Cortese, IT
Carlo Cortese, Prato IT
Patent application number | Description | Published |
---|---|---|
20090022596 | Steam Turbine Rotating Blade - A rotating blade for a steam turbine includes a root section and an airfoil section contiguous with the root section. The airfoil section is shaped to optimize aerodynamic performance while providing optimized flow distribution and minimal centrifugal and bending stresses. The blade also includes a tip section continuous with the airfoil section, and a cover formed as part of the tip section. The cover defines a radial seal that serves to minimize tip losses. The rotating blade is capable of running at operating speeds between 5626 and 11250 rotations per minute. | 01-22-2009 |
Mario Cortese, Milan IT
Patent application number | Description | Published |
---|---|---|
20130028450 | LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY - A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon, respectively, wherein a through cavity extends through the first board and the first and second metal layers; a second board with opposite third and fourth surfaces; an adhesive layer sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess; and a first conductor layer coating the bottom and the side surfaces of the recess. | 01-31-2013 |
Mario Cortese, Milano IT
Patent application number | Description | Published |
---|---|---|
20100052144 | SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES - A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described. | 03-04-2010 |
20110081739 | ELECTRONIC DEVICE INCLUDING MEMS DEVICES AND HOLED SUBSTRATES, IN PARTICULAR OF THE LGA OR BGA TYPE - An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free. | 04-07-2011 |
20120032285 | Electronic Device Including MEMS Devices And Holed Substrates, In Particular Of The LGA Or BGA Type - An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free. | 02-09-2012 |
Mario Francesco Cortese, San Donato Milanese IT
Patent application number | Description | Published |
---|---|---|
20090194397 | PLANAR MICROELECTROMECHANICAL DEVICE HAVING A STOPPER STRUCTURE FOR OUT-OF-PLANE MOVEMENTS - A microelectromechanical device has a mobile mass that undergoes a movement, in particular a spurious movement, in a first direction in response to an external event; the device moreover has a stopper structure configured so as to stop said spurious movement. In particular, a stopper element is fixedly coupled to the mobile mass and is configured so as to abut against a stopper mass in response to the spurious movement, thereby stopping it. In detail, the stopper element is arranged on the opposite side of the stopper mass with respect to a direction of the spurious movement, protrudes from the space occupied by the mobile mass and extends in the space occupied by the stopper mass, in the first direction. | 08-06-2009 |
Mario Francesco Cortese, Milano IT
Patent application number | Description | Published |
---|---|---|
20100284553 | ASSEMBLY OF A CAPACITIVE ACOUSTIC TRANSDUCER OF THE MICROELECTROMECHANICAL TYPE AND PACKAGE THEREOF - A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers. | 11-11-2010 |
20130221457 | ASSEMBLY OF A CAPACITIVE ACOUSTIC TRANSDUCER OF THE MICROELECTROMECHANICAL TYPE AND PACKAGE THEREOF - A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers. | 08-29-2013 |
20130264662 | ELECTRONIC DEVICE, SYSTEM, AND METHOD COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES - Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate. | 10-10-2013 |
20140299949 | ASSEMBLY OF A CAPACITIVE ACOUSTIC TRANSDUCER OF THE MICROELECTROMECHANICAL TYPE AND PACKAGE THEREOF - A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers. | 10-09-2014 |
Mario Francesco Cortese, Sa Donato Milanese IT
Patent application number | Description | Published |
---|---|---|
20090278215 | ELECTRONIC DEVICE, SYSTEM, AND METHOD COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES - Electronic device which comprises a substrate provided with at least one passing opening, a MEMS device with function of differential sensor provided with a first and a second surface and of the type comprising at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof, the first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate so as to leave the first and second opposed active surfaces exposed respectively through the passing opening of the substrate and the further opening of the second surface. | 11-12-2009 |
20120164775 | ELECTRONIC DEVICE, SYSTEM, AND METHOD COMPRISING DIFFERENTIAL SENSOR MEMS DEVICES AND DRILLED SUBSTRATES - Electronic device which comprises a substrate provided with at least one passing opening, a MEMS device with function of differential sensor provided with a first and a second surface and of the type comprising at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof, the first surface of the MEMS device leaving the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate so as to leave the first and second opposed active surfaces exposed respectively through the passing opening of the substrate and the further opening of the second surface. | 06-28-2012 |
Mario Francesco Cortese, Milan IT
Patent application number | Description | Published |
---|---|---|
20120153771 | MICROELECTROMECHANICAL TRANSDUCER AND CORRESPONDING ASSEMBLY PROCESS - A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements. | 06-21-2012 |
