Patent application number | Description | Published |
20100269040 | MOBILE TERMINAL AND CONTROL METHOD THEREOF - A method of controlling a mobile terminal is presented. The method includes detecting a first touch on the mobile terminal for a predetermined time when the mobile terminal is in a locked state, simultaneously displaying a locking icon and an unlocking icon in response to the detected first touch, and detecting a second touch on the locking icon or the unlocking icon, wherein touching the locking icon for a predetermined time will partially unlock the mobile terminal, and wherein touching and dragging the unlocking icon to the locking icon will fully unlock the mobile terminal. | 10-21-2010 |
20100317736 | COMPOSITION OF THE SKIN EXTERNAL APPLICATION OR THE FOOD FOR ACCELERATING PROLINE RECYCLING BY CONTAINING THEANINE - Disclosed herein is a composition for promoting proline recycling, and more particularly, to a composition for external application to skin or cosmetic food comprising theanine as an active ingredient for promoting expression or activity of prolidase, which is an enzyme to promote proline recycling, thereby increasing collagen synthesis and restoring wrinkle. | 12-16-2010 |
20110268824 | COMPOSITION FOR PREVENTING OR TREATING ARTHEROSCLEROSIS - A composition according to the present invention is a composition containing extract of | 11-03-2011 |
20110289169 | METHOD AND APPARATUS FOR MANAGING SPAM MESSAGE IN MESSAGING SERVICE - A method and apparatus for managing a spam message in a messaging service are disclosed. When a user reports a message determined as a spam message, he may directly select a sharing level of his personal information in order to prevent a leakage of the personal information according to a sharing policy, reports the spam message by transmitting only a hash value of the spam message in order to prevent an increase in traffic. With respect to reported spam messages, a user can access a spam server to check an errononeously reported message through a sorting algorithm. | 11-24-2011 |
20120006687 | METHOD OF FORMING CIGS THIN FILM - Disclosed herein is a method of forming a CIGS thin film, comprising the steps of: immersing a substrate comprising an electrode into an electrolyte solution comprising Na | 01-12-2012 |
20140374178 | DEVICE FOR DRIVING REAR WHEEL OF ELECTRIC VEHICLE - A device for driving a rear wheel of an electric vehicle is provided. In one embodiment, the rear wheel driving device includes a motor for supplying rotational power, a gear group connected to a rotor of the motor, a final gear connected to the gear group, an output shaft connected to the final gear and rotating, a hub installed on an outer circumferential surface of the output shaft using a nut, a wheel connected to the hub, an axle housing connected to the hub using a hub bearing, a motor cover protecting the motor and mounting an output shaft bearing, and a trailing arm connected to the axle housing using an axle housing bolt and configured to mount the motor from an exterior side to an interior side of a vehicle. | 12-25-2014 |
Patent application number | Description | Published |
20090104467 | SURFACE PROTECTIVE FILM, METHOD FOR FABRICATING THE SAME, POUCH THEREOF AND METHOD FOR FABRICATING THE SAME - Disclosed is a surface protective film, a method for fabricating the same, and pouch, and a method for fabricating the same. The surface protective film includes a stack of films including a middle layer, and a first skin layer and a second skin layer on opposite sides of the middle layer, wherein at least one of the first skin layer and the second skin layer is formed of a resin having a hardness lower than a hardness of a surface to be protected by the surface protective film, and the middle layer is formed of a resin including high density polyethylene, thereby permitting protection of a display surface without formation of scratch at a very low cost compared to the related art without aging and with slip. | 04-23-2009 |
20100020531 | BACK LIGHTING UNIT HAVING PHOSPHOR FILM STRUCTURE - A back lighting unit is disclosed in which lower and upper surfaces of a light transmitting plate function as incident and exit surfaces of light, respectively, and a phosphor film structure for wavelength-converting the light is provided at a position which the light is incident on or exits from. The disclosed back lighting unit includes a light emitting means including a light emitting diode disposed to emit light upwards; a light transmitting plate disposed over the light emitting diode, the light transmitting plate having a lower surface allowing light to be incident thereon and an upper surface allowing light to exit therefrom; and a phosphor film structure including a particulate phosphor and formed on at least one of the lower and upper surfaces of the light transmitting plate. | 01-28-2010 |
20100025700 | WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME - A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generatea base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K. | 02-04-2010 |
