Patent application number | Description | Published |
20100008460 | Synchronous de-skew with programmable latency for multi-lane high speed serial interface - A method and system for performing clock calibration and de-skew on a multi-lane high speed serial interface is presented. Each of a plurality of serial lane transceivers associated with an individual bit lane receives a first data frame, comprising a training sequence header pattern. Based on each of the first data frames, the plurality of serial lane transceivers de-skew a plurality of data frames and generate a plurality of event signals. Using the plurality of event signals, a core clock, having a first phase, is adjusted to be phase aligned with the slowest bit lane. | 01-14-2010 |
20100139710 | METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS - An apparatus for cleaning a surface of wafer or substrate includes a plate being positioned with a gap to surface of the wafer or substrate, and the plate being rotated around an axis vertical to surface of wafer or substrate. The rotating plate surface facing surface of the wafer or substrate has grooves, regular patterns, and irregular patterns to enhance the cleaning efficiency. Another embodiment further includes an ultra sonic or mega sonic transducer vibrating the rotating plate during cleaning process. | 06-10-2010 |
20100205486 | System and method of error reporting - A system of error reporting and the method thereof are provided. A user end sends an error message to a server. The server uses the error message to check historical data and find out how to process the error message. This solves the problem of inconvenient notification channel when an application program on the user end discovers an error. This is helpful to increase the convenience and thus enhance the efficiency in sending error reports. | 08-12-2010 |
20100240226 | METHOD AND APPARATUS FOR THERMAL TREATMENT OF SEMICONDUCTOR WORKPIECES - The present invention provides an apparatus and method for rapid and uniform thermal treatment of semiconductor workpieces in two closely arranged thermal treatment chambers with a retractable door between them. The retractable door moves in between two thermal treatment chambers during heating or cooling process, and additional heating and cooling sources are provided for double-side thermal treatment of the semiconductor workpiece. | 09-23-2010 |
20100279976 | USE OF ARTEMISININ AND ITS DERIVATIVES IN CANCER THERAPY - A method for treating cancer in a mammal includes administering to the mammal in need thereof a therapeutically effective amount of artemisinin (ART) or its derivative, such as dihydroartemisinin (DHA), artemether (ARM), or artesunate (ARS) alone or in combination with a chemotherapeutic agent, such as gemcitabine and carboplatin. A method for inhibiting tumor cell proliferation includes contacting a tumor cell with ART or its derivative, such as DHA, ARM, and ARS, in an amount effective to inhibit tumor cell proliferation or in combination with a chemotherapeutic agent, such as gemcitabine and carboplatin. | 11-04-2010 |
20110073469 | ELECTROCHEMICAL DEPOSITION SYSTEM - A electrochemical deposition system which has a 3-D stacked architecture comprises a factory interface for receiving semiconductor wafers, a mainframe comprising a mainframe transfer robot and a plurality of wafer holder assemblies which disposed on the top thereof, a plurality of electroplating cells disposed within the mainframe, a plurality of cleaning cells disposed within the mainframe and located below the electroplating cells, a plurality of thermal treatment chambers disposed in between the mainframe and the factory interface, and a fluid distribution system fluidly connected to the electroplating cells and the cleaning cells, wherein the mainframe transfer robot transfers the semiconductor wafer from the factory interface and within the electroplating cells, the cleaning cells, and the thermal treatment chambers. As a result, the system of the present invention is expandable to accommodate newly-added processing units without overmuch increased footprint. | 03-31-2011 |
20110074483 | TECHNIQUE TO REDUCE CLOCK RECOVERY AMPLITUDE MODULATION IN HIGH-SPEED SERIAL TRANSCEIVER - A method is provided for improving clock recovery signal jitter in digital communication based on a phase adjustment technique in a phase interpolation. A clock signal is expressed as the combination of two sinusoidal signals. The phase interpolating process determines the amplitude of the first sinusoidal signal, and the amplitude of the second sinusoidal signal that is 90° out of phase from the first sinusoidal signal. The clock signal is then formed by combining first sinusoidal signal with the second sinusoidal signal by choosing the first and second amplitude such that the amplitude of the clock signal is substantially a constant. Modulation of the clock signal amplitude is significantly improved by the disclosed technique over the conventional technique when the sum of the first and second amplitudes of the two sinusoidal functions is kept a constant. | 03-31-2011 |
