Leong, MY
Ak Wing Leong, Penang MY
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20090295718 | MULTIPLE INPUT OPTICAL NAVIGATION SYSTEM - An optical navigation system with optical imaging of multiple inputs using a single navigation sensor. The optical navigation system includes a tactile interface device, an image sensor, and a processor. The tactile interface device facilitates a navigation input. The image sensor intermittently generates images of a surface of the tactile interface device and images of a contact navigation surface. The image sensor also generates the images of the surface of the tactile interface device exclusive of the images of the contact navigation surface. The processor is coupled to the image sensor. The processor generates a first navigation signal based on the images of the tactile interface device and generates a second navigation signal based on the images of the contact navigation surface. | 12-03-2009 |
Chi Hoe Leong, Sungai Ara MY
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20090079143 | ROTARY TOOL WITH MULTIPLE TOOL ATTACHMENT INTERFACES - A rotary tool has an output shaft having an axis of rotation and a distal neck portion which has at least three neck faces that do not intersect the axis of rotation, and a substantially U-shaped spring element having a base portion and two leg portions, wherein the spring element straddles the distal neck portion. | 03-26-2009 |
20100149790 | HAND-HELD POWER TOOL - A hand-held power tool comprising an output shaft rotatable around a tool axis of rotation, a tool housing portion radially disposed relative to the output shaft, an illuminating element for illuminating a work area of the tool, a lens positioned adjacent the illuminating element, and a cover that secures the lens and the illuminating element to the tool housing portion. At least a portion of the cover is closer to the axis of rotation than the lens is to the axis of rotation. | 06-17-2010 |
20110048750 | ROTARY POWER TOOL - A rotary power tool having a tool housing, an internal housing within the tool housing, and a switch assembly that is substantially within the tool housing. According to the invention, the switch assembly is supported by the internal housing and is movable between at least two positions for selecting between at least two tool operational modes. The internal housing is embodied by at least one blocking element that extends towards the tool housing and limits the overall range of motion of the switch assembly. | 03-03-2011 |
20130199814 | handheld machine tool having a mechanical striking mechanism - In the case of a handheld machine tool having a mechanical striking mechanism, which includes a striking body provided with at least one actuating cam and an output shaft provided with at least one output cam, the actuating cam being configured for percussively driving the output cam during percussive operation of the mechanical striking mechanism, a damping element, which has an abutment element acted upon by a spring element, is provided at least on one actuating cam and/or on one output cam. | 08-08-2013 |
Chi Hoe Leong, Penang MY
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20140020921 | MECHANICAL IMPACT MECHANISM FOR A HANDHELD POWER TOOL - In a handheld power tool having a mechanical impact mechanism which has an impact member provided with at least one drive cam and an output shaft which is provided with at least one output cam and which is connected to a tool receptacle for accommodating a tool, the drive cam being designed for the percussive drive of the output cam during the impact operation of the mechanical impact mechanism, the impact member having the drive cams is mounted upstream from the output cams in an axial direction of the output shaft pointing away from the tool receptacle. | 01-23-2014 |
Chi Hoe Leong, Bayan Lepas MY
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20100224382 | NOISE ELIMINATION BRAKE FOR AUTOMATIC SPINDLE LOCKING MECHANISM - A rotary power tool of the invention has a motor, a motor shaft driven by the motor, an output shaft coupled to the motor shaft via an automatic spindle locking mechanism, a housing portion surrounding the output shaft, and a braking member that is non-rotatable relative to the housing portion. The braking member exercises a braking torque on the output shaft whenever it rotates. | 09-09-2010 |
20100326686 | ROTARY POWER TOOL OPERABLE IN EITHER AN IMPACT MODE OR A DRILL MODE - A rotary power tool operable in either an impact mode or a drill mode comprising a driveshaft ( | 12-30-2010 |
20110036605 | ROTARY POWER TOOL OPERABLE IN FIRST SPEED MODE AND A SECOND SPEED MODE - A rotary power tool operable in a first speed mode and a second speed mode comprising a motor shaft ( | 02-17-2011 |