20130170166 | SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD, IN PARTICULAR FOR MEMS DEVICES - A semiconductor package substrate suitable for supporting a damage-sensitive device, including a substrate core having a first and opposite surface; at least one pair of metal layers covering the first and opposite surfaces of the package substrate core, which define first and opposite metal layer groups, at least one of said layer groups including at least one metal support zone; one pair of solder mask layers covering the outermost metal layers of the at least one pair of metal layers; and a plurality of routing lines; wherein the at least one metal support zone is formed so that it lies beneath at least one side of the base of the damage-sensitive device and so as to occupy a substantial portion of the area beneath the damage-sensitive device which is free of said routing lines; a method for the production of such substrate is also described. | 07-04-2013 |
Mirko Cortese, Siena IT
Patent application number | Description | Published |
---|---|---|
20140348863 | CMV ANTIGENS AND USES THEREOF - The present invention relates to immunogenic compositions comprising CMV antigens and methods for preparing compositions that contain CMV antigens. The invention also relates to methods for inducing an immune response to CMV. | 11-27-2014 |
Riccardo Cortese, Roma IT
Patent application number | Description | Published |
---|---|---|
20110129498 | VACCINE FOR THE PREVENTION AND THERAPY OF HCV INFECTIONS - The present invention relates to CD81-binding peptides of the hepatitis virus C(HCV) E2 glycoprotein, which are devoid of or mutated within the amino-terminal 27 amino acids of the mature E2 envelope glycoprotein, or variant thereof which retains the ability to bind to CD81. Furthermore, the present invention provides polypeptides comprising said CD81-binding peptide, polynucleotides encoding the CD81-binding peptide, and expression cassettes and vectors comprising the polynucleotide of the invention. Moreover, the present invention relates to compositions comprising the CD81-binding peptide, the polynucleotide encoding the CD81-binding peptide, the expression cassette, or the vector, and an adjuvant. Furthermore, the present invention provides a pharmaceutical composition comprising the CD81-binding peptide, the polynucleotide, the expression cassette, the vector, or the composition of the invention, and a pharmaceutically acceptable excipient, carrier, or diluent. Moreover, the present invention provides the CD81-binding peptide, the polynucleotide, the expression cassette, the vector, the composition, or the pharmaceutical composition of the invention for induction of an immune response, preferably a broad specificity immune response, against HCV in a mammal, and methods for inducing a therapeutic and/or prophylactic immune response against HCV in a mammal, preferably against HCV of various genotypes. | 06-02-2011 |
Riccardo Cortese, Rome IT
Patent application number | Description | Published |
---|---|---|
20080286275 | Antigen Binding Proteins Directed Against Scavenger Receptor B1 that Inhibit Hcv Replication - The present invention features antigen binding protein that bind to a SR-BI target region identified herein as a region involved in HCV E2 binding. Identified target regions are regions bound by a single-chain antibody of SEQ ID NOs: 1, 2, 3 or 4. | 11-20-2008 |
20090233992 | HEPATITIS C VIRUS VACCINE - The present invention features Ad6 vectors and a nucleic acid encoding a Met-NS3-NS4A-NS4B-NS5A-NS5B polypeptide containing an inactive NS5B RNA-dependent RNA polymerase region. The nucleic acid is particularly useful as a component of an adenovector or DNA plasmid vaccine providing a broad range of antigens for generating an HCV specific cell mediated immune (CMI) response against HCV. | 09-17-2009 |
20120027788 | SIMIAN ADENOVIRUS NUCLEIC ACID- AND AMINO ACID-SEQUENCES, VECTORS CONTAINING SAME, AND USES THEREOF - The present invention relates to novel adenovirus strains with an improved sero-prevalence. In one aspect, the present invention relates to isolated polypeptides of adenoviral capsid proteins such as hexon, penton and fiber protein and fragments thereof and polynucleotides encoding the same. Also provided is a vector comprising the isolated polynucleotide according to the invention and adenoviruses comprising the isolated polynucleotides or polypeptides according to the invention and a pharmaceutical composition comprising said vector, adenovirus, polypeptide and/or polynucleotide. The invention also relates to the use of the isolated polynucleotides, the isolated polypeptides, the vector, the adenoviruses and/or the pharmaceutical composition for the therapy or prophylaxis of a disease. | 02-02-2012 |
20130101618 | CHIMPANZEE ADENOVIRAL VECTOR-BASED FILOVIRUS VACCINES - This invention provides vaccines for inducing an immune response and protection against filovirus infection for use as a preventative vaccine in humans. In particular, the invention provides chimpanzee adenoviral vectors expressing filovirus proteins from different strains of Ebolavirus (EBOV) or Marburg virus (MARV). | 04-25-2013 |
20130150563 | LIPID-CONJUGATED ANTIBODIES - The present invention relates to novel lipid-conjugated antibodies for use in the treatment or the prevention of diseases, including but not limited to cancer, metabolic diseases including but not limited to hyperglycemia and diabetes, obesity, hypertension, hypercholesterolemia, allergy, asthma, Alzheimer's disease, and infectious diseases including but not limited to diseases caused by viruses, bacteria and fungi. | 06-13-2013 |
Umberto Cortese, Casandrino IT
Patent application number | Description | Published |
---|---|---|
20100116846 | DEVICE FOR THE PRODUCTION OF SOFT ICE CREAM OR SIMILAR PRODUCTS, WITH PORTIONING DEVICE AND PORTIONS COUNTING DEVICE - The invention concerns a device ( | 05-13-2010 |