20100155278 | Protective film-integrated pouch - Disclosed is a protective film-integrated pouch wherein a protective film to protect a display panel and a bag to cover and package the display panel are integrally formed. The protective film-integrated pouch includes a rectangular body, including upper and lower layers, the body having three sealed edges and one opened edge to define an opening, allowing insertion of a display panel into the pouch, wherein each of the upper layer and the lower layer includes a base layer made of a metallic material, an outer surface layer disposed on the base layer, and an inner surface layer disposed on the outer surface layer, wherein the inner surface layer contacts the display panel and is made of a mixed polyethylene resin. | 06-24-2010 |
20100219428 | WARM WHITE LIGHT EMITTING APPARATUS AND BACK LIGHT MODULE COMPRISING THE SAME - A warm white light emitting apparatus includes a first light emitting diode (LED)-phosphor combination to generate a base light that is white or yellowish white and a second LED-phosphor combination to generate a Color Rendering Index (CRI) adjusting light. The base light and the CRI adjusting light together make a warm white light having a color temperature of 2500 to 4500K. | 09-02-2010 |
20100237800 | LIGHT EMITTING DEVICE AND DRIVING CIRCUIT THEREOF - A light emitting device comprises a first light emitting unit and a second light emitting unit connected in series with each other, and a PTF unit connected in parallel with the first light emitting unit and in series with the second light emitting unit. Each of the first light emitting unit and second light emitting unit comprises at least one LED. The PTF unit allows the second light emitting unit to be operated before operation of the first light emitting unit upon application of an AC voltage source. The light emitting device reduces total harmonic distortion and flickering, and improves power factor and optical efficiency. A driving circuit of the light emitting device is also disclosed. | 09-23-2010 |
20110181196 | DIMMER FOR A LIGHT EMITTING DEVICE - Exemplary embodiments of the present invention relate to a dimmer for a light emitting device using an alternating (AC) voltage source. The dimmer includes a switch to be switched in response to a switching control signal and to deliver an AC voltage of an AC voltage source to the light emitting device, a current detector to detect an electric current to be provided to the light emitting device and to output a current detection signal, and a controller to output the switching control signal in response to a dimming control signal and the current detection signal. | 07-28-2011 |
20120183706 | CELL PACKAGING MATERIAL AND METHOD FOR MANUFACTURING SAME - Cell packaging according to one embodiment of the present invention comprises: a base film layer; and a print layer provided beneath or on the base film layer, and including a binder resin and carbon black. The base film layer or print layer of the cell packaging is partially removed by means of laser irradiation to expose the layer under same. Therefore, according to the cell packaging of the invention, a wide range of shapes or logos, etc. can easily be externally displayed so as to be discernible by means of laser irradiation. By thus imparting discernibility and externality to the cell packaging, a labeling process for attaching a separate label to the cell packaging can be excluded. | 07-19-2012 |
Patent application number | Description | Published |
20090003015 | Light Guide Device and Back Lighting Module Comprising the Same - A light guide device is used in a back light module that more uniformly mixes different colored light emitted from a plurality of LEDs and transfers the mixed light to a display panel, wherein a light loss can be minimized during the light mixing process and the light can be more uniformly mixed. A light guide device is disclosed for mixing different colored light emitted from a plurality of light emitting diodes (LEDs) and guiding the mixed light to a display panel, wherein the light guide device comprises a light guide portion in the form of a plate arranged at a rear of the display panel; and a light mixing portion formed integrally with the light guide portion and including a light incidence surface adjacent to the plurality of LEDs and a light mixing area for mixing the light with difference colors incident through the light incidence surface. | 01-01-2009 |
20090004778 | Manufacturing Method of Light Emitting Diode - Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners. | 01-01-2009 |