20140027140 | HANDHELD MACHINE TOOL COMPRISING A MECHANICAL STRIKING MECHANISM - A handheld machine tool including a mechanical striking mechanism, which has a striking member equipped with at least one drive cam and an output shaft equipped with at least one output cam, which is connected to a tool holder for holding a tool, the drive cam being designed to drive the output cam in a striking manner during the striking operation of the mechanical striking mechanism, the output shaft being drivable by a barrel shaped drive member, which at least partially encloses the output shaft and the striking body and is connected via a threaded connection to a drive member that is drivable by an associated gearbox. | 01-30-2014 |
Chin Khew Leong, Penang MY
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20130135862 | Tubular Light Source with Light Emitting Diodes on End Portions and Light Reflecting Sheet - A light source includes a tube fixed to a first and a second end part. The tube has a lateral area. A part of the lateral area includes a light-outcoupling surface of the light source. At least one first light-emitting diode is mounted to the first end part and at least one second light-emitting diode is mounted to the second end part. Each of the first and the second light-emitting diode emitting light along a main direction of extent of the tube. A light reflecting sheet covers all interior surfaces of the tube except the light-outcoupling surface. | 05-30-2013 |
Dluong Ngan Leong, Negeri Sembilan MY
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20080246130 | Semiconductor Package Structure Having Enhanced Thermal Dissipation Characteristics - In an exemplary embodiment, a packaged device having enhanced thermal dissipation characteristics includes a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away from the next level of assembly. The packaged device further includes a conductive clip for coupling the major current carrying electrode to a next level of assembly, and a heat spreader device formed on or integral with the conductive clip. A portion of the heat spreader device may be optionally exposed. | 10-09-2008 |
Hung Yang Leong, Kota Damansara MY
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20140263584 | WIRE BONDING APPARATUS AND METHOD - A method of making an electrical connection includes passing a bond wire through a wire bonding system having a wire polisher and a wire bonding tool. The wire polisher removes contamination from a first portion of the bond wire. A first bond is then formed by bonding the first portion of the bond wire to a first contact such that the bond wire and the first device are electrically connected. A second bond is then formed by bonding a second portion of the bond wire to a second contact such that the first contact and the second contact are electrically connected. | 09-18-2014 |
Kam Foor Leong, Penang MY
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20090240351 | Programming Electronic Instruments by Logging Commands Into a File Format - Electronic instruments are communicatively connected to a processor. An application program is executed by the processor to communicate with the instruments. Electronic instrument commands for communicating with the electronic instruments are output from the processing element. The electronic instrument commands are logged in a file format. The logged electronic instrument commands are converted into code for another application program. | 09-24-2009 |
Keen Hun Leong, Penang MY
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20110050617 | Method and Apparatus for Detecting Defective Traces in a Mutual Capacitance Touch Sensing Device - Several different methods of testing the integrity and proper operation of the drive and sense electrodes in a mutual capacitance sensing device such as a touchscreen or touchpad are disclosed herein. According to one embodiment, measured values of mutual capacitance corresponding to individual cells in a mutual capacitance sensing device are compared to one another and to predetermined thresholds. The results of the comparison are employed to determine whether any of the traces forming the electrodes in the device are defective. By way of example, traces can be defective if they are broken, too thin, too thick, or shorted together. The various embodiments of the methods disclosed herein may be used for touchscreen or touchpad quality control in a manufacturing setting, or may be used to test touchscreens or touchpads that have already been incorporated into electronic devices. The various methods disclosed herein lower manufacturing costs, increase product quality and yield, and may be carried out quickly. | 03-03-2011 |
