Patent application number | Description | Published |
20080220574 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A method of fabricating a complementary metal oxide semiconductor (CMOS) device is provided. A first conductive type MOS transistor including a source/drain region using a semiconductor compound as major material is formed in a first region of a substrate. A second conductive type MOS transistor is formed in a second region of the substrate. Next, a pre-amorphous implantation (PAI) process is performed to amorphize a gate conductive layer of the second conductive type MOS transistor. Thereafter, a stress-transfer-scheme (STS) is formed on the substrate in the second region to generate a stress in the gate conductive layer. Afterwards, a rapid thermal annealing (RTA) process is performed to activate the dopants in the source/drain region. Then, the STS is removed. | 09-11-2008 |
20080237734 | COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR TRANSISTOR AND METHOD OF FABRICATING THE SAME - A complementary metal-oxide-semiconductor (CMOS) transistor comprising a substrate, a first conductive type MOS transistor, a second conductive type MOS transistor, a buffer layer, a first stress layer and a second stress layer is provided. The substrate has a device isolation structure therein that defines a first active area and a second active area. The first conductive type MOS transistor and the second conductive type MOS transistor are respectively disposed in the first active area and the second active area of the substrate. A first nitride spacer of the first conductive type MOS transistor has a thickness greater than that of a second nitride spacer of the second conductive type MOS transistor. The buffer layer is disposed on the first conductive type MOS transistor. The first stress layer is disposed on the buffer layer. The second stress layer is disposed on the second conductive type MOS transistor. | 10-02-2008 |
20080242031 | METHOD FOR FABRICATING P-CHANNEL FIELD-EFFECT TRANSISTOR (FET) - A method for fabrication a p-type channel FET includes forming a gate on a substrate. Then, a PAI ion implantation process is performed. Further, a pocket implantation process is conducted to form a pocket region. Thereafter, a first co-implantation process is performed to define a source/drain extension region depth profile. Then, a p-type source/drain extension region is formed. Afterwards, a second co-implantation process is performed to define a source/drain region depth profile. Thereafter, an in-situ doped epitaxy growth process is performed to form a doped semiconductor compound for serving as a p-type source/drain region. | 10-02-2008 |
20090166625 | MOS DEVICE STRUCTURE - The present invention provides a method for forming a metal-oxide-semiconductor (MOS) device and the structure thereof. The method includes at least the steps of forming a silicon germanium layer by the first selective epitaxy growth process and forming a cap layer on the silicon germanium layer by the second selective epitaxy growth process. Hence, the undesirable effects caused by ion implantation can be mitigated. | 07-02-2009 |
20090239347 | METHOD OF FORMING MOS DEVICE - The present invention provides a method for forming a metal-oxide-semiconductor (MOS) device. The method includes at least the steps of forming a silicon germanium layer by the selective epitaxy growth process and forming a cap layer on the silicon germanium layer by the selective growth process. Hence, the undesirable effects caused by ion implantation can be mitigated. | 09-24-2009 |
20110097868 | METHOD FOR FABRICATING P-CHANNEL FIELD-EFFECT TRANSISTOR (FET) - A method for fabrication a p-type channel FET includes forming a gate on a substrate. Then, a PAI ion implantation process is performed. Further, a pocket implantation process is conducted to form a pocket region. Thereafter, a first co-implantation process is performed to define a source/drain extension region depth profile. Then, a p-type source/drain extension region is formed. Afterwards, a second co-implantation process is performed to define a source/drain region depth profile. Thereafter, an in-situ doped epitaxy growth process is performed to form a doped semiconductor compound for serving as a p-type source/drain region. | 04-28-2011 |
20110104864 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A method of fabricating a complementary metal oxide semiconductor (CMOS) device is provided. A first conductive type MOS transistor including a source/drain region using a semiconductor compound as major material is formed in a first region of a substrate. A second conductive type MOS transistor is formed in a second region of the substrate. Next, a pre-amorphous implantation (PAI) process is performed to amorphize a gate conductive layer of the second conductive type MOS transistor. Thereafter, a stress-transfer-scheme (STS) is formed on the substrate in the second region to generate a stress in the gate conductive layer. Afterwards, a rapid thermal annealing (RTA) process is performed to activate the dopants in the source/drain region. Then, the STS is removed. | 05-05-2011 |
20110156156 | SEMICONDUCTOR DEVICE - A semiconductor device comprises a substrate, a first stress, and a second stress. The substrate has a first-type MOS transistor, an input/output (I/O) second-type MOS transistor, and a core second-type MOS transistor formed thereon. The first-type and the second-type are opposite conductivity types with respect to each other. The first stress layer is only disposed on the first-type MOS transistor, and the second stress layer is different from the first stress, and is only disposed on the core second-type MOS transistor. The I/O second-type MOS transistor is a type of I/O MOS transistor and without not noly the first stress layer but also the second stress layer disposed thereon, the core second-type MOS transistor is a type of core MOS transistor. | 06-30-2011 |
20110254064 | SEMICONDUCTOR DEVICE WITH CARBON ATOMS IMPLANTED UNDER GATE STRUCTURE - An exemplary semiconductor device includes a substrate, a spacer, a metal silicide layer and carbon atoms. The substrate has a gate structure formed thereon. The spacer is formed on the sidewall of the gate structure. The spacer has a first side adjacent to the gate structure and a second side away from the gate structure. The metal silicide layer is formed on the substrate and adjacent to the second side of the spacer but away from the first side of the spacer. The carbon atoms are formed into the substrate and adjacent to the first side of the spacer but away from the second side of the spacer. | 10-20-2011 |
20120009745 | METHOD FOR FABRICATING FIELD-EFFECT TRANSISTOR - A method for fabricating complimentary metal-oxide-semiconductor field-effect transistor is disclosed. The method includes the steps of: (A) forming a first gate structure and a second gate structure on a substrate; (B) performing a first co-implantation process to define a first type source/drain extension region depth profile in the substrate adjacent to two sides of the first gate structure; (C) forming a first source/drain extension region in the substrate adjacent to the first gate structure; (D) performing a second co-implantation process to define a first pocket region depth profile in the substrate adjacent to two sides of the second gate structure; (E) performing a first pocket implantation process to form a first pocket region adjacent to two sides of the second gate structure. | 01-12-2012 |
20140206170 | METHOD OF FABRICATING MOS DEVICE - Provided is a method of fabricating a MOS device including the following steps. At least one gate structure is formed on a substrate, wherein the gate structure includes a gate conductive layer and a hard mask layer disposed on the gate conductive layer. A first implant process is performed to form source and drain extension regions in the substrate, wherein the gate conductive layer is covered by the hard mask layer. A process is of removing the hard mask layer is performed to expose the surface of the gate conductive layer. A second implant process is performed to form pocket doped regions in the substrate, wherein the gate conductive layer is not covered by the hard mask layer. | 07-24-2014 |
20140343880 | METHOD FOR DERIVING CHARACTERISTIC VALUES OF MOS TRANSISTOR - A method for deriving characteristic values of a MOS transistor is described. A set of η | 11-20-2014 |
Patent application number | Description | Published |
20080270969 | METHOD FOR CORRECTING PHOTOMASK PATTERN - A method for correcting a photomask pattern is provided. The correcting method performs a verification of a focus-exposure matrix (FEM) and an overlay variation on a layout area having contact holes or vias in a layout pattern so as to generate a hint information. The layout pattern of the photomask is corrected according to the hint information to prevent the contact holes or vias from being exposed in arrangement to corresponding metal layer, poly layer, or diffusion layer. | 10-30-2008 |
20130157178 | METHOD FOR CORRECTING LAYOUT PATTERN AND METHOD FOR MANUFACTURING PHOTOMASK - A method for correcting a layout pattern includes the following steps. A first layout pattern, a second layout pattern, and a mis-alignment value are provided. The first layout pattern includes a first conducting line pattern, and the second layout pattern includes at least one contact via pattern. The contact via pattern at least partially overlaps the first conducting line pattern. The layout pattern is verified whether spacing between the contact via pattern and the first conducting line pattern is smaller than the mis-alignment value by a computing system. A first modified contact via pattern is then obtained by expanding the contact via pattern along a direction away from the spacing smaller than the mis-alignment value. | 06-20-2013 |
