Patent application number | Description | Published |
20080236868 | ELECTRONIC APPARATUS WITH FLEXIBLE FLAT CABLE FOR HIGH-SPEED SIGNAL TRANSMISSION - According to one embodiment, a flexible flat cable includes a plurality of ground lines and a plurality of signal lines. Each of the ground lines is connected to an electromagnetic shield layer by two connection line members. An arrangement of the ground lines and signal lines that are positioned in a region on one side of a center line of the flexible flat cable and an arrangement of the ground lines and signal lines on a region on the other side are symmetric with respect to the center line. In each of two connectors to which end portions of the flexible flat cable are coupled, terminals corresponding to the ground lines are grounded, a terminal corresponding to a signal line interposed between two ground lines is assigned a high-speed signal, and a terminal corresponding to another signal line is assigned a ground potential. | 10-02-2008 |
20080271914 | PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS - According to one embodiment, a printed wiring board includes, a main body including an obverse side with an obverse wiring layer, and a reverse side with a reverse wiring layer first pads provided on the obverse side in a first region defined thereon, and to be connected to terminals arranged on a surface of a first semiconductor chip, second pads provided on the reverse side in a second region defined thereon and overlapping with the first region, and to be connected to terminals arranged on a surface of a second semiconductor chip, and interlayer wiring electrically connecting those of the first pads, which are located in an overlapping region, to those of the second pads which are located in the overlapping region. | 11-06-2008 |
20090032921 | PRINTED WIRING BOARD STRUCTURE AND ELECTRONIC APPARATUS - According to one embodiment, a printed wiring board structure includes first and second semiconductor packages each including a substrate, and a printed wiring board including first and second component mounting surfaces having a relationship given as front and back surfaces and an inter-chip connection part provided at one portion thereof, the inter-chip connection part being provided with a plurality of arrayed through conductors penetrating through the first and second component mounting surfaces, wherein the substrates of the first and second semiconductor packages are arranged on the printed wiring board in a positional relationship such that the substrates mounted on the component mounting surfaces are partially overlapped via the printed wiring board, the external connection electrodes provided on the substrates are arrayed on the overlapped portion and are conductively connected to the through conductors arrayed in the inter-chip connection part. | 02-05-2009 |
20090032922 | Semiconductor Package, Printed Wiring Board Structure and Electronic Apparatus - According to one embodiment, a semiconductor package comprises a substrate having one surface mounted with a semiconductor chip, and the other surface mounted with a plurality of arrayed external connection electrodes, a differential line pair provided on the surface of the substrate mounted with the semiconductor chip, and making a connection between the semiconductor chip and a predetermined pair of electrodes included in the external connection electrodes, and a coupling capacitor pair inserted between the differential lines. | 02-05-2009 |
20090160474 | PRINTED CIRCUIT BOARD AND IMPEDANCE GUARANTEE METHOD OF PRINTED CIRCUIT BOARD - According to one embodiment, a printed circuit board includes a coupon portion having, for each of a plurality of signal layers, an impedance guarantee coupon as a reference for the layer, and a product portion having, in at least one of the plurality of signal layers, a transmission line requiring impedance guarantee having an impedance decision factor different from the coupon formed in the coupon portion, wherein an impedance of the transmission line is guaranteed on the basis of a known impedance decision factor of the transmission line and a measured value of the coupon. | 06-25-2009 |
20100126754 | ELECTRONIC APPARATUS WITH FLEXIBLE FLAT CABLE FOR HIGH-SPEED SIGNAL TRANSMISSION - According to one embodiment, a flexible flat cable includes a plurality of ground lines and a plurality of signal lines. Each of the ground lines is connected to an electromagnetic shield layer by two connection line members. An arrangement of the ground lines and signal lines that are positioned in a region on one side of a center line of the flexible flat cable and an arrangement of the ground lines and signal lines on a region on the other side are symmetric with respect to the center line. In each of two connectors to which end portions of the flexible flat cable are coupled, terminals corresponding to the ground lines are grounded, a terminal corresponding to a signal line interposed between two ground lines is assigned a high-speed signal, and a terminal corresponding to another signal line is assigned a ground potential. | 05-27-2010 |
20110080710 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a cooling unit includes a radiator unit on the circuit board, and a cooling fan connected to the radiator unit and supported outside the circuit board in a floating state, a keyboard on a top wall of the housing, opposed to the circuit board and the cooling fan, a first supporting member disposed between the cooling fan and the keyboard and configured to support the keyboard when a key is depressed, and a second supporting member disposed between the cooling fan and a bottom wall of the housing and configured to support the cooling fan when a key is depressed. At least one of the first and second supporting members is formed of an elastic material. | 04-07-2011 |
20110292579 | KEYBOARD MODULE AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a casing, a keyboard unit and a spacer. The casing includes a first face exposed to an outside region, a second face opposed to the first face and a plurality of hole sections penetrating from the first face to the second face. The keyboard unit includes a keyboard base arranged inside the casing and a plurality of key caps. The key caps are movably supported by the keyboard base at positions corresponding to the hole sections, and are exposed to the outside region of the casing. The spacer is located between the casing and the keyboard base and includes an insertion section in which the key caps are inserted. At least part of the key caps are located inside the hole sections. | 12-01-2011 |