20110050618 | Firmware Methods and Devices for a Mutual Capacitance Touch Sensing Device - Disclosed are various embodiments of methods and devices for operating a processor or host controller in a mutual capacitance sensing device. Methods and devices for sorting motion reports provided to a host controller or other processor in a mutual capacitance sensing device, reporting touch points to a host controller or other processor in a mutual capacitance sensing device, improving noise robustness and navigation performance in a mutual capacitance sensing device, determining a touch area of a user's finger on a touch panel or touchpad of a mutual capacitance sensing device, and avoiding false wakeups and minimizing power consumption in a mutual capacitance sensing device having a touch panel or touchpad are described. | 03-03-2011 |
20130057514 | Firmware Methods and Devices for a Mutual Capacitance Touch Sensing Device - Disclosed are various embodiments of methods and devices for operating a processor or host controller in a mutual capacitance sensing device. Methods and devices for sorting motion reports provided to a host controller or other processor in a mutual capacitance sensing device, reporting touch points to a host controller or other processor in a mutual capacitance sensing device, improving noise robustness and navigation performance in a mutual capacitance sensing device, determining a touch area of a user's finger on a touch panel or touchpad of a mutual capacitance sensing device, and avoiding false wakeups and minimizing power consumption in a mutual capacitance sensing device having a touch panel or touchpad are described. | 03-07-2013 |
20130069910 | Firmware Methods and Devices for a Mutual Capacitance Touch Sensing Device - Disclosed are various embodiments of methods and devices for operating a processor or host controller in a mutual capacitance sensing device. Methods and devices for sorting motion reports provided to a host controller or other processor in a mutual capacitance sensing device, reporting touch points to a host controller or other processor in a mutual capacitance sensing device, improving noise robustness and navigation performance in a mutual capacitance sensing device, determining a touch area of a user's finger on a touch panel or touchpad of a mutual capacitance sensing device, and avoiding false wakeups and minimizing power consumption in a mutual capacitance sensing device having a touch panel or touchpad are described. | 03-21-2013 |
20130321338 | Firmware Methods and Devices for a Mutual Capacitance Touch Sensing Device - Disclosed are various embodiments of methods and devices for operating a processor or host controller in a mutual capacitance sensing device. Methods and devices for sorting motion reports provided to a host controller or other processor in a mutual capacitance sensing device, reporting touch points to a host controller or other processor in a mutual capacitance sensing device, improving noise robustness and navigation performance in a mutual capacitance sensing device, determining a touch area of a user's finger on a touch panel or touchpad of a mutual capacitance sensing device, and avoiding false wakeups and minimizing power consumption in a mutual capacitance sensing device having a touch panel or touchpad are described. | 12-05-2013 |
Kok Foo Leong, Bayan Lepas MY
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20090078859 | Photodetector with Embedded Infrared Filter - A photodetector and method for making the same are disclosed. The photodetector includes a photodetector die mounted on a substrate, an infrared filter, and an encapsulating layer. The infrared filter is positioned over the photodetector, the infrared filter blocking light in an infrared region of the optical spectrum while allowing light in a visible region of the optical spectrum to reach the photodetector die. The encapsulating layer surrounds the photodetector and the substrate, the infrared filter being embedded in the encapsulating layer, which is transparent to light in the visible region. | 03-26-2009 |
Kok Hoong Leong, Selangor MY
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20120245284 | WATER CURABLE RESIN FORMULATIONS - The present invention relates to a water curable resin formulation comprising: (a) an epoxy resin; (b) an aromatic amine curing agent, wherein the molar ratio of amine functional groups in said curing agent relative to the epoxy functional groups of said epoxy resin is 2:1 or less; and (c) a coupling agent comprising a siloxane group coupled to an epoxy reactive group. | 09-27-2012 |
Kong Yang Leong, Muar MY