20140093814 | METHOD FOR FORMING PHOTOMASKS - A method for forming photomasks includes the following steps. A first photomask including a first target pattern and a first unprintable dummy pattern is provided. A second photomask including a second target pattern and a second printable dummy pattern are provided, wherein at least part of the second printable dummy pattern overlapping the first unprintable dummy pattern exposure limit, such that the second printable dummy pattern can not be printed in a wafer. | 04-03-2014 |
20140220482 | METHOD FOR FORMING PATTERNS - A method for forming patterns includes the following steps. A first layout including a first target pattern and a first unprintable dummy pattern is provided. A second layout including a second target pattern and a second printable dummy pattern are provided, wherein at least part of the second printable dummy pattern overlaps the first unprintable dummy pattern exposure limit, such that the second printable dummy pattern cannot be formed in a wafer. | 08-07-2014 |
20140241027 | Static random access memory unit cell structure and static random access memory unit cell layout structure - A static random access memory unit cell layout structure is disclosed, in which a slot contact is disposed on one active area and another one across from the one. A static random access memory unit cell structure and a method of fabricating the same are also disclosed, in which, a slot contact is disposed on drains of a pull-up transistor and a pull-down transistor, and a metal-zero interconnect is disposed on the slot contact and a gate line of another pull-up transistor. Accordingly, there is not an intersection of vertical and horizontal metal-zero interconnects, and there is no place suffering from twice etching. Leakage junction due to stitch recess can be avoided. | 08-28-2014 |
20140256132 | METHOD FOR PATTERNING SEMICONDUCTOR STRUCTURE - A method for patterning a semiconductor structure is provided. The method comprises following steps. A first mask defining a first pattern in a first region and a second pattern in a second region adjacent to the first region is provided. The first pattern defined by the first mask is transferred to a first film structure in the first region, and the second pattern defined by the first mask is transferred to the first film structure in the second region. A second film structure is formed on the first film structure. A second mask defining a third pattern in the first region is provided. At least 50% of a part of the first region occupied by the first pattern defined by the first mask is identical with a part of the first region occupied by the third pattern defined by the second mask. | 09-11-2014 |
20140282295 | Method for Forming Photo-masks and OPC Method - The present invention provides a method for forming at least a photo mask. A first photo-mask pattern relating to a first structure is provides. A second photo-mask pattern relating to a second structure is provides. A third photo-mask pattern relating to a third structure is provides. The first structure, the second structure and the third structure are disposed in a semiconductor structure in sequence. An optical proximity process including a comparison step is provided, wherein the comparison step includes comparing the first photo-mask pattern and the third photo-mask pattern. Last, the first photo-mask pattern is import to form a first mask, the second photo-mask pattern is import to form a second mask, and the third photo-mask pattern is import to form a third mask. The present invention further provides an OPC method. | 09-18-2014 |
20150052491 | METHOD FOR GENERATING LAYOUT PATTERN - A method for generating a layout pattern is provided. First, a layout pattern is provided to a computer system and is classified into two sub-patterns and a blank pattern. Each of the sub-patterns has pitches in simple integer ratios and the blank pattern is between the two sub-patterns. Then, a plurality of first stripe patterns and at least two second stripe patterns are generated. The edges of the first stripe patterns are aligned with the edges of the sub-patterns and the first stripe patterns have equal spacings and widths. The spacings or widths of the second stripe patterns are different from that of the first stripe patterns. | 02-19-2015 |
20150072272 | Method For Forming Photo-Mask And OPC Method - A method for forming a photo-mask is provided. A first photo-mask pattern relating to a first line, an original second photo-mask pattern relating to a first via plug, and a third photo-mask pattern relating to a second line are provided. A first optical proximity correction (OPC) process is performed. A second OPC process is performed, comprising enlarging a width of the second photo-mask pattern along the first direction to form a revised second photo-resist pattern. A contour simulation process is performed to make sure the revised second photo-mask pattern is larger or equal to the original second-mask pattern. The first photo-mask pattern, the revised second photo-mask pattern, and the third photo-mask pattern are output. The present invention further provides an OPC method. | 03-12-2015 |
Patent application number | Description | Published |
20110069045 | Driving Circuit, Electronic Display Device Applying the Same and Driving Method Thereof - A driving circuit applied in an electronic display apparatus is provided. The driving circuit includes a first exchange circuit and a first buffer. The first buffer includes first and second input stages, a second exchange circuit and first and second output stages. The first exchange circuit selectively couples a first input signal and a first output signal outputted from the first output stage to one of the first and the second input stages; and selectively couples a second input signal and a second output signal outputted from the second output stage to the other of the first and the second input stages. The second exchange circuit selectively couples the first input stage to one of the first and the second output stages and selectively couples the second input stage to the other of the first and the second output stages. | 03-24-2011 |
20110254962 | CONTROLLING APPARATUS AND CONTROLLING METHOD FOR SIGNAL OUTPUTING CIRCUIT AND VIDEO SYSTEM - The invention discloses a controlling apparatus for a signal outputting circuit in an electronic system. The controlling apparatus includes a detecting circuit, a switch, and a controlling circuit. The detecting circuit is used for detecting whether the electronic system has an abnormal condition. The switch is electrically connected between a signal receiving terminal and the signal outputting circuit. The controlling circuit is electrically connected between the detecting circuit and the switch. Once the detecting circuit detects that the electronic system has the abnormal condition, the controlling circuit sets the switch into a high-impedance state. | 10-20-2011 |
20120119854 | SEGMENTED TRANSMISSION SIGNAL CIRCUIT - A segmented transmission signal circuit is provided with a parallel bus of data transmission. The bus includes a plurality of sections, each section transmits a corresponding parallel data of multiple bits, and the parallel data corresponding to different sections are in different bit orders. | 05-17-2012 |
20130286002 | DRIVING APPARATUS, DRIVING APPARATUS OPERATING METHOD, AND SELF-JUDGEMENT SLEW RATE ENHANCING AMPLIFIER - A driving apparatus applied in a liquid crystal display is disclosed. The driving apparatus at least includes a first latch, a second latch, an output buffer, and a slew rate enhancing module. The first latch is used to store a second data signal. The second latch is used to store a first data signal. The first data signal is previous to the second data signal. The slew rate enhancing module is used to compare the first data signal and the second data signal to generate a compared result, and correspondingly output a control signal to the output buffer according to the compared result to control a driving current of the output buffer. | 10-31-2013 |
20140197868 | DRIVING CIRCUIT HAVING BUILT-IN-SELF-TEST FUNCTION - A driving circuit includes at least one reference voltage source, at least one offset unit, and at least one buffer module. The at least one reference voltage source generates a reference voltage. The at least one offset unit generates an offset voltage, wherein the offset voltage and the reference voltage form a judging voltage range. The at least one buffer module has a first input end, a second input end, and an output end, wherein the first input end receives an analog voltage; the at least one reference voltage source is connected with the second input end; the at least one buffer module, according as whether the analog voltage is within the judging voltage range, outputs a pass logic signal or a fail logic signal at the output end. Particularly, the buffer module has Built-In-Self-Test (BIST) function and can increase test efficiency and voltage accuracy. | 07-17-2014 |