20110079247 | SOLUTION PREPARATION APPARATUS AND METHOD FOR TREATING INDIVIDUAL SEMICONDUCTOR WORKPIECE - The invention discloses a low-cost apparatus for chemical solution preparation with controlled process parameters such as chemical age, temperature, yield of active ingredients at the point of use. In addition, this apparatus provides chamber-to-chamber consistency on these parameters across multiple processing chambers on a single wafer wet-clean system. The invention also discloses a method to use chemical solution mixture resident time to achieve optimal combined effect of temperature, reactivity and yield of active ingredients of chemical solution mixture for best wafer treatment results. | 04-07-2011 |
20110156696 | MULTIMETER - A multimeter has a plurality of control panels, a display screen that can change display orientation, and/or a magnetic portion to releasably support the multimeter. | 06-30-2011 |
20110177692 | Barrier Layer Removal Method and Apparatus - This invention relates to a method and apparatus by integrating semiconductor manufacturing processes of stress free electrochemical copper polishing (SFP), removal of the Tantalum oxide or Titanium oxide formed during SFP process and XeF | 07-21-2011 |
20110259752 | METHOD FOR SUBSTANTIALLY UNIFORM COPPER DEPOSITION ONTO SEMICONDUCTOR WAFER - The methods practiced in an electrochemical deposition apparatus with two or more electrodes, described in earlier inventions, are disclosed. The methods produce uniform copper films with WFNU less than 2.5% on semiconductor wafers bearing a resistive copper seed layer with a thickness ranging from 50 to 9O0 A in a copper sulfate based electrolyte whose conductivity is between 0.02 to 0.8 S/cm. | 10-27-2011 |
20110290277 | Methods and Apparatus for Cleaning Semiconductor Wafers - A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5λ/N for each rotation of the chuck, where λ is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5λn during the cleaning process, where λ is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1. | 12-01-2011 |
20120008595 | HANDOVER METHODS BETWEEN AN UNLICENSED MOBILE ACCESS NETWORK AND A CELLULAR COMMUNICATION NETWORK AND APPARATUSES THEREOF - The present invention relates to a handover technology between an unlicensed mobile access network and a cellular communication network. According to a first aspect of the present invention, a method of handing over a communication connection from an unlicensed mobile access network to a cellular communication network in a mobile terminal is provided. The method includes the following steps: acquiring a location information and/or moving direction and/or moving velocity of the mobile terminal ( | 01-12-2012 |
20120097195 | Methods and Apparatus for Cleaning Semiconductor Wafers - A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or count clockwise. | 04-26-2012 |
20120109991 | Input correction system based on translation search and method thereof - An input correction system based on translation search and the method thereof are provided. The invention searches a translation word according to a search message. When the translation word does not exist, the search message is compared with all similar messages in order to locate a matched word message. The word message is then taken as the search message to search the translation word again. The mechanism improves the convenience in searching for translation words. | 05-03-2012 |
20130241643 | SYSTEMS AND METHODS FOR ADAPTIVE EQUALIZATION CONTROL FOR HIGH-SPEED WIRELINE COMMUNICATIONS - Methods and systems for conditioning wireline communications to remove intersymbol interference are provided that used adaptive equalization. The method and systems include using a digital finite state machine to control two feedback loops that adjust the gain and power of the input signal relative to a supplied reference. The eye height of the input signal is conditioned by a gain feedback loop so that signal equalization can be performed in a known state. The digital finite state machine allows the loops to be flexibly run in sequence or concurrently. The adaptation functions can be shut off when adequate signal equalization has been achieve, thus saving power. | 09-19-2013 |
