Palmer, AZ
Ben Palmer, Phoenix, AZ US
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20080292979 | TRANSPARENT CONDUCTIVE MATERIALS AND COATINGS, METHODS OF PRODUCTION AND USES THEREOF - Transparent conductive materials, articles and films are described herein a) that are easily and efficiently produced, b) can be produced prior to application or in situ, c) are easily applied to surfaces and substrates or formed into articles, d) can be produced and used with materials and methods that are generally accepted by the flat panel display (FPD) industry, along with other industries that produce and utilize microelectronics, e) can be tailored to be photoimageable and patternable using accepted photolithography techniques, f) have superior optical properties and have superior film forming properties, including better adhesion to other adjacent layers, the ability to be laid down in very or ultra thin layers and the ability to remain transparent when laid down as thicker layers. Methods of producing and using these transparent conductive materials are also disclosed. | 11-27-2008 |
Bentley J. Palmer, Phoenix, AZ US
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20090057834 | Method for Chemical Mechanical Planarization of Chalcogenide Materials - A method and associated composition for chemical mechanical planarization of a chalcogenide-containing substrate (e.g., germanium/antimony/tellurium (GST)-containing substrate) are described. The composition and method afford low defect levels as well as low dishing and local erosion levels on the chalcogenide-containing substrate during CMP processing. | 03-05-2009 |
20090061630 | Method for Chemical Mechanical Planarization of A Metal-containing Substrate - A method using an associated composition for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) is described. This method affords low dishing and local erosion levels on the metal during CMP processing of the metal-containing substrate. | 03-05-2009 |
20100081279 | Method for Forming Through-base Wafer Vias in Fabrication of Stacked Devices - An effective method for forming through-base wafer vias in the fabrication of stacked devices is described. The base wafer can be a silicon wafer in which case the method relates to TSV (through-silicon via) technology. The method affords high removal rates of both silicon and metal (e.g., copper) under appropriate conditions and is tuneable with respect to base wafer material to metal selectivity. | 04-01-2010 |
20100101448 | Polishing Slurry for Copper Films - A slurry for use in a chemical mechanical planarization process for a wafer comprises a chemical portion and a mechanical portion. The chemical portion comprises a surfactant that forms a layer over a metallic layer of the wafer to decreasing dishing to less than an average of 843 Å reduce the static etch rate of the metallic layer. The mechanical portion comprises an abrasive agent to assist in the planarization of the metallic layer of the wafer. In another embodiment, a slurry for polishing a copper layer formed over a first layer is disclosed. The slurry comprises an abrasive agent; and a surfactant comprising at least one non-ionic surfactant to reduce the static etch rate of the copper layer. The shelf life of the slurry exceeds 90 days. | 04-29-2010 |
20100167545 | Method and Composition for Chemical Mechanical Planarization of A Metal - A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low within a wafer non-uniformity values and low residue levels remaining after polishing. | 07-01-2010 |
20100167546 | Method and Composition for Chemical Mechanical Planarization of A Metal or A Metal Alloy - A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low dishing and erosion levels during CMP processing. | 07-01-2010 |
20130102153 | METHOD AND COMPOSITION FOR CHEMICAL MECHANICAL PLANARIZATION OF A METAL OR A METAL ALLOY - A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low dishing and erosion levels during CMP processing. | 04-25-2013 |
20130178065 | Method and Composition for Chemical Mechanical Planarization of a Metal - A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low within a wafer non-uniformity values and low residue levels remaining after polishing. | 07-11-2013 |
Daniel K. Palmer, Phoenix, AZ US
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20110197200 | DECODING LOCATION INFORMATION IN CONTENT FOR USE BY A NATIVE MAPPING APPLICATION - Techniques are described to decode location information in content accessed by a mobile electronic device and pass the decoded information to a native mapping application to provide an enhanced user experience. In an implementation, location information is decoded by parsing a map link in content accessed by the mobile electronic device or from location information parameters associated with a mapping application programming interface (API) call made by a mapping script embedded in the content. The decoded location information is passed to a native mapping application of the mobile electronic device. A map-related function may then be provided by the mobile electronic device by accessing functionality of the native mapping application using the decoded location information. | 08-11-2011 |
Eric Palmer, Tempe, AZ US