Patent application number | Description | Published |
20090269874 | METHOD FOR FABRICATING FLEXIBLE PIXEL ARRAY SUBSTRATE - In a method for fabricating a flexible pixel array substrate, first, a release layer is formed on a rigid substrate. Next, on the release layer, a polymer film is formed, the adhesive strength between the rigid substrate and the release layer being higher than that between the release layer and the polymer film. The polymer film is formed by spin coating a polymer monomer and performing a curing process to form a polymer layer. Afterwards, a pixel array is formed on the polymer film. The polymer film with the pixel array formed thereon is separated from the rigid substrate. | 10-29-2009 |
20100080977 | STRUCTURE OF THERMAL RESISTIVE LAYER AND THE METHOD OF FORMING THE SAME - The prevent invention discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of hollow structure, and a buffer layer, formed on said porous layer, wherein said porous layer can protect said plastic substrate from damage caused by the heat generated during manufacturing process. With the structure and method disclosed above, making a thin film transistor and forming electronic devices on the plastic substrate in the technology of Low Temperature PolySilicon, i.e. LTPS, without changing any parameters is easy to carry out. | 04-01-2010 |
20110297550 | METHOD OF FORMING THE STRUCTURE OF THERMAL RESISTIVE LAYER - The prevent disclosure discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of hollow structure, and a buffer layer, formed on said porous layer, wherein said porous layer can protect said plastic substrate from damage caused by the heat generated during manufacturing process. With the structure and method disclosed above, making a thin film transistor and forming electronic devices on the plastic substrate in the technology of Low Temperature PolySilicon, i.e. LTPS, without changing any parameters is possible. | 12-08-2011 |
Patent application number | Description | Published |
20100145618 | VEHICLE COLLISION MANAGEMENT SYSTEMS AND METHODS - Vehicle collision management systems and methods for use in a first vehicle are provided. The system includes an information collection unit, an information filter, and a collision calculation unit. The information collection unit receives driving data corresponding to a second vehicle, wherein the driving data includes a position of the second vehicle, and a driving course and a velocity of the second vehicle. The information filter filters the driving data of the second vehicle according to the driving data of the second vehicle and the first vehicle. The collision calculation unit performs a collision management for the first vehicle according to the filtered driving data of the second vehicle and the first vehicle. | 06-10-2010 |
20110122806 | DATA RELAY MOBILE APPARATUS, DATA RELAY METHOD, AND COMPUTER PROGRAM PRODUCT THEREOF FOR A WIRELESS NETWORK - A data relay mobile apparatus and a data relay method for a wireless network and a computer program product thereof are provided. The wireless network comprises a first mobile node and a second mobile node. The data relay mobile apparatus receives first status information and second status information from the first mobile node and the second mobile node, respectively. The data relay apparatus relays data according to the first status information and the second status information. With the aforesaid method, the present invention can effectively reduce the problems caused from shadow fading. | 05-26-2011 |
20110131215 | PROCESS APPARATUS, DATA SCHEDULING METHOD, AND COMPUTER READABLE MEDIUM THEREOF FOR A DATA SCHEDULE - A process apparatus, a data scheduling method, and a computer readable medium thereof for a data schedule are provided. The process apparatus comprises a storage, a receiving interface, and a microprocessor. The microprocessor is respectively electrically connected to the storage and the receiving interface. The storage is configured to store a data scheduling structure which is constructed of a plurality of data items in an execution sequence. The receiving interface receives an input data item. The microprocessor retrieves at least one relevant data item from the data items according to the correlation information of the input data item. The microprocessor further performs a weight calculation according to the at least one relevant data item and the input data item, so as to generate at least one weight calculation result. The microprocessor further inserts the input data item into the data scheduling structure according to the at least one weight calculation result, so as to form an updated data scheduling structure. | 06-02-2011 |
20120136619 | COLLISION DETECTING METHOD, ELECTRONIC DEVICE, AND COMPUTER PROGRAM PRODUCT THEREOF - A collision detecting method, an electronic device, and a computer program product thereof are provided for the electronic device having an accelerometer, a positioning module, and a communication module. The method includes obtaining a plurality of acceleration variations within each of a plurality of sampling intervals respectively detected by the accelerometer. The method also includes transforming the corresponding acceleration variations into a plurality of frequency domain signals for each sampling interval, and calculating energy and entropy of the frequency domain signals. The method further includes determining a collision has occurred if the energy and the entropy corresponding to each of a plurality of specific sampling intervals among the sampling intervals both drastically increase then drastically decrease suddenly. | 05-31-2012 |
Patent application number | Description | Published |
20080298479 | ORTHOGONAL FREQUENCY DIVISION MULTIPLEXING TRANSMITTING AND RECEIVING METHOD AND DEVICE THEREOF - An orthogonal frequency division multiplexing (OFDM) transmitting apparatus including a signal processing unit, a subcarrier orthogonalization processing unit, and a transmitting unit is provided. The signal processing unit divides a received signal into several real parts and several corresponding imaginary parts. The subcarrier orthogonalization processing unit is coupled to the signal processing unit for receiving the real and the imaginary parts of the signal, and for making the real and the imaginary parts respectively carried by a plurality of different and orthogonal subcarriers. The transmitting unit is coupled to the subcarrier orthogonalization processing unit to transmit the subcarriers. | 12-04-2008 |
20090221236 | PRE-ENCODING AND PRE-DECODING APPARATUSES AND METHODS THEREOF - A pre-encoding apparatus and a pre-decoding apparatus are provided. The pre-encoding apparatus adopts a cascade structure constituted by a plurality of pre-encoding units and a plurality of interleavers for pre-encoding, and the pre-decoding apparatus adopts a cascade structure constituted by a plurality of pre-decoding units and a plurality of de-interleavers for pre-decoding. Therefore, the pre-decoding apparatus is featured with a lower error rate. Also, each of the pre-decoding units can be alternatively composed of a plurality of low dimensional pre-decoders so that a computation complexity of the pre-decoding apparatus can be reduced accordingly. | 09-03-2009 |
20110038250 | ORTHOGONAL FREQUENCY DIVISION MULTIPLEXING TRANSMITTING AND RECEIVING DEVICE - An orthogonal frequency division multiplexing (OFDM) receiving apparatus, including a receiving unit, a subcarrier demodulation unit and a signal output processing unit, is provided. The receiving unit is for receiving an RF signal to generate a set of discrete signals. The subcarrier demodulation unit is coupled to the receiving unit, and used for demodulating a set of discrete signals to obtain a complex signal. The signal output processing unit is coupled to the subcarrier demodulation unit, and used for capturing and outputting real parts of the complex signal. | 02-17-2011 |
Patent application number | Description | Published |
20100093484 | POWER TRANSMISSION DEVICE - A power transmission device is provided. The power transmission device includes a motor, an intermediate gearset, and a planetary gearset assembly. The motor includes a motor output shaft. The intermediate gearset has an input gear connected to the motor output shaft. The motor drives an intermediate gear output shaft of an output gear of the intermediate gearset. The planetary gearset assembly has an input end connected to the intermediate gear output shaft. The intermediate gear output shaft drives a planetary gear output shaft of an output end of the planetary gearset assembly. | 04-15-2010 |
20100102682 | MOTOR MODULE - A motor module includes a bearing housing having a loading base, an electric unit, a bearing, and a magnetic rotor unit disposed on the bearing. In addition, a protruding portion is extending from the loading base, and the electric unit includes a printed circuit board (PCB) and sensing elements, wherein the PCB is utilized for disposing the loading base thereon. Moreover, signal circuits and motor windings are formed on the PCB around the loading base, the sensing elements are disposed around the motor windings, and the bearing is disposed at the protruding portion. Besides, the magnetic rotor unit is disposed on the motor windings, keeping a gap with the PCB; therefore, when electric current passes the motor windings, the magnetic rotor unit and the motor windings generate a flux linkage induction, so as to drive the magnetic rotor unit to rotate relative to the PCB. | 04-29-2010 |