20130326346 | BRAINSTORMING IN A CLOUD ENVIRONMENT - The embodiments provide a cloud brainstorming service implemented on at least one cloud server. The brainstorming service includes a message service component configured to receive a plurality of ideas, over a network, from one or more users of devices. The users represent members of a brainstorming session. The brainstorming service also includes a brainstorming logic component configured to process the plurality of ideas and store the plurality of processed ideas in an in-memory database system, and a clustering component configured to retrieve the plurality of processed ideas from the in-memory database system and arrange the plurality of processed ideas into one or more clusters, where each cluster is a group of similar ideas. The message service component is configured to provide the plurality of processed ideas that are arranged into the one or more clusters, over the network, to the one or more users for display. | 12-05-2013 |
20140053978 | Barrier Layer Removal Method and Apparatus - A method and apparatus integrating semiconductor manufacturing processes of stress free electrochemical copper polishing (SFP), removal of the Tantalum oxide or Titanium oxide formed during SFP process and XeF | 02-27-2014 |
20140216940 | METHODS AND APPARATUS FOR UNIFORMLY METALLIZATION ON SUBSTRATES - An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining. | 08-07-2014 |
20140339614 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME - The present invention provides an image sensor and a method of fabricating the same. The image sensor comprises a semiconductor substrate, a photosensitive component, and a pixel-readout circuit, characterized in that, the semiconductor substrate comprises a supporting substrate, a first insulating buried layer, a first semiconductor layer, a second insulating buried layer, and a second semiconductor layer covered on the semiconductor substrate in sequence; the first semiconductor layer and the second semiconductor layer have different thicknesses, such that the photosensitive component is in the thicker semiconductor layer, and the pixel-readout circuit is in the thinner semiconductor layer. To realize the image sensor mentioned above, two different methods are provided. Ion implantation and bonding method are used respectively to provide the first and second insulating buried layers, and the first and second semiconductor layer substrates, and then the image sensor is fabricated. The image sensor in the present invention has a well anti-radiation character and a well semiconductor character, and a photosensitive zone that has higher light absorption rate. | 11-20-2014 |
20150069723 | VACUUM CHUCK - A vacuum chuck is disclosed for holding and positioning wafers more stably and securely. The vacuum chuck includes a supporting assembly having a receiving groove and at least one first vacuum aperture defined in the receiving groove. A seal unit includes a seal ring bulging to form a vacuum trough. The seal ring is fixed in the receiving groove of the supporting assembly and has at least one second vacuum aperture communicating with the first vacuum aperture. A chuck connector fastened with the supporting assembly has at least one vacuum port and at least one vacuum orifice communicating with the vacuum port. At least one vacuum hose connects the first vacuum aperture, the second vacuum aperture with the vacuum orifice and the vacuum port of the chuck connector for evacuating the air of the vacuum trough to hold and position the wafer on the seal ring and the supporting assembly. | 03-12-2015 |
20150072599 | NOZZLE FOR STRESS-FREE POLISHING METAL LAYERS ON SEMICONDUCTOR WAFERS - A nozzle for charging and ejecting electrolyte in SFP process is disclosed. The nozzle includes an insulated foundation defining a through-hole, a conductive body as negative electrode connecting with a power source for charging the electrolyte and an insulated nozzle head. The conductive body has a fixing portion located on the insulated foundation. The fixing portion protrudes to form a receiving portion inserted into the through-hole and defining a receiving hole passing therethrough and the fixing portion. The insulated nozzle head has a cover stably assembled with the insulated foundation above the conductive body and a tube extending through the cover and defining a main fluid path through where the charged electrolyte is ejected for polishing. The tube is inserted in the receiving hole and stretches out of the receiving hole of the conductive body. An auxiliary fluid path is formed between an inner circumferential surface of the receiving portion and an outer circumferential surface of the tube. | 03-12-2015 |