20090230419 | LIGHT EMITTING DEVICE - The present invention provides a light emitting device which comprises a blue light emitting diode, and at least an orthosilicate based phosphor for emitting light ranging from a green to yellow regions and a nitride or oxynitride based phosphor for emitting light in a red region over the light emitting diode. Accordingly, since white light with a continuous spectrum ranging from green to red can be implemented, a light emitting device with improved color rendering can be provided, and the light emitting device can be used for a general illumination or a flash. Further, since the phosphors having stable chemical characteristics against their external environment such as moisture are employed, the stability in optical characteristics of the light emitting device can also be improved. | 09-17-2009 |
20090315053 | LIGHT EMITTING DEVICE - The present invention provides a light emitting device, comprising a first light emitting diode for emitting light in an ultraviolet wavelength region; at least one phosphor arranged around the first light emitting diode and excited by the light emitted from the first light emitting diode to emit light having a peak wavelength longer than the wavelength of the light emitted from the first light emitting diode; and at least one second light emitting diode for emitting light having a wavelength different from the peak wavelength of the light emitted from the phosphor. According to the present invention, there is provided a white light emitting device, wherein using a light emitting diode for emitting light different in wavelength from light that is ex-cititively emitted from the phosphor, an excitation light source, i.e., light in the ultraviolet region for exciting the phosphor is effectively used, thereby improving energy conversion efficiency and improving reliability. | 12-24-2009 |
20100159620 | MANUFACTURING METHOD OF LIGHT EMITTING DIODE - Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners. | 06-24-2010 |
20120211781 | LIGHT EMITTING DEVICE - The present invention provides a light emitting device, comprising a first light emitting diode for emitting light in an ultraviolet wavelength region; at least one phosphor arranged around the first light emitting diode and excited by the light emitted from the first light emitting diode to emit light having a peak wavelength longer than the wavelength of the light emitted from the first light emitting diode; and at least one second light emitting diode for emitting light having a wavelength different from the peak wavelength of the light emitted from the phosphor. | 08-23-2012 |
Patent application number | Description | Published |
20100000675 | METHOD AND APPARATUS FOR MANUFACTURING MULTI-LAYER SUBSTRATE - Provided are a method and apparatus for manufacturing a multi-layer substrate. The method includes: rolling out a base substrate that is rolled up into a substrate supply roll and delivering the base substrate to a compression roller system; compressing and laminating a laminating material on the base substrate in a vacuum state using the compression roller system; and cooling the base substrate on which the laminating material is laminated. | 01-07-2010 |
20110132651 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one bump is formed so as to cover the at least one bump; and etching a second side of the conductive board so as to partially remove the board to form a pattern. | 06-09-2011 |
20120292092 | METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTURED BY THE METHOD - A method of manufacturing a circuit board includes: providing a base substrate that comprises a first electrically conductive layer that has an inner circuit pattern formed on at least one surface of the base substrate; attaching a build-up material to the base substrate to insulate the first electrically conductive layer from outside; forming one or more holes at one time in the build-up material attached to the base substrate; forming a stack by curing the build-up material in which the one or more holes are formed; and forming a second electrically conductive layer that has an outer circuit pattern formed on at least one outer surface of the stack. The method may form the holes without drilling. | 11-22-2012 |
20120298409 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Provided are a circuit board and a method of manufacturing the same which increase a peel strength between a prepreg and a copper plating layer. The method includes: providing a substrate including a first circuit pattern and a first prepreg; forming a plurality of holes on a top surface of the first prepreg; removing silica fillers contained in inner walls of the plurality of holes; and performing copper plating on the top surface of the first prepreg. | 11-29-2012 |
20130161073 | METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY USING THE METHOD - A method of manufacturing a multi-layer circuit board includes: forming a first circuit layer on a first surface of a first prepreg; stacking a second prepreg on a first surface of the first circuit layer; and forming at least one of a second or a third circuit layer on at least one of a first surface of the second prepreg and a second surface opposite of the first surface of the first prepreg, wherein, in the stacking of the first prepreg, the first prepreg and the second prepreg are semi-cured. | 06-27-2013 |