20100123372 | MOTOR INTEGRATED TO ELECTRONIC DEVICE - An integrated motor, integrated to a structural part and an electronic substrate of an electronic device, includes a base formed on the structural part of the electronic device, a rotor having a load, and a stator having a plurality of winding coils and a driving circuit respectively shaped on the electronic substrate of the electronic device, for driving the rotor to rotate in a specific direction. | 05-20-2010 |
20100143164 | FAN MOTOR STRUCTURE - A fan motor structure is provided. A fan is disposed within an accommodating hole at a center of a body. A permanent magnet and a printed circuit board (PCB) provided with plural coils are respectively disposed between an upper ring and a base of the body. An axial air gap is formed between the coils and the permanent magnet. A bearing is disposed between the upper ring and the base. The fan blades of the fan extend from the periphery of the accommodating hole toward the center of the fan. An axle center of the fan overlaps with that of the body. The coils after being supplied with a current create a flux linkage with the permanent magnet. Due to the flux linkage and the axial air gap between the coils and the permanent magnet, the upper ring is forced to rotate, thus driving the fan to rotate. | 06-10-2010 |
20100323836 | CONCENTRICALLY ALIGNED PLANETARY GEAR ASSEMBLY AND POWER TRANSMISSION DEVICE - A concentrically aligned planetary gear assembly and a power transmission device are provided. The planetary gear assembly includes a ring gear, having a bottom cover and a top cover; a graded transmission module; a power input module, having a power shaft and a power input gear; and a power output module, having a planet wheel set and an output shaft. The graded transmission module includes a planetary arm and plural planetary gears. The planetary arm has a transmission tray and a coaxial sun gear, in which the transmission tray has plural planetary pivoting structures, and an outer diameter of the transmission tray is coaxial with an addendum circle of the internal gear, so as to be slidingly fitted to each other. The plurality of planetary gears is engaged with the internal gear, pivoted on the planetary pivoting structures, and freely rotates with respect to the planetary pivoting structures. | 12-23-2010 |
20110037354 | STATOR STRUCTURE, MICROMOTOR HAVING THE SAME AND MANUFACTURING METHOD THEREFOR - A stator structure, a micromotor having the same, and a micromotor manufacturing method therefor are provided. In the micromotor configured with the stator, a rotor, the stator and a case are disposed outward in a radial direction. The rotor is pivotly connected in the case and the stator includes a FPC assembly which is configured with a plurality of coil windings and at least one position signal generating unit and is circumferentially disposed between the rotor and the case, with the rotor as the axis. Configuration positions of the coil windings and the position signal generating unit are corresponding to magnetic poles of the rotor. | 02-17-2011 |
20110133591 | COIL STRUCTURE FOR A CORELESS MOTOR - A coil structure for a coreless motor includes a plurality of first conductive traces and a plurality of second conductive traces. The first conductive traces are disposed in succession relative to one another, and are each arranged into a planar spiral configuration having a substantially polygonal shape. At least one adjacent pair of the first conductive traces cooperate to define a space therebetween. Each of the second conductive traces is disposed in the space defined by a corresponding adjacent pair of the first conductive traces, and is arranged into a planar spiral configuration that has one of a substantially triangular shape and a substantially rhombic shape so as to substantially fill the space. | 06-09-2011 |
20130334921 | MOTOR STRUCTURE - A motor structure includes a case, a rotor, a first magnet, a second magnet and at least one magnetic conductive plate, wherein the rotor is disposed within an accommodating slot of the case, and the first magnet is disposed between the case and the rotor. The first magnet comprises a first end portion spaced apart with the case to define a first separation space. The second magnet comprises a second end portion spaced apart with the case to define a second separation space. A spacing slot is composed of the first separation space and the second separation space, and the at least one magnetic conductive plate is disposed within the spacing slot. The magnetic conduction through the at least one magnetic conductive plate enables to lower the reluctance of the motor structure for prevention of magnetic flux leakage therefore increasing the air-gap flux density. | 12-19-2013 |
20140007897 | LASH BRUSH - A lash brush includes a case, a rotatable shaft, a plurality of bristles and a reciprocating transmission mechanism, the rotatable shaft is driven into reciprocal motion along an axial line by the reciprocating transmission mechanism, a first unit of the reciprocating transmission mechanism comprises an actuating surface having a plurality of spacing members, a second unit of the reciprocating transmission mechanism comprises a contacting terminal contacting against each of the spacing terminals in sequence to make the rotatable shaft vibrate back and forth instantaneously along the axial line. | 01-09-2014 |
Patent application number | Description | Published |
20100296269 | DISPLAY APPARATUS AND LIGHT SOURCE DEVICE USED IN THE DISPLAY APPARATUS - A light source device including light-emitting diodes (LEDs) and a carrier is provided. Chromaticities of some LEDs fall in a first area of a chromaticity coordinate diagram, while chromaticities of the other LEDs fall in a second area of the chromaticity coordinate diagram. The second area and the first area are point symmetric to a white center of the chromaticity coordinate diagram. A chromaticity coordinate value farthest from the white center in the first area is (X | 11-25-2010 |
20120170249 | BACKLIGHT MODULE - A backlight module having an elongated circuit board, a plurality of first red, green and blue (RGB) LED units, a second RGB LED unit, and a light guide plate is disclosed. The first RGB LED units are disposed on the elongated circuit board. The second RGB LED unit is disposed on at least one end of the elongated circuit board and is adjacent to the first RGB LED units. The light guide plate is disposed beside the first RGB LED units and the second RGB LED unit. The second RGB LED unit herein has a diverse displacement and/or an angular deflection with respect to the first RGB LED units, thereby preventing color deviation on both sides of a panel. | 07-05-2012 |
20120194759 | LIQUID CRYSTAL MODULE AND METHOD FOR ASSEMBLING THEREOF - A liquid crystal module includes a housing, a light guide plate, at least one optical film, a liquid crystal panel, and a light bar. The housing includes a bottom plate with a bearing surface and a frame wall connected to the bottom plate. The light guide plate is disposed on the bearing surface and has a light emitting surface and a light incident side surface. The frame wall surrounds the light guide plate. The optical film is disposed above the light emitting surface. The liquid crystal panel is disposed above the optical film. The light bar includes a first circuit board and at least one light emitting element mounted on the first circuit board. The light emitting element is located opposite to the light incident side surface. The first circuit board located between the liquid crystal panel and the light emitting surface partially covers the light emitting surface. | 08-02-2012 |
20120281164 | LIGHT GUIDE PLATE POSITIONING STRUCTURE OF LIQUID CRYSTAL PANEL - A light guide plate (LGP) positioning structure of a liquid crystal panel is provided. The liquid crystal panel includes a frame for a LGP to be placed in, and a light emitting module is disposed on the frame and is adjacent to the light guide plate, and has a plurality of light emitting units arranged with gaps. The LGP positioning structure includes a plurality of first, second positioning blocks, and positioning portions. Each first positioning block is disposed on the frame and is corresponds to a corner of the LGP. The positioning portions are formed at corners of the LGP and used to be held against the corresponding first positioning blocks. The second positioning blocks are disposed on the frame, located between the gaps, and used to resist a side edge of the LGP. A space is formed between the light emitting units and the LGP. | 11-08-2012 |
Patent application number | Description | Published |
20100110963 | SYSTEM AND METHOD FOR MULTICAST/ BROADCAST SERVICE ZONE BOUNDARY DETECTION - A wireless communication method for providing zone boundary detection performed by a controller managing communications within a multicast/broadcast service (MBS) zone. The method includes assigning to a boundary paging group a first base station communicating within the MBS zone and near a boundary of the MBS zone. The method further includes transmitting, through a second base station which covers a mobile station, to the mobile station information indicating that the boundary paging group corresponds to locations near the boundary of the MBS zone. | 05-06-2010 |
