Patent application number | Description | Published |
20080258278 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging - A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation. | 10-23-2008 |
20110001224 | LEAD FRAME ROUTED CHIP PADS FOR SEMICONDUCTOR PACKAGES - A redistributed lead frame for use in a molded plastic semiconductor package is formed from an electrically conductive substrate by a sequential metal removal process. The process includes patterning a first side of the substrate to form an array of lands separated by channels; disposing a first molding compound within those channels; patterning a second side of the substrate to form an array of chip attach sites and routing circuits electrically interconnecting the array of lands and the array of chip attach sites; directly electrically interconnecting input/output pads on a semiconductor device to the chip attach sites; and encapsulating the semiconductor device, the array of chip attach sites and the routing circuits with a second molding compound. This process is particularly suited for the manufacture of chip scale packages and very thin packages. | 01-06-2011 |
20110057298 | Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging - A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation. | 03-10-2011 |
20110111562 | Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging - A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom. A major portion of the manufacturing process steps is performed with a partially patterned strip of metal formed into a web-like lead frame on one side so that the web-like lead frame is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes, both at the chip level and the package level. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation. | 05-12-2011 |
20110304032 | NO LEAD PACKAGE WITH HEAT SPREADER - A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and electrically interconnecting the integrated circuit device to the leads; positioning a heat spreader in non-contact proximity to the integrated circuit device such that the integrated circuit device is disposed between the leads and the heat spreader; and encapsulating the integrated device and at least a portion of the heat spreader and leads in a molding resin. | 12-15-2011 |
20120126378 | SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING - A package for a semiconductor device includes shielding from RF interference. The package has a lead frame with a lead and a connecting bar. The lead has an inner end for connecting to the device and an outer end having an exposed surface at the package side face. The connecting bar also has an end with an exposed surface at the package side face. A molding compound overlying the leadframe forms a portion of the side face. Electrically conductive shielding forms a top surface of the package, and extends downward therefrom to form an upper portion of the package side face. The exposed surface at the connecting bar end has an upper edge higher than the upper edge of the exposed surface of lead end. Accordingly, the shielding makes electrical contact with the connecting bar adjacent to its exposed surface, while being electrically isolated from the lead. | 05-24-2012 |
Patent application number | Description | Published |
20140032591 | SYSTEM AND METHOD FOR IMPROVING HARDWARE UTILIZATION FOR A BIDIRECTIONAL ACCESS CONTROL LIST IN A LOW LATENCY HIGH-THROUGHPUT NETWORK - A method in an example embodiment includes creating a first search key from variable data of a message received in a network environment, creating a second search key from constant data of the message, identifying a first database entry in a first database based on the first search key, and identifying a second database entry in a second database based on the second search key. The method can also include performing an action associated with the first database entry when a correlation is identified between the first and second database entries. In specific embodiments, the variable data are modified and the constant data are not modified. The first search key can be created prior or subsequent to forwarding the message. In further embodiments, the correlation is identified when an offset of the first database entry is the same as an offset of the second database entry. | 01-30-2014 |
20140078902 | Scalable Low Latency Multi-Protocol Networking Device - A network device receives a packet that includes a plurality of sets of fields. Sets of fields of the packet are parsed and the field sets are evaluated as soon as they are available to determine whether a processing decision can be made on the packet. Additional field sets may be parsed from the packet and obtained in parallel with determining whether a processing decision can be made, but once it is determined that a processing decision can be made, the evaluating of field sets is terminated such that any further field sets of the packet are ignored for purposes of making a processing decision for the packet. | 03-20-2014 |
20140079062 | Ultra Low Latency Multi-Protocol Network Device - Presented herein are techniques to achieve ultra low latency determination of processing decisions for packets in a network device. A packet is received at a port of a network device. A processing decision is determined in a first processing decision path based on content of the packet and one or more network policies. A processing decision is determined in a second processing decision path, in parallel with the first processing path, by accessing a table storing processing decisions. The second processing decision path can output a processing decision faster than the first processing decision path for packets that match one or more particular packet flow parameters contained in the table. A processing decision determined by the second processing decision path, if one can be made, is used, and otherwise a processing decision determined by the first processing decision path is used. | 03-20-2014 |
20140079063 | Low Latency Networking Device Using Header Prediction - A network device receives a packet that includes a plurality of header fields. The packet is parsed to sequentially obtain the plurality of header fields. One or more header fields not yet available at the network device are predicted based on one or more header fields that are available at the network device. A network processing decision is generated for the packet based on the predicted one or more header fields and the one or more header fields that are available at the network device. | 03-20-2014 |
20140156667 | Increasing Internet Protocol Version 6 Host Table Scalability in Top of Rack Switches for Data Center Deployments - Techniques are provided for optimizing storage of address information in switch device databases. A control packet is received from a source host. An address associated with a host is determined. The address comprises a first and second address component. The first address component is stored in a first database and is mapped to an index value that is stored in the first database. The index value is also stored in a second database along with the second address component. The first database may also be examined to determine whether the first address component is stored in the first database. If the first address component is stored in the first database, the index value mapped to the first address component is retrieved. The second database is examined to determine whether the index value and the second address component are stored in the second database. | 06-05-2014 |