20130192885 | METHOD OF FORMING SOLDER RESIST LAYER AND PRINTED CIRCUIT BOARD COMPRISING SOLDER RESIST LAYER - Provided are a method of forming a solder resist layer on a printed circuit board (PCB) and a PCB comprising the solder resist layer. The method includes: preparing a PCB of which at least one surface has a circuit layer formed thereon, bonding an insulation layer, including a material having a non-photosensitive characteristic, in a half-cured state on the circuit layer, forming a solder resist layer patterned by selectively removing the insulation layer, and curing the insulation layer. | 08-01-2013 |
20140113415 | METHOD OF MANUFACTURING CIRCUIT BOARD AND CHIP PACKAGE AND CIRCUIT BOARD MANUFACTURED BY USING THE METHOD - Provided is a method of manufacturing a circuit board. The method includes: preparing a base substrate including a core layer and a first conductive layer that is formed on at least one surface of the core layer and includes an internal circuit pattern; forming a build-up material to cover the first conductive layer; forming in the build-up material at least one cavity through which the core layer and the first conductive layer are exposed; forming a laminated body by curing the build-up material in which the at least one cavity is formed; and forming a second conductive layer including an external circuit pattern on an outer surface of the laminated body. | 04-24-2014 |
Patent application number | Description | Published |
20090058838 | Source driver, display device and system having the same, and data output method thereof - Disclosed is an output method of a source driver, which may include the steps of receiving image data, converting the image data into analog image signals, and distributionally outputting the analog image signals based on pluralities of delayed control signals, wherein the pluralities of delayed control signals may be generated by delaying an external control signal. | 03-05-2009 |
20130068510 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING VIAS AND FINE CIRCUIT AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME - Provided is a method of manufacturing a circuit which includes: (a) providing a substrate made of a conductive material; (b) etching a first surface of the substrate excluding a region in which at least one via is to be formed; (c) etching a region of the etched first surface of the substrate in which an insulated portion of a first circuit is to be formed; (d) stacking a first insulation layer in spaces formed by the etching performed in operations (b) and (c); and (e) grinding a second surface of the substrate to expose the first insulation layer outward along with the first circuit, thereby forming a circuit board. | 03-21-2013 |
20130105214 | METHOD FOR MANUFACTURING CIRCUIT BOARD PROVIDED WITH METAL POSTS AND CIRCUIT BOARD MANUFACTURED BY THE METHOD | 05-02-2013 |
20130168349 | METHOD OF FORMING VIA HOLE IN CIRCUIT BOARD - A method of forming a via hole in a circuit board including an insulating layer and a metal layer disposed on each of top and bottom surfaces of the insulating layer, the method including: selectively removing a portion of each of the metal layers where the via hole is to be formed thereby exposing the insulating layer; and removing the exposed insulating layer, wherein the removing of the exposed insulating layer includes chemically swelling the exposed insulating layer and removing the swollen insulating layer. | 07-04-2013 |
20150049076 | DISPLAY DRIVING CIRCUIT AND DISPLAY DEVICE - A display device includes a timing controller to generate a plurality of data control signals, a source driving unit to receive the plurality of data control signals from the timing controller and generate a data voltage, and a display panel to receive the data voltage and output an image, wherein the source driving unit transmits the data voltage to the display panel, through a plurality of data lines, with delays that are respectively different corresponding each frame. | 02-19-2015 |
Patent application number | Description | Published |
20120080723 | FABRICATING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATED USING THE SAME METHOD - A fabricating method of a semiconductor device includes providing a substrate having a first region and a second region, forming a plurality of first gates in the first region of the substrate, such that the first gates are spaced apart from each other at a first pitch, forming a plurality of second gates in the second region of the substrate, such that the second gates are spaced apart from each other at a second pitch different from the first pitch, implanting an etch rate adjusting dopant into the second region to form implanted regions, while blocking the first region, forming a first trench by etching the first region between the plurality of first gates, and forming a second trench by etching the second region between the plurality of second gates. | 04-05-2012 |