20100260071 | ROUTING METHOD AND ROUTING PATH RECOVERY MECHANISM IN WIRELESS SENSOR NETWORK ENVIRONMENT - The present invention discloses an asymmetric routing method and routing path recovery mechanism. The wireless sensor network environment includes at least a management unit, at least a gateway, and mobile nodes. When joining, each mobile node obtains an unique ID code and, additionally, a depth as the gradient to the management unit. Accordingly, a mobile node sends an uplink packet via a nearby node with lower depth to the management unit; while the management unit transmits a downlink packet to a mobile node by utilizing the source route method. When the parent node of a mobile node is damaged or moves to another position or said mobile node with its sub-tree descendants changes their position together, the uplink routing path is recovered via selecting a nearby node of the sub-tree as relay node and the downlink routing path is recovered via sending a control message to the management unit. | 10-14-2010 |
20110047382 | FAST AUTHENTICATION BETWEEN HETEROGENEOUS WIRELESS NETWORKS - A method for preparing for handover of an apparatus from a first wireless network to a second, different wireless network, a master session key (MSK) having been generated during establishment of a connectivity of the apparatus to the first wireless network includes detecting signals of the second wireless network. In response thereto, establishing a connectivity of the apparatus to the second wireless network, using a pairwise master key (PMK) derived from the MSK generated during establishment of the connectivity to the first wireless network, one or more encryption keys being derivable from the PMK to support secure communication over the second wireless network. | 02-24-2011 |
20110051644 | POWER-EFFICIENT BACKBONE-ORIENTED WIRELESS SENSOR NETWORK, METHOD FOR CONSTRUCTING THE SAME AND METHOD FOR REPAIRING THE SAME - The present invention discloses a power-efficient backbone-oriented wireless sensor network, a method for constructing the same and a method for repairing the same, wherein energy-rich nodes are used to form backbones linking to a server, and wherein regular nodes having limited energy storage link to the backbones. When one energy-rich node malfunctions, the energy-rich node, which is posterior to the malfunctioning energy-rich node, searches for and links to a linkable neighboring energy-rich node on the backbone. If there is none linkable neighboring energy-rich node, the regular nodes are used to form a temporary tunnel until the malfunctioning energy-rich node has been repaired. The present invention can relieve the influence of hot spots, increase the robustness of the wireless sensor network, and prolong the service life of the wireless sensor network. | 03-03-2011 |
20110320802 | AUTHENTICATION METHOD, KEY DISTRIBUTION METHOD AND AUTHENTICATION AND KEY DISTRIBUTION METHOD - An authentication method, and a key distribution method, and an authentication and key distribution method are provided. The authentication method is adapted for a machine type communication involved with a wireless communication system, and includes the following steps. At least a user equipment (UE) transmits an application request including at least a first security material to a network application function (NAF), where the at least a first security material is not a key directly obtained through a bootstrapping procedure of a generic bootstrapping architecture. The NAF generates a second security material, which is not the key, either. The NAF replies the UE an application answer with the at least a second security material. In addition, the NAF authenticates the UE by the second security material, or the UE authenticates the NAF by the second security material. | 12-29-2011 |
20120044865 | Apparatus And Method For Coupling An M2M Device To A Wireless Network - Apparatus for coupling one or more machine-to-machine (M2M) devices to a wireless network, including: a first network interface controller (NIC) module configured to communicate with the M2M devices; an M2M controller unit coupled to the first NIC module, the M2M controller unit including a database and a controller, the controller being configured to store information regarding the M2M devices in the database and to retrieve information regarding the M2M devices from the database; and a second NIC module coupled to the M2M controller unit, the second NIC module including an M2M enable unit configured to send the information retrieved by the controller to the wireless network. | 02-23-2012 |
20130073746 | Apparatus And Method For Operating M2M Devices - A method for operating a machine-to-machine (M | 03-21-2013 |
20130163491 | OPERATION METHOD IN HETEROGENEOUS NETWORKS AND GATEWAY AND WIRELESS COMMUNICATION DEVICE USING THE SAME - An operation method in heterogeneous networks, and a gateway and a wireless communication device using the same are disclosed. The operation method in heterogeneous networks includes followings. When a gateway, connecting a first communication network and a second communication network, operates in a beacon mode, the gateway determines whether the first communication network is in an allowed period or a forbidden period, and generates a determination result. Then, the gateway adaptively adjusts a ratio of a superframe duration to a beacon interval of a periodic beacon of the second communication network according to the determination result. In addition, the gateway is connected to a M2M communication server via the first communication network, and the gateway is connected to at least one M2M communication device via the second communication network. | 06-27-2013 |
Patent application number | Description | Published |
20080307841 | Rekeyable lock cylinder structure - A rekeyable lock cylinder structure comprises a shell, a plug assembly and a plurality of pin groups. The shell has a hollow cylindrical portion and defines a central axis. The plug assembly is disposed within the hollow cylindrical portion of the shell and comprises a plug body and a sliding block. The plug body has a front section, a driving portion, a middle section connecting the front section and the driving portion, a coupling cavity recessed from the front section and the middle section and a plurality of lower pin holes formed in the middle section and communicating with the coupling cavity. The sliding block, which is disposed at the coupling cavity of the plug body and able to move parallel to the central axis of the shell, has a plurality of pin-sliding grooves and a keyhole communicating with the pin-sliding grooves. Each pin group at least comprises a lower pin that includes an upper locking piece, a lower locking piece able to engage with the upper locking piece and a resilient member disposed between the upper locking piece and the lower locking piece. The lower pin is moveably disposed within at least one lower pin hole of the plug body and at least one pin-sliding groove of the sliding block. | 12-18-2008 |
20090078012 | METHOD FOR REKEYING A REKEYABLE LOCK CYLINDER - This invention is to provide a method for rekeying a rekeyable lock cylinder. The first step of entire rekeying process is to insert a first user key into a keyhole of a sliding block of a plug assembly and turn the first user key to rotate the plug assembly, then a thrust is added to the first user key to move the sliding block of the plug assembly, thereby disengaging a plurality of upper locking pieces and a plurality of lower locking pieces within a plurality of lower pin sets. Next, after pulling out the first user key from the keyhole, a second user key is inserted into the keyhole of the sliding block and turned to restore the sliding block as to reengage the upper locking pieces and the lower locking pieces. Finally, the second user key is pulled out to complete the entire rekeying process. Accordingly, the present invention may provide advantages of widely lowering rekeying cost and enhancing convenience in use, because lock replacement may be completed as soon as rekeying another user key only without replacing lock cylinder. | 03-26-2009 |
20100101288 | Rekeyable lock cylinder with fool-proof function - A rekeyable lock cylinder with fool-proof function at least comprises a cylinder body, a plug, a limit member, a sliding block and a drive member. The plug disposed within the cylinder body has a trench, a plurality of first rack component runners communicating with the trench and a first through hole also communicating with the trench. The limit member is disposed within the first through hole and the sliding block is disposed within the trench. The sliding block has a plurality of second rack component runners respectively corresponding to each of the first rack component runners, a keyhole communicating with the second rack component runners and a second through hole communicating with the keyhole. The second through hole corresponds to the first through hole of the plug. The drive member is disposed within the second through hole and one end of the limit member contacts against the drive member. | 04-29-2010 |