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20100078781 | INPUT/OUTPUT PACKAGE ARCHITECTURES, AND METHODS OF USING SAME - A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die-side and the I/O trace to couple with an IC device to be disposed inside the IHS footprint. The I/O trace includes a pin-out terminal outside the IHS footprint to couple to an IC device to be disposed outside the IHS footprint. The high-speed I/O trace can sustain a data flow rate from a processor in a range from 5 gigabits per second (Gb/s) to 40 Gb/s. | 04-01-2010 |
20100096743 | Input/output package architectures, and methods of using same - A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die-side and the I/O trace to couple with an IC device to be disposed inside the IHS footprint. The I/O trace includes a pin-out terminal outside the IHS footprint to couple to an IC device to be disposed outside the IHS footprint. The high-speed I/O trace can sustain a data flow rate from a processor in a range from 5 gigabits per second (Gb/s) to 40 Gb/s. | 04-22-2010 |
Eric C. Palmer, Tempe, AZ US
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20090057910 | METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA - A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein. | 03-05-2009 |
20090294942 | PACKAGE ON PACKAGE USING A BUMP-LESS BUILD UP LAYER (BBUL) PACKAGE - In some embodiments, package on package using a bump-less build up layer (BBUL) package is presented. In this regard, an apparatus is introduced comprising a microelectronic die having an active surface, an inactive surface parallel to said active surface, and at least one side, an encapsulation material adjacent said at least one microelectronic die side, wherein said encapsulation material includes a bottom surface substantially planar to said microelectronic die active surface and a top surface substantially planar to said microelectronic die inactive surface, a through via connection in said encapsulation material extending from said top surface to said bottom surface, a first dielectric material layer disposed on at least a portion of said microelectronic die active surface and said encapsulation material surface, a plurality of build-up layers disposed on said first dielectric material layer, and a plurality of conductive traces disposed on said first dielectric material layer and said build-up layers and in electrical contact with said microelectronic die active surface. Other embodiments are also disclosed and claimed. | 12-03-2009 |
20110198723 | METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA - A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein. | 08-18-2011 |
20130249112 | PASSIVE WITHIN VIA - A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein. | 09-26-2013 |
Eric M. Palmer, Vail, AZ US
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20110077800 | SYSTEMS AND METHODS FOR TRIAGING A PLURALITY OF TARGETS WITH A ROBOTIC VEHICLE - Methods and systems are provided for triaging a plurality of targets with robotic vehicle while the robotic vehicle remains at a first location. The robotic vehicle is in operable communication with a remote command station and includes a processor that is coupled to a first imager. The first imager generates separate images of each one of the plurality of targets while the robotic vehicle remains at the first location. The processor receives target data identifying the plurality of targets from the remote command station, acquires an image of each one of the plurality of targets with the first imager while the robotic vehicle remains at the first location, and transmits each generated image to the remote command station. | 03-31-2011 |
Jana Palmer, Morristown, AZ US
Jeff Palmer, Scottsdale, AZ US
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20130030974 | DEVICE AND METHOD FOR AUTOMATICALLY ALLOCATING AND TRANSFERRING FUNDS IN AN ACCOUNT - A device including a processor which automatically allocates and transfers funds in a sweep account between a primary on-balance demand account and one or more off-balance accounts in a manner which assists the bank in maintaining an optimal liquidity profile and capital structure. The device is adapted to prepare and analyze current data pertaining to the liquidity profile and capital structure of a bank and compare this data to predetermined reference values stored in data storage means of the device. The device has an allocation unit which utilizes an algorithm in order to allocate an amount of funds to transfer between an on-balance account and one or more off-balance accounts which will provide an optimal liquidity profile and capital structure for the bank. | 01-31-2013 |
Larkin Palmer, Payson, AZ US
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20120217799 | Central Battery Interconnected Smoke Detector System with Single Wire AC and DC Pass-Through Relay - An AC powered and DC battery backup powered interconnected smoke alarm/detector system that provides battery backup to each and all smoke alarms/detectors within a dwelling using a single, centrally located rechargeable backup battery. Both AC power and DC backup power sources are distributed and provided to each and all smoke alarms/detectors through the same electrical high voltage wiring via an AC and DC Pass-Through Relay. | 08-30-2012 |