20120302034 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device is provided. The method includes providing a substrate having a protruding channel region, forming a gate insulation layer surrounding the protruding channel region, forming a sacrificial layer having an etch selectivity varying in a thickness direction of the sacrificial layer, on the gate insulation layer, and performing a gate-last process to form a gate electrode on the gate insulation layer in place of the sacrificial layer. | 11-29-2012 |
20130149499 | MAGNETIC DEVICES AND METHODS OF MANUFACTURING THE SAME - Magnetic devices, and methods of manufacturing the same, include a stack structure including at least one magnetic layer, etched using an etching gas including at least 70 volume percent of a hydrogen-containing gas and at least 2 volume percent of CO gas. | 06-13-2013 |
20140110757 | FABRICATING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATED USING THE SAME METHOD - A fabricating method of a semiconductor device includes providing a substrate having a first region and a second region, forming a plurality of first gates in the first region of the substrate, such that the first gates are spaced apart from each other at a first pitch, forming a plurality of second gates in the second region of the substrate, such that the second gates are spaced apart from each other at a second pitch different from the first pitch, implanting an etch rate adjusting dopant into the second region to form implanted regions, while blocking the first region, forming a first trench by etching the first region between the plurality of first gates, and forming a second trench by etching the second region between the plurality of second gates. | 04-24-2014 |
Patent application number | Description | Published |
20130169316 | TRI-STATE CONTROL FOR A LINE DRIVER - A tri-state control mechanism can be implemented for a line driver of a transmitter unit to switch the output impedance of the transmitter unit between a low impedance state in the transmit mode and a high impedance state in the receive mode while minimizing turn-off glitch. It may be determined whether a communication device comprising the transmitter unit is configured in a transmit operating mode or a receive operating mode. If the communication device is configured in the receive operating mode, a first bias voltage can be generated to bias output transistors of the line driver circuit in a sub-threshold state. If the communication device is configured in the transmit operating mode, a second bias voltage can be generated to bias output transistors of the line driver circuit in a saturation state. | 07-04-2013 |
20130335250 | HYBRID SUCCESSIVE APPROXIMATION ANALOG-TO-DIGITAL CONVERTER - A hybrid SAR ADC can be implemented to reduce the number of operations that are executed to convert an analog input signal into its digital representation. Pipeline processing operations can be executed on the analog input signal to generate pipeline bits (MSBs of the digital representation) and an analog residue signal. The analog residue signal can be compared against a plurality of thresholds to generate comparator bits that are indicative of a range associated with a subset of the predetermined thresholds that correspond to the analog residue signal. Successive approximation analog-to-digital conversion operations can be executed on the analog residue signal to generate successive approximation bits. The digital representation can be determined based, at least in part, on the pipeline bits, the comparator bits, and the successive approximation bits. | 12-19-2013 |
20140253357 | LOW GLITCH-NOISE DAC - An N-bit digital-to-analog converter (DAC) includes N input stages each of which generates the same amount of current and includes a pair of similarly sized transistor switches responsive to differential bits. The 2 | 09-11-2014 |
20140370803 | METHODS AND APPARATUS FOR IMPROVING REMOTE NFC DEVICE DETECTION USING A LOW POWER OSCILLATOR CIRCUIT - A method, an apparatus, and a computer program product for inductive communication are provided in connection with providing mechanisms for detecting a remote NFC device without excessive power consumption. In one example, a communications device is equipped to monitor frequency oscillations associated with a NFC antenna using a calibrated LPO, determine that a number of occurrences of the frequency oscillations from a reference frequency is greater than a frequency deviation threshold, and perform a NFC polling procedure in response to the determination. | 12-18-2014 |
Patent application number | Description | Published |
20100126873 | MANUFACTURING METHOD OF 3D SHAPE STRUCTURE HAVING HYDROPHOBIC INNER SURFACE - The present invention relates to a manufacturing method of a three dimensional structure having a hydrophobic inner surface. The manufacturing method includes anodizing a three dimensional metal member and forming fine holes on an external surface of the metal member, forming a replica by coating a non-wetting polymer material on the outer surface of the metal member and forming the non-wetting polymer material to be a replication structure corresponding to the fine holes of the metal member, forming an exterior by surrounding the replication structure with an exterior forming material, and etching the metal member and eliminating the metal member from the replication structure and the exterior forming material. | 05-27-2010 |
