotor therein; and a supporting frame coupled to the housing body and supporting a shaft of the rotor, wherein an end portion of the housing body is provided with a fixing part that is extended inwardly, such that the supporting frame is coupled to the fixing part. | 02-13-2014 |