20100212381 | ELECTRO-MECHANICAL LOCK ASSEMBLY - An electro-mechanical lock assembly comprises a casing, an electric control mechanism and a manual control member. The casing has a base and an axial bore formed at the base. The manual control member is installed penetrating the axial bore of the casing and has a knob and a spindle coupled to the knob. The electric control mechanism is disposed within the casing and comprises a control switch, a rotatable member capable of actuating the control switch, a clutch gear capable of driving the rotatable member, a position member capable of controlling movement of the clutch gear and a motor capable of driving the clutch gear. The rotatable member is coupled to the spindle of the manual control member and has at least one first coupling portion. The clutch gear has at least one second coupling portion corresponding to the first coupling portion. The second coupling portion is capable of being moved along the spindle to catch with the first coupling portion of the rotatable member. The spindle is installed penetrating the axial bore of the casing and one end of the spindle is coupled to the rotatable member of the electric control mechanism. | 08-26-2010 |
20110185554 | METHOD FOR AUTOMATICALLY DETERMINING THE DIRECTION INSTALLATION OF AN ELECTRONIC LOCK - A method for automatically determining the direction installation of an electronic lock is disclosed. The method achieves automatic determination of the electronic lock installed on the left-handed or right-handed door by controlling rotational directions of the rotational actuator and determining the touching sequence of switch units, so as to enable the electronic lock to be adapted to both the left-handed door and right-handed door, thereby significantly broadening the application scope and convenience of the electronic lock. | 08-04-2011 |
20110193352 | LOCK STRUCTURE - A lock structure with at least one latch comprises a base, a link member, a sliding member and a rotating member. The link member is moveable relative to the base to drive the latch. The sliding member is engaged with the link member and being capable of driving the link member. The rotating member is rotatably disposed between the base and the sliding member, wherein the rotating member is capable of driving the sliding member and the link member to drive the latch. | 08-11-2011 |
20120326455 | LOCK STRUCTURE - A lock structure with at least one latch comprises a base, a link member, a sliding member and a rotating member. The link member is moveable relative to the base to drive the latch. The sliding member is engaged with the link member and being capable of driving the link member. The rotating member is rotatably disposed between the base and the sliding member, wherein the rotating member is capable of driving the sliding member and the link member to drive the latch. | 12-27-2012 |
20130167598 | TRANSMISSION MECHANISM ADAPTED TO AN ELECTRO-MECHANICAL LOCK AND ELECTRO-MECHANICAL LOCK THEREWITH - A transmission mechanism adapted to an electro-mechanical lock and for driving a latch assembly to be unlocked is disclosed. The transmission mechanism includes a bottom plate, a pushing member, a clutch member and an electro-actuating member. The bottom plate includes at least one first pushed structure. The pushing member includes at least one second pushed structure. The clutch member abuts against the pushing member. The electro-actuating member is for driving the pushing member to rotate toward a first direction. The at least one second pushed structure cooperates with the at least one first pushed structure to move the pushing member relative to the bottom board, so that the clutch member is pushed with movement of the pushing member to an unlocked position. | 07-04-2013 |
20130167600 | CLUTCH MECHANISM AND ELECTRO-MECHANICAL LOCK THEREWITH - A clutch mechanism includes a rotating member, a clutch member and a key assembly. The rotating member has at least one pushed structure, and the clutch member has at least one second pushed member. The at least one second pushed structure abuts against the at least one first pushed structure. The key assembly is used for driving the rotating member to rotate in a first rotating direction and for driving the at least one first pushed structure of the rotating member to engage with the at least one second pushed structure for displacing the clutch member relative to the rotating member, so as to push the clutch member to an unlocked position. | 07-04-2013 |
20130167671 | TRANSMISSION MECHANISM AND ELECTRO-MECHANICAL LOCK THEREWITH - A transmission mechanism includes a first rotating wheel, a second rotating wheel and an interference mechanism. The interference mechanism includes an engaging slot, a containing slot and an engaging member. The engaging slot is formed on the first rotating wheel, and the engaging slot includes an arc-shaped concave surface. The containing slot is formed on the second rotating wheel. The engaging member is located in the at least one containing slot, and the engaging member includes an arc-shaped convex surface. The first rotating and the second rotating wheel simultaneously rotate when the arc-shaped convex surface of the at least one engaging member engagingly contacts with the arc-shaped concave surface of the at least one containing slot. The first rotating wheel and the second rotating wheel do not simultaneously rotate when the at least one engaging member disengages from the at least one containing slot. | 07-04-2013 |
20130168978 | REVERSIBLE HANDLE DEVICE - A reversible handle device includes a housing, a handle portion rotatably disposed on the housing and rotatable relative to a long axis, a reversible member and a stopping member. The reversible member is connected to the handle portion and rotatable relative to the handle portion. The reversible member has a first slot and a second slot for switching the handle portion to be in a first orientation status or in a second orientation status. The stopping member is disposed on a side of the reversible member in a manner of being movable in a direction parallel to the long axis. The stopping member is biased toward the reversible member in the direction parallel to the long axis, such that the stopping member protrudes into the first slot or the second slot. Accordingly, the handle portion is in the first orientation status or in the second orientation status. | 07-04-2013 |
20130169411 | METHOD FOR OPERATING AN ELECTRONIC LOCK - A method for operating an electronic lock is disclosed. The electronic lock includes a processing unit, an inner body and an outer body. The inner body includes an inner input portion, and the outer body includes an input device. The method includes operating the inner input portion of the inner body to output various signals according to operation of the inner input portion, wherein the various signals comprises a first signal and utilizing the input device to log in a manage menu of the electronic lock when the processing unit receives the first signal, wherein the manage menu of the electronic lock comprises a first controlling item for setting a left-handed mode or a right-handed mode by the input device. | 07-04-2013 |
20130276491 | BASE ASSEMBLY FOR A LOCK - A base assembly for a lock installed at a lock module includes a base, a connection member, at least one fixing member and an escutcheon coupled to the connection member. The base is coupled to the lock module, and the connection member is coupled to the base via the at least one fixing member. The connection member is located between the base and the escutcheon, and a portion of the connection member covers the base. The base may couple with different shapes of escutcheons via the connection member. | 10-24-2013 |
Patent application number | Description | Published |
20100224983 | SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a semiconductor package structure includes the following steps. Firstly, a carrier having an adhesion tape is provided. Next, a plurality of chips are disposed on the adhesion tape. Then, a molding compound is dispensed on the adhesion tape, so that the molding compound covers the chips. Afterwards, a heat spreader is disposed on a plurality of chips. Then, the molding compound is solidified as an encapsulant to fix the heat spreader on the chips. After that, the carrier and the adhesion tape are removed to expose the active surfaces of the chips. Then, a redistribution layer is formed adjacent to the active surfaces of the chips. Next, a plurality of solder balls are disposed on the redistribution layer. Lastly, a plurality of packages are formed by cutting the redistribution layer, the encapsulant and the heat spreader according to the positions of the chip. | 09-09-2010 |
20100308449 | SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD THEREOF - A manufacturing method of semiconductor package is provided. A carrier is provided. The chips are disposed on the carrier. The chips are encapsulated by a molding compound, so that the molding compound and the chips form a chip-redistribution encapsulant. The carrier is removed, so that the chip-redistribution encapsulant exposes the pads of the chips. The plasma is applied on the pads and the molding compound. A first dielectric layer is formed on the pads and the surface of the molding compound. The plasma is applied on a surface of the first dielectric layer. A patterned conductive layer is formed on the surface of the first dielectric layer. A second dielectric layer is formed on the patterned conductive layer and the first dielectric layer. A plurality of solder balls are formed on the second dielectric layer. The chip-redistribution encapsulant is divided so as to form a plurality of packages. | 12-09-2010 |
