Patent application number | Description | Published |
20140113660 | REAL-TIME PATH SUGGESTION FOR A LOCATION-ENABLED MOBILE DEVICE - The disclosure is directed to navigating based on directionality. An embodiment determines a position and a direction of a mobile device, determines one or more paths from the mobile device to one or more destinations associated with a current location of the mobile device, and displays one or more direction indicators corresponding to the one or more paths to the one or more destinations. | 04-24-2014 |
20140114568 | CHANGING A POSITION DETERMINATION SCHEME USED BY A USER EQUIPMENT DURING A TRANSITION BETWEEN INDOOR AND OUTDOOR SPACES RELATIVE TO AN ENCLOSED ENVIRONMENT - In an embodiment, a user equipment (UE) tracks its location using a first positioning scheme (PS) (e.g., an indoor PS or outdoor PS) while operating inside or outside of an enclosed environment, whereby the UE maintains transition region information related to the enclosed environment that characterizes one or more outdoor-to-indoor (OI) and/or indoor-to-outdoor (IO) transition regions of the enclosed environment. If the UE determines it has entered a transition region of the enclosed environment based on its location tracking using the first PS, the UE begins to track its location using a second PS. When the quality of the second PS rises above a threshold (e.g., such as the UE moves further inside or outside of the enclosed environment), the UE can switch to the second PS and turn off the first PS. | 04-24-2014 |
20140206340 | EFFICIENT GENERATION OF RADIO COVERAGE MAP OF ACCESS POINTS IN AN INDOOR ENVIRONMENT - A method for generating a radio coverage map. A two-dimensional radio coverage map located between a first physical level and a second physical level is generated. The access point is located above the second physical level. The two-dimensional radio coverage map is located at a distance from the access point and comprises a plurality of map points, where the map points have a predicted received signal strength value. A projection window is determined. A projected area on the two-dimensional radio coverage map is determined by computing a geometrical projection from the access point through the projection window onto the two-dimensional radio coverage map. A plurality of first points in a first area on the two-dimensional radio coverage map is identified. The first area is outside the projected area. The predicted received signal strength value of each of the first points is reduced by a value equal to the signal attenuation caused by the second physical level. | 07-24-2014 |
20140206380 | FAST GENERATION OF RADIO COVERAGE MAP OF ACCESS POINTS IN AN INDOOR ENVIRONMENT - A method for generating a two-dimensional radio coverage map comprising a plurality of physical levels including a first physical level and a second physical level. The access point is located above the second physical level. A first radio coverage map comprising original points located at a first distance from the access point is generated. Each of the original points has a first predicted value. A distance is selected to place the two-dimensional radio coverage map at the target distance from the access point. Coordinates of map points of the two-dimensional radio coverage map are generated. Each of the map points corresponds to one of the original points. An offset value representing an attenuation due to the target distance being different than the first distance is computed. For each of the map points, a predicted received signal strength value is generated by adding the offset value to the first predicted value of the corresponding one of the original points. | 07-24-2014 |
20140211691 | SYSTEM AND METHOD FOR CHOOSING SUITABLE ACCESS POINTS IN QUIPS AUTARKIC DEPLOYMENT - This disclosure presents methods, systems, computer-readable media, and apparatuses for determining a limited but sufficient group of APs suitable to be used for efficient and accurate wireless device location fixing. Certain embodiments relate to methods for eliminating unsuitable APs even when the geographic position of APs in the area of interest is not known a priori. | 07-31-2014 |
Patent application number | Description | Published |
20100019372 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor device package includes a semiconductor chip including a conductive pad, a die pad on which the semiconductor chip is mounted and having a first thickness, a lead pattern including a first portion disposed adjacent to the edge of the die pad and having the first thickness and a second portion having a second thickness greater than the first thickness, a heat radiation member disposed on the die pad and the lead pattern and including a groove formed at its bottom surface, and a conductive line disposed to electrically connect the conductive pad to the lead pattern corresponding to the conductive pad and partially inserted into the groove. | 01-28-2010 |