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20140339690 | Elimination of Die-Top Delamination - An integrated-circuit module includes an integrated-circuit device having a first surface and a plurality of bond pads disposed on the first surface. The module further includes metallic bond wires or metallic ribbons, which are attached between respective ones of a first subset of the bond pads and a package substrate or leadframe, such that a second subset of the bond pads are not attached to either a package substrate or leadframe. A metallic stud bump is affixed to each of one or more of the second subset of the bond pads. The integrated-circuit module further comprises a molding compound that contacts at least the first surface of the integrated-circuit device and substantially surrounds the bond wires or ribbon wires and the metallic stud bumps. | 11-20-2014 |
Man Loong Leong, Pahang MY
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20120128539 | AIR PURIFICATION SYSTEM FOR VEHICLES - An air purification device for a vehicle comprises an air inlet, an air outlet, and an air conduction volume between the air inlet and the air outlet. At least one reaction surface element is provided in the air conduction volume. At least one light source for ultraviolet light is arranged in the air conduction volume. A surface of the reaction surface element comprises a catalytic material, and the reaction surface element is arranged substantially in the entire air conduction volume or occupies at least 50% of the inner surface of the air purification device. | 05-24-2012 |
Mun Fook Leong, Bukit Mertajam MY
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20140304530 | POWER MANAGEMENT FOR DATA PORTS - According to some embodiments, a communication interface | 10-09-2014 |
Mun Fook Leong, Taman Bukit MY
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20140232710 | APPARATUS, SYSTEM, AND METHOD FOR VOLTAGE LEVEL SWITCHING - Various embodiments include apparatus, systems, and methods having a reference node to receive a reference voltage, a first node to provide a signal, and a circuit. Such a circuit may include a second node to receive different voltages greater than the reference voltage and to cause the signal at the first node to switch between a first voltage greater than the reference voltage and a second voltage greater than the reference voltage. Other embodiments including additional apparatus, systems, and methods are described. | 08-21-2014 |
Voon Kwai Leong, Sri Petaling MY
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20140252575 | LEAD FRAME FOR SEMICONDUCTOR PACKAGE - A lead frame having a die support area for supporting a semiconductor die, a plurality of leads surrounding the die support area, and a dam bar connecting adjacent leads. The dam bar has a dummy tab between adjacent ones of the leads that transversely extends towards the die support area. The presence of the dummy tab reduces the volume of mold compound between the lead frame leads and thus, when the lead frame is cut via punching, only the lead frame is cut and not the molding material. This reduces mechanical stress during singulation significantly and as a result, the occurrence of package cracking is reduced. In addition, less mold compound at the dam bar inter-lead reduces debris during cutting, which in turn reduces debris from contaminating the package. | 09-11-2014 |
20150221572 | METHOD OF LIMITING CAPILLARY ACTION OF GEL MATERIAL DURING ASSEMBLY OF PRESSURE SENSOR - A method for applying a pressure-sensitive gel material during assembly of an array of pre-singulated packaged semiconductor devices. In the method, pressure-sensitive gel material is dispensed onto a first semiconductor device of the array, where the first semiconductor device is disposed within a first cavity. A first curing process is performed to partially cure the pressure-sensitive gel material in the first cavity. Pressure-sensitive gel material is then dispensed onto another semiconductor device of the array, where the other semiconductor device is disposed within another cavity. The first curing process is initiated before the dispensing of the pressure-sensitive gel material inside of the other cavity is completed and initially cures pressure-sensitive gel material for fewer than all of the pre-singulated packaged semiconductor devices of the array. | 08-06-2015 |
Wai Nam Leong, Perak MY
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20110079908 | Stress buffer to protect device features - Disclosed is a stress buffer structure intended to be disposed adjacent a face of a semiconductor substrate. The stress buffer structure includes at least one polymer layer formed on the face of the semiconductor substrate and a plurality of metal plates disposed over the polymer layer, wherein the metal plates is physically and electrically isolated from the bond pads of the semiconductor substrate. The disclosed stress buffer structure provides protection to semiconductor components that are sensitive to stress. Also disclosed are semiconductor packages having the disclosed stress buffer structure and the methods of making the semiconductor packages. | 04-07-2011 |