20150084780 | CENTRAL BATTERY INTERCONNECTED SMOKE DETECTOR SYSTEM WITH SINGLE WIRE AC AND DC PASS-THROUGH RELAY - Disclosed is an interconnected smoke detector system of one or more smoke detector(s) wired into a dedicated circuit with a single location housing a DC power backup source, such as a rechargeable DC battery. The DC power backup source may be replaceable or rechargeable with DC current from and AC-DC transformer, a photovoltaic cell, or other means. Electronic relays within the system provide a current to the dedicated circuit by selecting between the line-voltage alternating current source and the DC power backup. | 03-26-2015 |
Preston Palmer, Gilbert, AZ US
Patent application number | Description | Published |
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20120217799 | Central Battery Interconnected Smoke Detector System with Single Wire AC and DC Pass-Through Relay - An AC powered and DC battery backup powered interconnected smoke alarm/detector system that provides battery backup to each and all smoke alarms/detectors within a dwelling using a single, centrally located rechargeable backup battery. Both AC power and DC backup power sources are distributed and provided to each and all smoke alarms/detectors through the same electrical high voltage wiring via an AC and DC Pass-Through Relay. | 08-30-2012 |
20150084780 | CENTRAL BATTERY INTERCONNECTED SMOKE DETECTOR SYSTEM WITH SINGLE WIRE AC AND DC PASS-THROUGH RELAY - Disclosed is an interconnected smoke detector system of one or more smoke detector(s) wired into a dedicated circuit with a single location housing a DC power backup source, such as a rechargeable DC battery. The DC power backup source may be replaceable or rechargeable with DC current from and AC-DC transformer, a photovoltaic cell, or other means. Electronic relays within the system provide a current to the dedicated circuit by selecting between the line-voltage alternating current source and the DC power backup. | 03-26-2015 |
Shane R. Palmer, Oro Valley, AZ US
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20140199844 | ARRAY DESCRIPTION SYSTEM FOR LARGE PATTERNS - A method for describing an array of elements includes the steps of providing an array description system that includes a library of possible alternative designations; and describing the array of elements using at least one of the alternative designations. The library of possible alternative designations includes one or more of the following (i) a line designation, (ii) a column designation, (iii) a square designation, (iv) a rectangle designation, (v) a cross designation, (vi) a diagonal designation, (vii) a complex designation, (viii) a mosaic designation, (ix) an overlap designation, (x) a power designation, (xi) a border designation, (xii) a corner flip designation, (xiii) a mirror image designation, (xiv) a repeat designation, and (xv) a glide designation. | 07-17-2014 |
20150055107 | MICROELECTROMECHANICAL MIRROR ASSEMBLY - An optical element assembly includes a base, and an element unit. The element unit includes (i) an optical element having an element central axis and an element perimeter; and (ii) an element connector assembly that couples the optical element to the base, the element connector assembly including a flexure assembly having an element flexure and a base flexure. A distal end of the element flexure is coupled to the optical element near the element perimeter, a distal end of the base flexure is coupled to the base, and a proximal end of the element flexure is coupled to a proximal end of the base flexure near the element central axis. | 02-26-2015 |
Shane Roy Palmer, Oro Valley, AZ US
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20120039523 | Method for matching high-numerical aperture scanners - A method for matching characterizing features of an optical scanner against target characterizing features is provided. The characterizing features are produced from characterizing data (also referred to as a signature characteristic) produced from a scan of a mask by the scanner against target scanner signature characteristics produced from a scan of the mask by another optical scanner that produces the target scanner signature characteristic. | 02-16-2012 |
Wesley Palmer, Mesa, AZ US
Patent application number | Description | Published |
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20120217799 | Central Battery Interconnected Smoke Detector System with Single Wire AC and DC Pass-Through Relay - An AC powered and DC battery backup powered interconnected smoke alarm/detector system that provides battery backup to each and all smoke alarms/detectors within a dwelling using a single, centrally located rechargeable backup battery. Both AC power and DC backup power sources are distributed and provided to each and all smoke alarms/detectors through the same electrical high voltage wiring via an AC and DC Pass-Through Relay. | 08-30-2012 |
20150084780 | CENTRAL BATTERY INTERCONNECTED SMOKE DETECTOR SYSTEM WITH SINGLE WIRE AC AND DC PASS-THROUGH RELAY - Disclosed is an interconnected smoke detector system of one or more smoke detector(s) wired into a dedicated circuit with a single location housing a DC power backup source, such as a rechargeable DC battery. The DC power backup source may be replaceable or rechargeable with DC current from and AC-DC transformer, a photovoltaic cell, or other means. Electronic relays within the system provide a current to the dedicated circuit by selecting between the line-voltage alternating current source and the DC power backup. | 03-26-2015 |