20100252525 | MANUFACTURING METHOD OF 3D SHAPE STRUCTURE HAVING HYDROPHOBIC EXTERNAL SURFACE - The present invention relates to a three-dimensional structure manufacturing method for performing surface treatment processes, and a replication step to provide hydrophobicity on an external surface of the three-dimensional structure. In the manufacturing method, the hydrophobicity may be provided to the external surface of the three-dimensional structure, a high cost device required in the conventional MEMS process is not used, the manufacturing cost is reduced, and the manufacturing process is simplified. In addition, it has been difficult to provide the hydrophobicity on an external surface of a three-dimensional structure having a large surface due to a spatial limitation, but in the exemplary embodiment of the present invention, the hydrophobicity may be provided to the external surface of the three-dimensional structure having a large surface, such as a torpedo, a submarine, a ship, and a vehicle, without the spatial limitation. | 10-07-2010 |
Patent application number | Description | Published |
20100099215 | THIN FILM TRANSISTOR, FLAT PANEL DISPLAY INCLUDING THE THIN FILM TRANSISTOR, AND METHOD FOR MANUFACTURING THE THIN FILM TRANSISTOR AND THE FLAT PANEL DISPLAY - A thin film transistor having a transformed region that provides the same result as patterning a semiconductor layer, a flat panel display having the thin film transistor and a method for manufacturing the thin film transistor and the flat panel display are disclosed. The thin film structure includes a gate electrode, a source and a drain electrode, each insulated from the gate electrode and an organic semiconductor layer coupled to the source electrode and the drain electrode. The organic semiconductor layer includes the transformed region having a crystal structure distinguished from crystal structures of regions around the channel region. | 04-22-2010 |
20100252803 | THIN FILM TRANSISTOR HAVING A NANO SEMICONDUCTOR SHEET AND METHOD OF MANUFACTURING THE SAME - Provided are a nano semiconductor sheet, a thin film transistor (TFT) using the nano semiconductor sheet, and a flat panel display using nano semiconductor sheet. The nano semiconductor sheet has excellent characteristics, can be manufactured at room temperature, and has good flexibility. The nano semiconductor sheet includes: a first film and a second film disposed on at least one side of or inside of the first film, and includes a plurality of nano particles arranged substantially in parallel to each other. In addition, provided are a method of manufacturing a nano semiconductor sheet and methods of manufacturing a TFT and a flat panel display using the nano semiconductor sheet. The method of manufacturing a nano semiconductor sheet, includes: forming first polymer micro-fibers having a plurality of nano particles arranged substantially in parallel; preparing a first film; and arranging a plurality of the first micro-fibers on at least one side of or inside of the first film. | 10-07-2010 |
20110126513 | Exhaust Purification System for Internal Combustion Engine and Desulfurization Method for the Same - An exhaust purification system for an internal combustion engine, and a desulfurization method for the same, recovers purification performance of a denitrification catalyst by removing sulfur poisoned at the denitrification catalyst in an exhaust system. The exhaust purification system may include an exhaust pipe through which an exhaust gas flows, the exhaust gas being generated at the internal combustion engine having a first injector injecting a fuel to a combustion chamber, a second injector mounted at the exhaust pipe and additionally injecting the fuel, a particulate filter mounted at the exhaust pipe downstream of the second injector and filtering particulate matters (PM) in the exhaust gas, a denitrification catalyst mounted at the exhaust pipe downstream of the particulate filter and reducing nitrogen oxide contained in the exhaust gas, and a control portion performing desulfurization of the denitrification catalyst when a desulfurization entering condition and a desulfurization condition are satisfied during regenerating the particulate filter. | 06-02-2011 |
Patent application number | Description | Published |
20100158009 | HIERARCHICAL PACKET PROCESS APPARATUS AND METHOD - Provided is a hierarchical packet processing apparatus and method. In one general aspect, a packet is analyzed, divided into an upper layer and a lower layer. It is determined whether a property of the packet to be analyzed has been already analyzed or has to be re-analyzed with respect to each of the upper and lower layers of the packet. Therefore, deep packet inspection is performed only when it is required, and thus assurance of quality of service (QoS) during packet processing can be achieved, as well as reduced waste of resources. | 06-24-2010 |
