Shioga
Daisuke Shioga, Fukui JP
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20160114429 | DISSIMILAR METAL JOINED BODY - A dissimilar metal joined body includes a copper material, an aluminum material and a molten mixed portion. The molten mixed portion is configured so that part of the aluminum material is melted and flows into the copper material. The depth from a surface of the copper material which contacts the aluminum material in the molten mixed portion is at least 5 μm and no greater than 30 μm. | 04-28-2016 |
Takeshi Shioga, Kawasaki-Shi JP
Patent application number | Description | Published |
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20110073993 | Laminated thin-film device, manufacturing method thereof, and circuit - The present invention provides a novel capacitor element, laminated thin-film device, and circuit wherein the capacitance dependency on voltage can be appropriately adjusted, and a technology for manufacturing such a capacitor element and laminated thin-film device. In the capacitor element that comprises a pair of electrode layers and a dielectric layer disposed between the electrode layers, a well region where an ion is implanted is disposed in the dielectric layer, and the C-V curve between the electrode layers is shifted or shifted and expanded in at least one direction of the plus direction and minus direction with respect to the voltage axis. | 03-31-2011 |
Takeshi Shioga, Kanagawa JP
Patent application number | Description | Published |
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20090007405 | Capacitor device and method of manufacturing the same - A capacitor device includes a capacitor Q constituted by a lower electrode ( | 01-08-2009 |
Takeshi Shioga, Atsugi JP
Patent application number | Description | Published |
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20130044432 | LOOP HEAT PIPE, AND ELECTRONIC APPARATUS INCLUDING LOOP HEAT PIPE - There is provided a loop heat pipe which includes an evaporator that internally includes at least one wick built, a condenser, a liquid pipe and a vapor pipe that connect the evaporator and the condenser to each other, and a heat dispersion cavity that is formed inside the evaporator, and disperses a vapor, wherein the wick includes, a first wick that is porous, a second wick that is porous, the second wick being inserted into the first wick from the liquid pipe side and including a pore size larger than the first wick, and a vapor channel that is defined between the first wick and the second wick. The vapor channel is connected at an end on the liquid pipe side to the heat dispersion cavity. | 02-21-2013 |
20130223010 | SEMICONDUCTOR PACKAGE, COOLING MECHANISM AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor package includes a substrate with a first surface on which a semiconductor device is mounted and a second surface opposite to the first surface, and a loop heat pipe including an evaporator and attached to the second surface of the substrate, wherein the substrate has a groove structure in the second surface, the groove structure being in contact with a porous wick provided in the evaporator. | 08-29-2013 |
20160056089 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE - A semiconductor device includes: a first semiconductor element; a first substrate provided on the first semiconductor element and including a cavity with reduced pressure; coolant held inside the cavity; a second semiconductor element provided on the first substrate; and a heat spreading member thermally connected to the first substrate and provided with a hole communicated with the cavity. | 02-25-2016 |