20100314746 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A semiconductor package and a manufacturing method thereof are provided. A carrier having an adhesion layer is provided. A plurality of chips are disposed on the adhesion layer, wherein an active surface of each chip faces the adhesion layer. A molding compound is formed for encapsulating the chips to form a chip-redistribution encapsulant having a first surface and a second surface, wherein the first surface has a chip area and a peripheral area. The carrier and the adhesion layer are removed, so that the chip-redistribution encapsulant exposes the active surface of each chip. A plurality of solder balls are uniformly formed in the chip area and the peripheral area. The second surface of the chip-redistribution encapsulant is grinded to reduce the thickness of the chip-redistribution encapsulant, wherein the solder balls provide the chip-redistribution encapsulant with a uniform support. The chip-redistribution encapsulant is sawn to form a plurality of packages. | 12-16-2010 |
20110018118 | Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof - Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof. | 01-27-2011 |
20110018124 | Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof - Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof. | 01-27-2011 |
20140175663 | SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIA AND MANUACTURING PROCESS - In accordance with the present invention, there is provided a semiconductor device comprising a semiconductor die or chip, a package body and a through package body via. The semiconductor chip includes a plurality of conductive pads. The package body encapsulates a sidewall of the semiconductor chip, and has at least one hole formed therein having a sidewall which is of a prescribed first surface roughness value. The through package body via is disposed in the hole of the package body and comprises a dielectric material and at least one conductive interconnection metal. The dielectric material is disposed on the sidewall of the hole and defines at least one bore having a sidewall which is of a second surface roughness value less than the first surface roughness value. The interconnection metal is disposed within the bore. | 06-26-2014 |
Patent application number | Description | Published |
20080222832 | VEHICLE WINDSHIELD WIPER FOR RAIN AND SNOW DUAL PURPOSE - The present invention is to provide a “vehicle windshield wiper for rain and snow dual purpose”, which comprises a bow elastic strip, some clamping devices, a strip scraper receptacle, a sheath cover, a strip scraper, two end ferrule caps and a truss saddle; Wherein, the sheath cover and two end ferrule caps totally envelope the bow elastic strip, clamping devices and strip scraper receptacle so that the snow and icy particles are blocked and separated out unable to intrude or gather in any space thereof; Thereby, the dual function of rain wiper and snow wiper of present invention eliminates the boring action in swapping between rain wiper and snow wiper during interim of snow and non-snow seasons so that it not only saves the extra expense in buying snow wiper for the consuming vehicle drivers but also totally obsoletes the conventional arm-supported snow wiper so as to eliminate the pollution burden incurred by the mass waste conventional snow wipers; Thus, it really possesses double effect in economic benefit and environmental protection. | 09-18-2008 |
20100257687 | FLAT BLADE WIPER FOR VEHICLE - A flat blade wiper for a vehicle includes a rigid elastic metal keelson strip, a saddle bracket for receiving a wiper adapter, an elongated scraping blade with an upper wing section, two rigid hard clipping sleeve mounts, and a pair of end positioning caps. Each clipping sleeve mount and wiper adapter saddle bracket has first compatible accommodating channels and second accommodating channels respectively so that the elastic metal keelson strip can run through the first accommodating channels while the upper wing section of the elongated scraping blade can run through the second accommodating channels in both the wiper adapter saddle bracket and the clipping sleeve mount. When the wiper swings back and forth, an acting force is directly transmitted to the clipping sleeve mounts by the metal keelson strip without any pause or delay, eliminating jerking so that no noise is incurred to spoil the internal tranquility of the vehicle. | 10-14-2010 |
20100257688 | Saddle bracket for wiper adapter - A saddle bracket for wiper adapter comprises a bracket chassis and a linking saddle to be extensively compatible in coupling with various types of articulation adapter in vast range. Wherein, the bracket chassis is a prerequisite component and the linking saddle is an optional component so that the bracket chassis can either be used alone or be docked by the linking saddle as an integral entity. Through such versatile structure with comprehensive compatibility, the kind and quantity of the saddle bracket can be reduced. Besides, the accumulative quantity of the defective wipers from annual replaced windshield wiper due to obsolete or aged malfunction can also be indirectly decreased. Thus, not only the vendors and the consumers of the viper can be benefited by the decreasing in manufacturing cost and selling price but also the environmental protection can be benefited by the decreasing in annual replacement quantity. | 10-14-2010 |
20110247167 | Combinational structure of flat blade wiper for vehicle - The present invention provides a combinational structure of flat blade wiper for vehicle comprising an elastic metal keelson strip, a saddle bracket, two clipping sleeve mounts, two external covers, and an elongated scraping blade. In the saddle bracket and each clipping sleeve mount, an upper accommodating channel and a lower accommodating channel of rectangular cross sections are formed such that the elastic metal keelson strip and the upper wing section of the elongated scraping blade are inserted therein respectively. During operation, all forces of the wiper arm directly relay to the elongated scraping blade to achieve the water-scraping effect. Thereby, the force transmission throughout the wiping operation, no delay pause or jerky phenomena spoils tranquility in vehicle. Thus, not only the service life of assembled components are prolonged but also replacing costs thereof are reduced owing to motive and wearing burdens of the wiper arm are decreased. | 10-13-2011 |
20140083489 | SOLAR CELL, SOLAR CELL MODULE AND METHOD OF MAKING THE SOLAR CELL - A solar cell includes: a semiconductor substrate having a back surface with a first doped region and a second doped region, the back surface being roughened to forma roughened region; a dielectric layer disposed on the back surface; a first electrode having a first surface conforming to the shape of the back surface; and a second electrode having a second surface conforming to the shape of the back surface. | 03-27-2014 |
20150020341 | Windshield Wiper Blade - A windshield wiper blade includes a main cover having a plurality of positioning portions. A fixing seat engages with each positioning portion. Each fixing seat includes a cover pivotal portion and a frame pivotal portion. A plurality of auxiliary covers is respectively mounted to two ends of the main cover. Each auxiliary cover is pivotably connected to one of the cover pivotal portions. A frame is pivotably connected to the frame pivotal portion of each fixing seat and includes at least one claw. A soft rubber strip engages with the at least one claw of each frame. | 01-22-2015 |
Patent application number | Description | Published |
20110103034 | ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWEEN CONDUCTING NODES - An electronic chip includes a plurality of conducting pins and a plurality of insulating blocks. The conducting pins are disposed on an outer side of the electronic chip to provide electrical connections between the electronic chip and an external circuit. Each of the insulating blocks is disposed between two adjacent conducting pins. | 05-05-2011 |
20110114950 | Integrated Circuit Wafer and Integrated Circuit Die - An integrated circuit wafer and integrated circuit dice are provided. The integrated circuit wafer includes a wafer substrate, a plurality of integrated circuits, a plurality of test-keys, an isolation film, and a plurality of ditches. The integrated circuits are disposed on the wafer substrate in matrix. The test-keys are respectively disposed between the adjacent integrated circuits. The isolation film covers at least one side of the integrated circuits on the wafer substrate. The ditches extend downwardly from the surface of the isolation film and are disposed between the integrated circuit and the adjacent test-key. The integrated circuit die includes a wafer substrate, an integrated circuit disposed on the wafer substrate, and an isolation film covering at least one side of the integrated circuit on the wafer substrate, wherein the side walls of the wafer substrate and the isolation film are respectively smooth walls. The side wall of the wafer substrate is substantially vertical. | 05-19-2011 |
20110256690 | INTEGRATED CIRCUIT WAFER DICING METHOD - An integrated circuit wafer dicing method is provided. The method includes forming a plurality of integrated circuits on a wafer substrate, forming a patterned protective layer on the integrated circuits, and etching through the wafer substrate to form a plurality of integrated circuit dies by using the patterned protective layer as a mask. The patterned protective layer is preferably a patterned photoresist layer. The step of forming the patterned protective layer includes covering the wafer substrate with a photoresist layer, exposing the photoresist layer by using a photomask, and developing the exposed photoresist layer to form the patterned protective layer. The etching process can be dry etching or wet etching. | 10-20-2011 |