20120040498 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor device package includes a semiconductor chip including a conductive pad, a die pad on which the semiconductor chip is mounted and having a first thickness, a lead pattern including a first portion disposed adjacent to the edge of the die pad and having the first thickness and a second portion having a second thickness greater than the first thickness, a heat radiation member disposed on the die pad and the lead pattern and including a groove formed at its bottom surface, and a conductive line disposed to electrically connect the conductive pad to the lead pattern corresponding to the conductive pad and partially inserted into the groove. | 02-16-2012 |
20130148312 | TAPE WIRING SUBSTRATE AND CHIP-ON-FILM PACKAGE INCLUDING THE SAME - A tape wiring substrate includes a base film having at least one recess in a first surface of the base film and a chip-mounting region on which a semiconductor chip is included on a second surface of the base film. A wiring pattern is formed on the second surface of the base film and is extended to an edge of the chip-mounting region. A protection film covers the wiring pattern. | 06-13-2013 |
20130175528 | CHIP ON FILM PACKAGE INCLUDING TEST PADS AND SEMICONDUCTOR DEVICES INCLUDING THE SAME - Provided are a chip on film (COF) package and semiconductor having the same. The COF package can include a flexible film having first and second surfaces opposite to and facing each other and including a conductive via penetrating from the first surface to the second surface, first and second conductive patterns respectively is on the first surface and the second surface and electrically connected to each other through the conductive via, an integrated circuit (IC) chip is on the first surface and electrically connected to the first conductive pattern, a test pad overlaps the conductive via and is electrically connected to at least one of the first conductive pattern and the second conductive pattern, and an external connection pattern is on the second surface spaced apart from the conductive via and electrically connected to the second conductive pattern. | 07-11-2013 |
20130193545 | SEMICONDUCTOR APPARATUS AND IMAGE SENSOR PACKAGE USING THE SAME - A semiconductor apparatus and a method of fabricating the same are provided. The semiconductor apparatus includes a body part having a first surface and a second surface facing each other, a first trench formed into the first surface of the body part, a second trench formed into the second surface of the body part, an opening connecting the first trench and the second trench to each other, a first adhesion enhancer, such as a rough surface, formed on a bottom surface of the first trench, and a second adhesion enhancer, such as a rough surface, formed on the second surface of the body part. | 08-01-2013 |
Patent application number | Description | Published |
20110240967 | Organic light emitting diode device - An organic light emitting diode device, including a first electrode, a second electrode facing the first electrode, and a light emitting member disposed between the first electrode and the second electrode, the light emitting member including at least one light emitting unit. At least one of the light emitting units may include a first hole injection layer, a second hole injection layer, a hole transport layer, and an emission layer, and a difference between a HOMO energy level of the first hole injection layer and a LUMO energy level of the second hole injection layer may be smaller than about 0.5 eV. | 10-06-2011 |
20140133023 | 3D DISPLAY DEVICE - The 3D display device includes a display panel including a first pixel area displaying a left-eye image, and a second pixel area neighboring the first pixel area and displaying a right-eye image, and a lenticular lens unit positioned on the display panel to cover the first pixel area and the second pixel area and having at least one color. | 05-15-2014 |
20140177046 | THREE-DIMENSIONAL DISPLAY FOR NAKED EYES - Provided is a three-dimensional display. The display includes a substrate including a plurality of pixel areas; a barrier layer on a first surface of the substrate and at an area corresponding to a boundary between neighboring pixel areas of the plurality of pixel areas; a driving circuit layer on the barrier layer; and a display device layer on the driving circuit layer and forming pixels at positions corresponding to the plurality of pixel areas, wherein light emitted by the display device layer is emitted outside via a second surface of the substrate opposite to the first surface of the substrate. | 06-26-2014 |