20120163163 | APPARATUS AND METHOD FOR PROTECTION SWITCHING OF MULTIPLE PROTECTION GROUP - There is provided a protection switching apparatus including: a path management unit to establish a plurality of connection paths for transmitting/receiving packets, and a plurality of protection paths that are able to substitute for the plurality of connection paths, respectively, and to create a protection group including the connection paths and the protection paths; a protection group controller to determine whether failure has occurred on the connection paths, based on path state information for each path included in the protection group, the path state information stored in the protection group table storage, and to issue an instruction for protection switching, according to the result of the determination; and a protection switching unit to perform protection switching of a path in which failure has occurred to a protection path corresponding to the path in which failure has occurred, according to the instruction for protection switching. | 06-28-2012 |
20120280961 | LIQUID CRYSTAL PANEL DRIVING CIRCUIT FOR DISPLAY STABILIZATION - Disclosed is a liquid crystal panel driving circuit of display stabilization, including: a plurality of output buffers buffering data voltage and supplying or cutting off the buffered data voltage to or from each of the plurality of data lines; an output MUX switch receiving outputs from two adjacent output buffers of the plurality of output buffers and transferring one of the two outputs to the plurality of data lines; a garbage switch connecting each of the plurality of data lines to a ground terminal; and a power on sensor or a power off sensor generating a power on or off reset signal in response to a turn on/off of a power supply voltage, wherein the output MUX switch is turned-off and the charge share switch and the garbage switch are turned-on, in response to the power on reset signal or the power off reset signal. | 11-08-2012 |
20140160931 | APPARATUS AND METHOD FOR MANAGING FLOW IN SERVER VIRTUALIZATION ENVIRONMENT, AND METHOD FOR APPLYING QOS - An apparatus and method for managing a flow in a server virtualization environment, and a method of applying a QoS policy, the method including a flow processing unit configured to analyze a flow generated by a virtual machine (VM) to extract flow information, determine whether the flow is a new flow by comparing the extracted flow information with preset flow information, and apply a corresponding Quality of Service (QoS) policy to the flow, and a QoS management unit configured to, in a case in which the flow is a new flow, generate a QoS policy for the analyzed flow based on the extracted flow information and prestored virtual machine information, and transmit the generated QoS policy to the flow processing unit. | 06-12-2014 |
20150022244 | SOURCE DRIVER AND BIAS CURRENT ADJUSTING METHOD THEREOF - Disclosed are a source driver provided in a display device that displays an image and a bias current adjusting method thereof, and a bias current deviating from a prescribed range is adjusted so that a source driver is driven by a bias current within the prescribed range. | 01-22-2015 |
Patent application number | Description | Published |
20100137739 | METHOD AND DEVICE FOR HEARING TEST - A method of conducting a hearing test, and a device to perform the method, the method including configuring multiple test sound sets including multiple sound sources at each included audio frequency, wherein the sound sources, when sequentially arranged according to volume, have a uniform volume difference and a same frequency band, the uniform volume difference indicating a volume difference between neighboring sound sources, outputting the sound sources included in one of the multiple test sound sets, and determining and outputting a following test sound set according to a subject's input sound sources' number one or more times, and determining an auditory threshold of the subject regarding the audio frequency of the output test sound sets based on a result of the subject's input. | 06-03-2010 |
20110200216 | FITTING SYSTEM OF DIGITAL HEARING AID TO BE CAPABLE OF CHANGING FREQUENCY BAND AND CHANNEL - Disclosed is a digital hearing aid fitting system capable of changing a frequency band and channel. The digital hearing aid fitting system capable of changing the frequency band and channel may include a digital signal processing (DSP) chip to adjust a fitting parameter including at least one parameter from among a number of bands of a frequency, a bandwidth, and a number of channels of the frequency, and a controlling unit to control the DSP chip based on a hearing test result to adjust the fitting parameter to a person with hearing loss. | 08-18-2011 |