20110272799 | IC CHIP AND IC CHIP MANUFACTURING METHOD THEREOF - An IC chip and an IC chip manufacturing method thereof are provided. The IC chip has a chip body and at least one bump. The chip body has at least one conducting area on its surface. The bump is formed on the conducting area of the chip body. The bump includes a plurality of protrusions and at least one conducting material. The protrusions protrude out of the conducting area and are spaced apart from each other. The conducting material covers the protrusions and electrically connects the conducting area. The method includes: (A) providing a chip body having a conducting area on its surface; (B) forming a plurality of protrusions on the chip body, wherein the protrusions protrude out of the conducting area and are spaced apart from each other; and (C) forming at least one conducting material, wherein the conducting material covers the protrusions and electrically connects the conducting area. | 11-10-2011 |
Patent application number | Description | Published |
20100225066 | Separable glands for cartridge seal - Separable glands for a cartridge seal includes an outer gland, and an inner gland assembly, which is separable from the outer gland, and consists of all necessary parts of a cartridge seal, including an inner gland; in installation, the outer gland is fixed on an rotating equipment to restrain the inner gland assembly; the outer gland can be rotated to make its peripheral gaps to face threaded holes of the rotating equipment before it is fixed; the outer gland is stopped from falling off with a loosen-prevention component, e.g. elastic piece and fastener; the inner gland has an outer adjoining portion, and the outer gland has an inner adjoining portion, which will come closely in contact with the outer adjoining portion to prevent the inner gland assembly from loosening; after a cartridge seal is removed for replacement of the inner gland assembly, the outer gland will be used again together with a new inner gland assembly. | 09-09-2010 |
20100264602 | SEAL DEVICE AND METHOD FOR ASSEMBLING A GUIDE BLOCK IN A GLAND OF THE SEAL DEVICE - A seal device for a rotary shaft includes a sleeve, a gland, a ring, a guide block, and a fixing member. The guide block has an outer block surface extending circumferentially and abutting against a portion of an inner gland surface of the gland, and an inner block surface extending circumferentially and opposite to the outer block surface. The outer block surface has two circumferentially opposite outer ends. The inner block surface has two circumferentially opposite inner ends. The guide block further has two opposite end faces each of which connects one of the outer ends to one of the inner ends. The inner ends subtend an angle of not larger than 90° at a center line of the gland. At least one of the end faces lies in a plane line that is substantially tangent to an outer peripheral face of the ring. | 10-21-2010 |
20110156358 | CARTRIDGE SEAL DEVICE - A cartridge seal device includes a sleeve, a gland unit, a first seal unit, a pumping ring, and a second seal unit. The gland unit includes a first gland and a second gland. The first seal unit includes a first rotary ring disposed around the sleeve and rotatable along with the sleeve, a first stationary ring abutting against the first rotary ring, a compression ring abutting against the first stationary ring, and at least one first spring disposed within a retaining slot of the first gland and abutting against the compression ring. The first stationary ring has one end in abutment with the first rotary ring, and an opposite end formed with at least one notch. The compression ring has aligned guide pieces extending respectively into the notch of the first stationary ring and an engaging recess of the first gland. | 06-30-2011 |
20110156360 | SEAL DEVICE - A seal device includes a sleeve, a gland, a sealing assembly, an end collar and a protective cushion. The sleeve is adapted to be sleeved on a rotary shaft of a pumping machine and has inner and outer end portions in an axial direction. The gland is disposed around the sleeve, and is formed with a through hole that permits extension of the sleeve, and a receiving groove that communicates fluidly with the through hole and that is adapted for receiving cooling fluid. The sealing assembly is sleeved on the sleeve and is connected to the gland. The end collar is disposed around the sleeve and outside the gland. The protective cushion is disposed around the sleeve and between the gland and the end collar. | 06-30-2011 |
Patent application number | Description | Published |
20090075027 | MANUFACTURING PROCESS AND STRUCTURE OF A THERMALLY ENHANCED PACKAGE - A manufacturing process for a thermally enhanced package is disclosed. First, a substrate strip including at least a substrate is provided. Next, at least a chip is disposed on an upper surface of the substrate, and the chip is electrically connected to the substrate. Then, a prepreg and a heat dissipating metal layer are provided, and the heat dissipating metal layer is disposed on a first surface of the prepreg and a second surface of the prepreg faces toward the chip. Finally, the prepreg covers the chip by laminating the prepreg and the substrate. | 03-19-2009 |
20090087947 | FLIP CHIP PACKAGE PROCESS - A flip chip package process is provided. First, a substrate strip including at least one substrate is provided. Next, at least one chip is disposed on the substrate, and the chip is electrically connected to the substrate. Then, a stencil having at least one opening and an air slot hole is disposed on an upper surface of the substrate strip, an air gap is formed between the stencil and the substrate strip, the air gap connects the opening and the air slot hole, and the chip is located in the opening. Finally, a liquid compound is formed into the opening of the stencil to encapsulate the chip, and a vacuum process is performed through the air slot hole and the air gap, so as to prevent the air inside the opening from being encapsulated by the liquid compound to become voids. | 04-02-2009 |
Patent application number | Description | Published |
20090180706 | System for applying multi-direction and multi-slope region detection to image edge enhancement - A system for applying multi-direction and multi-slope region detection to image edge enhancement is provided to perform the image edge enhancement on an image. For pixel (i) indicating i-th pixel of line of the image, a line buffer temporarily stores the pixel (i) and its neighboring pixels. A region classification device classifies the pixel (i) into a region type. A left flat pixel detector depends on the region type to search the neighboring pixels of the pixel (i) for a left flat region pixel. A right flat pixel detector depends on the region type to search the neighboring pixels of the pixel (i) for a right flat region pixel. An edge enhancer performs an edge enhancement operation on the pixel (i) and neighboring pixels when the pixel (i) is an extended region and the left and the right flat region pixels are included in the neighboring pixels. | 07-16-2009 |
20120288001 | MOTION VECTOR REFINING APPARATUS - A motion vector refining apparatus including a control unit, N filter units, and a mixer unit is provided. The control unit receives a motion estimation signal generated by a motion estimation unit and calculates a plurality of variation parameters according to a current motion vector, surrounding motion vectors, or a block matching error, so as to generate a control signal. The N filter units respectively calculate N filtering motion vectors by using N analysis processes. The mixer unit weights and mixes the filtering motion vectors according to the control signal to adjust and output a refined motion vector. Thereby, the motion vector refining apparatus can detect the edge of a moving object and mix filtering results of the analysis processes to adjust and refine motion vectors, so as to reduce image defects caused by a smooth processing. | 11-15-2012 |
20130136182 | MOTION VECTOR REFINING DEVICE AND VIDEO REFINING METHOD THEREOF - A motion vector refining device and a video refining method thereof are provided. The motion vector refining device includes a motion estimation unit, a reliability analysis module and a motion vector mixing module. The motion estimation unit receives a plurality of frames in a video signal or using historical information (for example, motion vectors of closing frames) previously calculated by the motion estimation unit, so as to estimate N target motion vectors. The reliability analysis module analyzes spatial and temporal reliability factors of the N target motion vectors, so as to estimate and adjust N reliability weight values dynamically. The motion vector mixing module uses the reliability weight values to dynamically mix the target motion vectors to produce a refined motion vector. Therefore, the motion vector refining device and a motion interpolation apparatus using the same can avoid instability of a motion vector on an edge of a moving object. | 05-30-2013 |