Patent application number | Description | Published |
20110057761 | PROTECTIVE DEVICE - A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting. | 03-10-2011 |
20110058295 | PROTECTIVE DEVICE - A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting. | 03-10-2011 |
20120263978 | ENERGY STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME - An energy storage device and a method of manufacturing the same are disclosed. The energy storage device includes a circuit board, a conductive cover disposed above the circuit board, a sealing structure, a metal coating layer, and an electrochemical cell. The sealing structure is disposed between the circuit board and the circumference of the conductive cover such that the circuit board, the conductive cover, and the sealing structure together form a sealed space where the electrochemical cell is disposed. The metal coating layer continuously covers a part of the conductive cover, an exposed portion of the sealing structure, and a part of the circuit board. Therefore, even if the energy storage device needs to be heated during a product assembly, the metal coating layer can keep the sealing structure structurally stable, and the electrolyte of the electrochemical cell will not leak; the whole energy storage device therefore can keeps undamaged. | 10-18-2012 |
20130250470 | PROTECTIVE DEVICE - A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting. | 09-26-2013 |
20130321119 | PROTECTIVE DEVICE - A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting. | 12-05-2013 |
20140133059 | PROTECTIVE DEVICE AND PROTECTIVE MODULE - A protective device includes a substrate, an electrode layer, a metal structure, an outer cover and an arc extinguishing structure. The electrode layer is disposed on the substrate. The electrode layer includes at least one gap. The metal structure is disposed on the electrode layer and located above the gap, and the metal structure has a melting temperature lower than a melting temperature of the electrode layer. The outer cover is disposed on the substrate and covers the metal structure and a portion of the electrode layer. The arc extinguishing structure is disposed between the outer cover and the substrate. A protective module is further provided. | 05-15-2014 |
Patent application number | Description | Published |
20090009281 | Fuse element and manufacturing method thereof - A fuse element comprises a substrate having a top surface, a bottom surface opposite to said top surface, and side surfaces, a heat insulation layer including a first surface and a second surface opposite to said first surface, said first surface of said heat insulation layer disposed on said top surface of said substrate, and said second surface having a surface roughness, a protective layer disposed above said heat insulation layer, and a fuse layer disposed between said heat insulation layer and said protective layer. | 01-08-2009 |
20140327031 | CURRENT CONDUCTING ELEMENT - A current conducting element including a substrate, a through hole, an electrode layer and a conductor structure is provided. The through hole is disposed through the substrate and has a first opening. The electrode layer is disposed on the substrate. A portion of the first opening is exposed from the electrode layer. The conductor structure is disposed in the through hole and contacted with the electrode layer. The electrode layer and the conductor structure form a current conducting path. | 11-06-2014 |
20150035640 | METHOD OF MANUFACTURING MULTI-LAYER COIL AND MULTI-LAYER COIL DEVICE - A method of manufacturing a multi-layer coil includes steps of providing a substrate; forming a seed layer on the substrate; and plating the seed layer with N coil layers by N current densities according to N threshold ranges, so as to form the multi-layer coil on the substrate, wherein an i-th current density of the N current densities is lower than an (i+1)-th current density of the N current densities. A first coil layer of the N coil layers is plated on the seed layer by a first current density of the N current densities. When an aspect ratio of an i-th coil layer of the N coil layers is within an i-th threshold range of the N threshold ranges, an (i+1)-th coil layer of the N coil layers is plated on the i-th coil layer by the (i+1)-th current density. | 02-05-2015 |