Patent application number | Description | Published |
20110076526 | ELECTROLYTE COMPOSITIONS - An electrolyte for a flow cell battery is provided. The electrolyte includes a concentration of chromium ions that is greater than the concentration of iron ions. | 03-31-2011 |
20110081561 | METHODS OF PRODUCING HYDROCHLORIC ACID FROM HYDROGEN GAS AND CHLORINE GAS - A method of producing HCl from H | 04-07-2011 |
20110086247 | REDOX FLOW CELL REBALANCING - A redox cell rebalance system is provided. In some embodiments, the rebalance system includes electrochemical cell and a photochemical cell. In some embodiments, the photochemical cell contains a source of ultraviolet radiation for producing HCl from H | 04-14-2011 |
20120183816 | QUENCHING SYSTEM - A quencher for a flow cell battery is described. The quencher utilizes a quench solution formed from FeCl | 07-19-2012 |
20130095362 | VANADIUM FLOW CELL - A Vanadium chemistry flow cell battery system is described. Methods of forming the electrolyte, a formulation for the electrolyte, and a flow system utilizing the electrolyte are disclosed. Production of electrolytes can include a combination of chemical reduction and electrochemical reduction. | 04-18-2013 |
20130316199 | ELECTROCHEMICAL BALANCE IN A VANADIUM FLOW BATTERY - A Flow Cell System that utilizes a Vanadium Chemistry is provided. The flow cell system includes a stack, storage tanks for electrolyte, and a rebalance system coupled to correct the electrolyte oxidation state. Methods of rebalancing the negative imbalance and positive imbalance in the flow cell system are also disclosed. | 11-28-2013 |
20140023943 | QUENCHING SYSTEM - A quencher for a flow cell battery is described. The quencher utilizes a quench solution formed from FeCl | 01-23-2014 |
20150050570 | PRODUCTION OF VANADIUM ELECTROLYTE FOR A VANADIUM FLOW CELL - A Vanadium chemistry flow cell battery system is described. Methods of forming the electrolyte, a formulation for the electrolyte, and a flow system utilizing the electrolyte are disclosed. In some embodiments, the vanadium electrolyte is sulfate-free. | 02-19-2015 |
Patent application number | Description | Published |
20090218310 | METHODS OF PATTERNING A CONDUCTOR ON A SUBSTRATE - A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate. | 09-03-2009 |
20090219257 | TOUCH SCREEN SENSOR - A touch screen sensor includes a visible light transparent substrate and an electrically conductive micropattern disposed on or in the visible light transparent substrate. The micropattern includes a first region micropattern within a touch sensing area and a second region micropattern. The first region micropattern has a first sheet resistance value in a first direction, is visible light transparent, and has at least 90% open area. The second region micropattern has a second sheet resistance value in the first direction. The first sheet resistance value is different from the second sheet resistance value. | 09-03-2009 |
20100258968 | INK SOLUTIONS FOR MICROCONTACT PRINTING - An ink solution comprises (a) a solvent having (i) a boiling point between about 50° C. and about 100° C., (ii) a relative polarity of less than about 0.4, and (iii) a poly(dimethylsiloxane) swelling ratio of less than about 1.25; and (b) one or more dissolved organosulfur compounds, wherein each organosulfur compound has 10 or more carbon atoms. The one or more organosulfur compounds are present in a total concentration of at least about 3 mM, and the ink solution contains essentially no solid particles of the organosulfur compounds or solid particles derived from the organosulfur compounds. | 10-14-2010 |
20120194481 | TOUCH SCREEN SENSOR - A touch screen sensor includes a visible light transparent substrate and an electrically conductive micropattern disposed on or in the visible light transparent substrate. The micropattern includes a first region micropattern within a touch sensing area and a second region micropattern. The first region micropattern has a first sheet resistance value in a first direction, is visible light transparent, and has at least 90% open area. The second region micropattern has a second sheet resistance value in the first direction. The first sheet resistance value is different from the second sheet resistance value. | 08-02-2012 |
Patent application number | Description | Published |
20110226733 | PATTERNING PROCESS - A patterning process comprises (a) providing at least one substrate having at least one major surface; (b) providing at least one patterning composition comprising at least one functionalizing molecule that is a perfluoropolyether organosulfur compound; (c) applying the patterning composition to the major surface of the substrate in a manner so as to form at least one functionalized region and at least one unfunctionalized region of the major surface; and (d) etching at least a portion of the unfunctionalized region. | 09-22-2011 |
20110260741 | INTEGRATED PASSIVE CIRCUIT ELEMENTS FOR SENSING DEVICES - Capacitive sensing devices are provided that include a sensing pattern of conductive traces disposed upon the surface of a substrate and a first passive circuit element that includes a metallic conductor disposed upon the same surface of the substrate. In some embodiments, the first passive circuit element is a component of an electronic circuit that can be, for example, a low pass filter. Provided capacitive sensing devices are useful, for example, when incorporated into projected touch screen display panels for use on electronic devices. | 10-27-2011 |