Wang Yew Leong, Tambun Indah Ipoh MY
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20120248105 | COLLAPSIBLE CONTAINERS - A collapsible shipping container has a corner post located at each corner of a base frame. A respective stile of an end cover frame, which may support at least one door, is pivotally mounted on the base frame adjacent each corner post. Respective lifting members on each corner post and stile have curved abutment faces which engage when the stile is in the erected position, and a latch member releasably locks the stile in the erected position. The or each end cover frame may be provided with a spring—or winch system to assist in moving the end cover frame to the erected position. | 10-04-2012 |
Wee-Hong Leong, Kuala Lumpur MY
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20150277628 | TOUCH CONTROL DEVICE AND FABRICATION METHOD THEREOF - A touch control device includes at least one sensing unit that includes an electrically insulating and light transmissive substrate, multiple mutually electrically insulating touch control electrode structures spacedly disposed on a same side of the substrate, and at least one dummy electrode set disposed on the substrate and located between adjacent ones of the touch control electrode structures. The dummy electrode set forms a groove that extends from a top side thereof through to the substrate and including a plurality of dummy electrode structures that are dividedly defined by said groove. The groove extends between the adjacent ones of the touch control electrode structures and forms at least one bent. | 10-01-2015 |
20150277629 | CAPACITIVE TOUCH-SENSITIVE DEVICE - A capacitive touch-sensitive device includes a sensor electrode layer, a signal trace layer, a flexible circuit board and an electrically-conductive adhesive layer. The sensor electrode layer includes electrically isolated sensor lines. The signal trace layer includes electrically isolated signal lines, each having an outer terminal portion coupled to a respective one of the sensor lines. The flexible circuit board has isolated mutually bonding pads, each corresponding to the outer terminal portion. The electrically-conductive adhesive layer includes a plurality of zones, each having a first adhesive matrix and first conductors dispersed therein. The first conductors bridge the outer terminal portion to the bonding pad. | 10-01-2015 |
Weng Yew Leong, Tambun Indah MY
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20150108120 | COLLAPSIBLE CONTAINERS - A collapsible shipping container has a corner post located at each corner of a base frame. A respective stile of an end cover frame, which may support at least one door, is pivotally mounted on the base frame adjacent each corner post. Respective lifting members on each corner post and stile have curved abutment faces which engage when the stile is in the erected position, and a latch member releasably locks the stile in the erected position. | 04-23-2015 |
Wong Kar Leong, Teluk Intan MY
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20080313478 | MECHANISM TO GATE CLOCK TRUNK AND SHUT DOWN CLOCK SOURCE - An apparatus, method, and system are disclosed. In one embodiment, the apparatus includes a clock source unit that generates a clock signal, multiple clock trunk lines that supply the clock signal to multiple devices, and a clock control unit that instructs the clock source unit that can gate or supply the clock signal on the clock trunk lines. | 12-18-2008 |
Yi Hao Leong, Selangor MY
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20100332308 | METHOD AND SYSTEM FOR DYNAMICALLY CUSTOMIZING A TRANSACTION OF SUBSIDIZED GOODS USING AN IDENTITY MEDIUM - A subsidy and payment system dynamically determines a consumer's subsidy entitlement status and calculates a customized subsidy applicable to purchase of subsidized goods based on the consumer's authenticated government-endorsed identity. The subsidy and payment system additionally facilitates electronic payments from the consumer and subsidy rebates to the consumer in connection with the purchase of subsidized goods based on the authenticated government-endorsed identity without requiring additionally information or actions from the consumer. | 12-30-2010 |
Yin Liong Leong, Selangor MY
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20120245284 | WATER CURABLE RESIN FORMULATIONS - The present invention relates to a water curable resin formulation comprising: (a) an epoxy resin; (b) an aromatic amine curing agent, wherein the molar ratio of amine functional groups in said curing agent relative to the epoxy functional groups of said epoxy resin is 2:1 or less; and (c) a coupling agent comprising a siloxane group coupled to an epoxy reactive group. | 09-27-2012 |