Patent application number | Description | Published |
20080258839 | HIGH-FREQUENCY SWITCHING MODULE AND FREQUENCY-CHARACTERISTIC ADJUSTING METHOD FOR HIGH-FREQENCY CIRCUIT - A high-frequency switching module in which a high-frequency switch including a diode, which functions as a switching device, and a high-frequency filter including inductors and a capacitor are integrated with each other. The inductor defining a π-type high-frequency filter is connected directly and in series to the diode. By inserting the inductor, the cut-off frequency of a Chebyshev-type low-pass filter circuit produced when the diode is turned ON can be shifted to a lower frequency side, and also, the ripple can be suppressed to a small level. | 10-23-2008 |
20090034504 | HIGH-FREQUENCY COMPONENT - A high-frequency component includes a diplexer in which a high-pass filter and a low-pass filter are connected in parallel with an antenna port, a high-frequency circuit cascade-connected to the high-pass filter, and a low-frequency circuit cascade-connected to the low-pass filter. A filter which causes an impedance mismatch to occur is connected to the low-frequency circuit. The low-pass filter includes a line. The low-pass filter is defined by a parallel resonant circuit including the line and a series circuit including the line. A resonant frequency of the parallel resonant circuit is a trap frequency of a high-frequency transmission/reception signal. A resonant frequency of all elements of the low-pass filter is a trap frequency of undesired resonance that occurs at high frequencies. | 02-05-2009 |
20090052358 | COMPOSITE HIGH-FREQUENCY COMPONENT - A composite high-frequency component includes a transmission/reception selection switch. The transmission/reception selection switch includes a first diode disposed in series with a transmission signal line, a second diode disposed in shunt with a reception signal line. A first current route in which a direct current flows through the first diode and a second current route in which a direct current flows through the second diode are connected in parallel with each other. When a predetermined positive voltage is applied to a control terminal, a direct current flows through, in sequence, the control terminal, a resistor, an inductor, the diode, a strip line, a strip line, and a shared inductor, and a direct current also flows through, in sequence, the control terminal, the resistor), the diode, a strip line, the strip line, the strip line, and the shared inductor. | 02-26-2009 |
20090268647 | HIGH-FREQUENCY COMPONENT - A high-frequency component in which a low-frequency-band transmission characteristic is not degraded even when impedance mismatching is generated by providing a SAW filter in a high-frequency-band circuit. The high-frequency component includes a diplexer having a high pass filter and a low pass filter connected in parallel to an antenna port, a high-frequency-band circuit serially connected to the high pass filter, and a low-frequency-band circuit serially connected to the low pass filter. A filter causing impedance mismatching is connected to the high-frequency-band circuit. The high pass filter includes a first series resonant circuit and a second series resonant circuit, and the resonance frequency of the first series resonant circuit is a trap frequency of a signal in the low-frequency band, and the resonance frequency of the second series resonant circuit is a trap frequency of undesired resonance generated in the transmission characteristic of the filter of the low-frequency-band side. | 10-29-2009 |
20100085722 | METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS USING THE SAME, AND ELECTRONIC-COMPONENT MODULE - A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate. | 04-08-2010 |
20100226355 | LOW-VOLTAGE CONTROL HIGH-FREQUENCY SWITCH AND COMPOSITE HIGH-FREQUENCY COMPONENT - In a first high frequency switch, a current path and a current path are connected in parallel. When a positive voltage is applied to a control terminal, a current flows through a path passing through (Vc | 09-09-2010 |
20100301964 | HIGH-FREQUENCY MODULE - A high-frequency module includes at least first and second signal circuits that are each connected between a common antenna port and at least first and second signal ports. The first signal circuit includes a first inductor connected in series between the antenna port and the first signal port, a first capacitor connected in series between the first inductor and the first signal port, and a second inductor connected in shunt between the first capacitor and the first signal port. Series resonance is produced between the first inductor, the first capacitor, and the second inductor at a frequency within the frequency band of a target signal of the second signal circuit. | 12-02-2010 |
20100304693 | HIGH FREQUENCY SWITCH MODULE - A high frequency switch module includes a laminated circuit component that includes an antenna electrode connected to a single antenna, a plurality of communication electrodes connected to a plurality of high frequency communication circuits to transmit, receive, or transmit and receive plural kinds of communication signals, and a land arranged to mount a switch IC on, and a switch IC that is mounted on the laminated circuit component and includes a common terminal connected to the single antenna through the laminated circuit component, and a plurality of communication circuit terminals connected to the plurality of high frequency communication circuits through the laminated circuit component. The switch IC is provided with switch circuits between the communication circuit terminals and the common terminal, and all of the switch circuits have the same or substantially the same resistance against transmission power applied at the time of transmission. | 12-02-2010 |
20110181342 | HIGH-FREQUENCY SWITCH MODULE - A high-frequency switch module includes a switch element, high-frequency circuits, and a GND circuit. The switch element includes an antenna port, switch ports, and an FET switch. The FET switch switches connection between the switch ports and the antenna port. The high-frequency circuits connect any of the switch ports to a signal processing circuit. In the GND circuit, the switch port, which is not connected to the high-frequency circuits, is directly connected to a GND electrode. | 07-28-2011 |