Justin K.
Justin K. Elerath, Temecula, CA US
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20130268045 | SEGMENTED SCAFFOLDS AND DELIVERY THEREOF FOR PERIPHERAL APPLICATIONS - Segmented scaffolds composed of disconnected scaffold segments are disclosed. System of and methods for delivery of the segmented scaffolds are disclosed. | 10-10-2013 |
Justin K. Ichida, Los Angeles, CA US
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20150023927 | CONVERSION OF SOMATIC CELLS INTO FUNCTIONAL SPINAL MOTOR NEURONS, AND METHODS AND USES THEREOF - The present invention provides methods of transdifferentiation of somatic cells, for example, directly converting a somatic cell of a first cell type, e.g., a fibroblast into a somatic cell of a second cell type, are described herein. In particular, the present invention generally relates to methods for converting a somatic cell, e.g., a fibroblast into a motor neuron, e.g., an induced motor neuron (iMN) with characteristics of a typical motor neuron. The present invention also relates to an isolated population comprising induced motor neurons (iMNs), compositions and their use in the treatment of motor neuron diseases such as ALS and SMA. In particular, the present invention relates to direct conversion of a somatic cell to an induced motor neuron (iMN) having motor neuron characteristics by increasing the protein expression of at least three motor-neuron inducing (MN-inducing) factors selected from Lhx3, Ascl1, Brn2, Myt1l, Isl1, Hb9, Ngn2 or NeuroD1 in a somatic cell, e.g., a fibroblast to convert the fibroblast to an induced motor neuron (iMN) which exhibits at least two characteristics of an endogenous motor neuron. | 01-22-2015 |
Justin K. Markunas, Washington, DC US
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20110079894 | Template Process for Small Pitch Flip-Flop Interconnect Hybridization - A process is disclosed for high density indium bumping of microchips by using an innovative template wafer upon which the bumps are initially fabricated. Once fabricated, these bumps are transferred to the microchip, after which can be hybridized to another microchip. Such a template wafer is reusable, and thus provides an economical way to fabricate indium bumps. Reusability also eliminates nonuniformities in bump shape and size in serial processing of separate microchips, which is not the case for other indium bump fabrication processes. Such a fabrication process provides a way to form relatively tall indium bumps and accomplishes this without the standard thick photoresist liftoff process. The described process can be suitable for bump pitches under 10 microns, and is only limited by the resolution of the photolithography equipment used. | 04-07-2011 |
20120161314 | TEMPLATE WAFER AND PROCESS FOR SMALL PITCH FLIP-CHIP INTERCONNECT HYBRIDIZATION - A process is disclosed for high density indium bumping of microchips by using an innovative template wafer upon which the bumps are initially fabricated. Once fabricated, these bumps are transferred to the microchip, after which can be hybridized to another microchip. Such a template wafer is reusable, and thus provides an economical way to fabricate indium bumps. Reusability also eliminates nonuniformities in bump shape and size in serial processing of separate microchips, which is not the case for other indium bump fabrication processes. Such a fabrication process provides a way to form relatively tall indium bumps and accomplishes this without the standard thick photoresist liftoff process. The described process can be suitable for bump pitches under 10 microns, and is only limited by the resolution of the photolithography equipment used. | 06-28-2012 |
20130244417 | Template Wafer Fabrication Process for Small Pitch Flip-Chip Interconnect Hybridization - A template wafer fabrication process is disclosed for high density indium bumping of microchips by using an innovative template wafer upon which the bumps are initially fabricated. Once fabricated, these bumps are transferred to the microchip, after which can be hybridized to another microchip. Such a template wafer is reusable, and thus provides an economical way to fabricate indium bumps. Reusability also eliminates nonuniformities in bump shape and size in serial processing of separate microchips, which is not the case for other indium bump fabrication processes. Such a fabrication process provides a way to form relatively tall indium bumps and accomplishes this without the standard thick photoresist liftoff process. The described process can be suitable for bump pitches under 10 microns, and is only limited by the resolution of the photolithography equipment used. | 09-19-2013 |
Justin K. Williams, Indiana, PA US
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20150330884 | PEELING APPARATUS AND METHOD FOR SEPARATING WELDED LAYERS - An apparatus and method for separating welded multi-layered samples has a slotted engine-driven spindle that twists and pulls a layer from the sample, breaking the welds as the layer winds around the spindle. The sample is held between two clamps and a tensioning cylinder pulls a movable first clamp against the second stationery clamp. Sensors may sense the force required to break the welds and the data may be stored and analyzed in a computer. | 11-19-2015 |