20120082825 | METHODS OF WET ETCHING A SELF-ASSEMBLED MONOLAYER PATTERNED SUBSTRATE AND METAL PATTERNED ARTICLES - Method of patterning a substrate are described including a method of providing a substrate comprising a metalized surface having a self-assembled monolayer patterned region and unpatterned region; and wet etching the metalized surface in a liquid etchant agitated with bubbling gas to remove metal from the unpatterned regions to form a metal pattern. Also described are metal patterned article including an article comprising a substrate and an etched microcontact printed metal pattern disposed on the substrate wherein the pattern has a thickness of at least 100 nanometers and a pattern feature uniformity of at least 50% for an area of at least 25 cm | 04-05-2012 |
20130264390 | Transparent Micropatterned RFID Antenna and Articles Incorporating Same - Antennas suitable for use in RFID devices include an insulating substrate and a first conductive micropattern disposed on or in the substrate, the first conductive micropattern defining a contiguous mesh conductor. The first conductive micropattern forms an antenna responsive to at least a frequency of 915 MHz, and includes interconnected traces having a trace width in a range from 0.5 to 20 microns. Furthermore, the first conductive micropattern is characterized by an open area fraction of at least 80% or 90%. RFID devices include such an antenna and an integrated circuit configured to transmit and receive signals using the antenna. Cards, such as financial transaction cards or identification cards, include such an antenna carried by a card layer. | 10-10-2013 |
20130277330 | METHODS OF PATTERNING A CONDUCTOR ON A SUBSTRATE - A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate. | 10-24-2013 |
20130299214 | Patterned Substrates With Darkened Conductor Traces - The present disclosure provides an article having (a) a substrate having a first nanostructured surface that is antireflective when exposed to air and an opposing second surface; and (b) a conductor micropattern disposed on the first surface of the substrate, the conductor micropattern formed by a plurality of traces defining a plurality of open area cells. The micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation. The traces of the conductor micropattern have a specular reflectance in a direction orthogonal to and toward the first surface of the substrate of less than 50%. Each of the traces has a width from 0.5 to 10 micrometer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields | 11-14-2013 |
20140231381 | Methods of Continuously Wet Etching A Patterned Substrate - Metalized web substrate is wet etched in a reaction vessel by contacting with oxidizing and metal complexing agent to remove metal from unpatterned region. Following etching, substrate is rinsed, and rinse is at least partly recycled. Concentrations of oxidizing and metal complexing agents in the etchant bath are maintained by delivering replenishment feeds of each. Concentration of metal in the etchant bath is maintained by discharging some of the etchant bath. Replenishment rates of oxidizing and metal complexing agents and etchant removal rate are determined based at least in part on rate that metal etched from the substrate enters the etchant bath. | 08-21-2014 |
20150086757 | Methods of Patterning a Conductor on a Substrate - A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate. | 03-26-2015 |
20150097587 | INTEGRATED PASSIVE CIRCUIT ELEMENTS FOR SENSING DEVICES - Capacitive sensing devices are provided that include a sensing pattern of conductive traces disposed upon the surface of a substrate and a first passive circuit element that includes a metallic conductor disposed upon the same surface of the substrate. In some embodiments, the first passive circuit element is a component of an electronic circuit that can be, for example, a low pass filter. Provided capacitive sensing devices are useful, for example, when incorporated into projected touch screen display panels for use on electronic devices. | 04-09-2015 |
Patent application number | Description | Published |
20100143656 | Method and Structure for Adapting Solder Column to Warped Substrate - A multiple substrate system, a method, and structure for adapting solder volume to a warped module. An illustrative embodiment comprises a method for joining a first substrate to a second substrate. A deviation from a nominal gap between the first substrate and the second substrate at a first region of the first substrate is ascertained. A volume of solder paste necessary to compensate for the deviation from a nominal gap is determined. The volume of solder paste necessary to compensate for the deviation at the first region of the first substrate is applied. Further, the second substrate is bonded to the first substrate using, at least in part, the solder paste applied at the first region of the first substrate. | 06-10-2010 |
20120021564 | Method for packaging semiconductor device - The present invention provides a method for packaging semiconductor device which is using more than once reflow processes to heat the solder ball to prevent the deformation of solder ball, so that the yield of the manufacturing process can be increased and the reliability of the semiconductor device can be increased. | 01-26-2012 |
20120146218 | Semiconductor package device with cavity structure and the packaging method thereof - A semiconductor device with a cavity structure comprises: a carrier substrate; a first die having an active surface and the pads thereon; a back surface of the first die is disposed on the carrier substrate; a second die having a top surface and a back surface and a cavity structure therein; the top surface of a second die is flipped to dispose on the first die, and the cavity structure is an inverse U-type to dispose between the active surface of the first die and the top surface of the second die; the wires is electrically connected the pads with the first connecting points; a package body encapsulated the first die, the second die, the wires, and the portion of the top surface of the carrier substrate; and the connecting components is disposed on the back surface of the carrier substrate and is electrically connected the second connecting points. | 06-14-2012 |