Yon Ho
Yon Ho Park, Seoul KR
Patent application number | Description | Published |
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20100121711 | SYSTEM FOR ADVERTISING USING META-BLOG WEB PAGE AND PROFIT CREATING METHOD WITH IT - The present invention relates to an advertising system and profit creation method using a metablog web page, in which the personal website and the display target entity of a member are posted on a personal metablog web page, managed by a metablog server | 05-13-2010 |
20110060646 | AUCTION SYSTEM FOR USE OF ADVERTISING AREAS ON INTERNET AND METHOD OF OPERATING THE AUCTION SYSTEM - Disclosed herein is an auction system for the use of an advertising area on the Internet. The auction system includes an auction server and a plurality of advertiser clients. The auction server is installed on the Internet, provides a plurality of advertising areas to each member who has subscribed to post an advertisement, and selects one member who will post an advertisement from among members who participate in an auction in order to use each of the plurality of advertising areas and post an advertisement therein. The advertiser clients connect with the auction server, subscribe as members for the posting of advertisements, search the plurality of advertising areas, select one from among the plurality of advertising areas, and enter bidding prices for the selected advertising area. | 03-10-2011 |
20110238494 | AUCTION SYSTEM FOR MAXIMIZING ADVERTISING EFFICIENCY BY EXPOSING ADVERTISEMENTS THROUGH INTERNET MEDIA AND METHOD OF OPERATING THE SAME - An auction system for maximizing advertising efficiency by exposing an advertisement through Internet media, and a method of operating the auction system are provided. The auction system includes Internet media for providing information to an unspecified number of Internet users over the Internet, and having advertising areas. An auction server provides information about Internet media groups, in which some or all of the Internet media are grouped, to subscribing members, and selects one or more members from among members participating in an auction to post advertisements on any one of the Internet media groups. At least one advertiser client accesses the auction server, subscribes to the auction server as a member, inquires about the provided Internet media groups information, selects any one from among the Internet media groups, and enters a bidding price for the selected Internet media group. | 09-29-2011 |
Yon Ho You, Suwon KR
Patent application number | Description | Published |
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20140035130 | PACKAGING METHOD USING SOLDER COATING BALL AND PACKAGE MANUFACTURED THEREBY - Disclosed herein a packaging method including: (A) forming a plurality of pads and another circuit pattern on a substrate; (B) forming a second dry film pattern including opening exposing the pad; (C) mounting a solder coating ball in the opening of the second dry film pattern; (D) performing a reflow process on the solder coating ball in order to allow the solder coating ball to have a modified pattern; (E) delaminating the second dry film pattern; and (F) forming a solder pattern including the modified pattern of the solder coating ball in a solder to mount a chip on the substrate using the solder pattern. | 02-06-2014 |
20140103098 | MASK FOR BUMPING SOLDER BALLS ON CIRCUIT BOARD AND SOLDER BALL BUMPING METHOD USING THE SAME - Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings. | 04-17-2014 |
Yon Ho You, Cheongju KR
Patent application number | Description | Published |
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20140076611 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a printed circuit board, including: preparing a base substrate; disposing a mask having through-holes formed therein on one surface of the base substrate; inserting metal core balls into the through-holes of the mask, performing reflow treatment on the metal core balls, and removing the mask; and laminating an insulating layer on one surface of the base substrate. | 03-20-2014 |
Yon Ho You, Gyunggi-Do KR
Patent application number | Description | Published |
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20140034707 | SOLDER INJECTION HEAD - Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate. | 02-06-2014 |